KR102701367B1 - 산화규소막용 연마액 조성물 - Google Patents

산화규소막용 연마액 조성물 Download PDF

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Publication number
KR102701367B1
KR102701367B1 KR1020207017358A KR20207017358A KR102701367B1 KR 102701367 B1 KR102701367 B1 KR 102701367B1 KR 1020207017358 A KR1020207017358 A KR 1020207017358A KR 20207017358 A KR20207017358 A KR 20207017358A KR 102701367 B1 KR102701367 B1 KR 102701367B1
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KR
South Korea
Prior art keywords
polishing
silicon oxide
oxide film
polymer compound
water
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KR1020207017358A
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English (en)
Korean (ko)
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KR20200101918A (ko
Inventor
요헤이 우치다
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카오카부시키가이샤
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B24B37/044—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • H01L21/304—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/06—Planarisation of inorganic insulating materials
    • H10P95/062—Planarisation of inorganic insulating materials involving a dielectric removal step

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
KR1020207017358A 2017-12-28 2018-12-21 산화규소막용 연마액 조성물 Active KR102701367B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2017-253993 2017-12-28
JP2017253993A JP6837958B2 (ja) 2017-12-28 2017-12-28 酸化珪素膜用研磨液組成物
PCT/JP2018/047344 WO2019131545A1 (ja) 2017-12-28 2018-12-21 酸化珪素膜用研磨液組成物

Publications (2)

Publication Number Publication Date
KR20200101918A KR20200101918A (ko) 2020-08-28
KR102701367B1 true KR102701367B1 (ko) 2024-08-30

Family

ID=67066422

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020207017358A Active KR102701367B1 (ko) 2017-12-28 2018-12-21 산화규소막용 연마액 조성물

Country Status (7)

Country Link
US (1) US11795346B2 (https=)
JP (2) JP6837958B2 (https=)
KR (1) KR102701367B1 (https=)
CN (1) CN111511870B (https=)
SG (1) SG11202005634VA (https=)
TW (1) TWI810232B (https=)
WO (1) WO2019131545A1 (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7252073B2 (ja) * 2019-06-26 2023-04-04 花王株式会社 酸化珪素膜用研磨液組成物
JP7550771B2 (ja) * 2019-09-10 2024-09-13 株式会社フジミインコーポレーテッド 研磨用組成物
JP7464432B2 (ja) * 2019-11-13 2024-04-09 花王株式会社 半導体デバイス用基板に用いる洗浄剤組成物
CN113496868B (zh) * 2020-04-03 2023-03-10 重庆超硅半导体有限公司 一种硅片的抛光后清洗方法
JP7425660B2 (ja) * 2020-04-07 2024-01-31 花王株式会社 酸化珪素膜用研磨液組成物
WO2022102019A1 (ja) * 2020-11-11 2022-05-19 昭和電工マテリアルズ株式会社 研磨液及び研磨方法
CN116507688A (zh) * 2020-11-27 2023-07-28 花王株式会社 氧化硅膜用研磨液组合物

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007103485A (ja) * 2005-09-30 2007-04-19 Fujifilm Corp 研磨方法及びそれに用いる研磨液
JP2010272733A (ja) 2009-05-22 2010-12-02 Hitachi Chem Co Ltd 研磨剤及びこの研磨剤を用いた基板の研磨方法
JP2016127268A (ja) 2014-12-26 2016-07-11 花王株式会社 シリコンウェーハ用研磨液組成物、又はシリコンウェーハ用研磨液組成物キット
JP2017190381A (ja) * 2016-04-12 2017-10-19 花王株式会社 表面処理剤

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000109810A (ja) 1998-10-08 2000-04-18 Hitachi Chem Co Ltd Ｃｍｐ研磨剤及び基板の研磨方法
JP2003158101A (ja) 2001-11-20 2003-05-30 Hitachi Chem Co Ltd Ｃｍｐ研磨剤及び製造方法
JP2004297035A (ja) 2003-03-13 2004-10-21 Hitachi Chem Co Ltd 研磨剤、研磨方法及び電子部品の製造方法
KR100856171B1 (ko) 2004-07-23 2008-09-03 히다치 가세고교 가부시끼가이샤 Ｃｍｐ연마제 및 기판의 연마방법
US7435356B2 (en) 2004-11-24 2008-10-14 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Abrasive-free chemical mechanical polishing compositions and methods relating thereto
KR101245502B1 (ko) * 2006-01-31 2013-03-25 히타치가세이가부시끼가이샤 절연막 연마용 ｃｍｐ 연마제, 연마 방법, 상기 연마 방법으로 연마된 반도체 전자 부품
US7732393B2 (en) 2006-03-20 2010-06-08 Cabot Microelectronics Corporation Oxidation-stabilized CMP compositions and methods
WO2007146680A1 (en) * 2006-06-06 2007-12-21 Florida State University Research Foundation , Inc. Stabilized silica colloid
US20090215266A1 (en) 2008-02-22 2009-08-27 Thomas Terence M Polishing Copper-Containing patterned wafers
JP2009260236A (ja) 2008-03-18 2009-11-05 Hitachi Chem Co Ltd 研磨剤、これを用いた基板の研磨方法並びにこの研磨方法に用いる溶液及びスラリー
TW201038690A (en) 2008-09-26 2010-11-01 Rhodia Operations Abrasive compositions for chemical mechanical polishing and methods for using same
JP6350861B2 (ja) 2014-07-15 2018-07-04 スピードファム株式会社 コロイダルシリカ及びそれを含有する半導体ウエハ研磨用組成物
EP3357866A4 (en) * 2015-09-30 2019-06-19 Nippon Shokubai Co., Ltd. ZIRCONIUM-NANOPARTICLES

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007103485A (ja) * 2005-09-30 2007-04-19 Fujifilm Corp 研磨方法及びそれに用いる研磨液
JP2010272733A (ja) 2009-05-22 2010-12-02 Hitachi Chem Co Ltd 研磨剤及びこの研磨剤を用いた基板の研磨方法
JP2016127268A (ja) 2014-12-26 2016-07-11 花王株式会社 シリコンウェーハ用研磨液組成物、又はシリコンウェーハ用研磨液組成物キット
JP2017190381A (ja) * 2016-04-12 2017-10-19 花王株式会社 表面処理剤

Also Published As

Publication number Publication date
JP2021100126A (ja) 2021-07-01
KR20200101918A (ko) 2020-08-28
CN111511870A (zh) 2020-08-07
US20200369919A1 (en) 2020-11-26
JP7133667B2 (ja) 2022-09-08
JP6837958B2 (ja) 2021-03-03
US11795346B2 (en) 2023-10-24
CN111511870B (zh) 2022-05-06
TWI810232B (zh) 2023-08-01
WO2019131545A1 (ja) 2019-07-04
SG11202005634VA (en) 2020-07-29
JP2019121641A (ja) 2019-07-22
TW201930543A (zh) 2019-08-01

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