KR102534135B1 - Organic light emitting diode display and manufacturing method of the same - Google Patents

Abstract

According to one embodiment of the present invention, an organic light emitting display device including at least one structure configured to efficiently control a disposition area of an adhesive layer is provided. A plurality of driving elements and a plurality of organic light emitting elements are disposed on the lower substrate, and a black matrix is disposed on the upper substrate facing the lower substrate. A seal dam and structure are disposed between the two substrates. The structure can improve the lifespan reliability of the organic light emitting device by minimizing damage to the sealing dam caused by the transfer of the adhesive layer to the sealing solder when the upper substrate and the lower substrate are bonded together.

Description

Organic light emitting display and manufacturing method thereof {ORGANIC LIGHT EMITTING DIODE DISPLAY AND MANUFACTURING METHOD OF THE SAME}

The present invention relates to an organic light emitting display device and a manufacturing method thereof, and more particularly, to provide an organic light emitting display device capable of improving the reliability of an encapsulation dam that minimizes permeation of oxygen and moisture, and a manufacturing method thereof.

An organic light emitting display (OLED) is a self-emissive display device, and unlike a liquid crystal display (LCD), it does not require a separate light source and can be manufactured to be lightweight and thin. In addition, the organic light emitting display device is advantageous in terms of power consumption due to low voltage driving, and is being studied as a next-generation display because it is excellent in color implementation, response speed, viewing angle, and contrast ratio (CR).

In the organic light emitting display device, a light emitting layer containing an organic material is disposed between a pixel electrode (anode) and a common electrode (cathode), and holes and electrons injected from the pixel electrode and the common electrode are combined in the organic light emitting layer to form holes. - Forms an exciton, which is a pair of electrons, and emits light by the energy generated when the exciton returns to the ground state. Unlike a liquid crystal display, an organic light emitting display device including a self-luminous element does not require a separate light source, and thus can be manufactured as a light and thin display device.

However, an organic light emitting display device is very vulnerable to oxygen, moisture, etc. because it uses an organic material as a light emitting layer. When oxygen or moisture permeates, electrical resistance required for injection of electrons and holes increases, and the organic light emitting layer is oxidized, causing defects such as dark spots.

Accordingly, various techniques for sealing the organic light emitting element are used to minimize the penetration of oxygen, moisture, etc. into the organic light emitting layer from the outside.

[Related technical literature]

[Patent Literature]

Organic light emitting diode display (Patent Application No. 10-2012-0151923)

In order to seal the organic light emitting element, a method of sealing the organic light emitting element by using an adhesive layer on a lower substrate on which the organic light emitting element is disposed and bonding it to an upper substrate, which is a sealing substrate, is mainly used. At this time, a method of minimizing the permeation of oxygen and moisture that may permeate from the side surfaces of the bonded substrates by disposing a sealing dam on the side surface of the substrate is used.

The lower substrate and the upper substrate are bonded after disposing an adhesive layer of a curable material such as resin on the upper substrate. A curable material such as resin may be disposed on the upper substrate in a liquid state using an inkjet printing method or the like.

In the process of bonding the upper substrate and the lower substrate, the adhesive layer disposed on the upper substrate has fluidity because it is in an uncured liquid state, and can be moved on the upper substrate by surface tension.

When the adhesive layer is moved, the sealing dam does not sufficiently contact the lower substrate due to the moving adhesive layer in the direction of the sealing dam disposed on the upper substrate in the process of bonding the upper substrate and the lower substrate, or the sealing dam is damaged by pressure. Collapsing can happen.

If the sealing dam does not sufficiently contact the two substrates between the upper substrate and the lower substrate, a penetration path of oxygen and moisture may occur, resulting in poor progress of the organic light emitting device. Accordingly, the inventors of the present invention invented a new structure and method of an organic light emitting display device capable of minimizing damage to the sealing dam in the process of bonding the upper substrate and the lower substrate.

An object to be solved according to an embodiment of the present invention is to provide an organic light emitting display device including a structure capable of minimizing fluidity of an adhesive layer on an upper substrate and a manufacturing method thereof.

An object to be solved according to an embodiment of the present invention is to provide an organic light emitting display device capable of improving reliability of a sealing dam and a manufacturing method thereof.

Solved problems according to an embodiment of the present invention are not limited to the above-mentioned problems, and other problems not mentioned above will be clearly understood by those skilled in the art from the following description.

According to an embodiment of the present invention, an organic light emitting display device including a structure capable of minimizing fluidity of an adhesive layer during bonding of an upper substrate and a lower substrate is provided. A plurality of driving elements and a plurality of organic light emitting elements are disposed on the lower substrate, and a sealing dam and a black matrix are disposed on the upper substrate facing the lower substrate. In addition, an adhesive layer made of a material such as resin is disposed between the upper substrate and the lower substrate, and at least one structure configured to easily control a disposition area of the adhesive layer by minimizing fluidity of the adhesive layer is disposed.

Due to the structure arranged to easily control the placement area of the adhesive layer, the movement of the adhesive layer to the area where the sealing dam is placed is minimized, so that the sealing dam collapses in the step of bonding the upper substrate and the lower substrate or the gap between the upper and lower substrates is minimized. It is possible to minimize defects that are insufficiently located in

A manufacturing method of an organic light emitting display device according to an exemplary embodiment of the present invention is provided. A plurality of driving elements and a plurality of organic light emitting elements are formed on the lower substrate. Meanwhile, a black matrix layer is formed on the upper substrate facing the lower substrate.

To form a sealing dam that can minimize the penetration of oxygen and moisture on the upper substrate, the sealing dam is placed in the bezel area. Subsequently, an adhesive layer is disposed on the upper substrate, the upper substrate and the lower substrate are bonded together, and then the adhesive layer and the sealing dam are cured using heat or UV.

Forming the black matrix on the upper substrate includes forming a structure capable of minimizing the movement of the adhesive layer to the sealing dam in the process of bonding the upper substrate and the lower substrate by efficiently controlling the arrangement area of the adhesive layer.

In this way, damage to the sealing dam due to the spreading of the adhesive layer in the process of bonding the upper and lower substrates by forming the structure on the upper substrate can be minimized.

According to an embodiment of the present invention, by providing a structure configured to easily control the arrangement area of the adhesive layer, the reliability of the sealing dam is improved, and the lifespan of the organic light emitting display device can be improved by minimizing moisture permeation and oxygen permeation rate.

In addition, by providing the structure, there is an effect of reducing manufacturing cost by improving the stability of the process of bonding the upper substrate and the lower substrate.

The effects of the present invention are not limited to the effects mentioned above, and other effects not mentioned will be clearly understood by those skilled in the art from the description below.

Since the content of the invention described in the problem to be solved, the means for solving the problem, and the effect above does not specify the essential features of the claim, the scope of the claim is not limited by the matters described in the content of the invention.

1 is a schematic plan view illustrating a configuration of an organic light emitting display device according to an exemplary embodiment of the present invention.
FIG. 2 is a schematic cross-sectional view taken along line AA′ of FIG. 1 to describe an organic light emitting display device in which a structure according to an exemplary embodiment is disposed.
3A to 3D are schematic cross-sectional enlarged views of region X of FIG. 2 for explaining various configurations of structures according to various embodiments of the present disclosure.
4 is a flowchart illustrating a method of manufacturing an organic light emitting display device including a structure according to an exemplary embodiment of the present invention.

Advantages and features of the present invention, and methods of achieving them, will become clear with reference to the detailed description of the following embodiments taken in conjunction with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but will be implemented in various different forms, only these embodiments make the disclosure of the present invention complete, and common knowledge in the art to which the present invention belongs. It is provided to fully inform the holder of the scope of the invention, and the present invention is only defined by the scope of the claims.

The shapes, sizes, ratios, angles, numbers, etc. disclosed in the drawings for explaining the embodiments of the present invention are illustrative, so the present invention is not limited to the details shown. Like reference numbers designate like elements throughout the specification. In addition, in describing the present invention, if it is determined that a detailed description of related known technologies may unnecessarily obscure the subject matter of the present invention, the detailed description will be omitted. When 'includes', 'has', 'consists of', etc. mentioned in this specification is used, other parts may be added unless 'only' is used. In the case where a component is expressed in the singular, the case including the plural is included unless otherwise explicitly stated.

In interpreting the components, even if there is no separate explicit description, it is interpreted as including the error range.

In the case of a description of a positional relationship, for example, 'on top of', 'on top of', 'at the bottom of', 'next to', etc. Or, unless 'directly' is used, one or more other parts may be located between the two parts.

In the case of a description of a temporal relationship, for example, when a temporal precedence relationship is described as 'after', 'continue to', 'after ~', 'before', etc., 'immediately' or 'directly' As long as ' is not used, non-continuous cases may also be included.

Although first, second, etc. are used to describe various components, these components are not limited by these terms. These terms are only used to distinguish one component from another. Therefore, the first component mentioned below may also be the second component within the technical spirit of the present invention.

Each feature of the various embodiments of the present invention can be partially or entirely combined or combined with each other, technically various interlocking and driving are possible, and each embodiment can be implemented independently of each other or can be implemented together in a related relationship. may be

Hereinafter, various configurations of an organic light emitting display device including a structure capable of efficiently controlling the arrangement of an adhesive layer according to an exemplary embodiment of the present invention will be described.

According to the configuration of the organic light emitting display device, the sealing dam reinforces the adhesion between the lower substrate and the upper substrate in the non-display area of the organic light emitting display device and minimizes the permeation of moisture. The sealing dam may include a sealant and a hygroscopic filler dispersed in the sealant. As the sealant, a curable sealant that can be cured by heat or ultraviolet light is mainly used. For example, the sealant may be an epoxy or acrylic material to which a heat curing accelerator and/or a photoinitiator are added.

The adhesive layer is a filler, and may be made of a resin material curable by heat or UV, and may include a transparent hygroscopic filler in the adhesive layer. Hygroscopic filler is a material capable of absorbing moisture pulverized into small sizes, and is uniformly dispersed in the adhesive layer.

Hereinafter, various embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a schematic plan view illustrating a configuration of an organic light emitting display device according to an exemplary embodiment of the present invention.

Referring to FIG. 1 , the organic light emitting diode display 100 includes a lower substrate 110 and an upper substrate 120 in which a pad region 150 is defined. The lower substrate 110 includes a plurality of driving elements and a plurality of organic light emitting elements, and includes a pad region 150 on which a D-IC (Drive IC, 152) is disposed, although it is shown in brief. The driving element and the organic light emitting element are electrically extended to the pad region 150 through a wiring electrode (not shown) on the lower substrate 110, and through the pad electrode 151 disposed on the pad region 150, the circuit board ( not shown) and electrically connected.

Current and signals for driving the organic light emitting display device 100 are supplied from the circuit board, and the organic light emitting diode is driven by the supplied signals and current to emit light.

Also, in the organic light emitting display device 100, a display area 130 displaying an image and a non-display area 140 are defined. The above-described organic light emitting device (not shown) is disposed corresponding to the display area 130 , and various purpose wires, electrodes, and pad areas 150 are disposed in the non-display area 140 .

To explain the operation of the organic light emitting display device 100 in more detail, the display area 140 may be referred to as an active area, and a pixel composed of a plurality of sub pixels is a matrix. placed in the form

The sub-pixels are configured to emit light of each unique color such as white, blue, green, and red, and an image can be displayed by displaying various colors on a pixel (pixel) with a combination of each unique color of the sub-pixels. .

In addition, in the display area 130, data lines and scan lines are orthogonal, and subpixels including an organic light emitting element and a driving element are arranged in a matrix form. Each subpixel includes a plurality of driving elements required for switching and driving. It may include a storage capacitor connected to the driving element. In addition, although not shown, a compensation circuit may be further included.

The adhesive layer between the upper substrate 120 and the lower substrate 110 maintains adhesion between the two substrates and at the same time includes a moisture absorbent in the adhesive layer to minimize the penetration and diffusion of moisture to improve the lifetime reliability of the organic light emitting device. can Matters related to this will be described in detail later.

The upper substrate 120 and the lower substrate 110 are bonded to primarily block external oxygen and moisture, but a sealing dam (not shown) is placed in the non-display area 140 to further block the penetration path of the side surfaces of the bonded substrates 120 and 110. ) to protect the organic light emitting element from external oxygen and moisture. Details on this will be described later.

The sealing dam disposed in the non-display area 140 and the adhesive layer may be moved toward the sealing dam during the bonding process, and the moved adhesive layer may damage the sealing dam by applying pressure to the sealing dam during the bonding process. . Due to the spreading of the adhesive layer, a sealing dam failure to completely seal the organic light emitting device from the external environment may occur due to the sealing dam including the adhesive layer between the two substrates. Therefore, a structure (not shown) constructed so that the sealing dam of the non-display area 140 is not damaged due to the spreading of the adhesive layer during the bonding process of the two substrates is placed in the non-display area 140 so that the sealing dam is formed between the two substrates by the adhesive layer and organic matter. The light emitting element is efficiently sealed. Details of the structure will be described later.

FIG. 2 is a schematic cross-sectional view taken along line AA′ of FIG. 1 to describe an organic light emitting display device in which a structure according to an exemplary embodiment is disposed.

Referring to FIG. 2 , the organic light emitting display device 100 includes a lower substrate 210, an upper substrate 220, a driving element 211, a pixel electrode 212, an organic light emitting layer 213, a common electrode 214, and an encapsulation. layer 215, black matrix layer 221, color filter layer 222, dam bank 233, adhesive layer 270, sealing dam 260, and structure 280, and display area 230 and non-display An area 240 is defined.

Although shown in FIG. 2 for simplicity, in the organic light emitting display device 100, a plurality of pixels are disposed in the display area 230, and a plurality of organic light emitting elements 216 are disposed in the display area 230, and each organic light emitting element is disposed in the display area 230. 216 corresponds to a pixel defined by the black matrix 221 and the color filter 222.

The non-display area 240 is also referred to as a bezel area, and prevents the sealing dam 260 penetrating into the sides of the two substrates and overflowing the sealing dam 260 to the surroundings in the step of disposing the sealing dam 260. A dam bank 233 to prevent is disposed.

The adhesive layer 270 filling the gap between the lower substrate 210 and the upper substrate 220 may use a photocurable material and serves as a filler filling the two substrates.

In addition, the adhesive layer 270 may further improve lifespan reliability of the organic light emitting display device 100 by pulverizing and mixing a material capable of adsorbing moisture.

On the other hand, since moisture and oxygen can penetrate from the sides of the two substrates, the sealing dam 260 is placed in the non-display area 240 to seal the adhesive layer 270 from the external environment, thereby further minimizing the penetration of oxygen and moisture. there is. That is, the sealing dam 260 surrounds the periphery of the adhesive layer 270 made of a filler and serves as an additional seal.

For the sealing dam 260, a material capable of absorbing moisture may be pulverized and mixed into small sizes, and an epoxy-based material, acrylic material, or olefin-based material may be used. The sealing dam 260 may be disposed using a dispenser equipment, and seals the adhesive layer 270 disposed between the two substrates through UV and thermal curing after bonding of the two substrates.

In order to efficiently dispose the sealing dam 260, a dam bank 233 is disposed on the upper substrate 220. The dam bank 233 is made of the same material as the black matrix layer 221 on the upper substrate 220. can be placed using

The adhesive layer 270 may be made of a material selected from among epoxy, acrylic, silicon, and olefin-based materials, and contains a getter to prevent diffusion of penetrating moisture, and lower substrate 210. It serves to adhere and fill between the and the upper substrate 220.

The adhesive layer 270 may be bonded to the lower substrate 210 after being disposed on the upper substrate 220 by a method such as inkjet printing. In the process of bonding the two substrates together, the adhesive layer 270 disposed on the upper substrate 220 may be moved from the non-display area 240 on the upper substrate 220 toward the sealing dam 260 by forces such as surface tension. there is.

In particular, when the uncured adhesive layer 270 is driven or thickened in the direction of the sealing dam 260 by a force such as surface tension, the sealing dam is bonded to the upper substrate 220 and the lower substrate 210. Excessive stress may be applied to 260, or the sealing dam 260 may be broken.

In order to control the fluidity of the uncured adhesive layer 270, the structure 280 is placed on the upper substrate 220 to minimize the mobility of the uncured adhesive layer 270 in the direction of the sealing dam 260. can

At least one structure 280 configured to minimize the fluidity of the uncured adhesive layer 270 is disposed in the non-display area 240 of the upper substrate 220, but the viscosity and ratio of the uncured adhesive layer 270 The shape, height, and number of the display area 240 can be adjusted in consideration of the size of the display area 240, and the black matrix layer 221 or the color filter layer 222 can be arranged simultaneously without the need for an additional arrangement. there is. The structure 270 is located in the boundary region between the adhesive layer 270 made of filler and the sealing dam 260, and when the upper substrate 220 and the lower substrate 210 are bonded due to the surface tension of the filler constituting the adhesive layer 270 It is possible to minimize damage to the sealing dam 260 by moving the filler thereto.

2, the structure 280 is shown as being disposed on the upper substrate 220, but is not limited thereto, and the structure 280 may be disposed on the lower substrate 210, and the upper substrate 220 and the lower substrate ( 210) may be placed on all.

Various configurations of the structure 280 will be described later.

3A to 3C are schematic cross-sectional enlarged views of region X of FIG. 2 for explaining various configurations of structures according to various embodiments of the present disclosure.

Referring to FIGS. 2 and 3A , the structure 380 is disposed on the upper substrate 320 and may be made of the same material as the black matrix layer 221 .

The shape of the structure 380 may be configured in various shapes in consideration of the surface tension, viscosity and material of the adhesive layer 270, and the plurality of structures 380 may be arranged at the same height. However, it is not limited thereto, and the plurality of structures 380 may be disposed at different heights.

In addition, the structure 380 may have a low slanted side surface, and as described above, the structure 380 may be configured in various shapes in consideration of the viscosity and material of the adhesive layer 270 .

The structure 380 may have a straight, zigzag, oblique or semicircular pattern on the upper substrate 320 based on a plane, and may have a pattern of a non-display area 240 where the sealing dam 260 is disposed and an adhesive layer ( The number of structures 380 and the distance between the structures 380 may be determined in consideration of materials of the structures 270 .

Referring to FIG. 3B , a black matrix layer 321 may be disposed on the upper substrate 320 and a structure 380 may be disposed on the black matrix layer 321 . The structure 380 may be made of the same material as the color filter layer 222, and the structure 380 is formed using red, blue, and green color filters used in the color filter layer 222, but each color filter layer 222 ) It is possible to configure various shapes of the structure 380 by varying the height.

Referring to FIG. 3C , the structure 380 may have at least one intaglio pattern 381 .

The intaglio pattern 381 may be configured in various patterns according to the type of material constituting the adhesive layer 270 . For example, the intaglio patterns 381 may be arranged to have different depths and widths, and the depth and width of the intaglio patterns 381 are appropriately changed according to the type of the adhesive layer 270 and the state of the material during the arrangement process. can be placed

The structure 380 may be made of the same material as the black matrix layer 221 disposed on the upper substrate 320 . However, it is not limited thereto, and the structure 380 may be made of the same material as the color filter layer 222 .

Referring to FIG. 3D , the structure 380 disposed on the upper substrate 320 may be a multi-layered structure 380 made of materials constituting the black matrix layer 221 and the color filter layer 222 .

The structure 380 is disposed using the same material as the black matrix layer 221, and the structure 380 is disposed using red, green, or blue color filters used to dispose the color filter layer 222 thereon. can In this case, when the plurality of structures 380 are arranged, structures 380 having various heights may be arranged by utilizing the arrangement and thickness of each color filter.

4 is a flowchart illustrating a method of manufacturing an organic light emitting display device including a structure according to an exemplary embodiment of the present invention.

Referring to FIG. 4 , a black matrix layer is formed on the upper substrate (S120). Subsequently, a structure is formed on the upper substrate (S121). The structure may be performed simultaneously with the step of forming the black matrix layer using a material for forming the black matrix layer.

Subsequently, a color filter layer is formed on the black matrix layer. The color filter layer may be formed using red, blue, and green color filters, and each color is formed to correspond to each subpixel (subpixel). In some embodiments, the structure may be formed of the same material as the color filter layer at the same time as the color filter layer.

A sealing dam is formed on the upper substrate (S130). The sealing dam is formed in the non-display area (bezel area) of the upper substrate using a dispenser and is formed using a material that can be cured by thermal or photocuring.

Meanwhile, a plurality of driving elements and a plurality of organic light emitting elements are formed on the lower substrate (S110).

The driving element and the organic light emitting element are formed to be electrically connected, and a plurality of wires and electrodes connected to the driving element and the organic light emitting element are disposed on the lower substrate.

An adhesive layer is formed on the upper substrate (S140). The adhesive layer may be formed of a thermosetting material such as resin by an inkjet printing method or the like and may include a moisture absorption material. The adhesive layer is formed on the inside of the sealing dam so as to cover the organic light emitting device in the bonding step between the upper substrate and the lower substrate. At this time, the movement of the adhesive layer in the sealing dam direction can be minimized by the structure formed on the upper substrate.

Subsequently, the upper substrate and the lower substrate are bonded (S150). An organic light emitting display device may be formed by bonding the upper substrate and the lower substrate and curing the adhesive layer by irradiating heat or UV light.

Embodiments of the present invention can be summarized once again as follows.

An organic light emitting display device according to an exemplary embodiment of the present invention includes two substrates facing each other, a filler filling the space between the two substrates and encapsulating an organic light emitting layer of one of the two substrates, and between the two substrates. A sealing dam that surrounds the outer periphery of the filler and acts as an additional seal; and a structure located in a boundary region between the filler and the sealing dam and minimizing damage to the sealing dam due to surface tension of the filler due to movement of the filler when bonding the two substrates.

The structure is on at least one of the two substrates, has a pattern, and may be made of the same material as the black matrix.

The shape of the pattern may be configured according to the characteristics of the surface tension of the filler.

The pattern may be configured to minimize the fluidity of the filler in consideration of the surface tension of the filler.

An organic light emitting diode display device according to an exemplary embodiment of the present invention includes a lower substrate having a plurality of driving elements and a plurality of organic light emitting elements, an upper substrate facing the lower substrate and having a black matrix layer, and a moisture content between the upper substrate and the lower substrate. A sealing dam configured to minimize permeation of peroxygen, an adhesive layer between the upper substrate and the lower substrate, and at least one structure on the upper substrate and configured to easily control a disposition area of the adhesive layer.

The structure may be in the non-display area of the upper substrate.

A plurality of color filter layers may be present on the upper substrate.

The structure may be made of the same material as the material constituting the color filter layer.

The structure is a multi-layered structure and may include a layer made of the same material as the black matrix layer and a layer made of the same material as the color filter layer.

The structure may be plural, and may include at least one structure having a different height from neighboring structures.

The spacing between the structures on the upper substrate may be determined in consideration of the fluidity of the adhesive layer in the process of arranging the adhesive layer.

The structure may be made of the same material as the black matrix layer.

The structure may have at least one intaglio pattern on the structure.

There are a plurality of structures, and the spacing between the plurality of structures may be determined in consideration of fluidity of the adhesive layer in the process of arranging the adhesive layer.

At least two or more structures having different thicknesses may be disposed on the upper substrate.

A method of manufacturing an organic light emitting diode display according to an embodiment of the present invention includes forming a plurality of driving elements and a plurality of organic light emitting elements on a lower substrate, forming a black matrix layer on an upper substrate, and forming a black matrix layer on an upper substrate. Forming a sealing dam, forming an adhesive layer on the upper substrate, and bonding the upper substrate and the lower substrate; forming a black matrix layer on the upper substrate forms a structure on the upper substrate. It includes steps to

Forming the adhesive layer on the upper substrate may include forming the adhesive layer using an inkjet printing method.

Forming the structure on the upper substrate may include forming the structure using the same material as the material forming the black matrix layer.

Forming the black matrix layer on the upper substrate may include forming a plurality of color filter layers on the upper substrate.

Forming the structure on the upper substrate may include forming a multi-layered structure using the same material as the color filter layer.

Although the embodiments of the present invention have been described in more detail with reference to the accompanying drawings, the present invention is not necessarily limited to these embodiments, and may be variously modified and implemented without departing from the technical spirit of the present invention. . Therefore, the embodiments disclosed in the present invention are not intended to limit the technical idea of the present invention, but to explain, and the scope of the technical idea of the present invention is not limited by these embodiments. Therefore, it should be understood that the embodiments described above are illustrative in all respects and not restrictive. The protection scope of the present invention should be construed according to the claims, and all technical ideas within the equivalent range should be construed as being included in the scope of the present invention.

100: organic light emitting display device
110, 210: lower substrate
211: drive element
212: pixel electrode
213 organic light emitting layer
214: common electrode
215: encapsulation layer
216: organic light emitting element
110, 220, 320: upper substrate
221, 321: Black Matrix
222: color filter
233: dam bank
130, 230: display area
140, 240: non-display area
150: pad area
151: pad electrode
152: D-IC
260: sealing dam
270: adhesive layer
280, 380: structure

Claims (37)

a substrate in which a display area and a non-display area surrounding the display area are defined;
a light emitting element disposed in the display area of the substrate and including a pixel electrode, a common electrode, and a light emitting layer between the pixel electrode and the common electrode;
an encapsulation layer on the light emitting device;
a sealing dam disposed in the non-display area and surrounding the periphery of the encapsulation layer;
a color filter layer disposed in the display area and including at least red, green, and blue color filters;
a black matrix disposed between the color filters; and
a structure disposed in at least a portion of the non-display area and made of the same material as the black matrix;
The structure is spaced apart from the sealing dam and positioned between the sealing dam and the light emitting element. According to claim 1,
At least two of the red, green, and blue color filters have different thicknesses. According to claim 1,
A thickness of the structure is different from a thickness of the black matrix. According to claim 1,
The thickness of the structure is greater than the thickness of the black matrix, the display device. According to claim 1,
The thickness of the structure is the same as the thickness of the black matrix, the display device. According to claim 1,
A width of the structure is different from a width of the black matrix. According to claim 1,
A width of the structure is greater than a width of the black matrix. According to claim 1,
The structure is a multilayer structure made of a material constituting the black matrix, the display device. According to claim 1,
The structure is a multilayer structure made of a material constituting the black matrix or the color filter layer, the display device. According to claim 1,
At least a portion between the red, green, and blue color filters is spaced apart from the display area. According to claim 1,
At least one of the red, green, and blue color filters is adjacent to a non-display area. According to claim 1,
The structure overlaps the encapsulation layer, the display device. According to claim 1,
The color filter layer overlaps the encapsulation layer, the display device. According to claim 1,
The light emitting element overlaps with the encapsulation layer, the display device. According to claim 1,
The encapsulation layer is disposed to cover the entire light emitting element and cover all outer surfaces of the outermost light emitting element. According to claim 1,
The display device further comprises an adhesive layer filled inside the sealing dam and covering the light emitting element. According to claim 16,
The adhesive layer is formed using an inkjet printing method, the display device. According to claim 16,
The adhesive layer is made of a material selected from among epoxy-based, acrylic-based, silicon-based, and olefin-based materials. According to claim 16,
The adhesive layer further includes a getter. According to claim 16,
The color filter layer and the black matrix are formed on the adhesive layer. According to claim 16,
The display device further comprises a dam bank disposed to contact the sealing dam. According to claim 21,
A structure located at a boundary between the adhesive layer and the sealing dam and minimizing damage to the sealing dam by moving the adhesive layer due to surface tension of the adhesive layer,
The structure is located inside the dam bank in a non-display area. According to claim 1,
Further comprising a plurality of pad electrodes disposed in the non-display area,
The plurality of pad electrodes are arranged in two columns. a lower substrate in which a display area and a non-display area surrounding the display area are defined;
an upper substrate facing the lower substrate;
a light emitting element disposed in the display area of the lower substrate and including a pixel electrode, a common electrode, and a light emitting layer between the pixel electrode and the common electrode;
an encapsulation layer on the light emitting device;
an adhesive layer positioned between the upper substrate and the lower substrate; and
A display device comprising a structure disposed in a non-display area of the upper substrate and having a plurality of intaglio patterns. According to claim 24,
The structure overlaps the encapsulation layer disposed on the upper substrate. According to claim 24,
The display device, wherein the structure is made of a single layer. delete According to claim 24,
At least some of the plurality of intaglio patterns have different heights or widths, the display device. According to claim 24,
Wherein the structure includes a first structure and a second structure positioned on the first structure, the display device. According to claim 29,
A height of the first structure is different from a height of the second structure. According to claim 29,
A height of the first structure is equal to a height of the second structure. According to claim 29,
A width of the first structure is different from a width of the second structure. According to claim 29,
A width of the first structure is greater than a width of the second structure. According to claim 29,
The second structure is formed in plurality, and each second structure is spaced apart from each other, the display device. According to claim 29,
The first structure and the second structure are made of the same material as a black matrix positioned on the upper substrate. According to claim 24,
a sealing dam disposed in a non-display area between the upper substrate and the lower substrate, enclosing the periphery of the adhesive layer and serving as an additional seal; and
A dam bank disposed on at least one of the upper substrate and the lower substrate and disposed to contact the sealing dam to prevent the sealing dam from overflowing to the surroundings,
The structure is located inside the dam bank in a non-display area. According to claim 24,
Further comprising a plurality of pad electrodes disposed in the non-display area,
The plurality of pad electrodes are arranged in two columns.

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