KR102662724B1 - Apparatus for treating substrate - Google Patents

Abstract

The present invention provides an apparatus for processing a substrate. In one embodiment, a substrate processing apparatus includes a housing; a first body and a second body placed inside the housing and combined with each other to form a processing space therein; a support unit supporting the substrate within the processing space; a fluid supply unit supplying fluid to the processing space; a fluid supply unit supplying fluid to the substrate supported on the substrate support unit; And, a sealing member positioned between the first body and the second body to seal the processing space from the outside at a position where the first body and the second body are in close contact with each other; It includes a sealing state measuring unit that measures the state of the sealing member, wherein the sealing state measuring unit includes: a concentration sensor that measures the concentration of fluid flowing out of the processing space; It may include a controller that determines the state of the sealing member based on whether the concentration of the fluid measured by the concentration sensor is within a preset concentration range.

Description

Substrate processing apparatus {APPARATUS FOR TREATING SUBSTRATE}

The present invention relates to a substrate processing device that processes a substrate using a fluid.

Generally, semiconductor devices are manufactured from a substrate such as a wafer. Specifically, semiconductor devices are manufactured by forming fine circuit patterns on the upper surface of a substrate by performing a deposition process, photolithography process, etching process, etc. Since various foreign substances adhere to the upper surface of the substrate on which the circuit pattern is formed while performing the above processes, a cleaning process to remove foreign substances on the substrate is performed between the above processes.

Generally, the cleaning process includes chemical treatment to remove foreign substances on the substrate by supplying chemicals to the substrate, rinsing treatment to remove chemicals remaining on the substrate by supplying pure water to the substrate, and drying treatment to remove pure water remaining on the substrate. Includes.

Supercritical fluid is used for the drying process of the substrate. According to one example, pure water on the substrate is replaced with an organic solvent, and then a supercritical fluid is supplied to the upper surface of the substrate in a high pressure chamber to dissolve the organic solvent remaining on the substrate in the supercritical fluid and remove it from the substrate. When isopropyl alcohol (hereinafter referred to as IPA) is used as the organic solvent, carbon dioxide (CO2), which has relatively low critical temperature and critical pressure and which dissolves IPA well, is used as the supercritical fluid.

Processing of the substrate using supercritical fluid is as follows. When a substrate is brought into the high-pressure chamber, carbon dioxide in a supercritical state is supplied into the high-pressure chamber to pressurize the inside of the high-pressure chamber, and then the substrate is treated with the supercritical fluid while repeating supply of the supercritical fluid and exhaustion from the high-pressure chamber. And when processing of the substrate is completed, the inside of the high pressure chamber is evacuated and the pressure is reduced.

Figure 1 shows a conventional substrate processing apparatus 1 using supercritical. Referring to FIG. 1, in a conventional substrate drying process using supercritical, the fluid supply unit 40 supplies supercritical fluid to the processing space 51 where the substrate W is placed. Process chamber 50 has an upper chamber 52 and a lower chamber 55. The upper chamber 52 and lower chamber 55 are combined to form the processing space 51. A sealing member 60 is provided between the upper chamber 52 and the lower chamber 55. The sealing member 60 prevents the supercritical fluid inside the processing space 51 from escaping from the process chamber 50 and prevents external airflow from flowing into the processing space 51 .

However, it is difficult to determine the state of the sealing member 60, making it difficult to measure the performance and lifespan of the sealing member 60. Accordingly, there is a problem in that the sealing member 60 that has reached the end of its life cannot be replaced, resulting in a process defect.

One object of the present invention is to provide a substrate processing device capable of measuring the condition and lifespan of a sealing member.

The object of the present invention is not limited here, and other objects not mentioned will be clearly understood by those skilled in the art from the description below.

The present invention provides a substrate processing apparatus. In one example, an apparatus for processing a substrate includes a housing; a first body and a second body placed inside the housing and combined with each other to form a processing space therein; a support unit supporting the substrate within the processing space; a fluid supply unit supplying fluid to the processing space; a fluid supply unit supplying fluid to the substrate supported on the substrate support unit; And, a sealing member positioned between the first body and the second body to seal the processing space from the outside at a position where the first body and the second body are in close contact with each other; It includes a sealing state measuring unit that measures the state of the sealing member, wherein the sealing state measuring unit includes: a concentration sensor that measures the concentration of fluid flowing out of the processing space; It may include a controller that determines the state of the sealing member based on whether the concentration of the fluid measured by the concentration sensor is within a preset concentration range.

In one example, the concentration sensor may be located below a position in the housing where the first body and the second body are in close contact with each other.

In one example, it may further include an airflow forming unit installed in the housing to form a descending airflow inside the housing.

In one example, the air flow forming unit may be installed in the housing in a position opposite to the concentration sensor.

In one example, the sealing state measuring unit further includes a collection part that becomes wider toward the top and has an opening that communicates with the internal space of the housing, and a concentration sensor may be provided in the collection part.

In one example, the sealing state measuring unit may further include a pressure reducing unit that provides reduced pressure to the collection unit.

In one example, the sealing state measuring unit further includes an imaging member that measures the roughness of the surface of the sealing member, and the controller determines the state of the sealing member based on whether the roughness measured by the imaging member is within a preset range. You can judge.

In one example, the first body can be positioned on top of the second body.

In one example, the fluid supplied into the processing space may be carbon dioxide in a supercritical state.

The present invention can measure the condition and lifespan of a sealing member.

The effects of the present invention are not limited to the effects described above, and effects not mentioned can be clearly understood by those skilled in the art from this specification and the attached drawings.

1 is a cross-sectional view schematically showing a general substrate processing apparatus.
Figure 2 is a plan view schematically showing a substrate processing apparatus according to an embodiment of the present invention.
FIG. 3 is a diagram schematically showing an embodiment of the liquid processing device of FIG. 2.
FIG. 4 is a diagram schematically showing an embodiment of the supercritical device of FIG. 1.
Figure 5 is a perspective view showing the sealing member of Figure 4.
FIG. 6 is a diagram schematically showing the airflow formed in the supercritical device of FIG. 1.
Figure 7 is a diagram showing another embodiment of a sealing state measuring unit.

Hereinafter, embodiments of the present invention will be described in more detail with reference to the attached drawings. Embodiments of the present invention may be modified in various forms, and the scope of the present invention should not be construed as being limited to the following embodiments. This example is provided to more completely explain the present invention to those with average knowledge in the art. Therefore, the shapes of elements in the drawings are exaggerated to emphasize a clearer description.

Figure 2 is a plan view schematically showing a substrate processing apparatus according to an embodiment of the present invention. Referring to FIG. 2, the substrate processing system includes an index module 10, a processing module 20, and a controller (not shown). According to one embodiment, the index module 10 and the processing module 20 are arranged along one direction. Hereinafter, the direction in which the index module 10 and the processing module 20 are arranged is referred to as the first direction 92, and the direction perpendicular to the first direction 92 when viewed from the top is referred to as the second direction 94. And the direction perpendicular to both the first direction 92 and the second direction 94 is called the third direction 96.

The index module 10 transfers the substrate W from the container 80 in which the substrate W is stored to the processing module 20, and transfers the substrate W that has been processed in the processing module 20 to the container 80. Store it as The longitudinal direction of the index module 10 is provided in the second direction 94. The index module 10 has a load port 12 and an index frame 14. Based on the index frame 14, the load port 12 is located on the opposite side of the processing module 20. The container 80 containing the substrates W is placed in the load port 12. A plurality of load ports 12 may be provided, and the plurality of load ports 12 may be arranged along the second direction 94.

The container 80 may be an airtight container such as a Front Open Unified Pod (FOUP). The container 80 is placed in the load port 12 by a transport means (not shown) such as an overhead transfer, overhead conveyor, or Automatic Guided Vehicle, or by an operator. You can.

An index robot 120 is provided in the index frame 14. A guide rail 140 is provided in the second longitudinal direction 94 within the index frame 14, and the index robot 120 may be provided to be movable on the guide rail 140. The index robot 120 includes a hand 122 on which a substrate W is placed, and the hand 122 moves forward and backward, rotates about the third direction 96, and moves in the third direction 96. It can be provided so that it can be moved along. A plurality of hands 122 are provided to be spaced apart in the vertical direction, and the hands 122 can move forward and backward independently of each other.

The processing module 20 includes a buffer unit 200, a transfer device 300, a liquid processing device 400, and a supercritical device 500. The buffer unit 200 provides a space where the substrate W brought into the processing module 20 and the substrate W taken out from the processing module 20 temporarily stay. The liquid processing device 400 supplies liquid onto the substrate W and performs a liquid treatment process to treat the substrate W. The supercritical device 500 performs a drying process to remove liquid remaining on the substrate W. The transfer device 300 transfers the substrate W between the buffer unit 200, the liquid processing device 400, and the supercritical device 500.

The transfer device 300 may be provided with its longitudinal direction in the first direction 92 . The buffer unit 200 may be disposed between the index module 10 and the transfer device 300. The liquid processing device 400 and the supercritical device 500 may be disposed on the side of the transfer device 300. The liquid processing device 400 and the transfer device 300 may be arranged along the second direction 94 . The supercritical device 500 and the transfer device 300 may be arranged along the second direction 94. The buffer unit 200 may be located at one end of the transfer device 300.

According to one example, the liquid processing devices 400 are disposed on both sides of the conveying device 300, the supercritical devices 500 are disposed on both sides of the conveying device 300, and the liquid processing devices 400 are disposed on both sides of the conveying device 300. It may be placed closer to the buffer unit 200 than the devices 500. On one side of the transfer device 300, the liquid processing devices 400 may be provided in an A there is. In addition, on one side of the transfer device 300, the supercritical devices 500 will be provided in numbers C You can. Unlike the above, only liquid processing devices 400 may be provided on one side of the transfer device 300, and only supercritical devices 500 may be provided on the other side.

The transfer device 300 has a transfer robot 320 . A guide rail 340 whose longitudinal direction is provided in the first direction 92 is provided within the transfer device 300, and the transfer robot 320 may be provided to be able to move on the guide rail 340. The transfer robot 320 includes a hand 322 on which the substrate W is placed, and the hand 322 moves forward and backward, rotates about the third direction 96, and moves in the third direction 96. It can be provided so that it can be moved along. A plurality of hands 322 are provided to be spaced apart in the vertical direction, and the hands 322 can move forward and backward independently of each other.

The buffer unit 200 includes a plurality of buffers 220 on which the substrate W is placed. The buffers 220 may be arranged to be spaced apart from each other along the third direction 96. The buffer unit 200 has open front and rear faces. The front side faces the index module 10, and the back side faces the transfer device 300. The index robot 120 may access the buffer unit 200 through the front, and the transfer robot 320 may approach the buffer unit 200 through the rear.

FIG. 3 is a diagram schematically showing an embodiment of the liquid processing device 400 of FIG. 2. Referring to FIG. 3 , the liquid processing device 400 includes a housing 410, a cup 420, a support member 440, a liquid supply unit 460, a lifting unit 480, and a controller 40. The controller 40 controls the operations of the liquid supply unit 460, the support member 440, and the lifting unit 480. The housing 410 is provided in a generally rectangular parallelepiped shape. The cup 420, the support member 440, and the liquid supply unit 460 are disposed within the housing 410.

The cup 420 has a processing space with an open top, and the substrate W is liquid-processed within the processing space. The support member 440 supports the substrate W within the processing space. The liquid supply unit 460 supplies liquid onto the substrate W supported on the support member 440. Liquids are provided in multiple types and can be sequentially supplied onto the substrate W. The lifting unit 480 adjusts the relative height between the cup 420 and the support member 440.

According to one example, the cup 420 has a plurality of recovery bins 422, 424, and 426. The recovery containers 422, 424, and 426 each have a recovery space for recovering the liquid used for processing the substrate. Each of the recovery bins 422, 424, and 426 is provided in a ring shape surrounding the support member 440. When the liquid treatment process progresses, the pretreatment liquid scattered by the rotation of the substrate W flows into the recovery space through the inlets 422a, 424a, and 426a of each recovery container 422, 424, and 426. According to one example, the cup 420 has a first recovery container 422, a second recovery container 424, and a third recovery container 426. The first recovery container 422 is arranged to surround the support member 440, the second recovery container 424 is arranged to surround the first recovery container 422, and the third recovery container 426 is the second recovery container 426. It is arranged to surround the recovery container 424. The second inlet 424a, which flows liquid into the second recovery tank 424, is located above the first inlet 422a, which flows liquid into the first recovery tank 422, and the third recovery tank 426 The third inlet 426a through which liquid flows may be located above the second inlet 424a.

The support member 440 has a support plate 442 and a drive shaft 444. The upper surface of the support plate 442 is provided in a generally circular shape and may have a larger diameter than the substrate (W). A support pin 442a is provided at the center of the support plate 442 to support the rear side of the substrate W, and the upper end of the support pin 442a is a support plate ( 442). A chuck pin 442b is provided at the edge of the support plate 442.

The chuck pin 442b is provided to protrude upward from the support plate 442 and supports the side of the substrate W so that the substrate W does not separate from the support member 440 when the substrate W is rotated. The drive shaft 444 is driven by the driver 446, is connected to the center of the bottom of the substrate W, and rotates the support plate 442 about its central axis.

According to one example, the liquid supply unit 460 has a first nozzle 462, a second nozzle 464, and a third nozzle 466. The first nozzle 462 supplies the first liquid onto the substrate (W). The first liquid may be a liquid that removes films or foreign substances remaining on the substrate W. The second nozzle 464 supplies the second liquid onto the substrate (W). The second liquid may be a liquid that dissolves well in the third liquid. For example, the second liquid may be a liquid that dissolves better in the third liquid than the first liquid. The second liquid may be a liquid that neutralizes the first liquid supplied to the substrate (W). Additionally, the second liquid may be a liquid that neutralizes the first liquid and at the same time dissolves better in the third liquid than the first liquid.

According to one example, the second liquid may be water. The third nozzle 466 supplies the third liquid onto the substrate (W). The third liquid may be a liquid that dissolves well in the supercritical fluid used in the supercritical device 500. For example, the third liquid may be a liquid that is more soluble in the supercritical fluid used in the supercritical device 500 than the second liquid. According to one example, the third liquid may be an organic solvent. The organic solvent may be isopropyl alcohol (IPA). According to one example, the supercritical fluid may be carbon dioxide.

The first nozzle 462, the second nozzle 464, and the third nozzle 466 are supported on different arms 461, and these arms 461 can be moved independently. Optionally, the first nozzle 462, the second nozzle 464, and the third nozzle 466 may be mounted on the same arm and moved simultaneously.

The lifting unit 480 moves the cup 420 in the vertical direction. The relative height between the cup 420 and the substrate (W) changes as the cup 420 moves up and down. As a result, the recovery containers 422, 424, and 426 for recovering the pretreatment liquid are changed depending on the type of liquid supplied to the substrate W, so the liquids can be separated and recovered. Unlike the above-mentioned, the cup 420 is fixedly installed, and the lifting unit 480 can move the support member 440 in the vertical direction.

FIG. 4 is a diagram schematically showing an embodiment of the supercritical device 500 of FIG. 2. According to one embodiment, the supercritical device 500 removes liquid on the substrate W using a supercritical fluid. According to one embodiment, the liquid on the substrate W is isopropyl alcohol (IPA). The supercritical device 500 supplies the supercritical fluid to the substrate, dissolves the IPA on the substrate W in the supercritical fluid, and removes the IPA from the substrate W.

The supercritical device 500 includes a housing 510, a process chamber 520 provided inside the housing, and a sealing state measurement unit 1000.

A fluid supply unit 560 and an exhaust line 552 are connected to the process chamber 520, and a support unit 580 is placed inside the process chamber 520. The process chamber 520 provides a processing space 502 in which a cleaning process for cleaning the substrate W is performed. The process chamber 520 has a first body 522 and a second body 524, and the first body 522 and the second body 524 are combined with each other to provide the processing space 502 described above. In one example, the first body 522 is provided on top of the second body 524. In one example, the position of the first body 522 is fixed, and the second body 524 can be raised and lowered by a driving member 590 such as a cylinder. When the second body 524 is separated from the first body 522, the processing space 502 is opened, and at this time, the substrate W is carried in or out. Optionally, the position of the second body 524 may be fixed, and the first body 522 may be raised and lowered by a driving member 590 such as a cylinder.

During the cleaning process of cleaning the substrate W inside the processing space 502, the second body 524 is in close contact with the first body 522 and the processing space 502 is sealed from the outside. A heater 525 is provided inside the wall of the process chamber 520. The heater 525 heats the processing space 502 of the process chamber 520 so that the fluid supplied into the internal space of the process chamber 520 remains in a supercritical state. An atmosphere created by supercritical fluid is created inside the processing space 502.

The sealing member 600 is located between the first body 522 and the second body 524. In one example, the sealing member 600 is positioned in a groove formed in the second body. The groove is formed on the close contact surface of the second body 524 and the first body 522, and the sealing member 600 is formed on the bottom surface of the first body 522 or the top surface of the second body 524. provided to. In one example, a groove is provided on the top surface of the second body 524. The sealing member 600 is positioned to be inserted into a groove formed in the second body 524. In one example, the sealing member 600 is provided in an annular ring shape that can be inserted into a groove, as shown in FIG. 5 . Accordingly, the groove may also be provided to have an annular ring shape when viewed from the top.

The shape of the sealing member 600 is deformed by pressure inside the processing space 502. In one example, the sealing member 600 may be made of a material containing elasticity. When the processing space 502 has a high pressure higher than the normal pressure, that is, a critical pressure, the sealing member 600 is deformed in a direction from the processing space 502 toward the outside of the process chamber 520. The sealing member 600 is changed in shape and comes into close contact with the first body 522 and the second body 524, thereby sealing the gap between the first body 522 and the second body 524.

The support unit 580 supports the substrate W within the processing space 502 of the process chamber 520. The substrate W brought into the processing space 502 of the process chamber 520 is placed on the support unit 580. According to one example, the substrate W is supported by the support unit 580 with the pattern surface facing upward.

The fluid supply unit 560 supplies cleaning fluid for substrate processing to the processing space 502 of the process chamber 520. According to one example, the fluid supply unit 560 has a main supply line 562, an upper supply line 564, and a lower supply line 566. The main supply line 562 is connected to a fluid source (not shown) to supply supercritical fluid to the processing space 502. The upper supply line 564 and lower supply line 566 branch from the main supply line 562. Valves 565 and 567 are installed in the upper supply line 564 and lower supply line 566, respectively, to control whether supercritical fluid is supplied to each supply line and the supply flow rate.

In one example, the upper supply line 564 is connected to the center of the first body 522 and the lower supply line 566 is connected to the center of the second body 524. Additionally, an exhaust line 552 is coupled to the second body 524. In one example, the exhaust line 552 may be connected to the center of the second body 524. The supercritical fluid in the processing space 502 of the process chamber 520 is exhausted to the outside of the process chamber 520 through the exhaust line 552. An exhaust valve 555 is installed in the exhaust line 552 to control whether the exhaust line 552 is exhausted and the amount of exhaust.

Hereinafter, the sealing state measuring unit 1000 of the present invention will be described in detail with reference to FIGS. 6 and 7. FIG. 6 is a diagram schematically showing an airflow formed in the supercritical device 500 of FIG. 1, and FIG. 7 is a diagram showing another embodiment of the sealing state measuring unit 1000.

The sealing state measuring unit 1000 measures the state of the sealing member 600. For example, the sealing state measuring unit 1000 measures the roughness of the sealing member 600 or the concentration of fluid flowing out from the processing space 502 to the internal space 511 through the sealing member 600 to measure the roughness of the sealing member 600. Predict the remaining lifespan of In one example, the sealing state measuring unit 1000 includes a concentration sensor (not shown), an air flow forming unit 1050, a collecting unit 1010, a pressure reducing member 1030, and a controller.

A concentration sensor (not shown) measures the concentration of fluid flowing out of the processing space 502. The controller determines the state of the sealing member 600 based on whether the concentration of the fluid measured by the concentration sensor (not shown) is within a preset concentration range. The controller determines that the life of the sealing member 600 still remains when the concentration of the fluid flowing out from the processing space 502 to the internal space 511 is within a preset concentration range. In one example, the supercritical fluid flowing into the processing space 502 is carbon dioxide, which sinks down within the bar interior space 511 as it is heavier than air. Accordingly, the concentration sensor (not shown) is located below the position where the first body 522 and the second body 524 are in close contact with each other within the housing 510, and measures the concentration of carbon dioxide in the internal space 511. do.

The air flow forming unit 1050 and the collecting unit 1010 send the fluid to a concentration sensor (not shown) so that the concentration sensor (not shown) can easily measure the concentration of the fluid flowing out from the processing space 502 into the internal space 511 of the housing 510. It serves to gather the area where (not shown) is located.

In one example, the airflow forming unit 1050 generates a downward airflow in the internal space 511 of the housing 510. The airflow forming unit 1050 forms a descending airflow in the internal space 511 of the housing 510. The airflow forming unit 1050 includes an airflow supply line 1052, a fan 1056, and a filter 1054. Airflow supply line 1052 is connected to housing 510. The airflow supply line 1052 supplies external air to the housing 510. Filter 1054 filters air provided from airflow supply line 1052. The filter 1054 removes impurities contained in the air. The fan 1056 is installed on the upper surface of the housing 510. Fan 1056 is located in the central area of the upper surface of housing 510. The fan 1056 forms a downward airflow in the internal space 511 of the housing 510. When air is supplied to the fan 1056 from the airflow supply line 1052, the fan 1056 supplies air in a downward direction. In one example, the air flow forming unit 1050 may be installed in the housing 510 at a position opposite to the concentration sensor (not shown). Accordingly, the fluid flowing out of the processing space 502 into the internal space 511 easily flows into the concentration sensor (not shown) along the descending airflow formed by the airflow forming unit 1050.

In one example, a concentration sensor (not shown) is provided within the collection unit 1010. The collection unit 1010 becomes wider toward the top and has an opening that communicates with the internal space 511 of the housing 510. A cylindrical body part 1020 is provided at the lower part of the collection part 1010. The collection unit 1010 and the body unit 1020 are in communication. In one example, a pressure reduction line may be connected to the body portion 1020. The pressure reducing member 1030 depressurizes the space 1022 within the body portion 1020 through a pressure reducing line. Accordingly, the collection unit 1010 is depressurized. Since the upper part of the collecting unit 1010 has a wider opening than the lower part, the speed of fluid flowing into the collecting unit 1010 and the body part 1020 through the internal space 511 can be increased.

In one example, the sealing state measuring unit 1000 may further include an imaging member 1090 that measures the roughness of the surface of the sealing member 600. The controller determines the state of the sealing member 600 based on whether the illuminance measured by the imaging member 1090 is within a preset range. For example, when the illuminance of the sealing member 600 exceeds a preset range, it is determined that the life of the sealing member 600 has reached the end. As shown in FIG. 7 , the imaging member 1090 captures an image of the sealing member 600 exposed to the outside when the first body 522 and the second body 524 are spaced apart from each other and the process chamber 520 is opened. is photographed to measure the roughness of the surface of the sealing member 600.

According to the present invention, the state or lifespan of the sealing member 600 can be predicted, which has the advantage of preventing the internal fluid of the processing space 502 from escaping to the outside.

The above detailed description is illustrative of the present invention. Additionally, the foregoing is intended to illustrate preferred embodiments of the present invention, and the present invention can be used in various other combinations, modifications, and environments. That is, changes or modifications are possible within the scope of the inventive concept disclosed in this specification, the scope equivalent to the written disclosure, and/or the technology or knowledge in the art. The written examples illustrate the best state for implementing the technical idea of the present invention, and various changes required for specific application fields and uses of the present invention are also possible. Accordingly, the detailed description of the invention above is not intended to limit the invention to the disclosed embodiments. Additionally, the appended claims should be construed to include other embodiments as well.

502: Processing space
510: housing
520: Process chamber
600: No sealing member
1000: Sealing condition measurement unit
1010: Collection unit
1050: Airflow forming unit

Claims (9)

In a device for processing a substrate,
housing;
a first body and a second body placed inside the housing and combined with each other to form a processing space therein;
a support unit supporting a substrate within the processing space;
a fluid supply unit supplying fluid to the processing space; and,
a sealing member positioned between the first body and the second body to seal the processing space from the outside at a position where the first body and the second body are in close contact with each other;
It includes a sealing state measuring unit that measures the state of the sealing member,
The sealing condition measurement unit is,
a concentration sensor that measures the concentration of the fluid discharged from the processing space;
A controller that determines the state of the sealing member based on whether the concentration of the fluid measured by the concentration sensor is within a preset concentration range,
Further comprising an airflow forming unit installed in the housing to form a descending airflow inside the housing,
The concentration sensor is located below the position where the first body and the second body are in close contact with each other in the housing,
The air flow forming unit is installed in the housing at a position opposite to the concentration sensor. delete delete delete In a device for processing a substrate,
housing;
a first body and a second body placed inside the housing and combined with each other to form a processing space therein;
a support unit supporting a substrate within the processing space;
a fluid supply unit supplying fluid to the processing space;
a sealing member positioned between the first body and the second body to seal the processing space from the outside at a position where the first body and the second body are in close contact with each other; and
It includes a sealing state measuring unit that measures the state of the sealing member,
The sealing condition measurement unit is,
a concentration sensor that measures the concentration of the fluid discharged from the processing space;
a controller that determines the state of the sealing member based on whether the concentration of the fluid measured by the concentration sensor is within a preset concentration range;
It further includes a collecting part that becomes wider toward the top and has an opening that communicates with the internal space of the housing,
The concentration sensor is a substrate processing device provided in the collection unit. According to clause 5,
The sealing condition measurement unit is,
A substrate processing device further comprising a pressure reduction unit that provides reduced pressure to the collection unit. In a device for processing a substrate,
housing;
a first body and a second body placed inside the housing and combined with each other to form a processing space therein;
a support unit supporting a substrate within the processing space;
a fluid supply unit supplying fluid to the processing space;
a sealing member positioned between the first body and the second body to seal the processing space from the outside at a position where the first body and the second body are in close contact with each other; and
It includes a sealing state measuring unit that measures the state of the sealing member,
The sealing condition measurement unit,
a concentration sensor that measures the concentration of the fluid discharged from the processing space;
a controller that determines the state of the sealing member based on whether the concentration of the fluid measured by the concentration sensor is within a preset concentration range;
Further comprising an imaging member that measures the roughness of the surface of the sealing member,
The controller is,
A substrate processing device that determines the state of the sealing member based on whether the illuminance measured by the imaging member is within a preset range. According to paragraph 1,
The first body is a substrate processing device located on top of the second body. According to any one of claims 1, 5 to 8,
A substrate processing device wherein the fluid supplied into the processing space is carbon dioxide in a supercritical state.