KR102773140B1 - 포스트 화학적-기계적-폴리싱 세정을 위한 조성물 - Google Patents
포스트 화학적-기계적-폴리싱 세정을 위한 조성물 Download PDFInfo
- Publication number
- KR102773140B1 KR102773140B1 KR1020187021128A KR20187021128A KR102773140B1 KR 102773140 B1 KR102773140 B1 KR 102773140B1 KR 1020187021128 A KR1020187021128 A KR 1020187021128A KR 20187021128 A KR20187021128 A KR 20187021128A KR 102773140 B1 KR102773140 B1 KR 102773140B1
- Authority
- KR
- South Korea
- Prior art keywords
- composition
- range
- mol
- cleaning
- cobalt
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/26—Organic compounds containing oxygen
- C11D7/265—Carboxylic acids or salts thereof
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/0005—Other compounding ingredients characterised by their effect
- C11D3/0026—Low foaming or foam regulating compositions
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/0005—Other compounding ingredients characterised by their effect
- C11D3/0073—Anticorrosion compositions
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/37—Polymers
- C11D3/3703—Macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
- C11D3/3707—Polyethers, e.g. polyalkyleneoxides
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/37—Polymers
- C11D3/3703—Macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
- C11D3/3719—Polyamides or polyimides
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/37—Polymers
- C11D3/3746—Macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
- C11D3/3753—Polyvinylalcohol; Ethers or esters thereof
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/37—Polymers
- C11D3/3746—Macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
- C11D3/3757—(Co)polymerised carboxylic acids, -anhydrides, -esters in solid and liquid compositions
- C11D3/3765—(Co)polymerised carboxylic acids, -anhydrides, -esters in solid and liquid compositions in liquid compositions
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/37—Polymers
- C11D3/3746—Macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
- C11D3/3769—(Co)polymerised monomers containing nitrogen, e.g. carbonamides, nitriles or amines
- C11D3/3776—Heterocyclic compounds, e.g. lactam
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/26—Organic compounds containing oxygen
- C11D7/261—Alcohols; Phenols
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/26—Organic compounds containing oxygen
- C11D7/263—Ethers
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/32—Organic compounds containing nitrogen
- C11D7/3281—Heterocyclic compounds
-
- H01L21/02052—
-
- H01L21/304—
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
- H10P52/40—Chemomechanical polishing [CMP]
- H10P52/403—Chemomechanical polishing [CMP] of conductive or resistive materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P70/00—Cleaning of wafers, substrates or parts of devices
- H10P70/10—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H10P70/15—Cleaning before device manufacture, i.e. Begin-Of-Line process by wet cleaning only
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P70/00—Cleaning of wafers, substrates or parts of devices
- H10P70/20—Cleaning during device manufacture
- H10P70/27—Cleaning during device manufacture during, before or after processing of conductive materials, e.g. polysilicon or amorphous silicon layers
- H10P70/277—Cleaning during device manufacture during, before or after processing of conductive materials, e.g. polysilicon or amorphous silicon layers the processing being a planarisation of conductive layers
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
- C11D2111/10—Objects to be cleaned
- C11D2111/14—Hard surfaces
- C11D2111/22—Electronic devices, e.g. PCBs or semiconductors
Landscapes
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Emergency Medicine (AREA)
- Detergent Compositions (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP15201935.2 | 2015-12-22 | ||
| EP15201935 | 2015-12-22 | ||
| PCT/EP2016/081856 WO2017108748A2 (en) | 2015-12-22 | 2016-12-20 | Composition for post chemical-mechanical-polishing cleaning |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20180097695A KR20180097695A (ko) | 2018-08-31 |
| KR102773140B1 true KR102773140B1 (ko) | 2025-02-25 |
Family
ID=54883958
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020187021128A Active KR102773140B1 (ko) | 2015-12-22 | 2016-12-20 | 포스트 화학적-기계적-폴리싱 세정을 위한 조성물 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US10844333B2 (https=) |
| EP (1) | EP3394879A2 (https=) |
| JP (1) | JP6886469B2 (https=) |
| KR (1) | KR102773140B1 (https=) |
| CN (1) | CN108431931B (https=) |
| SG (1) | SG11201804636YA (https=) |
| TW (1) | TWI736567B (https=) |
| WO (1) | WO2017108748A2 (https=) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6932147B2 (ja) * | 2016-06-10 | 2021-09-08 | ビーエイエスエフ・ソシエタス・エウロパエアBasf Se | 化学機械研磨後洗浄のための組成物 |
| US11377627B2 (en) * | 2017-03-14 | 2022-07-05 | Fujimi Incorporated | Composition for surface treatment, method for producing the same, and surface treatment method using the same |
| JP2022512429A (ja) * | 2018-12-12 | 2022-02-03 | ビーエーエスエフ ソシエタス・ヨーロピア | 銅及びルテニウムを含有する基板の化学機械研磨 |
| KR102871615B1 (ko) * | 2018-12-12 | 2025-10-15 | 바스프 에스이 | 구리 및 루테늄을 함유하는 기판의 화학적 기계적 폴리싱 |
| WO2020194978A1 (ja) * | 2019-03-26 | 2020-10-01 | 株式会社フジミインコーポレーテッド | 表面処理組成物、その製造方法、表面処理方法および半導体基板の製造方法 |
| MX2023011631A (es) | 2021-04-01 | 2023-12-15 | Sterilex LLC | Desinfectante/higienizante en polvo sin compuesto de amonio cuaternario (quat). |
| CN119325501A (zh) | 2022-05-31 | 2025-01-17 | 巴斯夫欧洲公司 | 用于清洁包含钴和铜的衬底的组合物、其用途及方法 |
| CN121548628A (zh) | 2023-06-20 | 2026-02-17 | 巴斯夫欧洲公司 | 用于清洁包含钴和铜的衬底的碱性组合物、其用途及方法 |
| CN121399239A (zh) | 2023-06-20 | 2026-01-23 | 巴斯夫欧洲公司 | 用于清洁包含钴和铜的衬底的碱性组合物、其用途及方法 |
| WO2026057376A1 (en) | 2024-09-11 | 2026-03-19 | Basf Se | Alkaline composition, its use and a process for cleaning substrates comprising cobalt and copper |
| WO2026074880A1 (ja) * | 2024-10-02 | 2026-04-09 | 富士フイルム株式会社 | 組成物、洗浄済み被処理物の製造方法、電子デバイスの製造方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090239777A1 (en) * | 2006-09-21 | 2009-09-24 | Advanced Technology Materials, Inc. | Antioxidants for post-cmp cleaning formulations |
| WO2014176193A1 (en) | 2013-04-22 | 2014-10-30 | Advanced Technology Materials, Inc. | Copper cleaning and protection formulations |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004319759A (ja) * | 2003-04-16 | 2004-11-11 | Hitachi Chem Co Ltd | 金属用研磨液及び研磨方法 |
| US20070210278A1 (en) * | 2006-03-08 | 2007-09-13 | Lane Sarah J | Compositions for chemical mechanical polishing silicon dioxide and silicon nitride |
| JP4777197B2 (ja) | 2006-09-11 | 2011-09-21 | 富士フイルム株式会社 | 洗浄液及びそれを用いた洗浄方法 |
| US20090056744A1 (en) | 2007-08-29 | 2009-03-05 | Micron Technology, Inc. | Wafer cleaning compositions and methods |
| JP2009069505A (ja) | 2007-09-13 | 2009-04-02 | Tosoh Corp | レジスト除去用洗浄液及び洗浄方法 |
| US8084406B2 (en) | 2007-12-14 | 2011-12-27 | Lam Research Corporation | Apparatus for particle removal by single-phase and two-phase media |
| RU2631870C2 (ru) * | 2012-02-06 | 2017-09-28 | Басф Се | Композиция для очистки после химико-механического полирования (после - смр), содержащая конкретное содержащее серу соединение и сахарный спирт или поликарбоновую кислоту |
| KR102105381B1 (ko) | 2012-02-15 | 2020-04-29 | 엔테그리스, 아이엔씨. | 조성물을 이용한 cmp-후 제거 방법 및 그의 이용 방법 |
| TWI573864B (zh) * | 2012-03-14 | 2017-03-11 | 卡博特微電子公司 | 具有高移除率及低缺陷率之對氧化物及氮化物有選擇性之cmp組成物 |
| TWI636131B (zh) * | 2014-05-20 | 2018-09-21 | 日商Jsr股份有限公司 | 清洗用組成物及清洗方法 |
| WO2017108743A1 (en) * | 2015-12-22 | 2017-06-29 | Basf Se | Composition for post chemical-mechanical-polishing cleaning |
| JP6932147B2 (ja) * | 2016-06-10 | 2021-09-08 | ビーエイエスエフ・ソシエタス・エウロパエアBasf Se | 化学機械研磨後洗浄のための組成物 |
-
2016
- 2016-12-20 JP JP2018533238A patent/JP6886469B2/ja active Active
- 2016-12-20 CN CN201680075204.9A patent/CN108431931B/zh active Active
- 2016-12-20 WO PCT/EP2016/081856 patent/WO2017108748A2/en not_active Ceased
- 2016-12-20 SG SG11201804636YA patent/SG11201804636YA/en unknown
- 2016-12-20 EP EP16819532.9A patent/EP3394879A2/en active Pending
- 2016-12-20 US US16/064,686 patent/US10844333B2/en active Active
- 2016-12-20 KR KR1020187021128A patent/KR102773140B1/ko active Active
- 2016-12-21 TW TW105142443A patent/TWI736567B/zh active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090239777A1 (en) * | 2006-09-21 | 2009-09-24 | Advanced Technology Materials, Inc. | Antioxidants for post-cmp cleaning formulations |
| WO2014176193A1 (en) | 2013-04-22 | 2014-10-30 | Advanced Technology Materials, Inc. | Copper cleaning and protection formulations |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108431931A (zh) | 2018-08-21 |
| WO2017108748A3 (en) | 2017-11-02 |
| US20190002802A1 (en) | 2019-01-03 |
| KR20180097695A (ko) | 2018-08-31 |
| JP2019502802A (ja) | 2019-01-31 |
| SG11201804636YA (en) | 2018-07-30 |
| WO2017108748A2 (en) | 2017-06-29 |
| EP3394879A2 (en) | 2018-10-31 |
| JP6886469B2 (ja) | 2021-06-16 |
| TW201732024A (zh) | 2017-09-16 |
| CN108431931B (zh) | 2023-08-18 |
| US10844333B2 (en) | 2020-11-24 |
| TWI736567B (zh) | 2021-08-21 |
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| A201 | Request for examination | ||
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| P13-X000 | Application amended |
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