KR102586944B1 - Structure and methode of manufacturing thereof - Google Patents

Abstract

An organic light emitting display device according to an embodiment of the present invention includes an organic light emitting element disposed between a TFT array substrate and a metal layer. The end of the metal layer supports the lower surface of the COF tape and is implemented to prevent physical shock to the wiring of the COF tape. As a result, shortcomings in the wiring of the COF tape or burnt defects due to shorts are improved, and the COF tape is desired. It has the effect of being able to be better fixed in position and implementing a narrow bezel.

Description

Structure and method of manufacturing the same {STRUCTURE AND METHODE OF MANUFACTURING THEREOF}

The present invention relates to a structure, and provides a structure including a metal layer in which damage to the ends of the thin metal layer is minimized and a method of manufacturing the same.

Organic Light Emitting Display Device (OLED), one of the new display devices, has self-luminance characteristics and does not require a separate light source, unlike Liquid Crystal Display (LCD). , it has the advantage of being able to be manufactured in a lightweight and thin form. In addition, it is attracting attention as a next-generation display device because it has superior viewing angle and contrast ratio compared to liquid crystal display devices, and has characteristics such as low power consumption, high brightness, and fast response speed.

An organic light emitting display device includes an organic light emitting device consisting of an anode, a cathode, and an organic light emitting layer between the anode and the cathode. An organic light-emitting device generates light when excitons generated by combining electrons and holes injected into the organic light-emitting layer from two electrodes fall from an excited state to a ground state. Organic light emitting display devices display images by controlling light generated from organic light emitting elements.

Additionally, organic light emitting display devices can be divided into a top emission method, a bottom emission method, or a dual emission method depending on the direction in which the generated light radiates. Additionally, organic light emitting display devices can be divided into active matrix type or passive matrix type depending on the driving method.

Due to the various advantages described above, organic light emitting display devices are attracting attention as next-generation displays, but there is a problem in that the organic light emitting layer constituting the organic light emitting device is very vulnerable to heat, moisture, oxygen, etc. This is a problem directly related to the lifespan of the organic light emitting display device, and is a huge difficulty in commercializing the organic light emitting display device. This is because the organic light-emitting layer deteriorates due to heat, moisture, or oxygen. Therefore, encapsulation technology that prevents moisture or oxygen from penetrating into the organic light emitting display device is being researched.

The organic light emitting display device consists of a lower substrate on which organic light emitting elements are formed, and an upper substrate corresponding to the lower substrate. Since the bottom emitting type organic light emitting display device has a structure in which light is emitted in the direction of the lower substrate, the upper substrate is opaque. It is possible to apply a thin metal film. Therefore, an organic light emitting display device encapsulated using a metal thin film is manufactured by bonding a lower substrate on which an organic light emitting element is formed and an upper substrate with an adhesive layer attached. During this manufacturing process, blows are continuously applied to the ends (or corners, or side ends) of the upper substrate to ensure alignment between the other components constituting the upper substrate and the lower substrate. For example, when an adhesive layer is attached to an upper substrate or when an upper substrate with an adhesive layer is adhered to a lower substrate on which an organic light emitting device is formed, a process of aligning between each component or between each component and equipment This goes on. During the alignment process for position adjustment, the ends (or corners, or side ends) of the upper substrate come into contact with other adjacent components, thereby subjecting them to physical shock. For example, in the case where the PCB is arranged in a reverse bonding structure, the COF (Chip on Film) tape connecting the PCB and the support substrate on which the TFT array is placed is in contact with the end of the upper substrate. Accordingly, the end of the upper board applies physical shock to the line wiring of the COF tape. Therefore, there are cases where the line wiring inside the connection part, such as the COF tape, is damaged. In addition, since bottom-emitting organic light emitting display devices are mainly sealed using metal thin films, there is a greater need to solve the problem of damage to line wiring inside connections such as COF tape.

In addition, recent display devices follow the trend of narrow bezels, gradually reducing the difference between the display area and non-display area, making it difficult to secure the margin between each component, creating a bigger problem. is being highlighted. As the bezel of the organic light emitting display device gradually decreases, the gap between the end of the metal thin film and the portion where the connector including the chip-type driving integrated circuit connects to the pad portion of the support substrate decreases. As the gap between the end of the metal thin film and the part where the connection including the chip-type driving integrated circuit connects to the pad part of the support substrate decreases, the problem of damage to the line wiring inside the connection such as COF tape becomes more severe.

The present invention is intended to solve the above problem, and the inventor of the present invention supports the COF tape so that the end of the upper substrate does not give physical impact to other components during the manufacturing process of the organic light emitting display device, while simultaneously damaging the COF tape. A new structure was invented that includes an upper substrate with an end that does not provide pressure.

The problem to be solved according to an embodiment of the present invention is to prevent damage to the COF wiring caused by the ends of the metal layers constituting the upper substrate by preventing protrusions or burrs from occurring at the ends of the metal layers constituting the upper substrate. It provides structure.

Another problem to be solved according to an embodiment of the present invention is to provide a structure that can prevent short circuits between line wiring of a COF tape caused by the ends of the metal layer constituting the upper substrate.

Another problem to be solved according to an embodiment of the present invention is to provide a structure that can prevent burnt, in which the surrounding area becomes black when a driving failure occurs after module work of an organic light emitting display device or a short circuit occurs between line wiring of a COF tape. It is done.

Another problem to be solved according to an embodiment of the present invention is to provide a structure with improved productivity and reliability that can prevent shorts or burns between line wiring of COF tape.

Another problem to be solved according to an embodiment of the present invention is to provide a structure capable of implementing a narrow bezel in which the end of the metal thin film and the lower surface of the connection are in stable contact, thereby reducing the difference between the display area and the non-display area. will be.

Problems to be solved according to embodiments of the present invention are not limited to the problems mentioned above, and other problems not mentioned will be clearly understood by those skilled in the art from the description below.

A method of manufacturing a structure according to an embodiment of the present invention includes the steps of laminating an adhesive sheet to a metal thin film fabric to form a metal thin film having adhesive properties on the first surface; A first cutting step of cutting the adhesive sheet portion of the metal thin film with a first laser to form a groove in the metal thin film; A second cutting step of cutting the metal thin film by irradiating a second laser into the groove formed by the first laser to form a metal thin film cell having an adhesive layer and a metal layer; and a physical processing step of causing the metal layer of the metal thin film cell to have a rounded edge shape.

A structure according to an embodiment of the present invention includes a metal layer having an upper surface that can accommodate a PCB and a lower surface that can accommodate the upper surface of a TFT substrate; An adhesive layer located on the lower surface of the metal layer and implemented to adhere the metal layer to the TFT substrate; And a COF tape that partially overlaps the metal layer and is supported by the end of the metal layer, has a driving integrated circuit on the lower surface, is on the upper surface of the metal layer, connects the PCB and the TFT substrate, and has a driving integrated circuit on the lower surface. , the COF tape connects the PCB and the TFTT substrate through a pad portion located on the top of the TFT substrate between the end of the metal layer and the end of the TFT substrate, and the metal layer, except for the end of the metal layer, is implemented to prevent damage to the COF tape. is characterized by no contact with the COF tape.

According to an embodiment of the present invention, in an organic light emitting display device, line wiring of the COF tape is performed by the end of the metal layer constituting the upper substrate by preventing protrusions or burrs from occurring at the end of the metal layer constituting the upper substrate. It can prevent damage from dents.

According to an embodiment of the present invention, in an organic light emitting display device, short circuits between line wiring of the COF tape caused by the ends of the metal layer constituting the upper substrate can be minimized.

According to an embodiment of the present invention, the occurrence of burnt, which causes the surrounding area to burn black when a driving failure occurs after module work of an organic light emitting display device or a short circuit occurs between line wiring of a COF tape, is reduced, thereby improving the productivity and reliability of the organic light emitting display device. It can be.

According to an embodiment of the present invention, in an organic light emitting display device, a narrow bezel in which the difference between the display area and the non-display area becomes smaller by stably contacting the end of the metal thin film and the lower surface of the connection part can be implemented.

The effects of the present invention are not limited to the effects mentioned above, and other effects not mentioned will be clearly understood by those skilled in the art from the description below.

Since the content of the invention described in the problem to be solved, the means for solving the problem, and the effect described above do not specify the essential features of the claim, the scope of the claim is not limited by the matters described in the content of the invention.

1 is a schematic configuration diagram of an organic light emitting display device according to an embodiment of the present invention.
Figure 2 is a schematic circuit configuration diagram of one subpixel according to an embodiment of the present invention.
Figure 3 is a plan view showing the rear of a structure according to an embodiment of the present invention.
Figure 4 is a cross-sectional view of the end of a structure according to an embodiment of the present invention.
Figure 5 is a cross-sectional view taken along line XX' in Figure 4, according to an embodiment of the present invention.
Figure 6 is a cross-sectional view of the shape of the end of the metal layer and the end of the adhesive layer implemented to prevent damage to the source COF tape in the structure according to an embodiment of the present invention.
Figure 7 is a cross-sectional view taken along line XX' in Figure 4, according to an embodiment of the present invention.
8 to 11 are diagrams showing step by step the manufacturing method of a structure according to an embodiment of the present invention.
8 to 11 are diagrams showing step by step the manufacturing method of a structure according to an embodiment of the present invention.
12 to 14 are cross-sectional views of each metal thin film cell including a metal layer cut according to each method of cutting the metal thin film.

The advantages and features of the present invention and methods for achieving them will become clear by referring to the embodiments described in detail below along with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below and will be implemented in various different forms, but the present embodiments only serve to ensure that the disclosure of the present invention is complete, and those skilled in the art It is provided to fully inform the person of the scope of the invention, and the present invention is only defined by the scope of the claims.

The shapes, sizes, proportions, angles, numbers, etc. disclosed in the drawings for explaining embodiments of the present invention are illustrative, and the present invention is not limited to the matters shown. Like reference numerals refer to like elements throughout the specification. Additionally, in describing the present invention, if it is determined that a detailed description of related known technologies may unnecessarily obscure the gist of the present invention, the detailed description will be omitted.

When 'includes', 'has', 'consists of', etc. mentioned in this specification are used, other parts may be added unless 'only' is used. When a component is expressed in the singular, the plural is included unless specifically stated otherwise.

When interpreting a component, it is interpreted to include the margin of error even if there is no separate explicit description.

In the case of a description of a positional relationship, for example, if the positional relationship of two parts is described as 'on top', 'on the top', 'on the bottom', 'next to', etc., 'immediately' Alternatively, there may be one or more other parts placed between the two parts, unless 'directly' is used.

In the case of a description of a temporal relationship, for example, if a temporal relationship is described as ‘after’, ‘after’, ‘after’, ‘before’, etc., ‘immediately’ or ‘directly’ Non-consecutive cases may also be included unless ' is used.

Although first, second, etc. are used to describe various components, these components are not limited by these terms. These terms are merely used to distinguish one component from another. Accordingly, the first component mentioned below may also be the second component within the technical spirit of the present invention.

The size and thickness of each component shown in the drawings are shown for convenience of explanation, and the present invention is not necessarily limited to the size and thickness of the components shown.

Each feature of the various embodiments of the present invention can be partially or entirely combined or combined with each other, and various technical interconnections and operations are possible, and each embodiment may be implemented independently of each other or may be implemented together in a related relationship. .

Hereinafter, an organic light emitting display device according to an embodiment of the present invention will be described in detail with reference to the attached drawings.

1 is a schematic configuration diagram of an organic light emitting display device according to an embodiment of the present invention.

As shown in FIG. 1, the organic light emitting display device according to an embodiment of the present invention includes a timing control unit 140, a data driver 150, a gate driver 160, and an organic light emitting display panel 170.

The system board unit 130 receives video data signals (RGB) from the outside, converts them into digital data signals, and outputs driving signals such as a data enable signal, vertical synchronization signal, horizontal synchronization signal, and clock signal. The system board unit 130 converts video data signals into digital data signals. The timing control unit 140 may convert a video data signal into a digital data signal.

The timing control unit 140 receives driving signals such as a data enable signal, a vertical synchronization signal, a horizontal synchronization signal, and a clock signal, as well as a color data signal (DDATA) from the system board unit 130. The timing control unit 140 provides a gate timing control signal (GDC) for controlling the operation timing of the scan driver 160 and a data timing control signal (DDC) for controlling the operation timing of the data driver 150 based on the driving signal. outputs. The timing control unit 140 outputs a color data signal (DDATA) in response to the gate timing control signal (GDC) and the data timing control signal (DDC) generated based on the driving signal.

The data driver 150 samples and latches the color data signal DDATA in response to the data timing control signal DDC supplied from the timing controller 140 and converts it into an analog data signal in response to the gamma reference voltage. The data driver 150 outputs data signals through data lines DL1 to DLn. The data driver 150 is formed in the form of an integrated circuit (IC).

The scan driver 160 outputs a scan signal while shifting the level of the gate voltage in response to the gate timing control signal (GDC) supplied from the timing controller 140. The scan driver 160 outputs scan signals through scan lines SL1 to SLm. The scan driver 160 is formed in the form of an integrated circuit (IC) or is mounted on the organic light emitting display panel 170 itself using a gate in panel method.

The organic light emitting display panel 170 is implemented with a subpixel structure including a red subpixel (SPr), a green subpixel (SPg), and a blue subpixel (SPb) (hereinafter referred to as an RGB subpixel). In addition, the organic light emitting display panel 170 includes a red subpixel (SPr), a green subpixel (SPg), a blue subpixel (SPb), and a white subpixel (SPw) to prevent deterioration of pure color luminance and color quality while increasing light efficiency. ) (hereinafter referred to as RGBW subpixel) is implemented with a subpixel structure including. That is, one pixel (P) consists of RGB subpixels (SPr, SPg, SPb) or RGBW subpixels (SPr, SPg, SPb, SPw). And these pixels P are formed in large numbers corresponding to the resolution of the organic light emitting display panel 170 to form a pixel array.

Figure 2 is a schematic circuit configuration diagram of one subpixel according to an embodiment of the present invention.

One subpixel (SP) includes a switching transistor (SW), a driving transistor (DR), a capacitor (Cstg), a compensation circuit (CC), and an organic light emitting device (OLED). An organic light emitting device (OLED) operates to emit light according to a driving current applied by a driving transistor (DR). The switching transistor (SW) performs a switching operation so that the color data signal supplied through the first data line (DL1) is stored as a data voltage in the capacitor (Cstg) in response to the scan signal supplied through the first scan line (SL1). . The driving transistor DR operates so that a driving current flows between the first power line (VDD) and the ground line (GND) according to the data voltage stored in the capacitor (Cstg).

The compensation circuit (CC) is a circuit added to compensate for the threshold voltage of the driving transistor (DR). Accordingly, the compensation circuit (CC) may be omitted depending on the configuration of the subpixel, but is usually composed of one or more transistors and a capacitor. Since the composition of the compensation circuit (CC) can be very diverse, specific examples and descriptions thereof will be omitted.

One subpixel (SP) consists of a 2T (Transistor) 1C (Capacitor) structure including a switching transistor (SW), a driving transistor (DR), a capacitor (Cstg), and an organic light emitting device (OLED). However, when a compensation circuit (CC) is added, it consists of 3T1C, 4T2C, 5T2C, 6T1C, etc. The subpixel (SP) having the above configuration is formed in a top-emission method, a bottom-emission method, or a dual-emission method depending on the structure.

Figure 3 is a plan view showing the rear of a structure according to an embodiment of the present invention.

Referring to FIG. 3, the structure according to an embodiment of the present invention is provided with a data driver 150 disposed at the horizontal end and a scan driver 160 disposed at the vertical end on its rear surface. The data driver 150 is formed in the form of a source COF tape 151 that embeds a source driver integrated circuit (IC) in the form of a chip, and is connected to the source PCB 180. The source COF tape 151 and the source PCB 180 are implemented on the back of the organic light emitting display panel 170. The scan driver 160 is formed in the form of a scan COF tape 161 that embeds a scan driver IC in the form of a chip, and is connected to the scan PCB 190. The scan driver 160 may be disposed on only one side or on both sides of the organic light emitting display panel 170. The scan driver 160 may be mounted inside the organic light emitting display panel 170 in a gate-in-panel manner, rather than in the form of an IC.

The organic light emitting display panel 170 has a display area (A/A) defined by a pixel array, which is the area where the actual image is displayed, and a display area (A/A) around the display area (A/A) as an area other than the display area (A/A). It is divided into a non-display area (N/A) surrounding the . The organic light emitting display panel 170 includes a TFT substrate including an organic light emitting device (OLED) and a pixel driving circuit capable of driving the organic light emitting device (OLED). The organic light emitting device (OLED) formed on the TFT substrate is easily deteriorated by moisture and oxygen. In order to protect the organic light emitting device (OLED) of each pixel, a sealable metal layer (FSM) may be disposed opposite the TFT substrate to cover the entire display area (A/A). Accordingly, the metal layer (FSA) has an area larger than the area of the display area (A/A) and has an area smaller than the area of the non-display area (N/A). In particular, on the back of the organic light emitting display panel 170, the scan COF tape 161 and the source COF tape 151 disposed across the non-display area (N/A) and the display area (A/A) are also formed with a metal layer (FSM). ) and partially overlaps with. Hereinafter, the region A, where the source COF tape 151 and the metal layer (FSM: Face Seal Metal) partially overlap, will be examined in more detail with reference to FIG. 4.

Figure 4 is a cross-sectional view of the end of a structure according to an embodiment of the present invention.

Referring to FIG. 4 , the source COF tape 151 is disposed on the back of the organic light emitting display panel 170 and at the horizontal end of the organic light emitting display panel 170. The source PCB 180 is also disposed on the back of the organic light emitting display panel 170 and is connected to the source COF tape 151. A source driving IC in the form of a chip is provided on the lower surface of the source COF tape 151, and the source driving IC is arranged to overlap the metal layer (FSM). Hereinafter, all descriptions related to the source COF tape 151 may be applied to the scan COF tape 161, and all descriptions related to the source PCB 180 may also be applied to the scan PCB 190.

Hereinafter, the arrangement of the source COF tape 151, metal layer (FSM), and source PCB 180 will be examined in more detail with reference to FIG. 5.

Figure 5 is a cross-sectional view taken along line XX' of Figure 4, according to an embodiment of the present invention.

Referring to FIG. 5, the organic light emitting display device 100 according to an embodiment of the present invention includes a TFT substrate 510 including a pixel array, disposed on the upper surface of the TFT substrate 510, and organic light emitting display devices defining each subpixel. It includes a light emitting layer 520 including a device (OLED). It is disposed on the upper surface of the light emitting layer 520 and includes a passivation layer 530 that flattens the light emitting layer 520. An adhesive layer (FSA) disposed on the upper surface of the passivation layer 530 and implemented to attach the metal layer (FSM) to the TFT substrate 510, a metal layer (FSM) disposed on the upper surface of the adhesive layer, and disposed on the upper surface of the metal layer (FSM) It includes a PCB adhesive member 540 and a source PCB 180 attached to the PCB adhesive member 540. And, it includes a source COF tape 151 connecting the source PCB 180 and the TFT substrate 510. In addition, a pad portion ( 550).

The TFT substrate 510 has a pixel array including a pixel driving circuit disposed on a support substrate. The support substrate may be made of transparent glass. For example, the support substrate can be formed using materials such as potassium lime, soda lime or quartz. The support substrate used in the manufacture of the organic light emitting display device is usually a glass substrate, and the thermal expansion coefficient is 2.5*10-6/(2.5ppm/°C) to 5.5*10-6/(5.5ppm/°C). When manufacturing a flexible organic light emitting display device, the support substrate may be made of a flexible organic material such as a plastic-based material. For example, the support substrate may be formed using a material such as polyimide.

The light emitting layer 520 disposed on the TFT substrate 510 includes a plurality of organic light emitting devices (OLEDs) defining each subpixel. The organic light emitting device (OLED) may be composed of an anode, an organic light emitting layer, and a cathode, and is connected to and driven with a pixel driving circuit disposed on the TFT substrate 510. Organic light emitting devices (OLEDs) may be composed of a single stack structure that emits light of one color or a multiple stack structure that emits white light by light of two or more colors. However, it is not necessarily limited to this, and may be configured in various stacked structures depending on the design of the organic light emitting device (OLED). Adhering an opaque metal layer (FSM) for encapsulation to the upper surface of the TFT substrate 510 is achieved by disposing a color filter between the TFT substrate 510 and the light emitting layer 520, thereby forming an organic light emitting display according to an embodiment of the present invention. The device 100 may be more effective when emitting light in a bottom-emitting manner.

The passivation layer 530 disposed on the light-emitting layer 520 protects the organic light-emitting device (OLED) from external foreign substances, shocks, and penetration of moisture (H ₂ O) or oxygen (O ₂ ). The passivation layer 530 may be composed of a single layer made of an inorganic film, or may be composed of a plurality of layers in which organic films and inorganic films are repeatedly stacked. For example, the passivation layer 530 may be made of an inorganic material such as silicon nitride (SiNx) or silicon oxide (SiOx). Additionally, an additional planarization layer may be disposed on the passivation layer 530 to facilitate adhesion to the adhesive layer (FSA) by filling the steps of the light emitting layer 530.

The TFT substrate 510 and the metal layer (FSM) are adhered and fixed to each other by the adhesive layer (FSA) disposed on the passivation layer 530. The adhesive layer (FSA) is made of resin, for example, epoxy, phenol, amino, unsaturated polyester, polyimide, and silicone. , may be made of any one of acryl, vinyl, and olefin. In addition, the adhesive layer (FSA) can be bonded by high-energy curing methods such as heat, ultraviolet rays, or lasers, or by applying physical pressure using a pressure sensitive adhesive (PSA). It may be possible. The adhesive layer (FSA) may be composed of multiple layers. For example, the adhesive layer (FSA) may be composed of a layer containing epoxy and polyolefin, and a moisture absorption filter layer.

The thickness of the adhesive layer (FSA) is 45㎛ to 55㎛, for example, may be 49㎛. At this time, the thickness of the adhesive layer (FSA) refers to the thickness at the portion where the adhesive layer (FSA) overlaps the display area (A/A), not at the end of the adhesive layer (FSA).

When the adhesive layer (FSA) is composed of a plurality of layers, it may include a moisture absorption filter layer, and the moisture absorption filter layer is composed of a moisture adsorbent. The moisture adsorbent can absorb moisture or oxygen by chemically reacting with moisture or oxygen introduced into the adhesive layer (FSA). The moisture adsorbent may be made of, for example, metal powder such as alumina, metal oxide, metal salt, or phosphorus pentoxide (P ₂ O ₅ ).

The end of the adhesive layer (FSA) is arranged so that there is a distance difference of several mm from the end of the display area (A/A). That is, the adhesive layer (FSA) is larger than the area of the display area (A/A) so that the adhesive layer (FSA) covers all of the organic light emitting devices (OLED) in the display area (A/A) to obtain an encapsulation effect. It is arranged to cover the entire area (A/A).

The metal layer (FSM) disposed on the adhesive layer (FSA) has an upper surface configured to accommodate the source PCB 180 and a lower surface configured to accommodate the upper surface of the TFT substrate 510. In order to prevent warping of the organic light emitting display panel 170 due to a difference in thermal expansion coefficient between the metal layer (FSM) and the TFT substrate 510, the thermal expansion coefficient is the same as or similar to that of the support substrate of the TFT substrate 510. It is implemented. Metal alloys with low thermal expansion coefficients include F alloy (Alloy), which contains iron (Fe) and nickel (Ni), and alloy (Fe-Ni-), which contains iron (Fe), nickel (Ni) and cobalt (Co). Co) etc.

For example, the metal layer (FSA) may be formed of an alloy of iron (Fe) and nickel (Ni) with a low coefficient of thermal expansion. At this time, the content of nickel (Ni) added to iron (Fe) may have a composition ratio of 33% to 35% or 38.5% to 41.5%. If the metal layer (FSA) is formed from an alloy with a content of 33% to 35% or 38.5% to 41.5% of nickel (Ni) added to iron (Fe), the metal layer (FSA) is the same as or similar to the glass support substrate. It has a thermal expansion coefficient of 2.5ppm/℃~5.5ppm/℃.

It can be seen that when less than 35% of nickel (Ni) is added to iron (Fe), the coefficient of thermal expansion decreases rapidly in this area, resulting in a coefficient of thermal expansion of less than 2.5ppm/℃. And, when the nickel (Ni) content exceeds 35%, the thermal expansion coefficient increases again, and when it exceeds 38.5%, it can be seen that it has a thermal expansion coefficient of 2.5ppm/℃ to 5.5ppm/℃. In addition, it can be seen that when the nickel (Ni) content exceeds 41.5%, the thermal expansion coefficient rapidly increases and exceeds 5.5ppm/°C.

On the other hand, when the content of nickel (Ni) is 35% to 38.5%, the thermal expansion coefficient is low, less than 2.5ppm/℃, but is within the range of 2.5ppm/℃ to 5.5ppm/℃, which is the thermal expansion coefficient of a support substrate made of glass. gets out of

The thickness of the metal layer (FSM) is 50㎛ ~ 500㎛. For example, by designing the thickness of the metal layer (FSM) to be 100㎛, the volume of the metal layer (FSM) itself can be reduced and the bending of the support substrate caused by the metal layer (FSM) can be minimized. In addition, even if the thickness of the metal layer (FSM) is reduced to 80㎛ for the purpose of reducing material costs, it has the same sealing effect as when it has a thickness of 100㎛, and physical rolling treatment of the ends is possible.

Since the adhesive layer (FSA) is made of a polymer material, the shape of the adhesive layer (FSA) has fluidity when adhering to the TFT substrate 510. That is, the adhesive layer (FSA) may gradually increase or decrease during the process of adhesion to the TFT substrate 510, depending on the characteristics of the polymer organic material. In order to make this part a process tolerance, it is desirable that the metal layer (FSM) has the same area as the adhesive layer (FSA) or that the area is larger than the adhesive layer (FSA) so that the metal layer (FSM) completely covers the adhesive layer (FSA). Additionally, the adhesive layer (FSA) may be scratched by external impact or foreign substances. It is preferable that the metal layer (FSM) completely covers the adhesive layer (FSA) so that the metal layer (FSM) can physically protect the adhesive layer (FSA). At this time, the end of the adhesive layer (FSA) may be melted by receiving high energy from a laser, etc., and at this time, the adhesive layer (FSA) may harden again and overflow along the end of the metal layer (FSM). This can create a shape where the end of the adhesive layer (FSA) surrounds the end of the metal layer (FSM). The end of the adhesive layer (FSA) where the shape has been deformed is not considered as the effective area of the adhesive layer (FSA) when comparing the areas of the metal layer (FSM) and the adhesive layer (FSA). If the area of the adhesive layer (FSA) (meaning the 'effective area' above) becomes larger than the area of the metal layer (FSM), the area of the adhesive layer (FSA) not covered by the metal layer (FSM) becomes a new path for moisture infiltration. This may cause deterioration of the organic light emitting diode (OLED), which may cause problems with the reliability of the organic light emitting display panel.

In other words, the area of the adhesive layer (FSA) and the area of the metal layer (FSM) are the same, and the adhesive layer (FSA) and the metal layer (FSM) can completely overlap each other. Alternatively, the area of the metal layer (FSM) may be larger than the area of the adhesive layer (FSA), and the adhesive layer (FSA) may be completely covered by the metal layer (FSM). In either case, at at least one end (horizontal end or vertical end) of the organic light emitting display panel 170, the distance (D) between the end of the metal layer (FSM) and the end of the TFT substrate 510 is at least 100 μm or more. There is a distance. A pad portion 550 may be disposed between the end of the metal layer (FSM) and the end of the TFT substrate 510 (D). The pad portion 550 is located on the upper surface of the TFT substrate 510 between the end of the metal layer (FSM) and the end of the TFT substrate 510 (D). Through the pad portion 550, the TFT substrate 510 The source COF tape 151 disposed on the upper surface of is connected to the TFT substrate 510.

On the metal layer (FSM), a source COF tape 151 is disposed on the upper surface of the metal layer (FSM) in a form that partially overlaps the metal layer (FSM) and is implemented to connect the source PCB 180 and the TFT substrate 510. . The source COF tape (FSM) is supported by the ends of the metal layer (FSM). The source COF tape 151 includes a driving integrated circuit (151_d). The driving integrated circuit (151_d) disposed on the lower surface of the source COF tape 151 may be in the form of a chip. A plurality of line wires 151_b for signal input and output of the driving integrated circuit 151_d are disposed on the source COF tape 151. In addition, an insulating solder resist (151_c) is disposed on the lower surface of the source COF tape 151 to prevent the inflow of static electricity, etc., and a support layer (151_a) made of a flexible plastic-based polymer material is disposed on the upper surface. do.

The source COF tape 151 is connected to the source PCB 180 through the pad portion 550 located on the upper surface of the TFT substrate 510 between the end of the metal layer (FSM) and the end of the TFT substrate 510 (D). Connect the TFT substrate 510. The source COF tape 151 is disposed over the non-display area (N/A) and the display area (A/A) to overlap a portion of the metal layer (FSM), and the source COF tape (151) does not overlap the metal layer (FSM). A portion of 151) is connected to the pad portion 550. Accordingly, the end of the metal layer (FSM) implemented to prevent damage to the source COF tape 151 overlaps the source COF tape 151. The metal layer (FSM) does not contact the source COF tape 151 except for an end of the metal layer (FSM), which is implemented to prevent damage to the source COF tape 151. That is, the organic light emitting display panel 170 includes a region B where the bottom of the source COF tape 151 is in contact with the end of the metal layer (FSM) implemented to prevent damage to the source COF tape 151.

The end of the metal layer (FSM) implemented to prevent damage to the source COF tape 151 may have a convex curved shape or a rounded corner shape through physical processing to have a rounded corner shape. As a result, the end of the metal layer (FSM) can be in contact with the metal layer (FSM) to support the source COF tape 151 while preventing damage to the line wiring of the source COF tape 151. Therefore, since the end of the metal layer (FSM) has a convex curved shape or a rounded corner shape, damage to the line wiring of the source COF tape 151 caused by the end of the metal layer (FSM) due to protrusions or burrs is prevented. There is a preventable effect.

The source PCB 180 connected to the TFT substrate 510 by the source COF tape 151 is implemented on the upper surface of the metal layer (FSM). The position of the source PCB 180 can be fixed simply by being connected to the source COF tape 151, but additionally, the PCB adhesive member 540 attached to the upper surface of the metal layer (FSM) is attached to the lower surface of the source PCB 180. It can be placed on and fixed to the upper surface of the metal layer (FSM).

Figure 6 is a cross-sectional view of the shapes of the ends of the metal layer and the end of the adhesive layer implemented to prevent damage to the source COF tape in the structure according to an embodiment of the present invention.

As shown in Figures 6 (a) and (b), along with the end of the metal layer (FSM) having a convex curve shape or rounded corner shape, the end of the adhesive layer (FSA) is also the end of the metal thin film cell (FSMA_c). It may be formed to have a convex curved shape or a rounded corner shape. More specifically, as shown in (a) of FIG. 6, the adhesive layer (FSA) may have a shape where the thickness gradually becomes thinner at the portion where the adhesive layer (FSA) overlaps the end of the metal layer (FSM). In other words, the thickness in the area of the adhesive layer (FSA) corresponding to the display area (A/A), excluding the end of the adhesive layer (FSA), is thicker than the thickness at the end of the adhesive layer (FSA). And, the thickness of the end of the adhesive layer (FSA) gradually becomes thinner toward the end. That is, the thickness of the end of the adhesive layer (FSA) gradually becomes thinner as the adhesive layer (FSA) overlaps the end of the metal layer (FSM). Alternatively, as shown in (b) of FIG. 6, the shape of the end of the adhesive layer (FSA) may have a convex curved shape or a rounded corner shape, similar to the shape of the end of the metal layer (FSM). In other words, the end of the adhesive layer (FSA) may cover the end of the metal layer (FSM) along the end of the metal layer (FSM) having a rounded corner shape. That is, the end of the adhesive layer (FSA) may be shaped to wrap around the end of the metal layer (FSM).

Referring to FIG. 6, the rounded edge shape of the end of the adhesive layer (FSA) may be a trace of the end of the adhesive layer (FSA) flowing during the process of melting and hardening again. In other words, the convex curved shape or rounded corner shape of the end of the adhesive layer (FSA) may be a trace of flowing down when the end of the adhesive layer (FSA) is in a liquid state or in an intermediate state between a solid and a liquid state. If the rounded edge shape of the end of the adhesive layer (FSA) is a trace of the end of the adhesive layer (FSA) flowing during the melting and re-hardening process, the end of the adhesive layer (FSA) is an adhesive layer other than the end of the adhesive layer (FSA) ( The thickness is thin compared to the FSA) area. The end of the metal layer (FSM) implemented to prevent damage to the source COF tape 151 may contact the COF tape with the end of the adhesive layer (FSA) covering the end of the metal layer (FSM) interposed therebetween. As a result, the end of the metal layer (FSM) can be in contact with the metal layer (FSM) to support the source COF tape 151 while preventing damage to the line wiring of the source COF tape 151. Accordingly, since the end of the metal layer (FSM) has a convex curved shape or a rounded corner shape, it is effective in preventing damage to the line wiring of the source COF tape 151 due to protrusions or burrs.

Figure 7 is a cross-sectional view taken along line XX' in Figure 4, according to an embodiment of the present invention. Since the embodiment of FIG. 7 is the same as the embodiment of FIG. 5 except for the addition of the cushion 610, description of the same content will be omitted and the cushion 610 will be discussed below.

As shown in FIG. 7, the end of the metal layer (FSM) implemented to prevent damage to the source COF tape 151 is disposed with a cushion 610 implemented to alleviate the amount of impact at the end of the metal layer (FSM). May be in contact with the source COF tape 151. At this time, the cushion 610 is placed near the end of the metal layer (FSM), (1) the source COF tape 151 and the end of the metal layer (FSM) are in contact with the cushion 610 between them, or (2) The end of the metal layer (FSM) and the source COF tape 151 are in direct contact, and a cushion 610 may fill the area around the contact point. As a result, the end of the metal layer (FSM) has a convex curved shape or a rounded corner shape, thereby preventing damage to the line wiring 151_b of the source COF tape 151 due to protrusions or burrs, and at the same time, the metal layer (FSM) ) has the effect of supporting the source COF tape 151. The cushion 610 helps to secure the contact between the end of the metal layer (FSM) and the source COF tape 151, and at the same time protects the end of the metal layer (FSM) from the physical force applied to the source COF tape 151. It has the effect of protecting the line wiring of the source COF tape 151 by absorbing shock instead.

For example, the cushion 610 may be further attached to the lower surface of the source COF tape 151 and may include uneven corrugated cardboard-like irregularities toward the TFT substrate 510 . That is, the end of the source COF tape 151 and the metal layer (FSM) may be in contact with the cushion 610 between them. At this time, the end of the metal layer (FSM) is inserted and seated on the corrugated cardboard-shaped unevenness, so that the cushion 610 assists the end of the metal layer (FSM) in supporting the source COF tape 151.

Hereinafter, the manufacturing method of the metal layer and the adhesive layer included in the structure according to the embodiment of the present invention, described in FIGS. 1 to 7, will be examined with reference to FIG. 8.

Referring to FIG. 8, an adhesive sheet (M2) is laminated to a metal thin film fabric (M1) to form a metal thin film (FSMA) having adhesive properties on the first side (S1). In this way, after lamination of the metal thin film fabric M1 and the adhesive sheet M2, the metal thin film (FSMA) can be cut to fit the size of the organic light emitting display device according to an embodiment of the present invention.

Referring to FIG. 9, a groove can be formed in the metal thin film (FSMA) by irradiating the first laser L1 to the metal thin film (FSMA) and cutting the adhesive sheet (M2) portion of the metal thin film (FSMA). (S2, first cleavage step). At this time, the first laser (L1) is a laser that has an energy level that can cut the adhesive sheet (M2), but cannot cut the metal thin film fabric (M1). For example, the first laser L1 may be a gas laser. The gas laser may be, for example, one of a carbon dioxide (CO ₂ ) laser, a helium (He) laser, a neon (Ne) laser, and an argon (Ar) laser. Regardless of the width (W) of the groove created in the adhesive sheet (M2) portion by the first laser (L1), no trace is created on the metal thin film fabric (M1) by the first laser (L1). In other words, even if the width (W) of the groove is widened by the first laser (L1), no trace is created on the metal thin film fabric (M1) in proportion to the width (W) of the groove. When the first laser L1 is irradiated to the adhesive sheet M2 portion of the metal thin film FSMA, gas can be blown from the surrounding area and suction can be performed at the same time. The end of the adhesive layer (FSA) may be melted and then solidified again by the first laser (L1). In this process, the end of the adhesive layer (FSA) may have fluidity. In this case, the end of the adhesive layer (FSA) may have traces of flowing when it is in a liquid state or in an intermediate state between a solid and a liquid state. When the second cutting step, which will be described later, is performed immediately after the first cutting step, the end of the adhesive layer (FSA) in a molten state may gradually harden while the second cutting step is performed. Accordingly, traces of the end of the adhesive layer (FSA) flowing down may be traces of flowing down along the end of the metal layer (FSM) formed through the second cutting step. If the end of the adhesive layer (FSA) is a trace of fluidity during the melting and re-hardening process, the end of the adhesive layer (FSA) is thinner than other areas of the adhesive layer (FSA) excluding the end of the adhesive layer (FSA).

Referring to FIG. 10, a metal thin film cell (FSMA_c) can be formed by irradiating the second laser (L2) to the metal thin film (FSMA) and cutting the metal thin film fabric (M1) portion of the metal thin film (FSMA). (S3, second cutting step). The metal thin film cell (FSMA_c) has a shape in which an adhesive layer (FSA) and a metal layer (FSM) overlap each other. At this time, the second laser (L2) is a laser having an energy level capable of cutting the metal thin film fabric (M1), and has a higher energy than the energy of the first laser (L1). For example, the second laser is an alloy of iron (Fe) and nickel (Ni) (Fe-Ni alloy) or an alloy of iron (Fe), nickel (Ni), and cobalt (Co) (Fe-Ni-Co alloy) It may be a laser that produces enough energy to cut a metal thin film fabric (M1) containing ). Alternatively, the second laser may be a laser having energy sufficient to cut a metal alloy having a thermal expansion coefficient of 2.5 ppm/℃ to 5.5 ppm/℃. When the second laser L2 is irradiated to the metal thin film fabric M1 portion of the metal thin film FSMA, gas can be blown from the surrounding area and suction can be performed at the same time.

At this time, the second laser L2 may be a laser capable of cutting a portion of the adhesive sheet M2. Since the adhesive sheet M2 can also be cut by the second laser L2, the width W of the groove created in the adhesive sheet M2 by the first laser L1 in the first cutting step is It is not maintained through the second cutting step. In the second cutting step, the width W' of the groove formed in the adhesive sheet M2 is formed by the second laser L2. As the time for irradiating the second laser L2 to the metal thin film fabric M1 increases, the width W' of the groove formed in the adhesive sheet M2 by the second laser L2 increases. Alternatively, the second laser L2 may be a laser capable of cutting only a portion of the thin metal film fabric M1 while passing through the adhesive sheet M2 without cutting the portion. For example, the second laser L2 may be a solid laser. The solid-state laser may be, for example, one of a fiber laser, a neodymium (Nd) laser, and a glass laser.

Referring to Figures 11 (a) and (b), physical processing is performed on the end of the metal thin film cell (FSMA_c) so that the metal layer (FSM) of the metal thin film cell (FSMA_c) has a convex curved shape or a rounded corner shape. (S4, physical processing step).

Figure 11(a) shows physical processing by the rolling method. By pressing the end of the metal thin film cell (FSMA_c), that is, the cut cross section, to the side using a press tool (P), the metal layer (FSM) of the metal thin film cell (FSMA_c) has a convex curved shape or a round shape. It can be processed to have an edge shape. In other words, pressure is applied to the end of the metal layer (FSM) in contact with the rolling tool (P), so that it can be processed into a rounded edge shape.

Figure 11(b) shows physical processing using a laser irradiation method. The third laser L3 is irradiated to the end of the metal thin film cell FSMA_c, that is, the cut cross section. At this time, while the third laser L3 is being irradiated, the irradiation direction of the third laser L3 changes. That is, the third laser L3 is irradiated while changing x, y, and x coordinates with respect to the x, y, and z axes. The end of the metal layer (FSM) that has received the third laser (L3) can be processed into a rounded corner shape by melting and hardening again by the third laser. At this time, due to the characteristics of the polymer organic material that makes up the adhesive layer (FSA), the shape can be changed without breaking or cracking, so the end of the adhesive layer (FSA) can be processed according to the shape of the end of the metal layer (FSM) after physical processing. You can. As mentioned above, the third laser L2 may be the same laser as the second laser L2. By tilting the third laser L3 and irradiating the end of the metal layer FSM of the metal thin film cell FSMA_c, the end of the metal layer FSM can be processed into a rounded corner shape. When the third laser L3 is irradiated to the end of the metal layer FSM of the metal thin film cell FSMA_c, gas can be blown from the surrounding area and suction can be performed at the same time.

When physical processing is performed immediately after the second cutting step, the end of the adhesive layer (FSA) in a molten state may gradually harden while the physical processing is performed through the second cutting step. Accordingly, the end of the adhesive layer (FSA) may have a convex curved shape or a rounded corner shape following the shape of the end of the metal layer (FSM) on which physical processing was performed. The end of the adhesive layer (FSA) can change shape without breaking or cracking due to the nature of the polymer organic material. Therefore, even if the end of the adhesive layer (FSA), which was in a molten state, has already completely hardened through the second cutting step, the end of the adhesive layer (FSA) follows the shape of the end of the newly modified metal layer (FSM) through physical processing. It can be processed. If the rounded edge shape of the end of the adhesive layer (FSA) is a trace of fluid in the process of melting and re-solidifying the end of the adhesive layer (FSA), the end of the adhesive layer (FSA) is an adhesive layer other than the end of the adhesive layer (FSA) ( The thickness may be thinner than the FSA) area.

12 to 14 show cross-sections of each metal thin film cell including a metal layer cut according to each method of processing the metal thin film to be cut.

Figure 12 is a cross-section of a metal thin film cell in which a metal thin film fabric is cut using an etching process and an adhesive layer is attached to the metal layer thus formed. The metal thin film fabric is cut using an etchant for metal materials, and at this time, the shape of the end of the metal layer is inclined to a tapered shape due to the circulation of the etchant. As the end of the metal layer has a tapered shape, a sharp shape appears and causes bunts due to shorts in the wiring of the COF tape. At this time, the shape of the taper may be a straight line or a concave curve. Also, because the metal thin film fabric must be dipped in the etchant, etching cannot be performed with an adhesive sheet that reacts to the etchant attached to the metal thin film fabric. Therefore, when cutting a metal thin film fabric using an etching process, the metal layer can be cut from the metal thin film fabric and the adhesive layer from the adhesive sheet, and then the metal layer and the adhesive layer can be attached. Therefore, there is a difficulty in aligning and attaching the metal layer and the adhesive layer to each other, so a larger tolerance must be set.

Figure 13 is a cross-section of a metal thin film cell in which a metal thin film fabric is vertically cut using a laser process. Unlike when using the etching process in FIG. 12, a vertical cut shape is obtained without a tapered shape. As the end of the metal layer has a vertical shape, not only a sharp shape appears, but also protrusions or burrs may be formed in random areas on the cut surface, that is, the end of the metal layer. Therefore, bunts due to shorts in the line wiring of the COF tapes 151 and 161 are caused by the sharp-shaped ends of the metal layers, or the ends of the metal layers with protrusions or knobs. When using a laser that can cut not only metal thin film fabric but also adhesive sheets, the adhesive sheet portion is relatively more affected by the laser (groove shape due to cutting, degree of loss of the adhesive sheet portion, etc.). , it may not be appropriate to cut the two together. That is, the metal layer can be cut from the metal thin film fabric and the adhesive layer from the adhesive sheet, and then the metal layer and the adhesive layer can be attached. Therefore, there is a difficulty in aligning and attaching the metal layer and the adhesive layer to each other, so a larger tolerance must be set.

Figure 14 shows a metal layer and an adhesive layer included in a structure according to an embodiment of the present invention. That is, in Figure 14, as described in Figures 1 to 11, the adhesive sheet (M2) and the metal thin film fabric (M1) are cut using a laser process and physically processed so that the end of the metal layer (FSM) has a rounded corner shape. This is a cross-section of a metal thin film cell (FSMA_c). The end of the metal layer (FSM) is made convex by (1) melting by a laser so that the sharp shape, protrusion, or lump disappears, or (2) by pressing the sharp shape, protrusion, or lump by physical pressure. It has a curved shape or rounded corner shape. When manufacturing the metal thin film cell (FSMA_c) using the first laser (L1) and the second laser (L2) described above, the metal thin film fabric (M1) and the adhesive sheet are first attached to each other, and then the metal thin film fabric (M1) is A method may be taken of cutting the and adhesive sheet (M2) together. Therefore, the tolerances that were considered when manufacturing the metal layer (FSM) and the adhesive layer (FSA) separately and aligning and attaching them may no longer be considered. In addition, as the end of the metal layer (FSM), which has a convex curved shape or a rounded corner shape, comes into contact with the lower surface of the COF tape (151.161), the metal layer (FSM) serves as a support for the COF tape (151.161). At the same time, it is possible to minimize burnt problems caused by shorts and shorts in the COF tape (151. 161) wiring. Accordingly, since the end of the metal layer (FSM) has a convex curved shape or a rounded corner shape, there is an effect of preventing damage to the line wiring of the COF tapes 151 and 161 due to protrusions or lumps.

Therefore, by preventing protrusions or lumps from occurring at the ends of the metal layer (FSM) constituting the upper substrate, damage to the line wiring of the COF tapes 151 and 161 caused by the ends of the metal layer (FSM) constituting the upper substrate can be prevented. You can. In addition, short circuits between the line wiring of the COF tapes 151 and 161 caused by the ends of the metal layer (FSM) constituting the upper substrate can be minimized. In addition, the occurrence of burnts in which the surrounding area becomes black when a driving failure occurs after module work of the organic light emitting display device or a short occurs between the line wiring of the COF tapes 151 and 161 is reduced, thereby improving the productivity and reliability of the organic light emitting display device. You can.

A method of manufacturing a structure according to an embodiment of the present invention includes forming a metal thin film having adhesive properties on a first surface by laminating an adhesive sheet to a metal thin film fabric; A first cutting step of cutting the adhesive sheet portion of the metal thin film with a first laser to form a groove in the metal thin film; A second cutting step of cutting the metal thin film by irradiating a second laser into the groove formed by the first laser to form a metal thin film cell having an adhesive layer and a metal layer; and a physical processing step of causing the metal layer of the metal thin film cell to have a rounded edge shape.

At this time, the end of the adhesive layer is melted by the first laser, and is characterized in that it has an overflow shape along the end of the metal layer.

*

*In addition, the second laser is an alloy of iron (Fe) and nickel (Ni) (Fe-Ni alloy) or an alloy of iron (Fe), nickel (Ni), and cobalt (Co) (Fe-Ni-Co alloy) It may be a laser that produces enough energy to cut a metal thin film fabric containing.

In addition, a metal thin film containing an alloy of iron (Fe) and nickel (Ni) (Fe-Ni alloy) or an alloy of iron (Fe), nickel (Ni), and cobalt (Co) (Fe-Ni-Co alloy) The fabric may have a coefficient of thermal expansion of 2.5ppm/℃ to 5.5ppm/℃.

Additionally, the first laser may be a laser in a lower energy range than the second laser.

At this time, the physical processing step may be a step in which pressure is applied to the end of the metal layer in contact with the rolling tool to form a rounded edge shape. Alternatively, the physical processing step may be a step in which the end of the metal layer is irradiated with a third laser to melt and harden the end of the metal layer, thereby processing it into a rounded edge shape. Meanwhile, the third laser may be the same laser as the second laser.

At this time, the second laser may be a laser that selectively cuts the metal thin film fabric by passing through the adhesive sheet portion while cutting the metal thin film fabric portion.

A structure according to an embodiment of the present invention includes a metal layer having an upper surface configured to accommodate a PCB and a lower surface configured to accommodate the upper surface of a TFT substrate; An adhesive layer located on the lower surface of the metal layer and implemented to adhere the metal layer to the TFT substrate; and a COF tape that partially overlaps the metal layer and is supported by the end of the metal layer, has a driving integrated circuit on the lower surface, is on the upper surface of the metal layer and is implemented to connect the PCB and the TFT substrate, and the COF tape is located at the end of the metal layer. The PCB and the TFT substrate are connected through a pad portion located on the upper surface of the TFT substrate between the end of the TFT substrate, and the metal layer is not in contact with the COF tape except for the end of the metal layer, which is implemented to prevent damage to the COF tape. It is characterized by

At this time, the end of the adhesive layer may be thinner than other areas of the adhesive layer excluding the end of the adhesive layer.

Additionally, the end of the metal layer implemented to prevent damage to the COF tape may be in contact with the COF tape by further disposing a cushion implemented to alleviate the amount of impact at the end of the metal layer.

In addition, the end of the metal layer implemented to prevent damage to the COF tape has a rounded corner shape, and the end of the adhesive layer can cover the end of the metal layer along the rounded corner shape.

Additionally, the end of the metal layer implemented to prevent damage to the COF tape may contact the COF tape with the end of the adhesive layer covering the end of the metal layer interposed therebetween.

Additionally, the thickness of the end of the adhesive layer may gradually become thinner toward the end of the adhesive layer.

In addition, the metal layer may include an alloy of iron (Fe) and nickel (Ni) (Fe-Ni alloy) or an alloy of iron (Fe), nickel (Ni), and cobalt (Co) (Fe-Ni-Co alloy). You can.

Additionally, the metal layer may have a thermal expansion coefficient of 2.5ppm/℃ to 5.5ppm/℃.

Additionally, an organic light emitting device may be disposed between the metal layer and the support substrate.

Additionally, a color filter may be further disposed between the organic light emitting device and the support substrate.

The structure according to an embodiment of the present invention is an upper substrate for physically and chemically protecting an organic light emitting device disposed on a TFT substrate, and includes a metal layer. The end of the metal layer has no protrusions or lumps and has a convex curved shape or rounded corner shape to prevent damage to the line wiring of the COF tape caused by the end of the metal layer constituting the upper substrate. In this way, the lower surface of the COF tape can be physically supported by the end of the metal layer that is implemented to prevent physical shock to the wiring of the COF tape. The end of the metal layer has a structure implemented to prevent short circuits between the line wiring of the COF tape while physically contacting the end of the metal layer and the bottom surface of the COF tape, preventing driving failure after module work of the organic light emitting display device or the line of the COF tape. The occurrence of short circuits between wiring is reduced. Therefore, the occurrence of burnts, which cause the surrounding area to burn black when a short circuit occurs, can be reduced, thereby improving the productivity and reliability of the organic light emitting display device. Since the end of the metal layer and the lower surface of the connection may be in stable contact, the tolerance between the end of the metal layer and the connection may not be considered. Therefore, it is possible to implement a narrow bezel in which the difference between the display area and the non-display area becomes smaller.

Although embodiments of the present invention have been described in more detail with reference to the accompanying drawings, the present invention is not necessarily limited to these embodiments, and may be modified and implemented in various ways without departing from the technical spirit of the present invention. . Accordingly, the embodiments disclosed in the present invention are not intended to limit the technical idea of the present invention, but are for illustrative purposes, and the scope of the technical idea of the present invention is not limited by these examples. Therefore, the embodiments described above should be understood in all respects as illustrative and not restrictive. The scope of protection of the present invention should be interpreted in accordance with the claims, and all technical ideas within the equivalent scope should be interpreted as being included in the scope of rights of the present invention.

100: Organic light emitting display device 130: System board part
140: timing control unit 150: data driver
151: Source COF tape 151_a: Support layer
151_b: Line wiring 151_c: Solder resist
151_d: Driving integrated circuit 160: Gate driving unit
170: Organic light emitting display panel 180: Source PCB
190: Scan PCB 510: TFT board
520: light emitting layer 530: passivation layer
540: PCB adhesive member 550: Pad portion
610: Cushion FSMA: Metal thin film
FSMA_c: Metal thin film cell FSM: Metal layer
FSA: Adhesive layer M1: Metal thin film fabric
M2: Adhesive sheet P: Rolling tool
L1, L2, L3: 1st, 2nd and 3rd lasers

Claims (25)

A TFT substrate including a display area on which a plurality of pixels are formed and a non-display area surrounding the display area;
a light emitting layer formed in the display area and including a plurality of organic light emitting elements;
A passivation layer formed on the light emitting layer;
An adhesive layer formed on the passivation layer;
an upper substrate formed on the adhesive layer;
a color filter formed between the TFT substrate and the upper substrate; and
It is formed in the non-display area and includes a pad portion connecting the TFT substrate and the PCB,
Each of the plurality of organic light emitting devices includes an anode, an organic light emitting layer including at least one stack structure, and a cathode,
The thickness of the upper substrate and the thickness of the adhesive layer are different from each other,
The upper substrate and the adhesive layer overlap each other,
The adhesive layer is disposed to completely cover the display area and has an area larger than the display area. According to claim 1,
Each of the plurality of pixels is composed of red, green, and blue subpixels, or each of the plurality of pixels is composed of red, green, blue, and white subpixels.
According to claim 1,
The passivation layer is composed of a single layer made of an inorganic film or a plurality of layers in which an organic film and an inorganic film are repeatedly stacked.
According to claim 1,
A display device wherein the thickness of the adhesive layer and the thickness of the passivation layer are different from each other.
According to claim 1,
The adhesive layer is made of epoxy, phenol, amino, unsaturated polyester, polyimide, silicone, acryl, vinyl, and olefin. ) A display device comprising any one of the following.
According to claim 1,
The display device wherein the upper substrate includes a metal material.
According to claim 1,
A display device wherein the thermal expansion coefficient between the upper substrate and the TFT substrate is different.
According to claim 1,
The upper substrate has an upper surface that can accommodate the PCB and a lower surface that can accommodate the upper surface of the TFT substrate.
According to claim 1,
Further comprising a COF tape provided with a driving integrated circuit on the lower surface,
The COF tape connects the PCB and the TFT substrate, partially overlaps the upper substrate, and is supported by an end of the upper substrate.
According to clause 9,
The COF tape connects the PCB and the TFT substrate through the pad portion.
According to clause 9,
The display device wherein the upper substrate is not in contact with the COF tape except for an end of the upper substrate.
According to clause 9,
It further includes a cushion implemented to alleviate the amount of impact at the end of the upper substrate,
A display device wherein an end of the upper substrate is in contact with the COF tape, with the cushion interposed therebetween.
According to clause 9,
A display device, wherein an end of the upper substrate is in contact with the COF tape, with an end of the adhesive layer covering the end of the upper substrate interposed therebetween.
According to claim 1,
The display device wherein the end of the adhesive layer is thinner than the remaining area of the adhesive layer excluding the end of the adhesive layer.
According to claim 1,
The end of the upper substrate has a rounded corner shape,
An end of the adhesive layer covers an end of the upper substrate along the rounded corner shape.
According to claim 1,
The display device wherein the thickness of the end of the adhesive layer gradually becomes thinner toward the area where the end of the upper substrate overlaps with the upper substrate.


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