KR102823944B1 - 도전성 페이스트, 전극 및 칩 저항기 - Google Patents
도전성 페이스트, 전극 및 칩 저항기 Download PDFInfo
- Publication number
- KR102823944B1 KR102823944B1 KR1020227026685A KR20227026685A KR102823944B1 KR 102823944 B1 KR102823944 B1 KR 102823944B1 KR 1020227026685 A KR1020227026685 A KR 1020227026685A KR 20227026685 A KR20227026685 A KR 20227026685A KR 102823944 B1 KR102823944 B1 KR 102823944B1
- Authority
- KR
- South Korea
- Prior art keywords
- conductive paste
- electrode
- weight
- glass frit
- present
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Conductive Materials (AREA)
- Details Of Resistors (AREA)
- Non-Adjustable Resistors (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2020-005224 | 2020-01-16 | ||
JP2020005224 | 2020-01-16 | ||
PCT/JP2021/000345 WO2021145269A1 (ja) | 2020-01-16 | 2021-01-07 | 導電性ペースト、電極及びチップ抵抗器 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20220123286A KR20220123286A (ko) | 2022-09-06 |
KR102823944B1 true KR102823944B1 (ko) | 2025-06-24 |
Family
ID=76864627
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020227026685A Active KR102823944B1 (ko) | 2020-01-16 | 2021-01-07 | 도전성 페이스트, 전극 및 칩 저항기 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP7687687B2 (enrdf_load_stackoverflow) |
KR (1) | KR102823944B1 (enrdf_load_stackoverflow) |
CN (1) | CN114930467A (enrdf_load_stackoverflow) |
TW (1) | TWI857203B (enrdf_load_stackoverflow) |
WO (1) | WO2021145269A1 (enrdf_load_stackoverflow) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2024042764A1 (ja) | 2022-08-26 | 2024-02-29 | ナミックス株式会社 | 導電性ペースト、電極、電子部品及び電子機器 |
CN119563212A (zh) | 2022-08-26 | 2025-03-04 | 纳美仕有限公司 | 导电性糊剂、电极、电子部件及电子设备 |
WO2024043328A1 (ja) | 2022-08-26 | 2024-02-29 | ナミックス株式会社 | 導電性ペースト、電極、電子部品及び電子機器 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101002694B1 (ko) * | 2009-11-09 | 2010-12-21 | 한수광 | 태양전지 전극용 페이스트 |
CN103177789A (zh) * | 2011-12-20 | 2013-06-26 | 比亚迪股份有限公司 | 一种晶体硅太阳电池导电浆料及其制备方法 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0428108A (ja) * | 1990-05-23 | 1992-01-30 | Asahi Chem Ind Co Ltd | 銀系導電性ペースト並びに該ペーストを用いた導電体 |
JP2003115216A (ja) * | 2001-07-19 | 2003-04-18 | Toray Ind Inc | 導電ペースト |
JP2005244119A (ja) * | 2004-02-27 | 2005-09-08 | Tdk Corp | 抵抗体ペースト及びこれを用いた抵抗体 |
JP4918994B2 (ja) * | 2005-05-30 | 2012-04-18 | 住友電気工業株式会社 | 金属被膜の形成方法および金属配線 |
JP2007105723A (ja) | 2005-09-14 | 2007-04-26 | Mizushoo Kk | 流体磁気処理装置及び磁石ユニット |
WO2008078374A1 (ja) * | 2006-12-25 | 2008-07-03 | Namics Corporation | 太陽電池用導電性ペースト |
JP5160813B2 (ja) * | 2007-05-25 | 2013-03-13 | パナソニック株式会社 | 導電性ペーストおよび基板 |
US8257619B2 (en) * | 2008-04-18 | 2012-09-04 | E I Du Pont De Nemours And Company | Lead-free resistive composition |
JP5426241B2 (ja) * | 2009-06-10 | 2014-02-26 | イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー | チップ抵抗器の表電極および裏電極 |
EP2586752A1 (en) | 2011-10-25 | 2013-05-01 | Heraeus Precious Metals North America Conshohocken LLC | Electroconductive paste composition containing metal nanoparticles |
US9034417B2 (en) * | 2012-08-20 | 2015-05-19 | E I Du Pont De Nemours And Company | Photonic sintering of polymer thick film conductor compositions |
CN105051830B (zh) | 2013-03-27 | 2017-03-08 | 第一毛织株式会社 | 形成太阳电池电极用的组成物及以所述组成物制备的电极 |
JP6350127B2 (ja) * | 2014-08-29 | 2018-07-04 | 日立化成株式会社 | 無鉛低融点ガラス組成物並びにこれを含む低温封止用ガラスフリット、低温封止用ガラスペースト、導電性材料及び導電性ガラスペースト並びにこれらを利用したガラス封止部品及び電気電子部品 |
JP2017041627A (ja) * | 2015-08-17 | 2017-02-23 | 信越化学工業株式会社 | 導電性ペースト、その製造方法及びそれを用いた太陽電池電極 |
JP6396964B2 (ja) * | 2015-09-29 | 2018-09-26 | 三ツ星ベルト株式会社 | 導電性ペースト並びに電子基板及びその製造方法 |
CA3032768C (en) * | 2016-08-03 | 2023-08-29 | Shoei Chemical Inc. | Conductive paste |
JP7132591B2 (ja) | 2018-03-28 | 2022-09-07 | ナミックス株式会社 | 導電性ペースト及び焼成体 |
-
2021
- 2021-01-07 KR KR1020227026685A patent/KR102823944B1/ko active Active
- 2021-01-07 WO PCT/JP2021/000345 patent/WO2021145269A1/ja active Application Filing
- 2021-01-07 JP JP2021571163A patent/JP7687687B2/ja active Active
- 2021-01-07 CN CN202180009442.0A patent/CN114930467A/zh active Pending
- 2021-01-12 TW TW110101115A patent/TWI857203B/zh active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101002694B1 (ko) * | 2009-11-09 | 2010-12-21 | 한수광 | 태양전지 전극용 페이스트 |
CN103177789A (zh) * | 2011-12-20 | 2013-06-26 | 比亚迪股份有限公司 | 一种晶体硅太阳电池导电浆料及其制备方法 |
Also Published As
Publication number | Publication date |
---|---|
JP7687687B2 (ja) | 2025-06-03 |
CN114930467A (zh) | 2022-08-19 |
TW202146592A (zh) | 2021-12-16 |
KR20220123286A (ko) | 2022-09-06 |
WO2021145269A1 (ja) | 2021-07-22 |
JPWO2021145269A1 (enrdf_load_stackoverflow) | 2021-07-22 |
TWI857203B (zh) | 2024-10-01 |
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Legal Events
Date | Code | Title | Description |
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PA0105 | International application |
Patent event date: 20220802 Patent event code: PA01051R01D Comment text: International Patent Application |
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PG1501 | Laying open of application | ||
E902 | Notification of reason for refusal | ||
PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 20241014 Patent event code: PE09021S01D |
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E701 | Decision to grant or registration of patent right | ||
PE0701 | Decision of registration |
Patent event code: PE07011S01D Comment text: Decision to Grant Registration Patent event date: 20250526 |
|
GRNT | Written decision to grant | ||
PR0701 | Registration of establishment |
Comment text: Registration of Establishment Patent event date: 20250618 Patent event code: PR07011E01D |
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PR1002 | Payment of registration fee |
Payment date: 20250619 End annual number: 3 Start annual number: 1 |
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PG1601 | Publication of registration |