KR102670962B1 - 연마의 인-시튜 모니터링 동안의 필터링 - Google Patents

연마의 인-시튜 모니터링 동안의 필터링 Download PDF

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Publication number
KR102670962B1
KR102670962B1 KR1020207028579A KR20207028579A KR102670962B1 KR 102670962 B1 KR102670962 B1 KR 102670962B1 KR 1020207028579 A KR1020207028579 A KR 1020207028579A KR 20207028579 A KR20207028579 A KR 20207028579A KR 102670962 B1 KR102670962 B1 KR 102670962B1
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South Korea
Prior art keywords
signal
polishing
monitoring system
filtered
states
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KR1020207028579A
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English (en)
Korean (ko)
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KR20200120745A (ko
Inventor
시바쿠마르 드한다파니
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어플라이드 머티어리얼스, 인코포레이티드
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • H01L21/304—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
    • H01L21/31051—
    • H01L21/67092—
    • H01L21/67253—
    • H01L21/67276—
    • H01L21/76819—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0604—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0612—Production flow monitoring, e.g. for increasing throughput
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/06—Planarisation of inorganic insulating materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/071—Manufacture or treatment of dielectric parts thereof
    • H10W20/092—Manufacture or treatment of dielectric parts thereof by smoothing the dielectric parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/49—Nc machine tool, till multiple
    • G05B2219/49085—CMP end point analysis, measure parameters on points to detect end of polishing process

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Automation & Control Theory (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
KR1020207028579A 2018-03-12 2019-03-06 연마의 인-시튜 모니터링 동안의 필터링 Active KR102670962B1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020247017724A KR102853782B1 (ko) 2018-03-12 2019-03-06 연마의 인-시튜 모니터링 동안의 필터링

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201862641950P 2018-03-12 2018-03-12
US62/641,950 2018-03-12
PCT/US2019/021045 WO2019177842A1 (en) 2018-03-12 2019-03-06 Filtering during in-situ monitoring of polishing

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020247017724A Division KR102853782B1 (ko) 2018-03-12 2019-03-06 연마의 인-시튜 모니터링 동안의 필터링

Publications (2)

Publication Number Publication Date
KR20200120745A KR20200120745A (ko) 2020-10-21
KR102670962B1 true KR102670962B1 (ko) 2024-05-31

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KR1020207028579A Active KR102670962B1 (ko) 2018-03-12 2019-03-06 연마의 인-시튜 모니터링 동안의 필터링
KR1020247017724A Active KR102853782B1 (ko) 2018-03-12 2019-03-06 연마의 인-시튜 모니터링 동안의 필터링

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Country Status (6)

Country Link
US (3) US11446783B2 (https=)
JP (1) JP7237083B2 (https=)
KR (2) KR102670962B1 (https=)
CN (1) CN111316403B (https=)
TW (2) TWI885376B (https=)
WO (1) WO2019177842A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102670962B1 (ko) 2018-03-12 2024-05-31 어플라이드 머티어리얼스, 인코포레이티드 연마의 인-시튜 모니터링 동안의 필터링
CN115943016A (zh) * 2020-07-14 2023-04-07 应用材料公司 在化学机械抛光期间检测不合格衬底处理事件的方法
KR20240161701A (ko) * 2021-03-03 2024-11-12 어플라이드 머티어리얼스, 인코포레이티드 공간 분해능을 제공하기 위한 모터 토크 모니터링 동안의 압력 신호들
JP2023124546A (ja) * 2022-02-25 2023-09-06 株式会社荏原製作所 研磨装置および研磨装置における研磨終点検出方法

Citations (3)

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JP2015085487A (ja) 2013-11-01 2015-05-07 株式会社荏原製作所 研磨装置および研磨方法
JP2015519740A (ja) 2012-04-26 2015-07-09 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 研磨のインシトゥ監視時にデータをフィルタリングするための線形予測
JP2016538728A (ja) 2013-11-27 2016-12-08 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 基板研磨中の研磨速度の制限的調整

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US5213655A (en) * 1990-05-16 1993-05-25 International Business Machines Corporation Device and method for detecting an end point in polishing operation
US5069002A (en) 1991-04-17 1991-12-03 Micron Technology, Inc. Apparatus for endpoint detection during mechanical planarization of semiconductor wafers
EP0616362A3 (en) * 1993-03-15 1995-06-21 Tokyo Shibaura Electric Co Process for polishing workpieces and device therefor.
DE69635816T2 (de) 1995-03-28 2006-10-12 Applied Materials, Inc., Santa Clara Verfahren zum Herstellen einer Vorrichtung zur In-Situ-Kontrolle und Bestimmung des Endes von chemisch-mechanischen Planiervorgängen
JP2953387B2 (ja) * 1996-08-12 1999-09-27 日本電気株式会社 ウェハの研磨装置及びウェハの研磨方法
US5865665A (en) 1997-02-14 1999-02-02 Yueh; William In-situ endpoint control apparatus for semiconductor wafer polishing process
US6230069B1 (en) 1998-06-26 2001-05-08 Advanced Micro Devices, Inc. System and method for controlling the manufacture of discrete parts in semiconductor fabrication using model predictive control
JP2000218518A (ja) 1999-02-01 2000-08-08 Nec Corp 研磨装置
US6464824B1 (en) 1999-08-31 2002-10-15 Micron Technology, Inc. Methods and apparatuses for monitoring and controlling mechanical or chemical-mechanical planarization of microelectronic substrate assemblies
JP2001198813A (ja) * 2000-01-13 2001-07-24 Toshiba Corp 研磨装置及びその研磨方法
DE60132385T2 (de) * 2000-05-19 2008-05-15 Applied Materials, Inc., Santa Clara Polierkissen
US7087527B2 (en) 2002-08-28 2006-08-08 Micron Technology, Inc. Extended kalman filter incorporating offline metrology
US7306507B2 (en) 2005-08-22 2007-12-11 Applied Materials, Inc. Polishing pad assembly with glass or crystalline window
JP5283506B2 (ja) * 2006-09-12 2013-09-04 株式会社荏原製作所 研磨装置および研磨方法
US20130065493A1 (en) * 2011-08-09 2013-03-14 Taro Takahashi Polishing monitoring method, polishing end point detection method, and polishing apparatus
US9551567B2 (en) * 2013-10-25 2017-01-24 Applied Materials, Inc. Reducing noise in spectral data from polishing substrates
US9375824B2 (en) 2013-11-27 2016-06-28 Applied Materials, Inc. Adjustment of polishing rates during substrate polishing with predictive filters
KR102670962B1 (ko) 2018-03-12 2024-05-31 어플라이드 머티어리얼스, 인코포레이티드 연마의 인-시튜 모니터링 동안의 필터링

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Publication number Priority date Publication date Assignee Title
JP2015519740A (ja) 2012-04-26 2015-07-09 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 研磨のインシトゥ監視時にデータをフィルタリングするための線形予測
JP2015085487A (ja) 2013-11-01 2015-05-07 株式会社荏原製作所 研磨装置および研磨方法
JP2016538728A (ja) 2013-11-27 2016-12-08 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 基板研磨中の研磨速度の制限的調整

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Publication number Publication date
CN111316403B (zh) 2024-12-13
KR20200120745A (ko) 2020-10-21
JP7237083B2 (ja) 2023-03-10
TWI885376B (zh) 2025-06-01
US11446783B2 (en) 2022-09-20
US20190275633A1 (en) 2019-09-12
TW201946135A (zh) 2019-12-01
CN111316403A (zh) 2020-06-19
US20230286105A1 (en) 2023-09-14
US20220388113A1 (en) 2022-12-08
JP2021517359A (ja) 2021-07-15
KR102853782B1 (ko) 2025-09-03
US11679466B2 (en) 2023-06-20
US11969855B2 (en) 2024-04-30
TWI805703B (zh) 2023-06-21
TW202336853A (zh) 2023-09-16
WO2019177842A1 (en) 2019-09-19
KR20240093966A (ko) 2024-06-24

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