KR102820054B1 - 탄성파 장치 - Google Patents

탄성파 장치 Download PDF

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Publication number
KR102820054B1
KR102820054B1 KR1020237005531A KR20237005531A KR102820054B1 KR 102820054 B1 KR102820054 B1 KR 102820054B1 KR 1020237005531 A KR1020237005531 A KR 1020237005531A KR 20237005531 A KR20237005531 A KR 20237005531A KR 102820054 B1 KR102820054 B1 KR 102820054B1
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KR
South Korea
Prior art keywords
piezoelectric film
density
elastic wave
region
wave device
Prior art date
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KR1020237005531A
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English (en)
Korean (ko)
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KR20230036155A (ko
Inventor
카츠야 다이몬
Original Assignee
가부시키가이샤 무라타 세이사쿠쇼
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Publication of KR20230036155A publication Critical patent/KR20230036155A/ko
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Publication of KR102820054B1 publication Critical patent/KR102820054B1/ko
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Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/125—Driving means, e.g. electrodes, coils
    • H03H9/13—Driving means, e.g. electrodes, coils for networks consisting of piezoelectric or electrostrictive materials
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02543—Characteristics of substrate, e.g. cutting angles
    • H03H9/02559—Characteristics of substrate, e.g. cutting angles of lithium niobate or lithium-tantalate substrates
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02543—Characteristics of substrate, e.g. cutting angles
    • H03H9/02574—Characteristics of substrate, e.g. cutting angles of combined substrates, multilayered substrates, piezoelectrical layers on not-piezoelectrical substrate
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/125—Driving means, e.g. electrodes, coils
    • H03H9/145—Driving means, e.g. electrodes, coils for networks using surface acoustic waves
    • H03H9/14538—Formation
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
    • H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
    • H03H9/176—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of ceramic material
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/25—Constructional features of resonators using surface acoustic waves

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
KR1020237005531A 2020-09-03 2021-08-31 탄성파 장치 Active KR102820054B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020148279 2020-09-03
JPJP-P-2020-148279 2020-09-03
PCT/JP2021/031896 WO2022050260A1 (ja) 2020-09-03 2021-08-31 弾性波装置

Publications (2)

Publication Number Publication Date
KR20230036155A KR20230036155A (ko) 2023-03-14
KR102820054B1 true KR102820054B1 (ko) 2025-06-12

Family

ID=80490990

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020237005531A Active KR102820054B1 (ko) 2020-09-03 2021-08-31 탄성파 장치

Country Status (5)

Country Link
US (1) US20230208391A1 (https=)
JP (1) JP7582315B2 (https=)
KR (1) KR102820054B1 (https=)
CN (1) CN115989637A (https=)
WO (1) WO2022050260A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102851822B1 (ko) * 2023-10-13 2025-08-28 (주)와이솔 표면 탄성파 소자 및 그 제조 방법

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018182615A (ja) * 2017-04-18 2018-11-15 株式会社村田製作所 弾性波装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3163679B2 (ja) * 1991-09-27 2001-05-08 株式会社村田製作所 弾性表面波基板
JP3880150B2 (ja) * 1997-06-02 2007-02-14 松下電器産業株式会社 弾性表面波素子
JP3829644B2 (ja) * 2000-05-01 2006-10-04 株式会社村田製作所 表面波装置、横波トランスデューサー及び縦波トランスデューサーの製造方法
US7687971B2 (en) * 2006-08-15 2010-03-30 Northrop Grumman Corporation Electric field control of surface acoustic wave velocity
US8513863B2 (en) * 2009-06-11 2013-08-20 Qualcomm Mems Technologies, Inc. Piezoelectric resonator with two layers
CN103262410B (zh) 2010-12-24 2016-08-10 株式会社村田制作所 弹性波装置及其制造方法
JP2013214954A (ja) * 2012-03-07 2013-10-17 Taiyo Yuden Co Ltd 共振子、周波数フィルタ、デュプレクサ、電子機器及び共振子の製造方法
US9331666B2 (en) * 2012-10-22 2016-05-03 Qualcomm Mems Technologies, Inc. Composite dilation mode resonators
CN102946236B (zh) * 2012-10-22 2016-04-20 华中科技大学 一种可调薄膜体声波谐振器及其制备方法
JP6360847B2 (ja) * 2016-03-18 2018-07-18 太陽誘電株式会社 弾性波デバイス
WO2019116897A1 (ja) * 2017-12-13 2019-06-20 株式会社村田製作所 電子部品
JP6835038B2 (ja) * 2018-06-18 2021-02-24 株式会社村田製作所 弾性波装置及び高周波フロントエンド回路

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018182615A (ja) * 2017-04-18 2018-11-15 株式会社村田製作所 弾性波装置

Also Published As

Publication number Publication date
CN115989637A (zh) 2023-04-18
JP7582315B2 (ja) 2024-11-13
WO2022050260A1 (ja) 2022-03-10
US20230208391A1 (en) 2023-06-29
KR20230036155A (ko) 2023-03-14
JPWO2022050260A1 (https=) 2022-03-10

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