KR102815060B1 - 평탄화 공정, 장치 및 물품 제조 방법 - Google Patents

평탄화 공정, 장치 및 물품 제조 방법 Download PDF

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Publication number
KR102815060B1
KR102815060B1 KR1020200098914A KR20200098914A KR102815060B1 KR 102815060 B1 KR102815060 B1 KR 102815060B1 KR 1020200098914 A KR1020200098914 A KR 1020200098914A KR 20200098914 A KR20200098914 A KR 20200098914A KR 102815060 B1 KR102815060 B1 KR 102815060B1
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South Korea
Prior art keywords
chuck
superstrate
zones
trench
substrate
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KR1020200098914A
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English (en)
Korean (ko)
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KR20210020795A (ko
Inventor
병진 최
세쓰 제이 베임스버거
세혁 임
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캐논 가부시끼가이샤
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • H01L21/31051—
    • H01L21/31058—
    • H01L21/6838—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0442—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/06—Planarisation of inorganic insulating materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/08—Planarisation of organic insulating materials

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Micromachines (AREA)
  • Auxiliary Devices For And Details Of Packaging Control (AREA)
KR1020200098914A 2019-08-15 2020-08-07 평탄화 공정, 장치 및 물품 제조 방법 Active KR102815060B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US16/542,062 2019-08-15
US16/542,062 US11145535B2 (en) 2019-08-15 2019-08-15 Planarization process, apparatus and method of manufacturing an article

Publications (2)

Publication Number Publication Date
KR20210020795A KR20210020795A (ko) 2021-02-24
KR102815060B1 true KR102815060B1 (ko) 2025-06-02

Family

ID=74568188

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020200098914A Active KR102815060B1 (ko) 2019-08-15 2020-08-07 평탄화 공정, 장치 및 물품 제조 방법

Country Status (4)

Country Link
US (1) US11145535B2 (https=)
JP (1) JP7481937B2 (https=)
KR (1) KR102815060B1 (https=)
TW (1) TWI772838B (https=)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11875967B2 (en) * 2020-05-21 2024-01-16 Applied Materials, Inc. System apparatus and method for enhancing electrical clamping of substrates using photo-illumination
US11538714B2 (en) 2020-05-21 2022-12-27 Applied Materials, Inc. System apparatus and method for enhancing electrical clamping of substrates using photo-illumination
JP7778482B2 (ja) * 2021-03-02 2025-12-02 キヤノン株式会社 チャック、基板保持装置、基板処理装置、及び物品の製造方法
TWI906472B (zh) * 2021-03-02 2025-12-01 日商佳能股份有限公司 夾頭、基板保持裝置、基板處理裝置及物品之製造方法
CN115008025B (zh) * 2021-03-04 2024-05-03 鑫天虹(厦门)科技有限公司 基板及半导体磊晶结构的雷射分离方法
US12027373B2 (en) 2021-05-28 2024-07-02 Canon Kabushiki Kaisha Planarization process, planarization system, and method of manufacturing an article
US12550688B2 (en) 2021-12-29 2026-02-10 Canon Kabushiki Kaisha Planarization process, apparatus and method of manufacturing an article
US12138747B2 (en) 2022-05-19 2024-11-12 Canon Kabushiki Kaisha Planarization process, apparatus and method of manufacturing an article
WO2024049719A2 (en) * 2022-08-29 2024-03-07 Rajeev Bajaj Advanced fluid delivery
US20240213074A1 (en) * 2022-12-27 2024-06-27 Intel Corporation Enhanced nozzle for disaggregated die handling during thermal compression bonding
US20240429060A1 (en) * 2023-06-26 2024-12-26 Canon Kabushiki Kaisha Planarization system, planarizing method, and method of manufacturing an article

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007207842A (ja) * 2006-01-31 2007-08-16 Sumitomo Osaka Cement Co Ltd 静電チャック装置
US20100013169A1 (en) 2008-07-17 2010-01-21 Bjorn Monteen Thin wafer chuck
US20190019678A1 (en) 2016-03-22 2019-01-17 Ev Group E. Thallner Gmbh Device and method for bonding of substrates
US20190049849A1 (en) * 2017-08-10 2019-02-14 Taiwan Semiconductor Manufacturing Co., Ltd. Wafer table chuck having a particle recess

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JP3106499B2 (ja) * 1990-11-30 2000-11-06 株式会社ニコン 露光装置
JPH0851143A (ja) * 1992-07-20 1996-02-20 Nikon Corp 基板保持装置
US5923408A (en) * 1996-01-31 1999-07-13 Canon Kabushiki Kaisha Substrate holding system and exposure apparatus using the same
JPH10242255A (ja) * 1997-02-28 1998-09-11 Kyocera Corp 真空吸着装置
TW524873B (en) 1997-07-11 2003-03-21 Applied Materials Inc Improved substrate supporting apparatus and processing chamber
US7790231B2 (en) * 2003-07-10 2010-09-07 Brewer Science Inc. Automated process and apparatus for planarization of topographical surfaces
JP3894562B2 (ja) * 2003-10-01 2007-03-22 キヤノン株式会社 基板吸着装置、露光装置およびデバイス製造方法
JP2010067796A (ja) * 2008-09-11 2010-03-25 Canon Inc インプリント装置
US8913230B2 (en) 2009-07-02 2014-12-16 Canon Nanotechnologies, Inc. Chucking system with recessed support feature
WO2012083578A1 (zh) 2010-12-22 2012-06-28 青岛理工大学 整片晶圆纳米压印的装置和方法.
KR20160013916A (ko) * 2013-05-23 2016-02-05 가부시키가이샤 니콘 기판 유지 방법 및 장치, 그리고 노광 방법 및 장치
WO2015070054A1 (en) * 2013-11-08 2015-05-14 Canon Nanotechnologies, Inc. Low contact imprint lithography template chuck system for improved overlay correction
US11104057B2 (en) 2015-12-11 2021-08-31 Canon Kabushiki Kaisha Imprint apparatus and method of imprinting a partial field
JP6546550B2 (ja) 2016-03-09 2019-07-17 日本特殊陶業株式会社 真空吸着部材および真空吸着方法
JP6818351B2 (ja) * 2017-04-14 2021-01-20 サムコ株式会社 ウエハ処理装置
US11126083B2 (en) * 2018-01-24 2021-09-21 Canon Kabushiki Kaisha Superstrate and a method of using the same

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007207842A (ja) * 2006-01-31 2007-08-16 Sumitomo Osaka Cement Co Ltd 静電チャック装置
US20100013169A1 (en) 2008-07-17 2010-01-21 Bjorn Monteen Thin wafer chuck
US20190019678A1 (en) 2016-03-22 2019-01-17 Ev Group E. Thallner Gmbh Device and method for bonding of substrates
US20190049849A1 (en) * 2017-08-10 2019-02-14 Taiwan Semiconductor Manufacturing Co., Ltd. Wafer table chuck having a particle recess

Also Published As

Publication number Publication date
US20210050245A1 (en) 2021-02-18
JP7481937B2 (ja) 2024-05-13
TW202109735A (zh) 2021-03-01
TWI772838B (zh) 2022-08-01
US11145535B2 (en) 2021-10-12
KR20210020795A (ko) 2021-02-24
JP2021034723A (ja) 2021-03-01

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