KR102653479B1 - Photosensitive resin composition, photosensitive resin layer and semiconductor device using the same - Google Patents

Abstract

(A) a polyhydroxyamide-based resin containing a structural unit represented by the following formula (1); (B) photopolymerizable compound; (C) photopolymerization initiator; (D) an additive comprising a sulfide linkage group or a disulfide linkage group and at least one carboxyl group at the terminal; and (E) a solvent, a photosensitive resin composition containing the same, a photosensitive resin film manufactured using the same, and a semiconductor device comprising the photosensitive resin film.
[Formula 1]

(In Formula 1 above, each substituent is as defined in the specification.)

Description

Photosensitive resin composition, photosensitive resin film and semiconductor device using the same {PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN LAYER AND SEMICONDUCTOR DEVICE USING THE SAME}

This description relates to a photosensitive resin composition, a photosensitive resin film using the same, and a semiconductor device.

A method of sealing a semiconductor device with an epoxy resin composition is being commercially used for the purpose of protecting the semiconductor device from external environments such as moisture or mechanical shock. Conventionally, semiconductor chips were manufactured by dicing wafers when sealing semiconductor devices, and then packaging was performed on a semiconductor chip basis. However, recently, packaging has been performed on uncut wafers or larger panels. Next, a process for dicing into semiconductor chips was developed. Generally, the former method is called chip scale packaging (CSP), and the latter process is called wafer level packaging (WLP) and panel level packaging (PLP).

Wafer-level packaging has the advantage of having a higher process yield compared to the chip-scale packaging process and reducing the semiconductor mounting space due to the thinner package. However, in the case of wafer-level packaging or panel-level packaging, the film deposition area is larger than chip-scale packaging that seals individual chips, so there is a problem that large warpage occurs due to the difference in thermal expansion rates between the wafer or panel and the encapsulant. If warpage occurs, it affects the yield and wafer handling of subsequent processes. In addition, liquid-type epoxy resin or silicone resin is currently mainly used as a sealant for wafer-level packaging or panel-level packaging. However, in the case of liquid-type compositions, the content of inorganic fillers is low and the resin also uses liquid single molecules. There is a problem that the reliability of the semiconductor package is weak after sealing.

Therefore, there is a need for the development of an insulating film for a redistriburion layer (RDL) that is less prone to warping and can achieve excellent reliability even when applying wafer-level packaging or panel-level packaging.

In order to meet the above requirements, the development of photosensitive resin compositions capable of forming an insulating film for a redistribution layer continues, and in general, photosensitive polyimide resin compositions in which photosensitivity is imparted to the polyimide resin itself have been mainly used. This is because the pattern formation process can be simplified by using a photosensitive polyimide resin composition. However, in the case of the insulating film (cured film) for the redistribution layer manufactured using a conventional photosensitive polyimide resin composition, there is a problem of reduced corrosion resistance and chemical resistance, and in particular, the resin for the insulating film for the redistribution layer requires low-temperature curing. Conventional photosensitive polyimide resins have a problem in that they cannot be cured at low temperatures and therefore cannot achieve high heat resistance and high reliability.

In one embodiment, a polyhydroxyamide-based resin having a specific structure is used together with 'an additive containing a sulfide linkage group or a disulfide linkage group and containing at least one carboxyl group at the end,' to improve adhesion to copper in the redistribution layer. By improving this, the aim is to provide a photosensitive resin composition that can be usefully used as an interlayer insulating film between semiconductor redistribution lines.

Another embodiment is to provide a photosensitive resin film manufactured using the photosensitive resin composition.

Another embodiment is to provide a semiconductor device including the photosensitive resin film.

One embodiment includes (A) a polyhydroxyamide-based resin containing a structural unit represented by the following formula (1); (B) photopolymerizable compound; (C) photopolymerization initiator; (D) an additive comprising a sulfide linkage group or a disulfide linkage group and at least one carboxyl group at the terminal; and (E) a solvent.

[Formula 1]

In Formula 1,

X ¹ is a residue derived from an anhydride monomer,

Y ¹ is a residue derived from a diamine monomer,

R ¹ and R ² are each independently a substituted or unsubstituted C1 to C20 alkyl group, a substituted or unsubstituted C3 to C20 cycloalkyl group, a substituted or unsubstituted C6 to C20 aryl group, or a substituted or unsubstituted C2 to C20 hetero It's a ring.

The additive may be represented by the following formula (2).

[Formula 2]

In Formula 2,

R ³ is a substituted or unsubstituted C1 to C20 alkyl group or a substituted or unsubstituted C6 to C20 aryl group,

L ¹ is a single bond, a substituted or unsubstituted C1 to C20 alkylene group or a substituted or unsubstituted C6 to C20 arylene group,

L ² is a substituted or unsubstituted C1 to C20 alkylene group or a substituted or unsubstituted C6 to C20 arylene group.

In Formula 2, L ² may be a C6 to C20 arylene group substituted or unsubstituted with a carboxyl group.

The additive represented by Formula 2 may be represented by any one of the following Formulas 2-1 to 2-6.

[Formula 2-1]

[Formula 2-2]

[Formula 2-3]

[Formula 2-4]

[Formula 2-5]

[Formula 2-6]

The additive may be represented by the following formula (3).

[Formula 3]

In Formula 3 above,

L ³ to L ⁷ are each independently a single bond, a sulfide linkage group, a disulfide linkage group, a substituted or unsubstituted C1 to C20 alkylene group, a substituted or unsubstituted C6 to C20 arylene group, or a divalent thiophene linkage group, At least one of L ³ to L ⁷ must be a sulfide linkage group, a disulfide linkage group, or a divalent thiophene linkage group.

When any one or more of the L ³ to L ⁷ is a substituted or unsubstituted C1 to C20 alkylene group, it is a 'C1 to C20 alkylene group substituted with a C1 to C10 alkyl group', 'C1 to C20 alkylene group substituted with a carboxyl group. ' or 'unsubstituted C1 to C20 alkylene group'.

The additive represented by Formula 3 may be represented by any one of the following Formulas 3-1 to 3-12.

[Formula 3-1]

[Formula 3-2]

[Formula 3-3]

[Formula 3-4]

[Formula 3-5]

[Formula 3-6]

[Formula 3-7]

[Formula 3-8]

[Formula 3-9]

[Formula 3-10]

[Formula 3-11]

[Formula 3-12]

The additive may be included in an amount of 1 to 20 parts by weight based on 100 parts by weight of the polyhydroxyamide-based resin.

The anhydride monomer may be represented by the following formula (X-1).

[Formula X-1]

In Formula X-1,

L ⁸ is a single bond, *-O-*, *-S-*, *-C(=O)-*, *-C(=O)O-*, -*NR ⁴ -*(R ⁴ is hydrogen Atom or substituted or unsubstituted C1 to C10 alkyl group), substituted or unsubstituted C1 to C20 alkylene group, substituted or unsubstituted C6 to C20 arylene group, substituted or unsubstituted C2 to C20 heterocyclic linking group, or a combination thereof am.

The diamine monomer may be represented by the following formula Y-1 or formula Y-2.

[Formula Y-1]

[Formula Y-2]

In the above formula Y-2,

R ⁵ and R ⁶ are each independently a halogen atom, a hydroxy group, a substituted or unsubstituted C1 to C20 alkyl group, or a substituted or unsubstituted C1 to C20 alkoxy group,

L ⁹ is *-O-* or *-S-*,

n1 and n2 are each independently integers from 0 to 4.

The photosensitive resin composition includes the photopolymerizable compound in an amount of 1 to 10 parts by weight, the photopolymerization initiator in an amount of 1 to 10 parts by weight, based on 100 parts by weight of the polyhydroxyamide-based resin, and the additive. may be included in an amount of 1 to 20 parts by weight, and the solvent may be included in an amount of 100 to 500 parts by weight.

The photosensitive resin composition may further include diacid, alkanolamine, leveling agent, silane coupling agent, surfactant, epoxy compound, thermal latent acid generator, or a combination thereof.

The photosensitive resin composition may be a negative photosensitive resin composition.

Another embodiment provides a photosensitive resin film manufactured using the photosensitive resin composition.

Another embodiment provides a semiconductor device including the photosensitive resin film.

Details of other aspects of the invention are included in the detailed description below.

The photosensitive resin composition according to one embodiment includes a polyhydroxyamide-based resin having a specific structure, a sulfide linkage group or a disulfide linkage group, and an additive containing one or more carboxyl groups at the terminal, to form a metal layer (e.g., copper layer and titanium layer), it is possible to implement an insulating film for a semiconductor redistribution layer with excellent heat resistance and reliability.

Figure 1 is a schematic diagram of a die shear tester device for evaluating the adhesion of a photosensitive resin composition.

Hereinafter, embodiments of the present invention will be described in detail. However, this is presented as an example, and the present invention is not limited thereby, and the present invention is only defined by the scope of the claims to be described later.

Unless otherwise specified herein, “alkyl group” refers to a C1 to C20 alkyl group, “alkenyl group” refers to a C2 to C20 alkenyl group, and “cycloalkenyl group” refers to a C3 to C20 cycloalkenyl group. , “Heterocycloalkenyl group” refers to a C3 to C20 heterocycloalkenyl group, “aryl group” refers to a C6 to C20 aryl group, “arylalkyl group” refers to a C7 to C20 arylalkyl group, and “alkylene group” means a C1 to C20 alkylene group, “arylene group” means a C6 to C20 arylene group, “alkylarylene group” means a C7 to C20 alkylarylene group, and “heteroarylene group” means a C3 to C20 heteroarylene group. It means an arylene group, and “alkoxylene group” means a C1 to C20 alkoxylene group.

Unless otherwise specified herein, “substitution” means a C1 to C20 alkyl group, hydroxy group, C1 to C20 alkoxy group in which at least one hydrogen atom is replaced with a halogen atom such as a halogen atom (F, Cl, Br, I), trifluoromethyl group, etc. group, nitro group, cyano group, amine group, imino group, azido group, amidino group, hydrazino group, hydrazono group, carbonyl group, carbamyl group, thiol group, ester group, ether group, carboxyl group or a salt thereof, Sulfonic acid group or its salt, phosphoric acid or its salt, C1 to C20 alkyl group, C2 to C20 alkenyl group, C2 to C20 alkynyl group, C6 to C20 aryl group, C3 to C20 cycloalkyl group, C3 to C20 cycloalkenyl group, C3 to C20 cycloalkynyl group, C2 to C20 heterocycloalkyl group, C2 to C20 heterocycloalkenyl group, C2 to C20 heterocycloalkynyl group, C3 to C20 heteroaryl group, or a combination thereof.

Also, unless otherwise specified herein, “hetero” means that at least one hetero atom of N, O, S, and P is included in the chemical formula.

Additionally, unless otherwise specified in the specification, “(meth)acrylate” means that both “acrylate” and “methacrylate” are possible.

Unless otherwise defined herein, “combination” means mixing or copolymerization. Additionally, “copolymer” means block copolymerization, alternating copolymerization, or random copolymerization, and “copolymer” means block copolymer, alternating copolymer, or random copolymerization.

Unless otherwise specified in the specification, unsaturated bonds include not only multiple bonds between carbon and carbon atoms, but also those containing other molecules, such as carbonyl bonds and azo bonds.

Unless otherwise defined in the chemical formulas in this specification, if a chemical bond is not drawn at a position where a chemical bond should be drawn, it means that a hydrogen atom is bonded at that position.

Unless otherwise defined herein, “*” means a portion connected to the same or different atom or chemical formula.

A photosensitive resin composition according to one embodiment includes (A) a polyhydroxyamide-based resin containing a structural unit represented by the following formula (1); (B) photopolymerizable compound; (C) photopolymerization initiator; (D) an additive comprising a sulfide linkage group or a disulfide linkage group and at least one carboxyl group at the terminal; and (E) a solvent.

[Formula 1]

In Formula 1,

X ¹ is a residue derived from an anhydride monomer,

Y ¹ is a residue derived from a diamine monomer,

R ¹ and R ² are each independently a substituted or unsubstituted C1 to C20 alkyl group, a substituted or unsubstituted C3 to C20 cycloalkyl group, a substituted or unsubstituted C6 to C20 aryl group, or a substituted or unsubstituted C2 to C20 hetero It's a ring.

For example, R ¹ and R ² may each independently be a C1 to C20 alkyl group substituted or unsubstituted with a (meth)acrylate group at the terminal.

Below, each component is described in detail.

(A) Polyhydroxyamide-based resin

The polyhydroxyamide-based resin used in the photosensitive resin composition according to one embodiment includes a structural unit represented by Formula 1 above.

The polyhydroxyamide-based resin containing the structural unit represented by Formula 1 can very easily improve adhesion to metal layers (especially copper layers and titanium layers) by using it with additives described later, and in addition, negative type resin It is also easy to apply to the composition to greatly improve developability.

In general, alkali-soluble resins with a closed ring structure have the problem of slightly deteriorating film properties when cured at low temperatures, but polyhydroxyamide-based resins containing structural units represented by Formula 1 are used with additives described later, The photosensitive resin composition according to one embodiment is suitable for low-temperature curing and can provide an insulating film (cured film) with excellent film properties.

For example, the polyhydroxyamide-based resin containing the structural unit represented by Formula 1 may be a polymer between an anhydride monomer and a diamine monomer.

For example, the diamine monomer may be represented by the following formula Y-1 or the following formula Y-2.

[Formula Y-1]

[Formula Y-2]

In the above formula Y-2,

R ⁵ and R ⁶ are each independently a halogen atom, a hydroxy group, a substituted or unsubstituted C1 to C20 alkyl group, or a substituted or unsubstituted C1 to C20 alkoxy group,

L ⁹ is *-O-* or *-S-*,

n1 and n2 are each independently integers from 0 to 4.

For example, the anhydride monomer may include a monomer represented by the following formula (X-1), but is not necessarily limited thereto.

[Formula X-1]

In Formula X-1,

L ⁸ is a single bond, *-O-*, *-S-*, *-C(=O)-*, *-C(=O)O-*, -*NR ⁴ -*(R ⁴ is hydrogen Atom or substituted or unsubstituted C1 to C10 alkyl group), substituted or unsubstituted C1 to C20 alkylene group, substituted or unsubstituted C6 to C20 arylene group, substituted or unsubstituted C2 to C20 heterocyclic linking group, or a combination thereof am.

For example, when L ⁸ is a substituted or unsubstituted C1 to C20 alkylene group, it may be a C1 to C20 alkylene group substituted or unsubstituted with a trifluoroalkyl group.

The weight average molecular weight (M _w ) of the polyhydroxyamide-based resin may be 3,000 g/mol to 300,000 g/mol. When the weight average molecular weight of the polyhydroxyamide-based resin is within the above range, sufficient physical properties can be obtained, and its solubility in organic solvents is excellent, making it easy to handle.

(B) Photopolymerizable compound

The photopolymerizable compound in the photosensitive resin composition according to one embodiment may be a single compound or a mixture of two different types of compounds.

When the photopolymerizable compound is a mixture of two different types of compounds, one of the two types of compounds may be a compound containing at least two functional groups represented by the following formula (4).

[Formula 4]

In Formula 4 above,

R ¹⁰⁰ is a hydrogen atom or a substituted or unsubstituted C1 to C10 alkyl group,

L ¹⁰⁰ is a single bond or a substituted or unsubstituted C1 to C10 alkylene group.

For example, a compound containing at least two functional groups represented by Formula 4 may include 2 to 6 functional groups represented by Formula 4. In this case, sufficient polymerization occurs during exposure in the pattern formation process to form a pattern with excellent heat resistance, light resistance, and chemical resistance.

For example, the compound containing at least two functional groups represented by Formula 4 may be a compound represented by Formula 5 or Formula 6 below.

[Formula 5]

[Formula 6]

In Formula 5 and Formula 6 above,

p, q, r and s are each independently integers from 1 to 10.

When the photopolymerizable compound is a mixture of two different types of compounds, the other one of the two types of compounds may be a monofunctional or multifunctional ester compound of (meth)acrylic acid having at least one ethylenically unsaturated double bond. there is.

Monofunctional or multifunctional ester compounds of (meth)acrylic acid having at least one ethylenically unsaturated double bond include, for example, ethylene glycol di(meth)acrylate, diethylene glycol di(meth)acrylate, triethylene glycol di( Meth)acrylate, propylene glycol di(meth)acrylate, neopentyl glycol di(meth)acrylate, 1,4-butanediol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, bisphenol A di(meth)acrylate, pentaerythritol di(meth)acrylate, pentaerythritol tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, pentaerythritol hexa(meth)acrylate, dipenta Erythritol di(meth)acrylate, dipentaerythritol tri(meth)acrylate, dipentaerythritol penta(meth)acrylate, dipentaerythritol hexa(meth)acrylate, bisphenol A epoxy(meth)acrylate , ethylene glycol monomethyl ether (meth)acrylate, trimethylolpropane tri(meth)acrylate, tris(meth)acryloyloxyethyl phosphate, novolac epoxy (meth)acrylate, or a combination thereof.

Examples of commercially available products of mono- or multi-functional ester compounds of (meth)acrylic acid having at least one ethylenically unsaturated double bond are as follows. Examples of the monofunctional ester of (meth)acrylic acid include Aronix M-101 ^® , Aronix M-111 ^® , and Aronix M-114 ^® manufactured by Toagosei Chemical Co., Ltd.; Nihon Kayaku Co., Ltd.'s KAYARAD TC-110S ^® , KAYARAD TC-120S ^® , etc.; Examples include V-158 ^® and V-2311 ^® manufactured by Osaka Yuki Chemical Industry Co., Ltd. Examples of the above-mentioned difunctional ester of (meth)acrylic acid include Aronix M-210 ^® , Aronix M-240 ^® , and Aronix M-6200 ^® manufactured by Toagosei Chemical Co., Ltd.; Nihon Kayaku Co., Ltd.'s KAYARAD HDDA ^® , KAYARAD HX-220 ^® , KAYARAD R-604 ^® , etc.; Examples include V-260 ^® , V-312 ^® , and V-335 HP ^® manufactured by Osaka Yuki Chemical Industry Co., Ltd. Examples of the trifunctional ester of (meth)acrylic acid include Aronix M-309 ^® , Aronix M-400 ^® , Aronix M-405 ^® , and Aronix M-450 ^® manufactured by Toagosei Chemical Co., Ltd. , Aronix M-7100 ^® , Aronix M-8030 ^® , Aronix M-8060 ^{® ,} etc.; Nihon Kayaku Co., Ltd.'s KAYARAD TMPTA ^® , KAYARAD DPCA-20 ^® , KAYARAD DPCA-30 ^® , KAYARAD DPCA-60 ^® , KAYARAD DPCA-120 ^® , etc.; Examples include V-295 ^® , V-300 ^® , V-360 ^® , V-GPT ^® , V-3PA ^® , and V-400 ^® manufactured by Osaka Yuki Kayaku Kogyo Co., Ltd. The above products can be used alone or in combination of two or more types.

The photopolymerizable compound may be used by treating it with an acid anhydride to provide better developability.

The photopolymerizable compound may be included in an amount of 1 to 10 parts by weight, for example, 1 to 7 parts by weight, based on 100 parts by weight of the polyhydroxyamide. When the photopolymerizable compound is contained within the above range, curing occurs sufficiently, reliability is excellent, heat resistance, light resistance, and chemical resistance of the pattern are excellent, and resolution and adhesion are also excellent.

(C) Photopolymerization initiator

The photosensitive resin composition according to one embodiment includes a photopolymerization initiator. The photopolymerization initiator may be an acetophenone-based compound, a benzophenone-based compound, a thioxanthone-based compound, a benzoin-based compound, a triazine-based compound, or an oxime-based compound.

Examples of the acetophenone-based compounds include 2,2'-diethoxy acetophenone, 2,2'-dibutoxy acetophenone, 2-hydroxy-2-methylpropiophenone, p-t-butyltrichloro acetophenone, p-t -Butyldichloro acetophenone, 4-chloro acetophenone, 2,2'-dichloro-4-phenoxy acetophenone, 2-methyl-1-(4-(methylthio)phenyl)-2-morpholinopropane-1 -one, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butan-1-one, etc.

Examples of the benzophenone-based compounds include benzophenone, benzoyl benzoic acid, methyl benzoyl benzoate, 4-phenyl benzophenone, hydroxy benzophenone, acrylated benzophenone, 4,4'-bis(dimethylamino)benzophenone, 4,4 '-bis(diethylamino)benzophenone, 4,4'-dimethylaminobenzophenone, 4,4'-dichlorobenzophenone, 3,3'-dimethyl-2-methoxybenzophenone, etc.

Examples of the thioxanthone-based compounds include thioxanthone, 2-chlorothioxanthone, 2-methylthioxanthone, isopropyl thioxanthone, 2,4-diethyl thioxanthone, 2,4-diiso Propyl thioxanthone, etc. can be mentioned.

Examples of the benzoin-based compound include benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, and benzyldimethyl ketal.

Examples of the triazine-based compounds include 2,4,6-trichloro-s-triazine, 2-phenyl 4,6-bis(trichloromethyl)-s-triazine, 2-(3',4'- Dimethoxystyryl)-4,6-bis(trichloromethyl)-s-triazine, 2-(4'-methoxynaphthyl)-4,6-bis(trichloromethyl)-s-triazine, 2-(p-methoxyphenyl)-4,6-bis(trichloromethyl)-s-triazine, 2-(p-tolyl)-4,6-bis(trichloromethyl)-s-triazine, 2-Biphenyl 4,6-bis(trichloromethyl)-s-triazine, bis(trichloromethyl)-6-styryl-s-triazine, 2-(naphtho1-yl)-4,6 -bis(trichloromethyl)-s-triazine, 2-(4-methoxynaphtho1-yl)-4,6-bis(trichloromethyl)-s-triazine, 2-4-bis(trichlor Romethyl)-6-piperonyl-s-triazine, 2-4-bis(trichloromethyl)-6-(4-methoxystyryl)-s-triazine, etc. can be mentioned.

Examples of the oxime-based compounds include O-acyloxime-based compounds, 2-(O-benzoyloxime)-1-[4-(phenylthio)phenyl]-1,2-octanedione, 1-(O-acetyloxime) -1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]ethanone, O-ethoxycarbonyl-α-oxyamino-1-phenylpropan-1-one, etc. can be used. Specific examples of the O-acyloxime compounds include 1,2-octanedione, 2-dimethylamino-2-(4-methylbenzyl)-1-(4-morpholin-4-yl-phenyl)-butane -1-one, 1-(4-phenylsulfanylphenyl)-butane-1,2-dione-2-oxime-O-benzoate, 1-(4-phenylsulfanylphenyl)-octane-1,2- Dione-2-oxime-O-benzoate, 1-(4-phenylsulfanylphenyl)-octan-1-oneoxime-O-acetate and 1-(4-phenylsulfanylphenyl)-butan-1-oneoxime -O-acetate, etc. can be used.

In addition to the above compounds, the photopolymerization initiator may include carbazole-based compounds, diketone-based compounds, sulfonium borate-based compounds, diazo-based compounds, imidazole-based compounds, biimidazole-based compounds, and fluorene-based compounds.

The photopolymerization initiator may be included in an amount of 1 to 10 parts by weight, for example, 1 to 7 parts by weight, based on 100 parts by weight of the polyhydroxyamide. When the photopolymerization initiator is included within the above range, photopolymerization sufficiently occurs, resulting in excellent sensitivity and improved transmittance.

(D) an additive comprising a sulfide linkage or disulfide linkage and containing at least one carboxyl group at the terminal

The photosensitive resin composition according to one embodiment includes the sulfide linkage group or the disulfide linkage group, and includes an additive containing at least one carboxyl group at the terminal.

Since the additive contains a sulfide linkage group or a disulfide linkage group and one or more carboxyl groups at the terminal, it can be used with the above-described polyhydroxyamide resin to form a photosensitive resin composition that is advantageous for low temperature curing. , the adhesion with metal layers (especially copper and titanium layers) is greatly improved, making it very suitable for use as an insulating film between semiconductor redistribution layers.

Specifically, the sulfide linkage or disulfide linkage group in the additive can improve adhesion between the metal layer and the titanium layer, and the carboxyl group can improve adhesion with the polyhydroxyamide-based resin. In one embodiment, The photosensitive resin composition according to the present invention is very advantageous for use as an insulating film for a semiconductor redistribution layer.

For example, the additive may be represented by Formula 2 or Formula 3 below.

[Formula 2]

In Formula 2,

R ³ is a substituted or unsubstituted C1 to C20 alkyl group or a substituted or unsubstituted C6 to C20 aryl group,

L ¹ is a single bond, a substituted or unsubstituted C1 to C20 alkylene group or a substituted or unsubstituted C6 to C20 arylene group,

L ² is a substituted or unsubstituted C1 to C20 alkylene group or a substituted or unsubstituted C6 to C20 arylene group.

[Formula 3]

In Formula 3 above,

L ³ to L ⁷ are each independently a single bond, a sulfide linkage group, a disulfide linkage group, a substituted or unsubstituted C1 to C20 alkylene group, a substituted or unsubstituted C6 to C20 arylene group, or a divalent thiophene linkage group, At least one of L ³ to L ⁷ must be a sulfide linkage group, a disulfide linkage group, or a divalent thiophene linkage group.

Generally, the copper layer in the semiconductor redistribution layer contains a small amount of titanium in addition to copper, and the additives represented by Formula 2 or Formula 3 all have a sulfide linkage group or a disulfide linkage group, which is advantageous in improving adhesion with the titanium, and the copper layer It can be easily predicted that the adhesive strength will be very excellent.

For example, in Formula 2, L ² may be a C6 to C20 arylene group substituted or unsubstituted with a carboxyl group.

For example, the additive represented by Formula 2 may be represented by any one of the following Formulas 2-1 to 2-6, but is not necessarily limited thereto.

[Formula 2-1]

[Formula 2-2]

[Formula 2-3]

[Formula 2-4]

[Formula 2-5]

[Formula 2-6]

For example, in Formula 3, when at least one of L ³ to L ⁷ is a substituted or unsubstituted C1 to C20 alkylene group, it is a C1 to C20 alkylene group substituted with a C1 to C10 alkyl group, or a C1 to C20 alkylene group substituted with a carboxyl group. It may be a C20 alkylene group or an unsubstituted C1 to C20 alkylene group.

For example, the additive represented by Formula 3 may be represented by any one of the following Formulas 3-1 to 3-12, but is not necessarily limited thereto.

[Formula 3-1]

[Formula 3-2]

[Formula 3-3]

[Formula 3-4]

[Formula 3-5]

[Formula 3-6]

[Formula 3-7]

[Formula 3-8]

[Formula 3-9]

[Formula 3-10]

[Formula 3-11]

[Formula 3-12]

The additive may be included in an amount of 1 to 20 parts by weight, for example, 5 to 15 parts by weight, based on 100 parts by weight of the polyhydroxyamide-based resin. When the additive is included in the above range, adhesion to the copper layer and titanium layer and to the polyhydroxyamide-based resin can be improved simultaneously.

(E) Solvent

The solvent may be a material that is compatible with, but does not react with, the polyhydroxyamide-based resin, the photopolymerizable compound, the photopolymerization initiator, and the additive.

Examples of the solvent include alcohols such as methanol and ethanol; ethers such as dichloroethyl ether, n-butyl ether, diisoamyl ether, methylphenyl ether, and tetrahydrofuran; Glycol ethers such as ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, and ethylene glycol dimethyl ether; Cellosolve acetates such as methyl cellosolve acetate, ethyl cellosolve acetate, and diethyl cellosolve acetate; Carbitols such as methyl ethyl carbitol, diethyl carbitol, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol dimethyl ether, diethylene glycol ethyl methyl ether, and diethylene glycol diethyl ether; Propylene glycol alkyl ether acetates such as propylene glycol methyl ether acetate and propylene glycol propyl ether acetate; Aromatic hydrocarbons such as toluene and xylene; Ketones such as methyl ethyl ketone, cyclohexanone, 4-hydroxy-4-methyl-2-pentanone, methyl-n-propyl ketone, methyl-n-butyl ketone, methyl-n-amyl ketone, and 2-heptanone ; Saturated aliphatic monocarboxylic acid alkyl esters such as ethyl acetate, n-butyl acetate, and isobutyl acetate; Lactic acid esters such as methyl lactate and ethyl lactate; Alkyl oxyacetic acid esters such as methyl oxyacetate, ethyl oxyacetate, and butyl oxyacetate; Alkoxy acetic acid alkyl esters such as methyl methoxy acetate, ethyl methoxy acetate, butyl methoxy acetate, methyl ethoxy acetate, and ethyl ethoxy acetate; 3-oxypropionic acid alkyl esters such as methyl 3-oxypropionate and ethyl 3-oxypropionate; 3-alkoxypropionic acid alkyl esters such as methyl 3-methoxypropionate, ethyl 3-methoxypropionate, ethyl 3-ethoxypropionate, and methyl 3-ethoxypropionate; 2-oxypropionic acid alkyl esters such as methyl 2-oxypropionate, ethyl 2-oxypropionate, and propyl 2-oxypropionate; 2-alkoxypropionic acid alkyl esters such as methyl 2-methoxypropionate, ethyl 2-methoxypropionate, ethyl 2-ethoxypropionate, and methyl 2-ethoxypropionate; 2-oxy-2-methylpropionate esters such as methyl 2-oxy-2-methylpropionate, ethyl 2-oxy-2-methylpropionate, 2-methoxy-2-methylpropionate methyl, 2-ethoxy-2- Monooxymonocarboxylic acid alkyl esters of alkyl 2-alkoxy-2-methylpropionate such as ethyl methylpropionate; esters such as ethyl 2-hydroxypropionate, ethyl 2-hydroxy-2-methylpropionate, ethyl hydroxyacetate, and methyl 2-hydroxy-3-methylbutanoate; Keto acid esters such as ethyl pyruvate, etc. Also include N-methylformamide, N,N-dimethylformamide, N-methylformanilad, N-methylacetamide, and N,N-dimethylacetamide. , N-methylpyrrolidone, dimethyl sulfoxide, benzyl ethyl ether, dihexyl ether, acetylacetone, isophorone, caproic acid, caprylic acid, 1-octanol, 1-nonanol, benzyl alcohol, benzyl acetate, benzoic acid. High boiling point solvents such as ethyl, diethyl oxalate, diethyl maleate, γ-butyrolactone, 3-methylbenzoic acid, ethylene carbonate, propylene carbonate, and phenyl cellosolve acetate can be mentioned.

The solvent may be included in an amount of 100 to 500 parts by weight based on 100 parts by weight of the polyhydroxyamide-based resin. When the solvent is contained within the above range, the photosensitive resin composition has an appropriate viscosity and thus the processability in manufacturing the photosensitive resin film is excellent.

(F) Other additives

The photosensitive resin composition according to one embodiment may further include other additives.

The photosensitive resin composition contains diacid (e.g. malonic acid, etc.), alkanolamine (e.g. 3-amino-1,2- propanediol, etc.), a leveling agent, a silane coupling agent, a surfactant, an epoxy compound, a thermal latent acid generator, a development control agent, a curing agent, or a combination of additives thereof. The amount of these additives used can be easily adjusted depending on the desired physical properties.

For example, the silane coupling agent may have a reactive substituent such as a vinyl group, carboxyl group, methacryloxy group, isocyanate group, or epoxy group to improve adhesion to the substrate.

Examples of the silane coupling agent include trimethoxysilylbenzoic acid, γ-methacryloxypropyltrimethoxysilane, vinyltriacetoxysilane, vinyltrimethoxysilane, γ-isocyanatepropyltriethoxysilane, and γ-glycylate. Examples include doxypropyltrimethoxysilane, β-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, and these can be used alone or in a mixture of two or more types.

The silane coupling agent may be included in an amount of 0.01 to 10 parts by weight based on 100 parts by weight of the photosensitive resin composition. When the silane-based coupling agent is included within the above range, adhesion, storage, etc. may be excellent.

For example, the surfactant is added to prevent film thickness unevenness or improve developability, and may include a fluorine-based surfactant and/or a silicone-based surfactant.

Examples of the fluorine-based surfactants include BM-1000 ^® and BM-1100 ^® from BM Chemie; Mechapack F 142D ^® , Mechapack F 172 ^® , Mechapack F 173 ^® , Mechapack F 183 ^® , Mechapack F 554 ^® , etc. from Dainippon Inki Chemicals Co., Ltd.; Sumitomo 3M Co., Ltd.'s Prorad FC-135 ^® , Prorad FC-170C ^® , Prorad FC-430 ^® , Prorad FC-431 ^® , etc.; Asahi Grass Co., Ltd.'s Saffron S-112 ^® , Saffron S-113 ^® , Saffron S-131 ^® , Saffron S-141 ^® , Saffron S-145 ^® , etc.; Those commercially available under names such as SH-28PA ^® , SH-190 ^® , SH-193 ^® , SZ-6032 ^® , and SF-8428 ^® from Toray Silicone Co., Ltd. can be used.

The silicone-based surfactants include BYK-307, BYK-333, BYK-361N, BYK-051, BYK-052, BYK-053, BYK-067A, BYK-077, BYK-301, BYK-322, manufactured by BYK Chem. Those commercially available under names such as BYK-325 and BYK-378 can be used.

The surfactant may be used in an amount of 0.001 to 5 parts by weight based on 100 parts by weight of the photosensitive resin composition. When the surfactant is contained within the above range, coating uniformity can be secured, stains cannot occur, and wetting on an ITO substrate or glass substrate can be excellent.

Additionally, the photosensitive resin composition may further include an epoxy compound as an additive to improve adhesion. The epoxy compound may be epoxy novolac acrylic carboxylate resin, ortho-cresol novolak epoxy resin, phenol novolac epoxy resin, tetramethyl biphenyl epoxy resin, bisphenol A type epoxy resin, cycloaliphatic epoxy resin, or a combination thereof. You can.

The epoxy compound may be used in an amount of 0.01 to 5 parts by weight based on 100 parts by weight of the photosensitive resin composition. When the epoxy compound is included within the above range, storage properties, adhesion, and other properties can be improved.

Additionally, the photosensitive resin composition may further include a thermal latent acid generator. Examples of the thermal latent acid generator include arylsulfonic acids such as p-toluenesulfonic acid and benzenesulfonic acid; perfluoroalkylsulfonic acids such as trifluoromethanesulfonic acid, trifluorobutanesulfonic acid, etc.; Alkylsulfonic acids such as methanesulfonic acid, ethanesulfonic acid, butanesulfonic acid, etc.; Or a combination thereof may be mentioned, but is not limited thereto.

Additionally, a certain amount of other additives such as antioxidants and stabilizers may be added to the photosensitive resin composition within the range that does not impair the physical properties.

Another embodiment provides a photosensitive resin film, such as a semiconductor redistribution layer insulating film, manufactured by exposing, developing, and curing the above-described photosensitive resin composition.

The photosensitive resin film (semiconductor redistribution layer insulating film) manufacturing method is as follows.

(1) Application and film formation stage

The photosensitive resin composition is applied to a desired thickness using a spin or slit coat method, roll coat method, screen printing method, or applicator method on a substrate such as a glass substrate or ITO substrate that has undergone a predetermined pretreatment, and then applied at a desired thickness, 70 A coating film is formed by removing the solvent by heating at ℃ to 150℃ for 1 to 10 minutes.

(2) exposure step

In order to form the necessary pattern on the obtained photosensitive resin film, a mask is interposed and 200 nm to 500 nm actinic rays are irradiated. Light sources used for irradiation include low-pressure mercury lamps, high-pressure mercury lamps, ultra-high pressure mercury lamps, metal halide lamps, and argon gas lasers. In some cases, X-rays and electron beams can also be used.

The exposure amount varies depending on the type, mixing amount, and dry film thickness of each component of the composition, but when using a high-pressure mercury lamp, it is 500 mJ/cm ² (based on a 365 nm sensor) or less.

(3) Development stage

In the development method, following the exposure step, an alkaline aqueous solution is used as a developer to dissolve and remove unnecessary parts, leaving only the exposed parts remaining to form a pattern.

(4) Post-processing step

There is a post-heating process to obtain a pattern excellent in terms of heat resistance, light resistance, adhesion, crack resistance, chemical resistance, high strength, and storage stability of the image pattern obtained by development in the above process. For example, after development, it can be heated in a convection oven at 250°C for 1 hour.

Another embodiment provides a semiconductor device including the photosensitive resin film (semiconductor redistribution layer insulating film).

Hereinafter, preferred embodiments of the present invention will be described. However, the following example is only a preferred example of the present invention, and the present invention is not limited by the following example.

(Example)

(Synthesis of polyhydroxyamide-based resin)

While passing nitrogen through a four-necked flask equipped with a stirrer, temperature controller, nitrogen gas injection device, and condenser, 0.58 mol of the anhydride monomer represented by the following formula A was added to 600 g of γ-butyrolactone (GBL), and 2-hydride was added. Add 1.22 mol of oxyethyl methacrylate (HEMA), stir at room temperature, and add 1.16 mol of pyridine to obtain a reaction mixture. After reacting at room temperature for 16 hours, cool to -10°C and add dropwise a solution of 1.17 mol of dicyclohexylcarbodiimide (DCC) and 250 g of GBL over 30 minutes. After stirring for an additional 5 minutes, a solution of 0.54 mol of diamine monomer represented by Chemical Formula B and 300 g of GBL was added for 40 minutes and stirred for an additional 2 hours. After reacting at room temperature for 1 hour, 30 g of ethanol was added and stirred for 1 hour. Next, GBL is added to the solid content of the reaction solution to 18% and added to 3 liters of ethanol to obtain a precipitate. The polymer was separated by filtration, dissolved in 1.5 liters of tetrahydrofuran (THF), and added dropwise to 30 liters of water to produce a precipitate, which was then separated by filtration and dried in vacuum. By reducing pressure at 50°C and drying for more than 24 hours, a polyamidoimide precursor resin containing a structural unit represented by the following Chemical Formula 1-1 was prepared. At this time, the resin molecular weight is confirmed through the polystyrene calibration curve and is 20k.

[Formula A]

[Formula B]

[Formula 1-1]

(Preparation of photosensitive resin composition)

Example 1

After adding 200 g of GBL (Gamma butyrolactone) as a solvent and 50 g of DMSO (Dimethyl sulfoxide) to 100 g of the polyhydroxyamide resin prepared above, 2 g of photopolymerizable monomer (DPHA, Japanese gunpowder) and a photopolymerization initiator (SPI-02) were added. , Samyang) and 10 g of the additive represented by the following formula 2-1 were added, and then 0.5 g of F-554 (DIC), a fluorine-based leveling agent, was added and stirred sufficiently. After that, it was filtered through a 0.45 µm polypropylene resin filter to obtain a negative photosensitive resin composition.

[Formula 2-1]

Example 2

It was the same as Example 1, except that an additive represented by Formula 2-2 below was used instead of the additive represented by Formula 2-1.

[Formula 2-2]

Example 3

It was the same as Example 1, except that an additive represented by the following Formula 2-3 was used instead of the additive represented by the Formula 2-1.

[Formula 2-3]

Example 4

It was the same as Example 1, except that an additive represented by the following Formula 2-4 was used instead of the additive represented by the Formula 2-1.

[Formula 2-4]

Example 5

It was the same as Example 1, except that an additive represented by the following Formula 2-5 was used instead of the additive represented by the Formula 2-1.

[Formula 2-5]

Example 6

It was the same as Example 1, except that an additive represented by the following Formula 2-6 was used instead of the additive represented by the Formula 2-1.

[Formula 2-6]

Example 7

It was the same as Example 1, except that an additive represented by the following Formula 3-1 was used instead of the additive represented by the Formula 2-1.

[Formula 3-1]

Example 8

It was the same as Example 1, except that an additive represented by the following Formula 3-2 was used instead of the additive represented by the Formula 2-1.

[Formula 3-2]

Example 9

It was the same as Example 1, except that an additive represented by the following Formula 3-3 was used instead of the additive represented by the Formula 2-1.

[Formula 3-3]

Example 10

It was the same as Example 1, except that an additive represented by the following Formula 3-4 was used instead of the additive represented by the Formula 2-1.

[Formula 3-4]

Example 11

It was the same as Example 1, except that an additive represented by the following Formula 3-5 was used instead of the additive represented by the Formula 2-1.

[Formula 3-5]

Example 12

It was the same as Example 1, except that an additive represented by the following Formula 3-6 was used instead of the additive represented by the Formula 2-1.

[Formula 3-6]

Example 13

It was the same as Example 1, except that an additive represented by the following Formula 3-7 was used instead of the additive represented by the Formula 2-1.

[Formula 3-7]

Example 14

It was the same as Example 1, except that an additive represented by the following Formula 3-8 was used instead of the additive represented by the Formula 2-1.

[Formula 3-8]

Example 15

It was the same as Example 1, except that an additive represented by the following Formula 3-9 was used instead of the additive represented by the Formula 2-1.

[Formula 3-9]

Example 16

It was the same as Example 1, except that an additive represented by the following Formula 3-10 was used instead of the additive represented by the Formula 2-1.

[Formula 3-10]

Example 17

It was the same as Example 1, except that an additive represented by the following Formula 3-11 was used instead of the additive represented by the Formula 2-1.

[Formula 3-11]

Example 18

It was the same as Example 1, except that an additive represented by the following Formula 3-12 was used instead of the additive represented by the Formula 2-1.

[Formula 3-12]

Comparative Example 1

It was the same as Example 1, except that the additive represented by Chemical Formula 2-1 was not used.

Comparative Example 2

It was the same as Example 1, except that KBM-573 (silane coupling agent) was used instead of the additive represented by Chemical Formula 2-1.

Comparative Example 3

It was the same as Example 1, except that an additive represented by the following formula C-1 was used instead of the additive represented by the formula 2-1.

[Formula C-1]

Comparative Example 4

It was the same as Example 1, except that an additive represented by the following formula C-2 was used instead of the additive represented by the formula 2-1.

[Formula C-2]

Comparative Example 5

It was the same as Example 1, except that an additive represented by the following Formula C-3 was used instead of the additive represented by the Formula 2-1.

[Formula C-3]

Comparative Example 6

It was the same as Example 1, except that an additive represented by the following Formula C-4 was used instead of the additive represented by the Formula 2-1.

[Formula C-4]

(Evaluation 1: Adhesion evaluation)

The photosensitive resin compositions according to Examples 1 to 18 and Comparative Examples 1 to 6 were coated on a Cu wafer to a thickness of 10㎛, and heated on a hot plate at 120°C for 4 minutes to form a photosensitive resin film. The photosensitive resin film was cured at 220°C for 120 minutes under nitrogen conditions.

Adhesion was measured using a die shear tester (DAGE series 4000PXY from DAGE) after EMC molding was performed on the cured film, and the results are shown in Table 1 below.

Cu wafer die shear test (kgf) Example 1 32 Example 2 32 Example 3 29 Example 4 30 Example 5 31 Example 6 30 Example 7 33 Example 8 35 Example 9 34 Example 10 33 Example 11 35 Example 12 35 Example 13 34 Example 14 33 Example 15 35 Example 16 33 Example 17 33 Example 18 35 Comparative Example 1 13 Comparative Example 2 18 Comparative Example 3 20 Comparative Example 4 19 Comparative Example 5 18 Comparative Example 6 20

(Evaluation 2: Viscosity evaluation)

For the photosensitive resin compositions according to Examples 1 to 18 and Comparative Examples 1 to 6, before and after storage at 23°C for one week, 5 rpm (select rpm at which the torque value is 50 to 100%) , Brookfield DV- at 25° C. Viscosity was evaluated using an II Pro viscometer and CPE-52 Spindle, and the results are shown in Table 2 below.

Viscosity (cP) before storage for 1 week at 23°C Viscosity (cP) after storage at 23°C for 1 week Example 1 1,010 1,010 Example 2 1,006 1,007 Example 3 1,005 1,010 Example 4 1,005 1,008 Example 5 1,010 1,015 Example 6 1,000 1,005 Example 7 1,000 1,000 Example 8 1,010 1,015 Example 9 1,014 1,015 Example 10 1,010 1,011 Example 11 1,008 1,010 Example 12 1,005 1,006 Example 13 1,010 1,010 Example 14 1,001 1,004 Example 15 1,005 1,006 Example 16 1,000 1,005 Example 17 1,010 1,011 Example 18 1,010 1,012 Comparative Example 1 1,008 1,220 Comparative Example 2 1,010 2,250 Comparative Example 3 1,010 2,350 Comparative Example 4 1,005 2,350 Comparative Example 5 1,005 2,250 Comparative Example 6 1,005 2,300

Through Tables 1 and 2, it can be seen that the photosensitive resin composition according to one embodiment has very excellent adhesion to the copper layer. Furthermore, it can be confirmed that the photosensitive resin compositions according to Comparative Examples 3 to 6 have too high a viscosity to contain a silane compound containing a thiol group, and are therefore not suitable for use as a composition for a semiconductor redistribution layer.

The present invention is not limited to the above-mentioned embodiments, but can be manufactured in various different forms, and those skilled in the art will be able to form other specific forms without changing the technical idea or essential features of the present invention. You will be able to understand that this can be implemented. Therefore, the embodiments described above should be understood in all respects as illustrative and not restrictive.

Claims (16)

(A) 100 parts by weight of a polyhydroxyamide-based resin containing a structural unit represented by the following formula (1);
(B) 1 to 10 parts by weight of a photopolymerizable compound;
(C) 1 to 10 parts by weight of a photopolymerization initiator;
(D) 1 to 20 parts by weight of an additive represented by Formula 2 or Formula 3 below; and
(E) 100 to 500 parts by weight of solvent
Photosensitive resin composition comprising:
[Formula 1]

In Formula 1,
X ¹ is a residue derived from an anhydride monomer,
Y ¹ is a residue derived from a diamine monomer,
R ¹ and R ² are each independently a substituted or unsubstituted C1 to C20 alkyl group, a substituted or unsubstituted C3 to C20 cycloalkyl group, a substituted or unsubstituted C6 to C20 aryl group, or a substituted or unsubstituted C2 to C20 hetero It is a cyclic group,
[Formula 2]

In Formula 2,
R ³ is a substituted or unsubstituted C1 to C20 alkyl group or a substituted or unsubstituted C6 to C20 aryl group,
L ¹ is a single bond, a substituted or unsubstituted C1 to C20 alkylene group or a substituted or unsubstituted C6 to C20 arylene group,
L ² is a C6 to C20 arylene group substituted or unsubstituted with a carboxyl group,
[Formula 3]

In Formula 3 above,
L ³ to L ⁷ are each independently a single bond, a sulfide linkage group, a disulfide linkage group, a C1 to C20 alkylene group substituted with a C1 to C10 alkyl group, a C1 to C20 alkylene group substituted with a carboxyl group, or an unsubstituted C1 to C20 alkylene group. , a substituted or unsubstituted C6 to C20 arylene group or a divalent thiophene linking group, where at least one of L ³ to L ⁷ must be a sulfide linking group, a disulfide linking group, or a divalent thiophene linking group.
delete delete According to paragraph 1,
The additive represented by Formula 2 is a photosensitive resin composition represented by any one of the following Formulas 2-1 to 2-6.
[Formula 2-1]

[Formula 2-2]

[Formula 2-3]

[Formula 2-4]

[Formula 2-5]

[Formula 2-6]

delete delete According to paragraph 1,
The additive represented by Formula 3 is a photosensitive resin composition represented by any one of the following Formulas 3-1 to 3-12.
[Formula 3-1]

[Formula 3-2]

[Formula 3-3]

[Formula 3-4]

[Formula 3-5]

[Formula 3-6]

[Formula 3-7]

[Formula 3-8]

[Formula 3-9]

[Formula 3-10]

[Formula 3-11]

[Formula 3-12]

delete According to paragraph 1,
The anhydride monomer is a photosensitive resin composition represented by the following formula (X-1):
[Formula X-1]

In Formula X-1,
L ⁸ is a single bond, *-O-*, *-S-*, *-C(=O)-*, *-C(=O)O-*, -*NR ⁴ -*(R ⁴ is hydrogen Atom or substituted or unsubstituted C1 to C10 alkyl group), substituted or unsubstituted C1 to C20 alkylene group, substituted or unsubstituted C6 to C20 arylene group, substituted or unsubstituted C2 to C20 heterocyclic linking group, or a combination thereof am.
According to paragraph 1,
The diamine monomer is a photosensitive resin composition represented by the following formula Y-1 or formula Y-2:
[Formula Y-1]

[Formula Y-2]

In the above formula Y-2,
R ⁵ and R ⁶ are each independently a halogen atom, a hydroxy group, a substituted or unsubstituted C1 to C20 alkyl group, or a substituted or unsubstituted C1 to C20 alkoxy group,
L ⁹ is *-O-* or *-S-*,
n1 and n2 are each independently integers from 0 to 4.
delete According to paragraph 1,
The photosensitive resin composition further includes diacid, alkanolamine, leveling agent, silane coupling agent, surfactant, epoxy compound, thermal latent acid generator, or a combination thereof.
According to paragraph 1,
The photosensitive resin composition is a negative photosensitive resin composition.
A photosensitive resin film manufactured using the photosensitive resin composition of any one of claims 1, 4, 7, 9, 10, 12, and 13.
According to clause 14,
The photosensitive resin film is a semiconductor redistribution layer insulating film.
A semiconductor device comprising the photosensitive resin film of claim 14.