TWI865536B - 半導體奈米粒子複合體分散液 - Google Patents

半導體奈米粒子複合體分散液 Download PDF

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TWI865536B
TWI865536B TW109118000A TW109118000A TWI865536B TW I865536 B TWI865536 B TW I865536B TW 109118000 A TW109118000 A TW 109118000A TW 109118000 A TW109118000 A TW 109118000A TW I865536 B TWI865536 B TW I865536B
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semiconductor nanoparticle
ligand
semiconductor
group
ligands
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TW109118000A
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TW202112651A (zh
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城戶信人
佐佐木洋和
森山喬史
三津家由子
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日商昭榮化學工業股份有限公司
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent materials, e.g. electroluminescent or chemiluminescent
    • C09K11/02—Use of particular materials as binders, particle coatings or suspension media therefor
    • C09K11/025—Use of particular materials as binders, particle coatings or suspension media therefor non-luminescent particle coatings or suspension media
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B19/00—Selenium; Tellurium; Compounds thereof
    • C01B19/04—Binary compounds including binary selenium-tellurium compounds
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B25/00—Phosphorus; Compounds thereof
    • C01B25/08—Other phosphides
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01G—COMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSES C01D OR C01F
    • C01G9/00—Compounds of zinc
    • C01G9/08—Sulfides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
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    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
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    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
    • C09D11/037—Printing inks characterised by features other than the chemical nature of the binder characterised by the pigment
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    • C09D11/00—Inks
    • C09D11/30—Inkjet printing inks
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    • C09D11/00—Inks
    • C09D11/50—Sympathetic, colour changing or similar inks
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    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/22—Luminous paints
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    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
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    • C09K11/70—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials containing phosphorus
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    • C09K11/00—Luminescent materials, e.g. electroluminescent or chemiluminescent
    • C09K11/08—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials
    • C09K11/88—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials containing selenium, tellurium or unspecified chalcogen elements
    • C09K11/881—Chalcogenides
    • C09K11/883—Chalcogenides with zinc or cadmium
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y20/00—Nanooptics, e.g. quantum optics or photonic crystals
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/10—Metal compounds
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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
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  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Nanotechnology (AREA)
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  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Biophysics (AREA)
  • Composite Materials (AREA)
  • Luminescent Compositions (AREA)
  • Led Device Packages (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW109118000A 2019-05-31 2020-05-29 半導體奈米粒子複合體分散液 TWI865536B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2019-103239 2019-05-31
JP2019103239 2019-05-31
JP2019103240 2019-05-31
JP2019-103240 2019-05-31

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TW202112651A TW202112651A (zh) 2021-04-01
TWI865536B true TWI865536B (zh) 2024-12-11

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TW109118000A TWI865536B (zh) 2019-05-31 2020-05-29 半導體奈米粒子複合體分散液
TW113146729A TWI897744B (zh) 2019-05-31 2020-05-29 半導體奈米粒子複合體分散液、半導體奈米粒子複合體、半導體奈米粒子複合體組成物及半導體奈米粒子複合體硬化膜

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US (1) US12415948B2 (https=)
JP (2) JP7602206B2 (https=)
KR (2) KR102825651B1 (https=)
CN (1) CN113906116A (https=)
TW (2) TWI865536B (https=)
WO (1) WO2020241872A1 (https=)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201716543A (zh) * 2015-07-17 2017-05-16 馬克專利公司 發光粒子、墨水調配物、聚合物組合物、光學裝置、其製造及發光粒子之用途
TW201825648A (zh) * 2016-11-15 2018-07-16 南韓商東友精細化工有限公司 量子點分散液、自發光型感光性樹脂組成物、使用其製備的彩色濾光件與影像顯示裝置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7361516B2 (en) * 2004-09-24 2008-04-22 The United States Of America As Represented By The Secretary Of The Navy Field of modular multifunctional ligands
JP5881045B2 (ja) 2011-10-11 2016-03-09 国立研究開発法人産業技術総合研究所 量子ドット含有チタン化合物及びその製造方法、並びに該量子ドット含有チタン化合物を用いた光電変換素子
JP2015086284A (ja) 2013-10-30 2015-05-07 シャープ株式会社 蛍光体、波長変換部材及び発光装置
WO2017038487A1 (ja) * 2015-08-31 2017-03-09 富士フイルム株式会社 半導体ナノ粒子、分散液、フィルムおよび半導体ナノ粒子の製造方法
KR20190009763A (ko) * 2016-05-20 2019-01-29 쓰리엠 이노베이티브 프로퍼티즈 컴파니 혼합 아민 및 티올 리간드를 갖는 양자점
CN108110144B (zh) * 2016-11-25 2021-11-26 三星电子株式会社 包括量子点的发光器件和显示器件
KR102664513B1 (ko) * 2017-06-05 2024-05-13 소에이 가가쿠 고교 가부시키가이샤 양자 점-수지 농축물 및 프리믹스의 산 안정화
KR102662811B1 (ko) * 2017-06-07 2024-05-02 소에이 가가쿠 고교 가부시키가이샤 수지 필름에서의 향상된 양자 점 신뢰성을 위한 티올화된 친수성 리간드
CN110691836B (zh) * 2017-06-08 2024-02-23 默克专利股份有限公司 包含具有硫醇官能表面配体的半导体发光纳米粒子的组合物
US10768485B2 (en) 2017-07-05 2020-09-08 Nanoco Technologies Ltd. Quantum dot architectures for color filter applications
KR102712599B1 (ko) * 2017-10-17 2024-10-02 엘지디스플레이 주식회사 발광체, 이를 포함하는 발광 필름, 발광다이오드 및 발광장치

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201716543A (zh) * 2015-07-17 2017-05-16 馬克專利公司 發光粒子、墨水調配物、聚合物組合物、光學裝置、其製造及發光粒子之用途
TW201825648A (zh) * 2016-11-15 2018-07-16 南韓商東友精細化工有限公司 量子點分散液、自發光型感光性樹脂組成物、使用其製備的彩色濾光件與影像顯示裝置

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Publication number Publication date
US12415948B2 (en) 2025-09-16
KR20220015399A (ko) 2022-02-08
CN113906116A (zh) 2022-01-07
TWI897744B (zh) 2025-09-11
JPWO2020241872A1 (https=) 2020-12-03
KR20250096886A (ko) 2025-06-27
WO2020241872A1 (ja) 2020-12-03
JP2025032144A (ja) 2025-03-11
TW202513462A (zh) 2025-04-01
US20220315834A1 (en) 2022-10-06
JP7602206B2 (ja) 2024-12-18
KR102825651B1 (ko) 2025-06-26
JP7824584B2 (ja) 2026-03-05
TW202112651A (zh) 2021-04-01

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