KR102653011B1 - Light emitting display device - Google Patents

Abstract

An organic light emitting display device according to an embodiment of the present invention includes an organic light emitting element disposed between a TFT substrate and a metal layer. The end of the metal layer fixes and supports the COF tape and is implemented to prevent physical shock to the wiring of the COF tape. Accordingly, short-circuit defects in the wiring of the COF tape or burnt defects due to short-circuiting are improved, and a narrow bezel can be implemented without changing the position of the COF tape.

Description

Light emitting display device {LIGHT EMITTING DISPLAY DEVICE}

The present invention relates to an organic light emitting display device, and provides an organic light emitting display device including a metal layer in which damage to a COF tape caused by an end of a thin metal layer is minimized.

Organic Light Emitting Display Device (OLED), one of the new display devices, has self-luminance characteristics and does not require a separate light source, unlike Liquid Crystal Display (LCD). , it has the advantage of being able to be manufactured in a lightweight and thin form. In addition, it is attracting attention as a next-generation display device because it has superior viewing angle and contrast ratio compared to liquid crystal display devices, and has characteristics such as low power consumption, high brightness, and fast response speed.

An organic light emitting display device includes an organic light emitting device consisting of an anode, a cathode, and an organic light emitting layer between the anode and the cathode. An organic light emitting device generates light when excitons generated by combining electrons and holes injected into the organic light emitting layer from two electrodes fall from the excited state to the ground state. Organic light emitting display devices display images by controlling light generated from organic light emitting elements.

Additionally, organic light emitting display devices can be divided into a top emission structure, a bottom emission structure, or a dual emission structure depending on the direction in which the generated light radiates. Additionally, organic light emitting display devices can be divided into active matrix type or passive matrix type depending on the driving method.

Due to the various advantages described above, organic light emitting display devices are attracting attention as next-generation displays, but there is a problem in that the organic light emitting layer constituting the organic light emitting device is very vulnerable to heat, moisture, oxygen, etc. This is a problem directly related to the lifespan of the organic light emitting display device, and is a huge difficulty in commercializing the organic light emitting display device. This is because the organic light-emitting layer deteriorates due to heat, moisture, or oxygen. Therefore, encapsulation technology that prevents moisture or oxygen from penetrating into the organic light emitting display device is being researched.

The organic light emitting display device consists of a lower substrate on which organic light emitting elements are formed, and an upper substrate corresponding to the lower substrate. Since the bottom emitting type organic light emitting display device has a structure in which light is emitted in the direction of the lower substrate, the upper substrate is opaque. It is possible to apply a thin metal film. Therefore, an organic light emitting display device encapsulated using a metal thin film is manufactured by bonding a lower substrate on which an organic light emitting element is formed and an upper substrate with an adhesive layer attached. During this manufacturing process, blows are continuously applied to the ends (or corners, or side edges) of the upper substrate to ensure alignment between the other components that make up the upper substrate and the lower substrate. For example, when an adhesive layer is attached to an upper substrate or when an upper substrate with an adhesive layer is attached to a lower substrate on which an organic light emitting device is formed, a process of aligning each component or between each component and equipment is performed. . During the alignment process for position adjustment, the ends (or corners, or side ends) of the upper substrate come into contact with other adjacent components, thereby subjecting them to physical shock. For example, in the case where the PCB is arranged in a reverse bonding structure, the COF (Chip on Film) tape connecting the PCB and the support substrate on which the TFT array is placed is in contact with the end of the upper substrate. Accordingly, the end of the upper board applies physical shock to the wiring of the COF tape. Therefore, there are cases where the wiring inside the connection part, such as the COF tape, is damaged. In addition, since bottom-emitting organic light emitting display devices are mainly sealed using metal thin films, there is a greater need to solve the problem of damage to wiring inside connections such as COF tape.

In addition, in recent display devices, the difference between the display area and the non-display area is gradually decreasing due to the trend of narrow bezels, making it difficult to secure the margin between each component, which is an even bigger problem. is being highlighted. As the bezel of the organic light emitting display device gradually decreases, the gap between the end of the metal thin film and the connection portion including the chip-type driving integrated circuit and the portion connecting the pad portion of the support substrate decreases. As the gap between the end of the metal thin film and the connection part containing the chip-type driving integrated circuit and the part connecting the pad part of the support substrate decreases, the problem of damage to the wiring inside the connection part, such as COF tape, becomes more severe.

The present invention is intended to solve the above problem, and the inventor of the present invention supports the COF tape so that the end of the upper substrate does not give physical impact to other components during the manufacturing process of the organic light emitting display device, while simultaneously damaging the COF tape. A new organic light emitting display device including an upper substrate having an end that does not provide light was invented.

The problem to be solved according to an embodiment of the present invention is to prevent damage to the COF wiring caused by the ends of the metal layers constituting the upper substrate by preventing protrusions or burrs from occurring at the ends of the metal layers constituting the upper substrate. An organic light emitting display device is provided.

Another problem to be solved according to an embodiment of the present invention is to provide an organic light emitting display device that can prevent short circuits between wires of a COF tape caused by the ends of the metal layer constituting the upper substrate.

Another problem to be solved according to an embodiment of the present invention is an organic light emitting display device that can prevent burnt, in which the surrounding area becomes black when a driving failure occurs after module work on the organic light emitting display device or a short circuit occurs between wires of the COF tape. is to provide.

Another problem to be solved according to an embodiment of the present invention is to provide an organic light emitting display device with improved productivity and reliability that can prevent short circuits or burns between wires of a COF tape.

Another problem to be solved according to an embodiment of the present invention is an organic light emitting display device that can implement a narrow bezel in which the difference between the display area and the non-display area becomes smaller by stably contacting the end of the metal thin film and the lower surface of the connection part. is to provide.

Problems to be solved according to embodiments of the present invention are not limited to the problems mentioned above, and other problems not mentioned will be clearly understood by those skilled in the art from the description below.

An organic light emitting display device according to an embodiment of the present invention includes a metal layer having an upper surface configured to accommodate a PCB and a lower surface configured to accommodate the upper surface of a TFT substrate; An adhesive layer located on the lower surface of the metal layer and implemented to adhere the metal layer to the TFT substrate; and a COF tape that partially overlaps the metal layer and is supported by the end of the metal layer, has a driving integrated circuit on the lower surface, is on the upper surface of the metal layer, and is implemented to connect the PCB and the TFT substrate. At this time, the COF tape connects the PCB and the TFTT board through a pad located on the upper surface of the TFT board between the end of the metal layer and the end of the TFT board, and the end of the metal layer prevents damage to the COF tape at the end of the metal layer. Characterized in that only the part implemented to do so is in contact with the COF tape.

An organic light emitting display device according to an embodiment of the present invention includes an organic light emitting element disposed between a TFT array substrate and a metal layer. The end of the metal layer fixes and supports the COF tape and is implemented to prevent physical shock to the wiring of the COF tape. Accordingly, shortcomings in the wiring of the COF tape or burnt defects due to the short are improved, and a narrow bezel can be implemented without changing the position of the COF tape.

According to an embodiment of the present invention, in an organic light emitting display device, protrusions or lumps are not generated at the ends of the metal layers constituting the upper substrate, thereby preventing damage to the COF tape from being pinched by the ends of the metal layers constituting the upper substrate. can do.

According to an embodiment of the present invention, in an organic light emitting display device, short circuits between wires of the COF tape caused by the ends of the metal layer constituting the upper substrate can be minimized.

According to an embodiment of the present invention, the occurrence of burnt, which causes the surrounding area to burn black when a driving failure occurs after module work of an organic light emitting display device or a short circuit occurs between wires of a COF tape, is reduced, thereby improving the productivity and reliability of the organic light emitting display device. You can.

According to an embodiment of the present invention, in an organic light emitting display device, a narrow bezel in which the difference between the display area and the non-display area becomes smaller by stably contacting the end of the metal thin film and the lower surface of the connection part can be implemented.

The effects of the present invention are not limited to the effects mentioned above, and other effects not mentioned will be clearly understood by those skilled in the art from the description below.

Since the content of the invention described in the problem to be solved, the means for solving the problem, and the effect described above do not specify the essential features of the claim, the scope of the claim is not limited by the matters described in the content of the invention.

1 is a schematic configuration diagram of an organic light emitting display device according to an embodiment of the present invention.
Figure 2 is a schematic circuit configuration diagram of one subpixel according to an embodiment of the present invention.
Figure 3 is a plan view showing the back of an organic light emitting display device according to an embodiment of the present invention.
Figure 4 is an enlarged cross-sectional view of the end of an organic light emitting display device according to an embodiment of the present invention.
Figure 5 is a cross-sectional view of Figure 4, according to an embodiment of the present invention.
Figure 6 is a cross-sectional view of the shapes of the ends of the metal layer and the end of the adhesive layer, implemented to prevent damage to the source COF tape, in the organic light emitting display device according to an embodiment of the present invention.
Figures 7A, 8A and 9A are cross-sectional views taken along line XX' in Figure 4, according to an embodiment of the present invention.
FIG. 7B is a top view of the back side of the source COF tape in FIG. 7A.
FIG. 8B is a top view of the back side of the source COF tape in FIG. 8A.
FIG. 9B is a plan view of the back of the organic light emitting display panel in FIG. 9A.
10 to 13 are diagrams illustrating step by step a method of manufacturing a metal layer and an adhesive layer included in an organic light emitting display device according to an embodiment of the present invention.
14 to 16 are cross-sectional views of each metal thin film cell including a metal layer cut according to each method of cutting the metal thin film.

The advantages and features of the present invention and methods for achieving them will become clear by referring to the embodiments described in detail below along with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below and will be implemented in various different forms, but the present embodiments only serve to ensure that the disclosure of the present invention is complete, and those skilled in the art It is provided to fully inform the person of the scope of the invention, and the present invention is only defined by the scope of the claims.

The shapes, sizes, proportions, angles, numbers, etc. disclosed in the drawings for explaining embodiments of the present invention are illustrative, and the present invention is not limited to the matters shown. Like reference numerals refer to like elements throughout the specification. Additionally, in describing the present invention, if it is determined that a detailed description of related known technologies may unnecessarily obscure the gist of the present invention, the detailed description will be omitted.

When 'includes', 'has', 'consists of', etc. mentioned in this specification are used, other parts may be added unless 'only' is used. When a component is expressed in the singular, the plural is included unless specifically stated otherwise.

When interpreting a component, it is interpreted to include the margin of error even if there is no separate explicit description.

In the case of a description of a positional relationship, for example, if the positional relationship of two parts is described as 'on top', 'on the top', 'on the bottom', 'next to', etc., 'immediately' Alternatively, there may be one or more other parts placed between the two parts, unless 'directly' is used.

In the case of a description of a temporal relationship, for example, if a temporal relationship is described as ‘after’, ‘after’, ‘after’, ‘before’, etc., ‘immediately’ or ‘directly’ Non-consecutive cases may also be included unless ' is used.

Although first, second, etc. are used to describe various components, these components are not limited by these terms. These terms are merely used to distinguish one component from another. Accordingly, the first component mentioned below may also be the second component within the technical spirit of the present invention.

The size and thickness of each component shown in the drawings are shown for convenience of explanation, and the present invention is not necessarily limited to the size and thickness of the components shown.

Each feature of the various embodiments of the present invention can be partially or entirely combined or combined with each other, and various technical interconnections and operations are possible, and each embodiment may be implemented independently of each other or may be implemented together in a related relationship. .

Hereinafter, an organic light emitting display device according to an embodiment of the present invention will be described in detail with reference to the attached drawings.

1 is a schematic configuration diagram of an organic light emitting display device according to an embodiment of the present invention.

As shown in FIG. 1, the organic light emitting display device 100 according to an embodiment of the present invention includes a timing control unit 140, a data driver 150, a gate driver 160, and an organic light emitting display panel 170. do.

The system board unit 130 receives video data signals (RGB) from the outside, converts them into digital data signals, and outputs driving signals such as a data enable signal, vertical synchronization signal, horizontal synchronization signal, and clock signal. The system board unit 130 converts video data signals into digital data signals. The timing control unit 140 may convert a video data signal into a digital data signal.

The timing control unit 140 receives driving signals such as a data enable signal, a vertical synchronization signal, a horizontal synchronization signal, and a clock signal, as well as a color data signal (DDATA) from the system board unit 130. The timing control unit 140 provides a gate timing control signal (GDC) for controlling the operation timing of the scan driver 160 and a data timing control signal (DDC) for controlling the operation timing of the data driver 150 based on the driving signal. outputs. The timing control unit 140 outputs a color data signal (DDATA) in response to the gate timing control signal (GDC) and the data timing control signal (DDC) generated based on the driving signal.

The data driver 150 samples and latches the color data signal DDATA in response to the data timing control signal DDC supplied from the timing controller 140 and converts it into an analog data signal in response to the gamma reference voltage. The data driver 150 outputs data signals through data lines DL1 to DLn. The data driver 150 is formed in the form of an integrated circuit (IC).

The scan driver 160 outputs a scan signal while shifting the level of the gate voltage in response to the gate timing control signal (GDC) supplied from the timing controller 140. The scan driver 160 outputs scan signals through scan lines SL1 to SLm. The scan driver 160 is formed in the form of an integrated circuit (IC) or is mounted on the organic light emitting display panel 170 itself using a gate in panel method.

The organic light emitting display panel 170 is implemented with a subpixel structure including a red subpixel (SPr), a green subpixel (SPg), and a blue subpixel (SPb) (hereinafter referred to as an RGB subpixel). In addition, the organic light emitting display panel 170 includes a red subpixel (SPr), a green subpixel (SPg), a blue subpixel (SPb), and a white subpixel (SPw) to prevent deterioration of pure color luminance and color quality while increasing light efficiency. ) (hereinafter referred to as RGBW subpixel) is implemented with a subpixel structure including. That is, one pixel (P) consists of RGB subpixels (SPr, SPg, SPb) or RGBW subpixels (SPr, SPg, SPb, SPw). And these pixels P are formed in large numbers corresponding to the resolution of the organic light emitting display panel 170 to form a pixel array.

Figure 2 is a schematic circuit configuration diagram of one subpixel according to an embodiment of the present invention.

One subpixel (SP) includes a switching transistor (SW), a driving transistor (DR), a capacitor (Cstg), a compensation circuit (CC), and an organic light emitting device (OLED). An organic light emitting device (OLED) operates to emit light according to a driving current applied by a driving transistor (DR). The switching transistor (SW) performs a switching operation so that the color data signal supplied through the first data line (DL1) is stored as a data voltage in the capacitor (Cstg) in response to the scan signal supplied through the first scan line (SL1). . The driving transistor DR operates so that a driving current flows between the first power line (VDD) and the ground line (GND) according to the data voltage stored in the capacitor (Cstg).

The compensation circuit (CC) is a circuit added to compensate for the threshold voltage of the driving transistor (DR). Accordingly, the compensation circuit (CC) may be omitted depending on the configuration of the subpixel, but is usually composed of one or more transistors and a capacitor. Since the composition of the compensation circuit (CC) can be very diverse, specific examples and descriptions thereof will be omitted.

One subpixel (SP) consists of a 2T (Transistor) 1C (Capacitor) structure including a switching transistor (SW), a driving transistor (DR), a capacitor (Cstg), and an organic light emitting device (OLED). However, when a compensation circuit (CC) is added, it consists of 3T1C, 4T2C, 5T2C, 6T1C, etc. The subpixel (SP) having the above configuration has a top-emission structure, bottom-emission structure, or dual-emission structure depending on the emission direction of light emitted from the organic light-emitting device (OLED). It is formed by one of the structures.

Figure 3 is a plan view showing the back of an organic light emitting display device according to an embodiment of the present invention.

Referring to FIG. 3, the organic light emitting display device 100 according to an embodiment of the present invention includes a data driver 150 located at the rear horizontal end of the organic light emitting display panel 170, and an organic light emitting display panel 170. It is provided with a scan driver 160 disposed at the rear vertical end. The data driver 150 is formed in the form of a source COF tape 151 that embeds a source driver integrated circuit (IC) in the form of a chip, and is connected to the source PCB 180. The source COF tape 151 and the source PCB 180 are implemented on the back of the organic light emitting display panel 170. The scan driver 160 is formed in the form of a scan COF tape 161 that embeds a scan driver IC in the form of a chip, and is connected to the scan PCB 190. The scan driver 160 may be disposed on only one side or on both sides of the organic light emitting display panel 170. The scan driver 160 may be mounted inside the organic light emitting display panel 170 in a gate-in-panel manner, rather than in the form of an IC.

The organic light emitting display panel 170 has (1) a display area (A/A), which is the area where the actual image is displayed, defined by the pixel array, and (2) an area other than the display area (A/A) that is displayed around the display area. It is divided into a non-display area (N/A) surrounding the area (A/A). The organic light emitting display panel 170 includes a TFT substrate including an organic light emitting device (OLED) and a pixel driving circuit capable of driving the organic light emitting device (OLED). Organic light emitting devices (OLEDs) formed on TFT substrates are easily deteriorated by moisture and oxygen. In order to protect the organic light emitting device (OLED) of each pixel, a thin metal layer (FSM: Face Seal Metal) may be placed opposite the TFT substrate to cover the entire display area (A/A). For sufficient encapsulation of the organic light emitting device (OLED), the metal layer (FSM) has an area larger than the area of the display area (A/A) and smaller than the area of the non-display area (N/A). In particular, on the back of the organic light emitting display panel 170, the scan COF tape 161 and the source COF tape 151 disposed across the non-display area (N/A) and the display area (A/A) are also formed with a metal layer (FSM). ) and partially overlaps with. Hereinafter, region A, where the source COF tape 151 and the metal layer (FSM) partially overlap, will be described in more detail with reference to FIG. 4.

Figure 4 is an enlarged plan view of an end of an organic light emitting display device according to an embodiment of the present invention.

Referring to FIG. 4 , the source COF tape 151 is disposed on the back of the organic light emitting display panel 170 and at the horizontal end of the organic light emitting display panel 170. The source PCB 180 is also disposed on the back of the organic light emitting display panel 170 and is connected to the source COF tape 151. A source driving IC in the form of a chip is provided on the lower surface of the source COF tape 151, and the source driving IC is arranged to overlap the metal layer (FSM). Hereinafter, all descriptions related to the source COF tape 151 may be applied to the scan COF tape 161, and all descriptions related to the source PCB 180 may also be applied to the scan PCB 190.

Hereinafter, the arrangement of the source COF tape 151, metal layer (FSM), and source PCB 180 will be described in more detail with reference to FIGS. 5 to 9B.

Figure 5 is a cross-sectional view taken along line XX' of Figure 4, according to an embodiment of the present invention.

Referring to FIG. 5, the organic light emitting display device 100 according to an embodiment of the present invention includes a TFT substrate 510 including a pixel array, disposed on the upper surface of the TFT substrate 510, and organic light emitting display devices defining each subpixel. It includes a light emitting layer 520 including a device (OLED). It is disposed on the upper surface of the light-emitting layer 520 and includes a passivation layer 530 that flattens the light-emitting layer 520. An adhesive layer (FSA) disposed on the upper surface of the passivation layer 530 and implemented to attach the metal layer (FSM) to the TFT substrate 510, a metal layer (FSM) disposed on the upper surface of the adhesive layer, and disposed on the upper surface of the metal layer (FSM) It includes a PCB adhesive member 540 and a source PCB 180 attached to the PCB adhesive member 540. And, it includes a source COF tape 151 connecting the source PCB 180 and the TFT substrate 510. In addition, a pad portion ( 550).

The TFT substrate 510 has a pixel array including a pixel driving circuit disposed on a support substrate. The support substrate may be made of transparent glass. For example, the support substrate can be formed using materials such as potassium lime, soda lime or quartz. The support substrate used in the manufacture of the organic light emitting display device is usually a glass substrate, and the thermal expansion coefficient is 2.5*10-6/°C (2.5 ppm/°C) to 5.5*10-6/°C (5.5 ppm/°C). When manufacturing a flexible organic light emitting display device, the support substrate may be made of a flexible organic material such as a plastic-based material. For example, the support substrate may be made of a material such as polyimide.

The light emitting layer 520 disposed on the TFT substrate 510 includes a plurality of organic light emitting devices (OLEDs) defining each subpixel. The organic light emitting device (OLED) may be composed of an anode, an organic light emitting layer, and a cathode, and is connected to and driven with a pixel driving circuit disposed on the TFT substrate 510. Organic light emitting devices (OLEDs) may be composed of a single stack structure that emits light of one color or a multiple stack structure that emits white light by light of two or more colors. However, it is not necessarily limited to this, and may be configured in various stacked structures depending on the design of the organic light emitting device (OLED). Adhering an opaque metal layer (FSM) for encapsulation to the upper surface of the TFT substrate 510 is achieved by disposing a color filter between the TFT substrate 510 and the light emitting layer 520, thereby forming an organic light emitting display according to an embodiment of the present invention. The device 100 may be more effective when emitting light in a bottom-emitting manner.

The passivation layer 530 disposed on the light-emitting layer 520 protects the organic light-emitting device (OLED) from external foreign substances, shock, penetration of moisture (H2O) or oxygen (O2), etc. The passivation layer 530 may be composed of a single layer made of an inorganic film, or may be composed of a plurality of layers in which organic films and inorganic films are repeatedly stacked. For example, the passivation layer 530 may be made of an inorganic material such as silicon nitride (SiNx) or silicon oxide (SiOx). Additionally, an additional planarization layer may be disposed on the passivation layer 530 to facilitate adhesion to the adhesive layer (FSA) by filling the steps of the light emitting layer 530.

The TFT substrate 510 and the metal layer (FSM) are adhered and fixed to each other by the adhesive layer (FSA) disposed on the passivation layer 530. The adhesive layer (FSA) is made of resin, for example, epoxy, phenol, amino, unsaturated polyester, polyimide, and silicone. , may be made of any one of acryl, vinyl, and olefin. In addition, the adhesive layer (FSA) can be bonded by high-energy curing methods such as heat, ultraviolet rays, or lasers, or by applying physical pressure using a pressure sensitive adhesive (PSA). It may be possible. The adhesive layer (FSA) may be composed of multiple layers. For example, the adhesive layer (FSA) may be composed of a layer containing epoxy and polyolefin, and a moisture absorption filter layer.

The thickness of the adhesive layer (FSA) may be 45 μm to 55 μm, for example, 49 μm. At this time, the thickness of the adhesive layer (FSA) refers to the thickness at the portion where the adhesive layer (FSA) overlaps the display area (A/A), not at the end of the adhesive layer (FSA).

When the adhesive layer (FSA) is composed of a plurality of layers, it may include a moisture absorption filter layer, and the moisture absorption filter layer is composed of a moisture adsorbent. The moisture adsorbent can absorb moisture or oxygen by chemically reacting with moisture or oxygen introduced into the adhesive layer (FSA). The moisture adsorbent may be made of, for example, metal powder such as alumina, metal oxide, metal salt, or phosphorus pentoxide (P2O5).

The end of the adhesive layer (FSA) is configured to have a distance difference of several mm from the end of the display area (A/A). That is, the adhesive layer (FSA) is larger than the area of the display area (A/A) so that the adhesive layer (FSA) covers all of the organic light emitting devices (OLED) in the display area (A/A) to obtain an encapsulation effect. It is arranged to cover the entire area (A/A). The edge of the adhesive layer (FSA) may form a fine gap in relation to the upper surface of the TFT substrate 510. Alternatively, the adhesive layer FSA may be melted and compressed when bonded to the upper surface of the TFT substrate 510, so that the adhesive layer FSA may not form a gap in relation to the upper surface of the TFT substrate 510. Specifically, the adhesive layer (FSA) may be bonded to the upper surface of the TFT substrate 510 to cover the entire passivation layer 530.

The metal layer (FSM) disposed on the adhesive layer (FSA) has an upper surface configured to accommodate the source PCB 180 and a lower surface configured to accommodate the upper surface of the TFT substrate 510. In order to prevent warping of the organic light emitting display panel 170 due to a difference in thermal expansion coefficient between the metal layer (FSM) and the TFT substrate 510, the thermal expansion coefficient is the same as or similar to that of the support substrate of the TFT substrate 510. It is implemented. Metal alloys with low thermal expansion coefficients include F alloy (Alloy), which contains iron (Fe) and nickel (Ni), and alloy (Fe-Ni-), which contains iron (Fe), nickel (Ni) and cobalt (Co). Co) etc.

For example, the metal layer (FSA) may be formed of an alloy of iron (Fe) and nickel (Ni) with a low coefficient of thermal expansion. At this time, the content of nickel (Ni) added to iron (Fe) may have a composition ratio of 33% to 35% or 38.5% to 41.5%. If the metal layer (FSA) is formed from an alloy with a content of 33% to 35% or 38.5% to 41.5% of nickel (Ni) added to iron (Fe), the metal layer (FSA) is the same as or similar to the glass support substrate. It has a thermal expansion coefficient of 2.5ppm/℃ ~ 5.5ppm/℃.

It can be seen that when less than 35% of nickel (Ni) is added to iron (Fe), the coefficient of thermal expansion decreases rapidly in this area, resulting in a coefficient of thermal expansion of less than 2.5ppm/℃. And, when the nickel (Ni) content exceeds 35%, the thermal expansion coefficient increases again, and when it exceeds 38.5%, it can be seen that it has a thermal expansion coefficient of 2.5ppm/℃ to 5.5ppm/℃. In addition, it can be seen that when the nickel (Ni) content exceeds 41.5%, the thermal expansion coefficient rapidly increases and exceeds 5.5ppm/°C.

On the other hand, when the nickel (Ni) content is 35% to 38.5%, the thermal expansion coefficient is low, less than 2.5ppm/℃, but is within the range of 2.5ppm/℃ to 5.5ppm/℃, which is the thermal expansion coefficient of a support substrate made of glass. gets out of

The thickness of the metal layer (FSM) is 50 μm to 500 μm. For example, when the thickness of the metal layer (FSM) is designed to be 100 μm, the bending of the support substrate caused by the metal layer (FSM) can be minimized by reducing the volume of the metal layer (FSM) itself. In addition, even if the thickness of the metal layer (FSM) is reduced to 80μm for the purpose of reducing material costs, it has the same encapsulation effect as when it has a thickness of 100μm, and physical rolling treatment of the ends is possible.

Since the adhesive layer (FSA) is made of a polymer material, the shape of the adhesive layer (FSA) has fluidity when adhering to the TFT substrate 510. That is, the adhesive layer (FSA) may gradually increase or decrease during the process of adhesion to the TFT substrate 510, depending on the characteristics of the polymer organic material. In order to make this part a process tolerance, it is desirable that the metal layer (FSM) has the same area as the adhesive layer (FSA), or that the area is larger than the adhesive layer (FSA), so that the metal layer (FSM) covers the entire adhesive layer (FSA). Additionally, the adhesive layer (FSA) may be scratched by external impact or foreign substances. It is preferable that the metal layer (FSM) covers the entire adhesive layer (FSA) so that the metal layer (FSM) can physically protect the adhesive layer (FSA). At this time, the end of the adhesive layer (FSA) may be melted by receiving high energy from a laser, etc. At this time, the adhesive layer (FSA) may harden again and overflow along the end of the metal layer (FSM). As a result, a shape in which the end of the adhesive layer (FSA) surrounds the end of the metal layer (FSM) can be created. The end of the adhesive layer (FSA) where the shape has been deformed is not considered as the effective area of the adhesive layer (FSA) when comparing the areas of the metal layer (FSM) and the adhesive layer (FSA). If the area of the adhesive layer (FSA) (meaning the 'effective area' above) becomes larger than the area of the metal layer (FSM), the area of the adhesive layer (FSA) not covered by the metal layer (FSM) becomes a new path for moisture infiltration. This may cause deterioration of the organic light emitting diode (OLED), which may cause problems with the reliability of the organic light emitting display panel.

In other words, the area of the adhesive layer (FSA) and the area of the metal layer (FSM) are the same, and the adhesive layer (FSA) and the metal layer (FSM) can completely overlap each other. Alternatively, the area of the metal layer (FSM) may be larger than the area of the adhesive layer (FSA), and the adhesive layer (FSA) may be completely covered by the metal layer (FSM). In either case, at at least one end (horizontal end or vertical end) of the organic light emitting display panel 170, the distance (D) between the end of the metal layer (FSM) and the end of the TFT substrate 510 is at least 120 μm or more. There is. Additionally, a pad portion 550 may be disposed between the end of the metal layer (FSM) and the end of the TFT substrate 510 (D). The pad portion 550 is located on the upper surface of the TFT substrate 510 between the end of the metal layer (FSM) and the end of the TFT substrate 510 (D). Through the pad portion 550, the TFT substrate 510 The source COF tape 151 disposed on the upper surface of is connected to the TFT substrate 510.

On the metal layer (FSM), the source COF tape 151 is disposed so that only a portion of the source COF tape overlaps the metal layer (FSM). In other words, the source COF tape 151 is implemented to only partially overlap the top surface of the metal layer (FSM) to connect the source PCB 180 and the TFT substrate 510. The source COF tape 151 is supported by the end of the metal layer (FSM). The source COF tape 151 includes a drive integrated circuit (Drive IC, 151_d), which is disposed on the lower surface of the source COF tape 151 and may be in the form of a chip. A plurality of wires 151_b for signal input and output of the driving integrated circuit 151_d are disposed on the source COF tape 151. In addition, an insulating solder resist (151_c) is disposed on the lower surface of the source COF tape 151 to prevent the inflow of static electricity, etc., and a support layer (151_a) made of a flexible plastic-based polymer material is disposed on the upper surface. do.

The source COF tape 151 is connected to the source PCB 180 through the pad portion 550 located on the upper surface of the TFT substrate 510 between the end of the metal layer (FSM) and the end of the TFT substrate 510 (D). Connect the TFT substrate 510. The source COF tape 151 is disposed over the non-display area (N/A) and the display area (A/A) to overlap a portion of the metal layer (FSM), and the source COF tape (151) does not overlap the metal layer (FSM). A portion of 151) is connected to the pad portion 550. Accordingly, the end of the metal layer (FSM) implemented to prevent damage to the source COF tape 151 overlaps the source COF tape 151. The metal layer (FSM) does not contact the source COF tape 151 except for the ends of the metal layer (FSM), which are implemented to prevent damage to the source COF tape 151. That is, the organic light emitting display panel 170 includes a region B where the end of the metal layer (FSM) implemented to prevent damage to the source COF tape 151 and the lower surface of the source COF tape 151 are in contact. .

The end of the metal layer (FSM) implemented to prevent damage to the source COF tape 151 may have a convex curved shape or a rounded corner shape through physical processing to have a rounded corner shape. As a result, the end of the metal layer (FSM) can be in contact with the metal layer (FSM) to support the source COF tape 151 while preventing damage to the wiring of the source COF tape 151. Therefore, since the end of the metal layer (FSM) has a convex curved shape or a rounded corner shape, damage to the wiring of the source COF tape 151 by the end of the metal layer (FSM) due to protrusions or burrs is prevented. There is an effect that can be done.

The source PCB 180 connected to the TFT substrate 510 by the source COF tape 151 is implemented on the upper surface of the metal layer (FSM). The position of the source PCB 180 can be fixed simply by being connected to the source COF tape 151, but additionally, the PCB adhesive member 540 attached to the upper surface of the metal layer (FSM) is attached to the lower surface of the source PCB 180. By placing the source PCB 180 on the upper surface of the metal layer (FSM).

Figure 6 is a cross-sectional view of the shapes of the ends of the metal layer and the end of the adhesive layer, implemented to prevent damage to the source COF tape, in the organic light emitting display device according to an embodiment of the present invention.

As shown in Figures 6 (a) and (b), along with the end of the metal layer (FSM) having a convex curved shape or a rounded corner shape, the end of the adhesive layer (FSA) also has a convex curved shape or a rounded corner shape. It can be formed to have. More specifically, as shown in (a) of FIG. 6, the adhesive layer (FSA) may have a shape where the thickness gradually becomes thinner at the portion where the adhesive layer (FSA) overlaps the end of the metal layer (FSM). In other words, the thickness in the area of the adhesive layer (FSA) corresponding to the display area (A/A), excluding the end of the adhesive layer (FSA), is thicker than the thickness at the end of the adhesive layer (FSA). And, the thickness of the end of the adhesive layer (FSA) gradually becomes thinner toward the end. That is, the thickness of the end of the adhesive layer (FSA) gradually becomes thinner as the adhesive layer (FSA) overlaps the end of the metal layer (FSM). Alternatively, as shown in (b) of FIG. 6, the shape of the end of the adhesive layer (FSA) may have a convex curved shape or a rounded corner shape, similar to the shape of the end of the metal layer (FSM). In other words, the end of the adhesive layer (FSA) may cover the end of the metal layer (FSM) along the end of the metal layer (FSM) having a rounded corner shape. That is, the end of the adhesive layer (FSA) may be shaped to wrap around the end of the metal layer (FSM).

Referring to FIG. 6, the rounded edge shape of the end of the adhesive layer (FSA) may be a trace of the end of the adhesive layer (FSA) spreading due to fluidity in the process of melting and re-solidifying. In other words, the convex curved shape or rounded corner shape of the end of the adhesive layer (FSA) may be a trace of flowing down when the end of the adhesive layer (FSA) is in a liquid state or in an intermediate state between a solid and a liquid state. If the rounded edge shape of the end of the adhesive layer (FSA) is a trace of the end of the adhesive layer (FSA) spreading during the process of melting and re-hardening, the end of the adhesive layer (FSA) is an adhesive layer (FSA) other than the end of the adhesive layer (FSA). ) The thickness is thin compared to the area. The end of the metal layer (FSM) implemented to prevent damage to the source COF tape 151 may be in contact with the COF tape 151 with the end of the adhesive layer (FSA) covering the end of the metal layer (FSM) interposed therebetween. there is. As a result, the end of the metal layer (FSM) can be in contact with the metal layer (FSM) to support the source COF tape 151 while preventing damage to the wiring of the source COF tape 151. Accordingly, since the end of the metal layer (FSM) has a convex curved shape or a rounded corner shape, it is effective to prevent damage to the wiring of the source COF tape 151 due to protrusions or burrs.

FIG. 7A is a cross-sectional view taken along line XX' in FIG. 4, according to an embodiment of the present invention. FIG. 7B is a plan view of the back of the source COF tape in FIG. 7A, showing the shape of the cushion implemented on the back of the source COF tape. The embodiment of FIGS. 7A and 7B is identical to the embodiment of FIG. 5 except that a cushion 710 is added. Therefore, with reference to FIGS. 7A and 7B , description of the same parts as described above will be omitted and the cushion 710 will be described.

Referring to FIG. 7A, a cushion 710 is formed on the lower surface of the source COF tape 151. The cushion 710, which is implemented to alleviate the amount of impact received when the source COF tape 151 comes into contact with the end of the metal layer (FSM), assists the contact between the source COF tape 151 and the metal layer (FSM). That is, the organic light emitting display device 100 according to an embodiment of the present invention has a metal layer (FSM) on the lower surface of the COF tape 151 to alleviate the amount of impact received by the source COF tape 151 from contacting the end of the metal layer (FSM). ) may further include a cushion 710 implemented at the point closest to the end of the. The end of the metal layer (FSM) has a structure in which only the portion implemented to prevent damage to the source COF tape 151 at the end of the metal layer (FSM) is in contact with the source COF tape 151. In other words, the part at the end of the metal layer (FSM) that is in direct contact with the cushion 710 becomes the end part of the metal layer (FSM) implemented to prevent damage to the source COF tape 151. Specifically, (1) the end of the source COF tape 151 and the metal layer (FSM) contact with the cushion 710 in between, or (2) the end of the metal layer (FSM) and the source COF tape 151 contact directly. , a cushion 710 may fill the area around the contact point. As a result, since the end of the metal layer (FSM) has a convex curved shape or a rounded corner shape, damage to the wiring 151_b of the source COF tape 151 due to protrusions or burrs is prevented, and the metal layer (FSM) This has the effect of fixing the end to the source COF tape 151. The cushion 710 is located between the end of the metal layer (FSM) and the source COF tape 151 so that the contact state between the end of the metal layer (FSM) and the source COF tape 151 is maintained without being shaken by external shock. do. In addition, the cushion 710 absorbs the physical shock applied by the end of the metal layer (FSM) to the source COF tape 151 during the process of attaching the source COF tape 151 to partially overlap the upper surface of the metal layer (FSM), The wiring 151_b of the source COF tape 151 is protected.

As shown in FIG. 7B, the cushion 710 may be implemented in the shape of a solid line on the lower surface of each source COF tape 151. The point where the cushion 710 is formed on the lower surface of the source COF tape 151 is when the source COF tape 151 is attached to the upper surface of the metal layer (FSM), the source COF tape 151 is attached to the end of the metal layer (FSM). It is a point of contact. The cushion 710 may have a corrugated cardboard-shaped uneven surface formed to be parallel to the end of the metal layer (FSM). At this time, the cushion 710 is made of an adhesive elastic material, thereby absorbing the shock applied by the metal layer (FSM) to the source COF tape 151. The cushion 710 may be made of any one of an olefin-based compound, a polyurethane-based compound, or a silicon-based compound. Additionally, the cushion 710 may be magnetic so that it acts as an attractive force with the metal layer (FSM). For example, the cushion 710 may be made of an adhesive elastic material in which magnetic particles are dispersed. Since the cushion 710 is implemented to have magnetism, an attractive force between the cushion 710 and the metal layer (FSM) acts to fix the contact state between the source COF tape 151 and the end of the metal layer (FSM). At this time, the magnetic particles may be composed of any one of a neodymium (Nd) magnet, a ferrite magnet, an Al-Ni-Co-Fe magnet, or a samarium cobalt (SM-Co) magnet. there is. Additionally, the cushion 710 may be made of a thermosetting polymeric organic material, such as an epoxy-based compound. The cushion 710 may be formed by applying a thermosetting polymer organic material to the end of the source COF tape 151 or the metal layer (FSM) in a fluid state and then curing it by thermal energy. The source COF tape 151 to which the cushion 710 is added is attached to the upper surface of the metal layer (FSM) so that the surface of the cushion 710 faces the TFT substrate 510. As a result, as shown in FIG. 7A, the end of the metal layer (FSM) can be seated in the corrugated groove area of the corrugated cardboard-shaped surface of the cushion 710. As the end of the metal layer (FSM) is inserted and seated in the groove area of the corrugated surface of the cushion 710, the cushion 710 absorbs contact shock while the end of the metal layer (FSM) protects the source COF tape 151. Assists in supporting and securing.

FIG. 8A is a cross-sectional view taken along line X-X' in FIG. 4, according to an embodiment of the present invention. FIG. 8B is a plan view of the back of the source COF tape in FIG. 8A, showing the shape of the cushion implemented on the back of the source COF tape. The embodiments of FIGS. 8A and 8B are the same as the embodiments of FIGS. 7A and 7B except that the shape of the cushion 810 is modified. That is, the cushion 810 of FIGS. 8A and 8B is a modified example of the cushion 710 of FIGS. 7A and 7B. Therefore, with reference to FIGS. 8A and 8B, description of the same parts as described above will be omitted and the cushion 810 will be described.

Referring to FIG. 8A, a cushion 810 is formed on the lower surface of the source COF tape 151. The cushion 810, which is implemented to alleviate the amount of impact received when the source COF tape 151 comes into contact with the end of the metal layer (FSM), assists the contact between the source COF tape 151 and the metal layer (FSM). That is, the organic light emitting display device 100 according to an embodiment of the present invention has a metal layer (FSM) on the lower surface of the COF tape 151 to alleviate the amount of impact received by the source COF tape 151 from contacting the end of the metal layer (FSM). ) may further include a cushion 810 implemented at the point closest to the end of the. The end of the metal layer (FSM) has a structure in which only the portion implemented to prevent damage to the source COF tape 151 at the end of the metal layer (FSM) is in contact with the source COF tape 151. In other words, the part at the end of the metal layer (FSM) that is in direct contact with the cushion 810 becomes the end part of the metal layer (FSM) implemented to prevent damage to the source COF tape 151. Specifically, (1) the end of the source COF tape 151 and the metal layer (FSM) contact with the cushion 810 in between, or (2) the end of the metal layer (FSM) and the source COF tape 151 contact directly. , a cushion 810 may fill the area around the contact point. As a result, since the end of the metal layer (FSM) has a convex curved shape or a rounded corner shape, damage to the wiring 151_b of the source COF tape 151 due to protrusions or burrs is prevented, and the metal layer (FSM) This has the effect of fixing the end to the source COF tape 151. The cushion 810 is located between the end of the metal layer (FSM) and the source COF tape 151 so that the contact state between the end of the metal layer (FSM) and the source COF tape 151 is maintained without being shaken by external shock. do. In addition, the cushion 810 absorbs the physical shock applied by the end of the metal layer (FSM) to the source COF tape 151 during the process of attaching the source COF tape 151 to partially overlap the upper surface of the metal layer (FSM), The wiring 151_b of the source COF tape 151 is protected.

As shown in FIG. 8B, the cushion 810 may be implemented in the shape of a dotted line on the lower surface of each source COF tape 151. The point where the cushion 810 is formed on the lower surface of the source COF tape 151 is when the source COF tape 151 is attached to the upper surface of the metal layer (FSM), the source COF tape 151 is attached to the end of the metal layer (FSM). It is a point of contact. The dotted line-shaped cushion 810 may be formed to be parallel to the end of the metal layer (FSM). At this time, the cushion 810 is made of an adhesive elastic material, thereby absorbing the shock applied by the metal layer (FSM) to the source COF tape 151. For example, the cushion 810 may be made of any one of an olefin-based compound, a polyurethane-based compound, or a silicon-based compound. Additionally, the cushion 810 may include magnetic particles so that they exert an attractive force with the metal layer (FSM). For example, the cushion 810 may be made of an adhesive elastic material in which magnetic particles are dispersed. As the cushion 810 is implemented to have magnetism, an attractive force acts between the cushion 810 and the metal layer (FSM), thereby fixing the contact state between the end of the source COF tape 151 and the metal layer (FSM). At this time, the magnetic particles may be composed of any one of a neodymium (Nd) magnet, a ferrite magnet, an Al-Ni-Co-Fe magnet, or a samarium cobalt (SM-Co) magnet. there is. Additionally, the cushion 810 may be made of a thermosetting polymeric organic material, such as an epoxy-based compound. The cushion 810 may be formed by applying a thermosetting polymer organic material to the end of the source COF tape 151 or the metal layer (FSM) in a fluid state and then curing it using thermal energy. The source COF tape 151 to which the cushion 810 is added is attached to the upper surface of the metal layer (FSM) so that the surface of the cushion 810 faces the TFT substrate 510. Accordingly, as shown in FIG. 8A, the position of the end of the metal layer (FSM) is fixed to the groove area of the cushion 810 formed when the cushion 810 is pressed by the end of the metal layer (FSM). As the end of the metal layer (FSM) is seated by the cushion 810, the cushion 810 absorbs contact shock and assists the end of the metal layer (FSM) in supporting and fixing the source COF tape 151.

FIG. 9A is a cross-sectional view taken along line XX' in FIG. 4, according to an embodiment of the present invention. FIG. 9B is a plan view of the back of the organic light emitting display panel 170 in FIG. 9A. The embodiments of FIGS. 9A and 9B are identical to the embodiments of FIGS. 7A and 7B except that the position and shape of the cushion 910 are changed. That is, the cushion 910 of FIGS. 9A and 9B is a modified example of the cushion 710 of FIGS. 7A and 7B. Therefore, with reference to FIGS. 9A and 9B , description of the same parts as described above will be omitted and the cushion 910 will be described.

Referring to FIG. 9A, a cushion 910 is formed at the top edge of the TFT substrate 510. A cushion 910 implemented to alleviate the amount of impact received when the source COF tape 151 comes into contact with the end of the metal layer (FSM) assists the contact between the source COF tape 151 and the metal layer (FSM). That is, the organic light emitting display device 100 according to an embodiment of the present invention has a metal layer ( It may further include a cushion 910 implemented at the point closest to the end of the FSM). The end of the metal layer (FSM) has a structure in which only the portion implemented to prevent damage to the source COF tape 151 at the end of the metal layer (FSM) is in contact with the source COF tape 151. In other words, the part at the end of the metal layer (FSM) that is in direct contact with the cushion 910 becomes the end part of the metal layer (FSM) implemented to prevent damage to the source COF tape 151. Specifically, (1) the end of the source COF tape 151 and the metal layer (FSM) are in contact with the cushion 910 between them, or (2) the end of the metal layer (FSM) and the source COF tape 151 are in direct contact. , a cushion 910 may fill the area around the contact point. As a result, since the end of the metal layer (FSM) has a convex curved shape or a rounded corner shape, damage to the wiring 151_b of the source COF tape 151 due to protrusions or burrs is prevented, and the metal layer (FSM) This has the effect of fixing the end to the source COF tape 151. The cushion 910 is located between the end of the metal layer (FSM) and the source COF tape 151, so that the contact state between the end of the metal layer (FSM) and the source COF tape 151 is maintained without being shaken by external shock. do. In addition, the cushion 910 absorbs the physical impact applied by the end of the metal layer (FSM) to the source COF tape 151 during the process of attaching the source COF tape 151 to partially overlap the upper surface of the metal layer (FSM), The wiring 151_b of the source COF tape 151 is protected.

As shown in FIG. 9B, the cushion 910 is a closed-ring along the edge of the metal layer (FSM) so as to cover the edge of the metal layer (FSM) at the top edge of the TFT substrate 510. It can be implemented in a (closed-ring) shape. That is, the cushion 910 covers the entire end of the metal layer (FSM), so that the entire end of the metal layer (FSM) can be implemented to prevent damage to the source COF tape 151. By means of the closed-ring shaped cushion 910, the entire end of the metal layer (FSM) is implemented to prevent damage to the source COF tape 151. The entire end of the metal layer (FSM) has a structure prepared for contact with the source COF tape 151, so that it is okay for the source COF tape 151 to contact any point of the end of the metal layer (FSM). . In other words, the entire end of the metal layer (FSM), the part in direct contact with the cushion 910, corresponds to the end of the metal layer (FSM) implemented to prevent damage to the source COF tape 151. As the cushion 910 is implemented in direct contact with the entire end of the metal layer (FSM), even at the end of the metal layer (FSM), especially the end portion of the metal layer (FSM) that overlaps the source COF tape 151, the source COF tape Can contact all of (151). At this time, the cushion 910 is made of an adhesive elastic material, thereby absorbing the shock applied by the metal layer (FSM) to the source COF tape 151. For example, the cushion 910 may be made of any one of an olefin-based compound, a polyurethane-based compound, or a silicon-based compound. Additionally, the cushion 910 may include magnetic particles so that they exert an attractive force with the metal layer (FSM). For example, the cushion 910 may be made of an adhesive elastic material in which magnetic particles are dispersed. As the cushion 910 is implemented to have magnetism, an attractive force acts between the cushion 910 and the metal layer (FSM), thereby fixing the contact state between the end of the source COF tape 151 and the metal layer (FSM). At this time, the magnetic particles may be composed of any one of a neodymium (Nd) magnet, a ferrite magnet, an Al-Ni-Co-Fe magnet, or a samarium cobalt (SM-Co) magnet. there is. Additionally, the cushion 910 may be made of a thermosetting polymeric organic material, such as an epoxy-based compound. The cushion 910 may be formed by applying a thermosetting polymeric organic material to the end of the source COF tape 151 or the metal layer (FSM) in a fluid state and then curing it using thermal energy. The cured cushion 910 loses its fluidity and fixes the position of the end of the metal layer (FSM) in contact with the cushion 910. Additionally, by including a hygroscopic getter, the cushion 910 can more effectively prevent moisture or oxygen from penetrating into the organic light emitting display panel 170 from the edge of the TFT substrate 510. For example, the hygroscopic getter may include any of BaO, CaO, or MgO, which are highly reactive with oxygen or moisture. Alternatively, the hygroscopic getter may be made of a material that is both hygroscopic and magnetic. As the cushion 910 is implemented to directly contact the entire end of the metal layer (FSM) to prevent damage to the source COF tape 151, the entire end of the metal layer (FSM) is implemented to prevent damage to the source COF tape 151. All portions overlapping with (151) are in contact with the source COF tape (151). As the end of the metal layer (FSM) is seated by the cushion 910, the cushion 910 absorbs contact shock and assists the end of the metal layer (FSM) in supporting and fixing the source COF tape 151.

Hereinafter, a method of manufacturing a metal layer and an adhesive layer included in an organic light emitting display device according to an embodiment of the present invention, which is explained with reference to FIGS. 1 to 9B, will be described.

Referring to FIG. 10, an adhesive sheet (M2) is laminated to a metal thin film fabric (M1) to form a metal thin film (FSMA) having adhesive properties on the first side (S1). In this way, after lamination of the metal thin film fabric M1 and the adhesive sheet M2, the metal thin film (FSMA) can be cut to fit the size of the organic light emitting display device according to an embodiment of the present invention.

Referring to FIG. 11, a groove can be formed in the metal thin film FSMA by irradiating the first laser L1 to the metal thin film FSMA and cutting the adhesive sheet M2 portion of the metal thin film FSMA. (S2, first cleavage step). At this time, the first laser (L1) is a laser that has an energy level that can cut the adhesive sheet (M2), but cannot cut the metal thin film fabric (M1). For example, the first laser L1 may be a gas laser. The gas laser may be, for example, one of a carbon dioxide (CO2) laser, a helium (He) laser, a neon (Ne) laser, and an argon (Ar) laser. Regardless of the width (W) of the groove created in the adhesive sheet (M2) portion by the first laser (L1), no trace is created on the metal thin film fabric (M1) by the first laser (L1). In other words, even if the width (W) of the groove is widened by the first laser (L1), no trace is created on the metal thin film fabric (M1) in proportion to the width (W) of the groove. When the first laser L1 is irradiated to the adhesive sheet M2 portion of the metal thin film FSMA, gas can be blown from the surrounding area and suction can be performed at the same time. The end of the adhesive layer (FSA) may be melted and then solidified again by the first laser (L1). In this process, the end of the adhesive layer (FSA) may have fluidity. In this case, the end of the adhesive layer (FSA) may have traces of flowing when it is in a liquid state or in an intermediate state between a solid and a liquid state. When the second cutting step, which will be described later, is performed immediately after the first cutting step, the end of the adhesive layer (FSA) in a molten state may gradually harden while the second cutting step is performed. Accordingly, traces of the end of the adhesive layer (FSA) flowing down may be traces of flowing down along the end of the metal layer (FSM) formed through the second cutting step. If the end of the adhesive layer (FSA) is a trace of fluidity during the melting and re-hardening process, the end of the adhesive layer (FSA) is thinner than other areas of the adhesive layer (FSA) excluding the end of the adhesive layer (FSA).

Referring to FIG. 12, a metal thin film cell (FSMA_c) can be formed by irradiating the second laser L2 to the metal thin film (FSMA) and cutting the metal thin film fabric (M1) portion of the metal thin film (FSMA). (S3, second cutting step). The metal thin film cell (FSMA_c) has a shape in which an adhesive layer (FSA) and a metal layer (FSM) overlap each other. At this time, the second laser (L2) is a laser having an energy level capable of cutting the metal thin film fabric (M1), and has a higher energy than the energy of the first laser (L1). For example, the second laser is an alloy of iron (Fe) and nickel (Ni) (Fe-Ni alloy) or an alloy of iron (Fe), nickel (Ni), and cobalt (Co) (Fe-Ni-Co alloy) It may be a laser that produces enough energy to cut a metal thin film fabric (M1) containing ). Alternatively, the second laser may be a laser having energy sufficient to cut a metal alloy having a thermal expansion coefficient of 2.5 ppm/℃ to 5.5 ppm/℃. When the second laser L2 is irradiated to the metal thin film fabric M1 portion of the metal thin film FSMA, gas can be blown from the surrounding area and suction can be performed at the same time.

At this time, the second laser L2 may be a laser capable of cutting a portion of the adhesive sheet M2. Since the adhesive sheet M2 can also be cut by the second laser L2, the width W of the groove created in the adhesive sheet M2 by the first laser L1 in the first cutting step is It is not maintained through the second cutting step. In the second cutting step, the width W' of the groove formed in the adhesive sheet M2 is formed by the second laser L2. As the time for irradiating the second laser L2 to the metal thin film fabric M1 increases, the width W' of the groove formed in the adhesive sheet M2 by the second laser L2 increases. Alternatively, the second laser L2 may be a laser capable of cutting only a portion of the thin metal film fabric M1 while passing through the adhesive sheet M2 without cutting the portion. For example, the second laser L2 may be a solid laser. The solid-state laser may be, for example, one of a fiber laser, a neodymium (Nd) laser, and a glass laser.

Referring to Figures 13 (a) and (b), physical processing is performed on the end of the metal thin film cell (FSMA_c) so that the metal layer (FSM) of the metal thin film cell (FSMA_c) has a convex curved shape or a rounded corner shape. (S4, physical processing step).

Figure 13(a) shows physical processing by the rolling method. By pressing the end of the metal thin film cell (FSMA_c), that is, the cut cross section, to the side using a press tool (P), the metal layer (FSM) of the metal thin film cell (FSMA_c) has a convex curved shape or a round shape. It can be processed to have an edge shape. In other words, pressure is applied to the end of the metal layer (FSM) in contact with the rolling tool (P), so that it can be processed into a rounded edge shape.

Figure 13(b) shows physical processing using the laser irradiation method. The third laser L3 is irradiated to the end of the metal thin film cell FSMA_c, that is, the cut cross section. At this time, while the third laser L3 is being irradiated, the irradiation direction of the third laser L3 changes. That is, the third laser L3 is irradiated while changing x, y, and x coordinates with respect to the x, y, and z axes. The end of the metal layer (FSM) that has received the third laser (L3) can be processed into a rounded corner shape by melting and hardening again by the third laser. At this time, due to the characteristics of the polymer organic material that makes up the adhesive layer (FSA), the shape can be changed without breaking or cracking, so the end of the adhesive layer (FSA) can be processed according to the shape of the end of the metal layer (FSM) after physical processing. You can. As mentioned above, the third laser L2 may be the same laser as the second laser L2. By tilting the third laser L3 and irradiating the end of the metal layer FSM of the metal thin film cell FSMA_c, the end of the metal layer FSM can be processed into a rounded corner shape. When the third laser L3 is irradiated to the end of the metal layer FSM of the metal thin film cell FSMA_c, gas can be blown from the surrounding area and suction can be performed at the same time.

When physical processing is performed immediately after the second cutting step, the end of the adhesive layer (FSA) in a molten state may gradually harden while the physical processing is performed through the second cutting step. Accordingly, the end of the adhesive layer (FSA) may have a convex curved shape or a rounded corner shape following the shape of the end of the metal layer (FSM) on which physical processing was performed. The end of the adhesive layer (FSA) can change shape without breaking or cracking due to the nature of the polymer organic material. Therefore, even if the end of the adhesive layer (FSA), which was in a molten state, has already completely hardened through the second cutting step, the end of the adhesive layer (FSA) follows the shape of the end of the newly modified metal layer (FSM) through physical processing. It can be processed. If the rounded edge shape of the end of the adhesive layer (FSA) is a trace of fluid in the process of melting and re-solidifying the end of the adhesive layer (FSA), the end of the adhesive layer (FSA) is an adhesive layer other than the end of the adhesive layer (FSA) ( The thickness may be thinner than the FSA) area.

14 to 16 show cross-sections of each metal thin film cell including a metal layer cut according to each method of processing the metal thin film to be cut.

Figure 14 is a cross-section of a metal thin film cell (FSMA_c) in which a metal thin film fabric is cut using an etching process and an adhesive layer is attached to the metal layer thus formed. The metal thin film fabric is cut using an etchant for metal materials, and at this time, the shape of the end of the metal layer (FSM) is inclined to a tapered shape due to the circulation of the etchant. As the end of the metal layer (FSM) has a tapered shape, a sharp shape appears and burnt occurs due to shorts in the wiring of the COF tapes 151 and 161. At this time, the shape of the taper may be a straight line or a concave curve. Also, because the metal thin film fabric must be obtained for the etchant, etching cannot be performed with an adhesive sheet that reacts to the etchant attached to the metal thin film fabric. Therefore, when cutting a metal thin film fabric using an etching process, the metal layer can be cut from the metal thin film fabric and the adhesive layer from the adhesive sheet, and then the metal layer (FSM) and the adhesive layer (FSA) can be attached. there is. Therefore, there is a difficulty in aligning and attaching the metal layer (FSM) and the adhesive layer (FAS) to each other, so the tolerance must be set larger.

Figure 15 is a cross-section of a metal thin film cell (FSMA_c) in which a metal thin film fabric is vertically cut using a laser process. Unlike when using the etching process in Figure 14, a vertical cut shape is obtained without a tapered shape. As the end of the metal layer (FSM) has a vertical structure, not only sharp parts are formed, but also protrusions or burrs are formed randomly in random areas on the cut surface, that is, at the end of the metal layer (FSM). It can be. Accordingly, the sharp end of the metal layer (FSM), the end of the metal layer (FSM) with protrusions or knobs, causes shorting and shorting in the wiring of the COF tapes 151 and 161, causing bunts. When using a laser that can cut not only metal thin film fabric but also adhesive sheets, the adhesive sheet portion is relatively more affected by the laser (groove shape due to cutting, degree of loss of the adhesive sheet portion, etc.). , it may not be appropriate to cut the two together. That is, the metal layer (FSM) can be cut from the metal thin film fabric and the adhesive layer (FSA) from the adhesive sheet, and then the metal layer (FSM) and the adhesive layer (FSA) are attached. Therefore, the metal layer (FSM) There is a difficulty in attaching the adhesive layer (FSA) by aligning it with each other, so the tolerance must be set larger.

Figure 16 shows a metal layer and an adhesive layer included in a structure according to an embodiment of the present invention. That is, as shown in Figure 16, as described in Figures 1 to 13, the adhesive sheet (M2) and the metal thin film fabric (M1) are cut using a laser process, and the end of the metal layer (FSM) is physically processed to have a rounded corner shape. This is a cross-section of a metal thin film cell (FSMA_c). The end of the metal layer (FSM) is either (1) melted by a laser and the sharp shape, protrusion, or lump disappears, or (2) by pressing the sharp shape, protrusion, or lump by physical pressure, forming a convex curve. It has a shape, or a rounded edge shape. When manufacturing the metal thin film cell (FSMA_c) using the first laser (L1) and the second laser (L2) described above, the metal thin film fabric (M1) and the adhesive sheet are first attached to each other, and then the metal thin film fabric (M1) is A method may be taken of cutting the and adhesive sheet (M2) together. Therefore, the tolerances that were considered when manufacturing the metal layer (FSM) and the adhesive layer (FSA) separately and aligning and attaching them may no longer be considered. In addition, as the end of the metal layer (FSM), which has a convex curved shape or a rounded corner shape, comes into contact with the lower surface of the COF tape (151.161), the metal layer (FSM) serves as a support for the COF tape (151.161). At the same time, it is possible to minimize burnt problems caused by shorts and shorts in the COF tape (151. 161) wiring. Accordingly, since the end of the metal layer (FSM) has a convex curved shape or a rounded corner shape, there is an effect of preventing damage to the wiring of the COF tapes 151 and 161 due to protrusions or lumps.

Therefore, by preventing protrusions or lumps from occurring at the ends of the metal layer (FSM) constituting the upper substrate, damage to the wiring of the COF tapes 151 and 161 caused by the ends of the metal layer (FSM) constituting the upper substrate can be prevented. there is. Additionally, short circuits between the wires of the COF tapes 151 and 161 caused by the ends of the metal layer (FSM) constituting the upper substrate can be minimized. In addition, the occurrence of burnts, which cause the surrounding area to burn black when a driving failure occurs after module work of the organic light emitting display device or a short circuit occurs between the wires of the COF tapes 151 and 161, can be reduced, thereby improving the productivity and reliability of the organic light emitting display device. there is.

Accordingly, an organic light emitting display device according to an embodiment of the present invention includes a metal layer having an upper surface configured to accommodate a PCB and a lower surface configured to accommodate the upper surface of a TFT substrate; An adhesive layer located on the lower surface of the metal layer and implemented to adhere the metal layer to the TFT substrate; and a COF tape partially overlapping the metal layer and supported by the ends of the metal layer, having a driving integrated circuit on the lower surface, and a COF tape on the upper surface of the metal layer and configured to connect the PCB and the TFT substrate. At this time, the COF tape connects the PCB and the TFTT board through a pad located on the top of the TFT board between the end of the metal layer and the end of the TFT board, and the end of the metal layer prevents damage to the COF tape at the end of the metal layer. Characterized in that only the part implemented to do so is in contact with the COF tape.

In addition, the organic light emitting display device according to an embodiment of the present invention further includes a cushion implemented at the point closest to the end of the metal layer on the lower surface of the COF tape to alleviate the amount of impact received when the COF tape contacts the end of the metal layer. It can be included. At this time, the part at the end of the metal layer that is in direct contact with the cushion may be the end part of the metal layer implemented to prevent damage to the COF tape.

Additionally, in the organic light emitting display device according to an embodiment of the present invention, the end of the adhesive layer covers the end of the metal layer, and the end of the adhesive layer contacts the cushion, so that the end of the adhesive layer and the end of the metal layer are connected to the COF tape with the cushion in between. It can be fixed to the bottom of the.

Additionally, in the organic light emitting display device according to an embodiment of the present invention, the cushion may have magnetism so that an attractive force acts on the metal layer. Additionally, in the organic light emitting display device according to an embodiment of the present invention, the cushion may be made of an adhesive elastomer in which magnetic particles are dispersed.

Additionally, in the organic light emitting display device according to an embodiment of the present invention, the adhesive elastomer may be composed of any one of an olefin-based compound, a polyurethane-based compound, or a silicon-based compound.

Additionally, in the organic light emitting display device according to an embodiment of the present invention, the cushion may be made of a thermosetting polymer organic material.

Additionally, in the organic light emitting display device according to an embodiment of the present invention, the cushion may have the shape of a solid line parallel to the end of the metal layer.

Additionally, in the organic light emitting display device according to an embodiment of the present invention, the cushion may have a corrugated cardboard-shaped uneven surface formed to be parallel to the end of the metal layer.

Additionally, in the organic light emitting display device according to an embodiment of the present invention, the end of the metal layer may be seated and fixed in the groove area of the uneven surface.

Additionally, in the organic light emitting display device according to an embodiment of the present invention, the cushion may have a dotted line shape parallel to the end of the metal layer.

Additionally, in the organic light emitting display device according to an embodiment of the present invention, the cushion may be implemented in a closed-ring shape along the edge of the metal layer so as to cover the edge of the metal layer on the upper edge of the TFT substrate.

Additionally, in the organic light emitting display device according to an embodiment of the present invention, the cushion may include a hygroscopic getter.

In addition, the organic light emitting display device according to an embodiment of the present invention is implemented so that the entire end of the metal layer prevents damage to the COF tape by directly contacting the entire end of the metal layer, so that the cushion overlaps the COF tape at the end of the metal layer. Any part can be in contact with the COF tape.

Although embodiments of the present invention have been described in more detail with reference to the accompanying drawings, the present invention is not necessarily limited to these embodiments, and may be modified and implemented in various ways without departing from the technical spirit of the present invention. . Accordingly, the embodiments disclosed in the present invention are not intended to limit the technical idea of the present invention, but are for illustrative purposes, and the scope of the technical idea of the present invention is not limited by these examples. Therefore, the embodiments described above should be understood in all respects as illustrative and not restrictive. The scope of protection of the present invention should be interpreted in accordance with the claims, and all technical ideas within the equivalent scope should be interpreted as being included in the scope of rights of the present invention.

100: Organic light emitting display device 130: System board part
140: timing control unit 150: data driver
151: Source COF tape 151_a: Support layer
151_b: Wiring 151_c: Solder resist
151_d: Driving integrated circuit 160: Gate driving unit
170: Organic light emitting display panel 180: Source PCB
190: Scan PCB 510: TFT board
520: light emitting layer 530: passivation layer
540: PCB adhesive member 550: Pad portion
710, 810, 910: Cushion FSMA: Metal thin film
FSMA_c: Metal thin film cell FSM: Metal layer
FSA: Adhesive layer M1: Metal thin film fabric
M2: Adhesive sheet L1, L2, L3: First, second and third lasers
P: rolling tool

Claims (20)

A substrate having a display area;
a light emitting layer in the display area of the substrate;
A passivation layer covering the light emitting layer; and
It includes a metal layer covering the passivation layer,
The metal layer covers the display area and has an area larger than that of the passivation layer. According to claim 1,
An end of the passivation layer is between an end of the light-emitting layer and an end of the metal layer. According to claim 1,
a pad portion between an end of the substrate and an end of the metal layer;
COF tape connected to the pad portion; and
A light emitting display device further comprising a driving integrated circuit mounted on the COF tape. A light emitting display panel having a pad portion; and
It includes a driving part connected to the pad part,
The light emitting display panel,
A substrate having a display area;
a light emitting layer in the display area of the substrate; and
a passivation layer on the light emitting layer; and
It includes a metal layer on the passivation layer,
At least one end of the metal layer is between an end of the passivation layer and the pad portion. According to claim 4,
The driving unit,
COF tape connected to the pad portion; and
A light emitting display device further comprising a driving integrated circuit mounted on the COF tape. The method according to any one of claims 1 to 5,
The light emitting display device further includes an adhesive layer between the metal layer and the passivation layer. According to claim 6,
The adhesive layer surrounds the passivation layer. According to claim 6,
An end of the adhesive layer covers at least a portion of a side surface of the metal layer. According to claim 6,
An end of the adhesive layer has a convex curved shape or a rounded corner shape. According to claim 3 or 5,
A light emitting display device, wherein the driving integrated circuit overlaps the metal layer. According to claim 3 or 5,
The driving integrated circuit is between the metal layer and the COF tape. According to claim 3 or 5,
A light emitting display device further comprising a PCB connected to the COF tape and overlapping at least a portion of the metal layer. According to claim 3 or 5,
The COF tape is supported on the metal layer. According to claim 13,
An end of the metal layer in contact with the COF tape has a convex curved shape or a rounded corner shape. According to claim 3 or 5,
A light emitting display device further comprising a cushion between the metal layer and the COF tape. According to claim 15,
The COF tape includes an inclined portion overlapping an end of the metal layer,
The light emitting display device of claim 1, wherein the cushion is on the inclined portion of the COF tape. According to claim 16,
Further comprising an adhesive layer between the metal layer and the passivation layer and covering at least a portion of a side surface of the metal layer,
The cushion is in contact with the adhesive layer. According to claim 15,
A light emitting display device, wherein the cushion includes a magnetic adhesive elastomer, a thermosetting polymer organic material, or a hygroscopic getter. According to claim 18,
A light emitting display device, wherein the adhesive elastomer includes any one of an olefin-based compound, a polyurethane-based compound, and a silicon-based compound. According to claim 15,
A light emitting display device, wherein the cushion includes an uneven surface in contact with an end of the metal layer.