KR102785194B1 - 마스크 블랭크용 기판, 다층 반사막을 구비한 기판, 반사형 마스크 블랭크 및 반사형 마스크, 및 반도체 장치의 제조 방법 - Google Patents
마스크 블랭크용 기판, 다층 반사막을 구비한 기판, 반사형 마스크 블랭크 및 반사형 마스크, 및 반도체 장치의 제조 방법 Download PDFInfo
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- KR102785194B1 KR102785194B1 KR1020187017533A KR20187017533A KR102785194B1 KR 102785194 B1 KR102785194 B1 KR 102785194B1 KR 1020187017533 A KR1020187017533 A KR 1020187017533A KR 20187017533 A KR20187017533 A KR 20187017533A KR 102785194 B1 KR102785194 B1 KR 102785194B1
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- South Korea
- Prior art keywords
- film
- substrate
- mask blank
- mask
- reflective
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/22—Masks or mask blanks for imaging by radiation of 100nm or shorter wavelength, e.g. X-ray masks, extreme ultraviolet [EUV] masks; Preparation thereof
- G03F1/24—Reflection masks; Preparation thereof
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/34—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
- C03C17/3411—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions with at least two coatings of inorganic materials
- C03C17/3429—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions with at least two coatings of inorganic materials at least one of the coatings being a non-oxide coating
- C03C17/3435—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions with at least two coatings of inorganic materials at least one of the coatings being a non-oxide coating comprising a nitride, oxynitride, boronitride or carbonitride
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/26—Phase shift masks [PSM]; PSM blanks; Preparation thereof
- G03F1/32—Attenuating PSM [att-PSM], e.g. halftone PSM or PSM having semi-transparent phase shift portion; Preparation thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/38—Masks having auxiliary features, e.g. special coatings or marks for alignment or testing; Preparation thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/38—Masks having auxiliary features, e.g. special coatings or marks for alignment or testing; Preparation thereof
- G03F1/46—Antireflective coatings
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/38—Masks having auxiliary features, e.g. special coatings or marks for alignment or testing; Preparation thereof
- G03F1/48—Protective coatings
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/54—Absorbers, e.g. of opaque materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/66—Containers specially adapted for masks, mask blanks or pellicles; Preparation thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
- G03F7/2004—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image characterised by the use of a particular light source, e.g. fluorescent lamps or deep UV light
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/7095—Materials, e.g. materials for housing, stage or other support having particular properties, e.g. weight, strength, conductivity, thermal expansion coefficient
- G03F7/70958—Optical materials or coatings, e.g. with particular transmittance, reflectance or anti-reflection properties
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2218/00—Methods for coating glass
- C03C2218/30—Aspects of methods for coating glass not covered above
- C03C2218/32—After-treatment
- C03C2218/328—Partly or completely removing a coating
- C03C2218/33—Partly or completely removing a coating by etching
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2218/00—Methods for coating glass
- C03C2218/30—Aspects of methods for coating glass not covered above
- C03C2218/34—Masking
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2218/00—Methods for coating glass
- C03C2218/30—Aspects of methods for coating glass not covered above
- C03C2218/365—Coating different sides of a glass substrate
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Environmental & Geological Engineering (AREA)
- Health & Medical Sciences (AREA)
- Public Health (AREA)
- Epidemiology (AREA)
- Geochemistry & Mineralogy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Physical Vapour Deposition (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPJP-P-2015-231444 | 2015-11-27 | ||
| JP2015231444 | 2015-11-27 | ||
| PCT/JP2016/083829 WO2017090485A1 (ja) | 2015-11-27 | 2016-11-15 | マスクブランク用基板、多層反射膜付き基板、反射型マスクブランク及び反射型マスク、並びに半導体装置の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20180086457A KR20180086457A (ko) | 2018-07-31 |
| KR102785194B1 true KR102785194B1 (ko) | 2025-03-25 |
Family
ID=58763499
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020187017533A Active KR102785194B1 (ko) | 2015-11-27 | 2016-11-15 | 마스크 블랭크용 기판, 다층 반사막을 구비한 기판, 반사형 마스크 블랭크 및 반사형 마스크, 및 반도체 장치의 제조 방법 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US10921705B2 (https=) |
| JP (2) | JP6789972B2 (https=) |
| KR (1) | KR102785194B1 (https=) |
| TW (1) | TWI732801B (https=) |
| WO (1) | WO2017090485A1 (https=) |
Families Citing this family (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20190100251A (ko) | 2017-01-17 | 2019-08-28 | 호야 가부시키가이샤 | 반사형 마스크 블랭크, 반사형 마스크 및 그 제조 방법, 및 반도체 장치의 제조 방법 |
| KR102429244B1 (ko) * | 2017-02-27 | 2022-08-05 | 호야 가부시키가이샤 | 마스크 블랭크 및 임프린트 몰드의 제조 방법 |
| JP6729508B2 (ja) * | 2017-06-29 | 2020-07-22 | 信越化学工業株式会社 | フォトマスクブランク及びフォトマスク |
| JP6863169B2 (ja) * | 2017-08-15 | 2021-04-21 | Agc株式会社 | 反射型マスクブランク、および反射型マスク |
| US10996553B2 (en) * | 2017-11-14 | 2021-05-04 | Taiwan Semiconductor Manufacturing Co., Ltd. | Extreme ultraviolet mask with reduced wafer neighboring effect and method of manufacturing the same |
| JP2019191209A (ja) * | 2018-04-18 | 2019-10-31 | Hoya株式会社 | 導電膜付き基板、多層反射膜付き基板、反射型マスクブランク、反射型マスク及び半導体装置の製造方法 |
| WO2020036694A1 (en) * | 2018-08-16 | 2020-02-20 | Applied Materials, Inc. | Photomask laser etch |
| US11275301B2 (en) | 2018-08-31 | 2022-03-15 | Taiwan Semiconductor Manufacturing Co., Ltd. | Extreme ultraviolet mask and method of manufacturing the same |
| US11119398B2 (en) * | 2018-09-28 | 2021-09-14 | Taiwan Semiconductor Manufacturing Co., Ltd. | EUV photo masks |
| JP7250511B2 (ja) | 2018-12-27 | 2023-04-03 | Hoya株式会社 | 反射型マスクブランク、反射型マスク、及び半導体装置の製造方法 |
| CN113767332B (zh) * | 2019-06-20 | 2024-09-10 | Hoya株式会社 | 反射型掩模坯料、反射型掩模、以及反射型掩模及半导体装置的制造方法 |
| US11249245B2 (en) * | 2019-09-05 | 2022-02-15 | Himax Technologies Limited | Patterned light guide structure and method to form the same |
| KR102946015B1 (ko) * | 2019-10-29 | 2026-03-31 | 에이지씨 가부시키가이샤 | 반사형 마스크 블랭크 및 반사형 마스크 |
| JP7409861B2 (ja) * | 2019-12-18 | 2024-01-09 | 株式会社トッパンフォトマスク | 反射型マスクブランク、反射型マスク、反射型マスクの製造方法、及び反射型マスクの修正方法 |
| KR102285099B1 (ko) * | 2020-01-08 | 2021-08-04 | 주식회사 에스앤에스텍 | 극자외선용 반사형 블랭크 마스크 및 포토마스크 |
| KR20210089406A (ko) * | 2020-01-08 | 2021-07-16 | 주식회사 에스앤에스텍 | 극자외선용 반사형 블랭크 마스크 및 포토마스크 |
| US11221554B2 (en) | 2020-01-17 | 2022-01-11 | Taiwan Semiconductor Manufacturing Co., Ltd. | EUV masks to prevent carbon contamination |
| US11111176B1 (en) * | 2020-02-27 | 2021-09-07 | Applied Materials, Inc. | Methods and apparatus of processing transparent substrates |
| JP7679357B2 (ja) * | 2020-03-30 | 2025-05-19 | Hoya株式会社 | 多層反射膜付き基板、反射型マスクブランク、反射型マスク、及び半導体装置の製造方法 |
| JP7421411B2 (ja) * | 2020-04-30 | 2024-01-24 | 株式会社トッパンフォトマスク | 反射型フォトマスクブランク及び反射型フォトマスク |
| KR102907633B1 (ko) * | 2020-06-18 | 2026-01-05 | 삼성전자주식회사 | 극자외선 노광 장치의 노광 마스크 |
| KR102849980B1 (ko) * | 2020-08-06 | 2025-08-27 | 삼성전자주식회사 | 에러 패턴에 대응하여 마스크 레이아웃을 설계하는 방법 및 그 방법을 이용한 마스크 형성 방법 |
| US12078921B2 (en) * | 2020-11-20 | 2024-09-03 | Entegris, Inc. | Phase-shift reticle for use in photolithography |
| TW202246879A (zh) * | 2021-02-09 | 2022-12-01 | 美商應用材料股份有限公司 | 極紫外光遮罩毛胚結構 |
| US12210279B2 (en) * | 2021-05-27 | 2025-01-28 | AGC Inc. | Electroconductive-film-coated substrate and reflective mask blank |
| JP7676291B2 (ja) * | 2021-10-29 | 2025-05-14 | Hoya株式会社 | マスクブランク用基板、多層反射膜付き基板、反射型マスクブランク、反射型マスク及び半導体デバイスの製造方法 |
| JP7669321B2 (ja) * | 2022-09-01 | 2025-04-28 | 信越化学工業株式会社 | 反射型マスクブランクおよび反射型マスクの製造方法 |
| JP2025117967A (ja) * | 2024-01-31 | 2025-08-13 | 信越化学工業株式会社 | パターン形成方法、及び積層体 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001194506A (ja) * | 1999-11-05 | 2001-07-19 | Asahi Glass Co Ltd | 紫外および真空紫外領域の反射防止基体 |
| JP2015028999A (ja) * | 2013-07-30 | 2015-02-12 | 旭硝子株式会社 | Euvリソグラフィ用反射型マスクブランク、および、euvリソグラフィ用反射型マスク |
| JP2015082553A (ja) * | 2013-10-22 | 2015-04-27 | 凸版印刷株式会社 | 反射型マスク及び反射型マスクブランク並びにその製造方法 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63204259A (ja) | 1987-02-20 | 1988-08-23 | Hitachi Ltd | マスク |
| JP2001100393A (ja) | 1999-09-28 | 2001-04-13 | Toshiba Corp | フォトマスク |
| WO2001035125A1 (en) | 1999-11-05 | 2001-05-17 | Asahi Glass Company, Limited | Antireflection base for ultraviolet and vacuum ultraviolet regions |
| JP4212025B2 (ja) | 2002-07-04 | 2009-01-21 | Hoya株式会社 | 反射型マスクブランクス及び反射型マスク並びに反射型マスクの製造方法 |
| JP4602430B2 (ja) | 2008-03-03 | 2010-12-22 | 株式会社東芝 | 反射型マスク及びその作製方法 |
| JP5282507B2 (ja) | 2008-09-25 | 2013-09-04 | 凸版印刷株式会社 | ハーフトーン型euvマスク、ハーフトーン型euvマスクの製造方法、ハーフトーン型euvマスクブランク及びパターン転写方法 |
| JP5533718B2 (ja) * | 2010-07-28 | 2014-06-25 | 旭硝子株式会社 | Euvリソグラフィ用反射型マスクブランク、該マスクブランク用の機能膜付基板 |
| JP5772135B2 (ja) | 2011-03-28 | 2015-09-02 | 凸版印刷株式会社 | 反射型マスクブランク及び反射型マスク |
| KR20130085774A (ko) * | 2012-01-20 | 2013-07-30 | 에스케이하이닉스 주식회사 | Euv 마스크 |
| JP5953833B2 (ja) | 2012-03-08 | 2016-07-20 | 凸版印刷株式会社 | 反射型フォトマスクおよびその製造方法 |
| TWI625592B (zh) | 2012-12-28 | 2018-06-01 | Hoya股份有限公司 | Substrate for substrate material, substrate with multilayer reflective film, reflective mask material, reflective mask, method for manufacturing substrate for mask material, method for manufacturing substrate with multilayer reflective film, and method for manufacturing semiconductor device |
| JP6225478B2 (ja) | 2013-05-20 | 2017-11-08 | 凸版印刷株式会社 | 反射型マスク |
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2016
- 2016-11-15 KR KR1020187017533A patent/KR102785194B1/ko active Active
- 2016-11-15 JP JP2017552370A patent/JP6789972B2/ja active Active
- 2016-11-15 US US15/778,363 patent/US10921705B2/en active Active
- 2016-11-15 WO PCT/JP2016/083829 patent/WO2017090485A1/ja not_active Ceased
- 2016-11-24 TW TW105138561A patent/TWI732801B/zh active
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2020
- 2020-11-04 JP JP2020184194A patent/JP7047046B2/ja active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001194506A (ja) * | 1999-11-05 | 2001-07-19 | Asahi Glass Co Ltd | 紫外および真空紫外領域の反射防止基体 |
| JP2015028999A (ja) * | 2013-07-30 | 2015-02-12 | 旭硝子株式会社 | Euvリソグラフィ用反射型マスクブランク、および、euvリソグラフィ用反射型マスク |
| JP2015082553A (ja) * | 2013-10-22 | 2015-04-27 | 凸版印刷株式会社 | 反射型マスク及び反射型マスクブランク並びにその製造方法 |
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| JP6789972B2 (ja) | 2020-11-25 |
| JP7047046B2 (ja) | 2022-04-04 |
| TWI732801B (zh) | 2021-07-11 |
| TW201730663A (zh) | 2017-09-01 |
| US20180356719A1 (en) | 2018-12-13 |
| US10921705B2 (en) | 2021-02-16 |
| WO2017090485A1 (ja) | 2017-06-01 |
| JPWO2017090485A1 (ja) | 2018-09-13 |
| JP2021015299A (ja) | 2021-02-12 |
| KR20180086457A (ko) | 2018-07-31 |
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