KR102621564B1 - Organic light emitting display device and method of manufacturing the same - Google Patents

Abstract

The present invention provides an organic light emitting display device that reduces the bezel and prevents defects and a manufacturing method thereof, comprising: a first substrate having a display area and a non-display area; a second substrate disposed to face the first substrate; It includes a dam disposed between the non-display area of one substrate and the second substrate, and a first sacrificial layer disposed between the first substrate and the dam, and the end of the first substrate and the dam overlap.

Description

Organic light emitting display device and manufacturing method thereof {ORGANIC LIGHT EMITTING DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME}

The present invention relates to an organic light emitting display device and a method of manufacturing the same.

Recently, the importance of display devices has increased along with the development of multimedia. In response to this, flat panel displays such as liquid crystal displays, plasma displays, and organic light emitting displays are being commercialized. Among these flat display devices, liquid crystal displays and organic light emitting display devices have excellent characteristics such as thinner, lighter, and lower power consumption, and are used in laptop computers, televisions, tablet computers, monitors, smart phones, portable display devices, portable information devices, etc. It is widely used as a display device.

An organic light emitting display device has a structure with a light emitting layer between a cathode that injects electrons and an anode that injects holes, and the electrons generated from the cathode and the holes generated from the anode are A display device using the principle that when injected into the light emitting layer, the injected electrons and holes combine to generate exciton, and the generated exciton falls from the excited state to the ground state and emits light. am.

This organic light emitting display device is constructed by bonding a first substrate and a second substrate, and the first substrate and the second substrate are bonded through a side sealing process using a sealant. At this time, during the process of bonding the first and second substrates, the sealant may be pressed and spread outward from the first and second substrates. If the sealant spreads to the outside of the organic light emitting display device, it may cause defects in the organic light emitting display device and reduce reliability. Accordingly, in a conventional organic light emitting display device, the sealant is disposed with a margin inside the first and second substrates to prevent the sealant from spreading to the outside of the organic light emitting display device. However, if a margin is left inside the first and second substrates, the bezel, which is a non-display area of the organic light emitting display device, increases. Additionally, when the first substrate is pressed by an external impact, the first substrate may bend and damage the second substrate, resulting in defects.

The present invention was developed to solve the above-mentioned problems, and its technical task is to provide an organic light emitting display device that reduces the bezel and prevents defects, and a method of manufacturing the same.

The present invention for achieving the above-described technical problem is a first substrate having a display area and a non-display area, a second substrate disposed to face the first substrate, and an arrangement between the non-display area of the first substrate and the second substrate. An organic light emitting display device and a method of manufacturing the same are provided, including a dam and a first sacrificial layer disposed between a first substrate and the dam, wherein an end of the first substrate and the dam overlap.

According to the present invention, in the organic light emitting display device according to one example, a dam is disposed without a margin on the outermost part of the first and second substrates, so that a narrow bezel can be implemented, improving aesthetics and providing a similar size. This has the effect of widening the actual screen of the product.

In addition, since the organic light emitting display device according to an example of the present invention has a dam disposed on the outermost edge of the first and second substrates, it is possible to prevent the first and second substrates from being bent when the outer portion is pressed.

Additionally, the organic light emitting display device according to an example of the present invention can prevent scratches from occurring on the first and second substrates and improve reliability.

Additionally, the organic light emitting display device according to an example of the present invention can prevent materials constituting the dam from contaminating the substrate or equipment used in the scribing process by disposing a sacrificial layer between the substrate and the dam.

The effects that can be obtained from the present invention are not limited to the effects mentioned above, and other effects not mentioned can be clearly understood by those skilled in the art from the description below. .

1 is a perspective view showing an organic light emitting display device according to an example of the present invention.
FIG. 2 is a plan view showing the display area, non-display area, gate driver, source drive IC, flexible film, circuit board, and timing control unit of the first substrate of FIG. 1.
Figure 3 is a cross-sectional view of an organic light emitting display device according to an example of the present invention.
Figure 4 is a cross-sectional view of an organic light emitting display device according to another example of the present invention.
5A to 5E are cross-sectional process views for explaining a method of manufacturing an organic light emitting display device according to an example of the present invention.

The meaning of terms described in this specification should be understood as follows.

Singular expressions should be understood to include plural expressions unless the context clearly defines otherwise, and terms such as “first”, “second”, etc. are used to distinguish one element from another element. The scope of rights should not be limited by these terms. Terms such as “include” or “have” should be understood as not precluding the presence or addition of one or more other features, numbers, steps, operations, components, parts, or combinations thereof. The term “at least one” should be understood to include all possible combinations from one or more related items. For example, “at least one of the first, second, and third items” means each of the first, second, or third items, as well as two of the first, second, and third items. It means a combination of all items that can be presented from more than one. The term “on” means not only the case where a component is formed directly on top of another component, but also the case where a third component is interposed between these components.

Hereinafter, a preferred example of the organic light emitting display device and its manufacturing method according to the present invention will be described in detail with reference to the attached drawings. In adding reference numerals to components in each drawing, identical components may have the same reference numerals as much as possible even if they are shown in different drawings. Additionally, when describing the present invention, if it is determined that a detailed description of a related known configuration or function may obscure the gist of the present invention, the detailed description may be omitted.

FIG. 1 is a perspective view showing an organic light emitting display device according to an example of the present invention, and FIG. 2 shows a display area and a non-display area of the first substrate of FIG. 1, a gate driver, a source drive IC, a flexible film, a circuit board, and This is a top view showing the timing control unit. 1 and 2, the X-axis represents a direction parallel to the gate line, the Y-axis represents a direction parallel to the data line, and the Z-axis represents the height direction of the organic light emitting display device.

Referring to FIGS. 1 and 2 , an organic light emitting display device according to an example of the present invention includes a display panel 100, a gate driver 200, and a source drive integrated circuit (hereinafter referred to as “IC”) 310. ), a flexible film 330, a circuit board 350, and a timing control unit 400.

The display panel 100 includes a first substrate 110 and a second substrate 120. Gate lines, data lines, and pixels are formed on one side of the first substrate 110 facing the second substrate 120. The pixels include a plurality of sub-pixels, and the plurality of sub-pixels are formed in intersection areas of gate lines and data lines.

Each of the plurality of sub-pixels may include at least one thin film transistor and an organic light emitting device. Each of the plurality of sub-pixels receives a data voltage through a data line when at least one thin film transistor is turned on by a gate signal of the gate line. Each of the plurality of sub-pixels controls the current flowing to the organic light-emitting device according to the data voltage, causing the organic light-emitting device to emit light at a predetermined brightness.

As shown in FIG. 2, the display panel 100 can be divided into a display area (DA) that displays images and a non-display area (NDA) that does not display images. Gate lines, data lines, and pixels may be formed in the display area DA. A gate driver 200 and pads may be formed in the non-display area NDA.

The gate driver 200 supplies gate signals to the gate lines according to the gate control signal input from the timing controller 400. The gate driver 200 may be formed in a non-display area (NDA) outside one or both sides of the display area (DA) of the display panel 100 using a gate driver in panel (GIP) method. Alternatively, the gate driver 200 is manufactured as a driving chip, mounted on a flexible film, and formed in a non-display area (NDA) outside one or both sides of the display area (DA) of the display panel 100 using a TAB (tape automated bonding) method. It may be attached to .

The source drive IC 310 receives digital video data and source control signals from the timing control unit 400. The source drive IC 310 converts digital video data into analog data voltages according to the source control signal and supplies them to the data lines. When the source drive IC 310 is manufactured as a driving chip, it can be mounted on the flexible film 330 using a COF (chip on film) or COP (chip on plastic) method.

Pads such as data pads may be formed in the non-display area NDA of the display panel 100. Wires connecting the pads and the source drive IC 310 and wires connecting the pads and the wires of the circuit board 350 may be formed in the flexible film 330. The flexible film 330 is attached to the pads using an anisotropic conducting film, so that the pads and the wiring of the flexible film 330 can be connected.

The circuit board 350 may be attached to flexible films 330. The circuit board 350 may be equipped with multiple circuits implemented with driving chips. For example, the timing control unit 400 may be mounted on the circuit board 350. The circuit board 350 may be a printed circuit board or a flexible printed circuit board.

The timing control unit 400 receives digital video data and timing signals from an external system board through a cable of the circuit board 350. The timing control unit 400 generates a gate control signal for controlling the operation timing of the gate driver 200 and a source control signal for controlling the source drive ICs 310 based on the timing signal. The timing control unit 400 supplies a gate control signal to the gate driver 200 and a source control signal to the source drive ICs 310.

Figure 3 is a cross-sectional view of an organic light emitting display device according to an example of the present invention. This is a diagram schematically showing the cross section of line I-I shown in FIG. 1.

Referring to FIG. 3 , the organic light emitting display device according to an example of the present invention includes a display area (DA) and a non-display area (NDA).

The display area DA is composed of a plurality of pixels (not shown) formed in each pixel area intersected by a plurality of gate lines (not shown) and a plurality of data lines (not shown). This display area (DA) includes a thin film transistor (T), a protection layer (PAS), a planarization layer (PAC), an organic light emitting device layer (OLED), a bank (BNK), and an encapsulation layer (INC) on the first substrate 110. ), a filling layer (FL), a color filter (CF), a light blocking layer (BM), and a second substrate 120.

The first substrate 110 is mainly made of glass, but transparent plastic that can be bent or bent, for example, polyimide, can be used. When using polyimide as a material for the first substrate 110, considering that a high temperature deposition process is performed on the first substrate 110, polyimide with excellent heat resistance that can withstand high temperatures can be used. .

A buffer layer (not shown) may be additionally provided on the first substrate 110. The buffer layer may be provided on the entire upper surface of the first substrate 110. The buffer layer functions to prevent moisture from penetrating into the display panel 100 from the first substrate 110, which is vulnerable to moisture permeation. Additionally, the buffer layer functions to prevent impurities such as metal ions from diffusing from the first substrate 110 and penetrating into the active layer (ACT) of the thin film transistor (T). The buffer layer may be made of an inorganic insulating material, such as silicon dioxide (SiO2), silicon nitride (SiNx), silicon oxynitride (SiON), or multiple layers thereof, but is not limited thereto.

The thin film transistor T is disposed on the first substrate 110. The thin film transistor (T) according to one example includes an active layer (ACT), a gate insulating layer (GI), a gate electrode (GE), a source electrode (SE), and a drain electrode (DE).

The active layer ACT is provided on the first substrate 110 disposed in the display area DA. The active layer (ACT) is arranged to overlap the gate electrode (GE). The active layer (ACT) has one end area (A1) located on the source electrode (SE) side, the other end area (A2) located on the drain electrode (DE) side, and the center located between one end area (A1) and the other end area (A2). It may be composed of an area (A3). The central region A3 may be made of a semiconductor material that is not doped with a dopant, and the first region (A1) and the other end region (A2) may be made of a semiconductor material that is doped with a dopant.

The gate insulating layer (GI) is provided on the active layer (ACT). The gate insulating film (GI) functions to insulate the active layer (ACT) and the gate electrode (GE). The gate insulating layer GI covers the active layer ACT and may be formed on the entire display area DA. The gate insulating film (GI) may be made of an inorganic insulating material, such as silicon dioxide (SiO2), silicon nitride (SiNx), silicon oxynitride (SiON), or multiple layers thereof, but is not limited thereto.

The gate electrode (GE) is provided on the gate insulating film (GI). The gate electrode (GE) overlaps the central area (A3) of the active layer (ACT) with the gate insulating film (GI) interposed therebetween. The gate electrode (GE) is made of, for example, molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu). It may be a single layer or a multi-layer made of any one or an alloy thereof, but is not limited thereto.

An interlayer insulating film (not shown) may be additionally provided on the gate electrode GE. The interlayer insulating film may be provided on the entire display area (DA) including the gate electrode (GE). The interlayer insulating film may be made of the same inorganic insulating material as the gate insulating film (GI), such as silicon dioxide (SiO2), silicon nitride (SiNx), silicon oxynitride (SiON), or multiple layers thereof, but is not limited thereto.

The protective layer (PAS) is provided on the gate electrode (GE). The protective layer (PAS) functions to protect the thin film transistor (T). The protective layer (PAS) may be made of inorganic insulating materials SiO2 (silicon dioxide), SiNx (silicon nitride), SiON (silicon oxynitride), or multiple layers thereof, but is not limited thereto.

The source electrode (SE) and drain electrode (DE) are provided to be spaced apart from each other on the protective layer (PAS). The protective layer (PAS) includes a first contact hole (CNT1) exposing part of one end area (A1) of the active layer (ACT) and a second contact hole (CNT2) exposing part of the other end area (A2) of the active layer (ACT). ) is provided. The source electrode (SE) is connected to one end area (A1) of the active layer (ACT) through the first contact hole (CNT1), and the drain electrode (DE) is connected to the active layer (ACT) through the second contact hole (CNT2). It is connected to the other end area (A2).

The configuration of the thin film transistor T described above is not limited to the example described above, and can be modified in various ways to known configurations that can be easily implemented by those skilled in the art.

The planarization layer (PAC) is provided on the protective layer (PAS). The planarization layer (PAC) performs the function of flattening the upper part of the protective layer (PAS). The planarization layer (PAC) is an organic insulating material such as acryl resin, epoxy resin, phenolic resin, polyamides resin, and polyimides resin. ), etc., but is not limited to this.

The organic light emitting device layer (OLED) is provided on the thin film transistor (T). The organic light emitting device layer (OLED) includes a first electrode (AND), an organic light emitting layer (EL), and a second electrode (CAT).

The first electrode (AND) is provided on the planarization layer (PAC). The first electrode AND is connected to the drain electrode DE of the thin film transistor T through the third contact hole CNT3 provided in the planarization layer PAC. The first electrode AND according to one example may be made of a transparent conductive material such as ITO, IZO, ZnO, or In2O3 with a high work function value and may serve as an anode.

The organic light emitting layer (EL) is provided on the first electrode (AND). The organic light emitting layer (EL) is provided in individual pixel areas defined by the bank (BNK). The organic light emitting layer (EL) according to one example may include a hole transporting layer, an organic light emitting layer, and an electron transporting layer. Furthermore, the organic light emitting layer (EL) may further include at least one functional layer to improve the luminous efficiency and/or lifespan of the light emitting layer.

The second electrode (CAT) is provided on the organic light emitting layer (EL). The second electrode CAT may be configured as an electrode common to all pixels rather than being divided by pixel area. That is, the second electrode CAT may be provided not only on the organic light emitting layer EL but also on the bank BNK. When voltage is applied to the second electrode (CAT) together with the first electrode (AND), holes and electrons are moved to the light-emitting layer through the hole transport layer and electron transport layer, respectively, and combine with each other in the light-emitting layer to emit light. The second electrode (CAT) may function as a cathode of the organic light emitting display device and may be made of an opaque metal material made of Li, Ca, LiF/Ca, LiF/Al, Al, Mg, or a compound thereof. there is.

The bank (BNK) is provided on the planarization layer (PAC). The bank BNK is provided between adjacent first electrodes AND to partition the first electrode AND. The bank BNK may electrically insulate adjacent first electrodes AND from each other. The bank (BNK) may be made of an organic insulating material such as polyimides resin, acryl resin, benzocyclobutene (BCB), but is not limited thereto.

The encapsulation layer (INC) is entirely disposed on the second electrode (CAT). The encapsulation layer (INC) prevents deterioration of the organic light emitting layer (EL) by blocking the penetration of moisture, etc., that may come in from the outside. The encapsulation layer (INC) may be made of metals such as copper (Cu) and aluminum (Al) or alloys thereof, but this is not necessarily the case and various materials known in the art can be used.

The filling layer FL fills the space between the first substrate 110 and the second substrate 120, and the filling layer FL does not spread outside the organic light emitting display device due to the dam DAM. The filling layer FL is disposed between the first substrate 110 and the second substrate 120 to prevent light loss and increase the adhesive force between the first substrate 110 and the second substrate 120.

The color filter CF is disposed between the encapsulation layer INC and the second substrate 120. The color filter (CF) is disposed on the organic light emitting layer (EL) and converts the color of white light emitted from the organic light emitting layer (EL). At this time, the color filter CF may be composed of a red color filter, a green color filter, and a blue color filter.

The light blocking layer (BM) is disposed between the encapsulation layer (INC) and the second substrate 120. The light blocking layer (BM) is disposed on the side of the color filter (CF) so as not to overlap the organic light emitting layer (EL), thereby preventing light from leaking into the non-display area (NDA).

The non-display area (NDA) is provided outside the display area (DA), and a driver for applying a signal to the display area (DA) is disposed. This non-display area (NDA) includes the first and second substrates 110 and 120, a protective layer (PAS), a dam (DAM), a sacrificial layer (SL), and a side sealing member (not shown). At this time, the first and second substrates 110 and 120 and the protective layer PAS are arranged to extend from the display area DA. Meanwhile, the planarization layer (PAC), the first electrode (AND), the second electrode (CAT), the encapsulation layer (INC), the filling layer (FL), and the light blocking layer (BM) extend from the display area (DA) and Even the display area (NDA) may be provided, but this is not necessarily the case and may be placed only in the display area (DA). Therefore, in the following description, only the dam (DAM), the sacrificial layer (SL), and the side sealing member (not shown) will be described, and duplicate descriptions of the same components will be omitted.

The dam (DAM) is disposed between the first substrate 110 and the second substrate 120. The dam DAM may have a frame shape surrounding the display area DA, and the dam DAM may prevent the filling layer FL from spreading outside the organic light emitting display device. Additionally, the dam (DAM) bonds the first substrate 110 and the second substrate 120. In the organic light emitting display device according to an example of the present invention, the dam may be made of a sealant, and the first substrate 110 and the second substrate 120 may be bonded through a side sealing process using a sealant. there is. At this time, in the conventional organic light emitting display device, in order to prevent the sealant from spreading to the outside of the first and second substrates 110 and 120 during the process of bonding the first and second substrates 110 and 120, the first sealant And the sealant is placed inside the second substrates 110 and 120, leaving a margin. That is, in a conventional organic light emitting display device, a bezel area other than the area where the dam (DAM) is placed in the non-display area (NDA) is provided for margin. However, the organic light emitting display device according to an example of the present invention does not have a bezel area provided for a margin in the non-display area (NDA). That is, the dam (DAM) of the organic light emitting display device according to an example of the present invention is disposed on the outermost side of the first substrate 110 and the second substrate 120. The dam (DAM) of the organic light emitting display device according to an example of the present invention overlaps the ends, that is, the sides, of the first and second substrates 110 and 120, and is located at the ends of the first and second substrates 110 and 120. In other words, it doesn't go off the side. That is, the end of the dam (DAM) of the organic light emitting display device according to an example of the present invention coincides with the ends of the first and second substrates 110 and 120. Therefore, since the organic light emitting display device according to an example of the present invention has a reduced non-display area (NDA) compared to the conventional organic light emitting display device, it is possible to implement a narrow bezel, thereby improving aesthetics and providing a similar look. This has the effect of widening the actual screen in a product of this size. In addition, since the organic light emitting display device according to an example of the present invention has a dam (DAM) disposed on the outermost side of the first and second substrates 110 and 120, the first and second substrates ( 110, 120) can prevent it from bending. Accordingly, the organic light emitting display device according to an example of the present invention can prevent scratches from occurring on the first and second substrates 110 and 120 and have the effect of improving reliability.

The sacrificial layer SL is disposed on the outermost side of the organic light emitting display device, and the sacrificial layer SL is provided between the first and second substrates 110 and 120 and the dam DAM. The sacrificial layer (SL) may have a frame shape together with the dam (DAM). The sacrificial layer (SL) can be formed into a liquid pattern using a polymer, or adhesive tape can also be used. The sacrificial layer SL may be made of an organic material, for example, silicon oxide such as amorphous silicon, or silicon nitride. If the sacrificial layer (SL) is made of an organic material, it may become a path for moisture to penetrate from the outside into the organic light emitting display device, so the width of the sacrificial layer (SL) is smaller than the width of the dam (DAM). Additionally, the sacrificial layer SL is provided to overlap the outer end of the dam DAM, is not provided in the display area DA, and is disposed at the outermost edge of the first and second substrates 110 and 120. The sacrificial layer (SL) loses its adhesive strength due to ultraviolet curing, laser irradiation, etc., and therefore, the sacrificial layer (SL) is damaged during the process of removing the bezel areas of the first and second substrates 110 and 120. The materials constituting the first and second substrates 110 and 120 and the dam (DAM) can be easily separated. Additionally, the sacrificial layer SL can prevent equipment for removing the first and second substrates 110 and 120 and the bezel area from being contaminated by materials constituting the dam DAM.

The organic light emitting display device according to an example of the present invention includes a first sacrificial layer (SL1) and a second sacrificial layer (SL2).

The first sacrificial layer SL1 is disposed on the first substrate 110 . One side of the first sacrificial layer SL1 is in contact with the first substrate 110, and the other side is in contact with the dam DAM. One end of the first sacrificial layer SL1 facing outward from the organic light emitting display device coincides with an end of the first substrate 110 . Additionally, one end of the first sacrificial layer SL1 coincides with an end of the dam DAM facing outward of the organic light emitting display device. The other end of the first sacrificial layer SL1 facing inward of the organic light emitting display device may be in contact with the dam DAM and is disposed so as not to go beyond the dam DAM.

The second sacrificial layer SL2 is disposed on the second substrate 120 . One side of the second sacrificial layer SL2 is in contact with the second substrate 120, and the other side is in contact with the dam DAM. One end of the second sacrificial layer SL2 facing outward from the organic light emitting display device coincides with an end of the second substrate 120 . Additionally, one end of the second sacrificial layer SL2 coincides with an end of the dam DAM facing outward of the organic light emitting display device. The other end of the second sacrificial layer SL2 facing inward of the organic light emitting display device may be in contact with the dam DAM and is disposed so as not to go beyond the dam DAM.

The side sealing member (not shown) is disposed on the side surfaces of the first substrate 110 and the second substrate 120. The side sealing member is disposed to cover the sides of the first and second substrates 110 and 120 to prevent light from leaking and protect the sides of the first and second substrates 110 and 120. The side sealing member may be composed of thermosetting or photocuring resin.

As such, in the organic light emitting display device according to an example of the present invention, a dam (DAM) is disposed without a margin on the outermost part of the first and second substrates 110 and 120, so that a narrow bezel is implemented. This improves aesthetics and has the effect of widening the actual screen in products of similar size. In addition, since the organic light emitting display device according to an example of the present invention has a dam (DAM) disposed on the outermost side of the first and second substrates 110 and 120, the first and second substrates ( 110, 120) can prevent it from bending. Accordingly, the organic light emitting display device according to an example of the present invention can prevent scratches from occurring on the first and second substrates 110 and 120 and have the effect of improving reliability.

Figure 4 is a cross-sectional view of an organic light emitting display device according to another example of the present invention. This is a diagram schematically showing the cross section of II-II shown in FIG. 1. This is a change in the configuration of the first substrate 110, the dam (DAM), and the first sacrificial layer (SL1) in the organic light emitting display device according to the example shown in FIG. 3. Accordingly, in the following description, only the first substrate 110, the dam (DAM), and the first sacrificial layer (SL1) will be described, and duplicate descriptions of the same components will be omitted.

Referring to FIG. 4 , the first substrate 110 of the organic light emitting display device according to another example of the present invention is provided to be larger than the second substrate 120 . Accordingly, in the organic light emitting display device according to another example of the present invention, the end of the first substrate 110 protrudes beyond the end of the second substrate 120. A plurality of pads (not shown) are provided on the protruding first substrate 110, and a flexible film 330 on which the source drive integrated circuit 310 is mounted is attached.

The dam (DAM) is disposed between the first substrate 110 and the second substrate 120. The end of the dam (DAM) of the organic light emitting display device according to another example of the present invention coincides with the end of the second substrate 120, but does not coincide with the end of the first substrate 110. Since the first substrate 110 according to another example of the present invention is not cut through a scribing process, the first sacrificial layer SL1 is not provided between the first substrate 110 and the dam DAM.

Although not shown, side sealing members (not shown) are disposed on the sides of the first substrate 110 and the second substrate 120 of the organic light emitting display device according to another example of the present invention. The side sealing member is disposed to cover the sides of the first and second substrates 110 and 120 to prevent light from leaking and protect the sides of the first and second substrates 110 and 120. The side sealing member may be composed of thermosetting or photocuring resin.

FIGS. 5A to 5E are process cross-sectional views illustrating a method of manufacturing an organic light emitting display device according to an example of the present invention, which relate to the method of manufacturing an organic light emitting display device according to FIG. 3 described above. Accordingly, the same reference numerals are assigned to the same components, and redundant descriptions of repeated parts in the materials and structures of each component are omitted.

Hereinafter, a method of manufacturing an organic light emitting display device according to an example of the present invention will be described as follows.

First, as shown in FIG. 5A, a thin film transistor (T) is formed in the display area (DA) on the first substrate 110, and a protective layer (PAS) and a planarization layer (PAC) are formed on the thin film transistor (T). , an organic light emitting device layer (OLED), a bank (BNK), and an encapsulation layer (INC) are formed. A first sacrificial layer SL1 is formed in a frame shape in the non-display area NDA on the first substrate 110.

The process of forming a thin film transistor (T) includes forming an active layer (ACT) and a gate insulating film (GI) on the first substrate 110, and forming a gate electrode (GE) and a protective layer (PAS) on the gate insulating film (GI). ) is formed, and first and second contact holes (CNT1, CNT2) are formed in the protective layer (PAS), so that the source and drain electrodes (SE, DE) are connected to the first and second contacts on the protective layer (PAS). It includes a forming process to connect to the active layer (ACT) through holes (CNT1, CNT2). The formation process of the thin film transistor (T) can use various methods known in the art.

Then, a color filter (CF) and a light blocking layer (BM) are formed in the display area (DA) on the second substrate 120. A second sacrificial layer (SL2) is formed in a frame shape in the non-display area (NDA) on the second substrate 120, a dam (DAM) is formed to surround the display area (DA), and the display area (DA) is formed. Fill the filling layer (FL).

Then, the first substrate 110 and the second substrate 120 are bonded, and ultraviolet rays (UV) or a laser are irradiated to the first sacrificial layer (SL1) and the second sacrificial layer (SL2), The first and second sacrificial layers (SL1, SL2) are heat-cured. The first and second sacrificial layers SL1 and SL2 irradiated with the laser lose their adhesion and their interfaces with the first and second substrates 110 and 120 are separated. At this time, as an example, an excimer laser may be used as the laser. Additionally, although not shown in the drawing, an inorganic layer such as silicon oxide or silicon nitride and amorphous silicon may be provided between the first and second substrates 110 and 120. When separating the first and second substrates 110 and 120 and the first and second sacrificial layers (SL1 and SL2) through laser release, the inorganic film is used to form the first and second sacrificial layers (SL1 and SL2). ) plays a role in allowing it to be completely removed. In addition, as another example, when a laser is irradiated to the first and second sacrificial layers (SL1, SL2), the hydrogen distributed in the first and second sacrificial layers (SL1, SL2) explodes and the first and second substrates ( 110, 120) and can also be separated. As such, the method of separating the first and second substrates 110 and 120 and the first and second sacrificial layers SL1 and SL2 is not limited to the example described above, but is a known method that can be easily performed by a person skilled in the art. It can be modified in various configurations.

Then, as shown in FIG. 5B, the non-display area (NDA) of the second substrate 120 is removed by cutting through a scribing process. The scribing process is based on the midpoint of the second sacrificial layer (SL2) for margin purposes. When the second substrate 120 is cut based on the midpoint of the second sacrificial layer (SL2), the second sacrificial layer (SL2), which has lost its adhesive strength due to heat curing, is separated from the dam (DAM) and forms the second substrate (120). ) is removed along with This second sacrificial layer (SL2) allows the materials constituting the second substrate 120 and the dam (DAM) to be easily separated during the process of removing the non-display area (NDA) of the second substrate 120. Accordingly, the organic light emitting display device according to an example of the present invention arranges the second sacrificial layer SL2 between the second substrate 120 and the dam DAM, so that the material constituting the dam DAM is disposed on the second substrate 120. (120) Alternatively, it can be prevented from contaminating the equipment used in the scribing process.

Then, as shown in FIG. 5C, the non-display area (NDA) of the first substrate 110 is removed by cutting through a scribing process. The scribing process is based on the midpoint of the first sacrificial layer SL1 for margin purposes. When the first substrate 110 is cut based on the midpoint of the first sacrificial layer SL1, the first sacrificial layer SL1, which has lost its adhesive strength due to heat curing, is separated from the dam DAM and forms the first substrate 110. ) is removed along with This first sacrificial layer SL1 allows the materials constituting the first substrate 110 and the dam DAM to be easily separated during the process of removing the non-display area NDA of the first substrate 110. Accordingly, the organic light emitting display device according to an example of the present invention arranges the first sacrificial layer SL1 between the first substrate 110 and the dam DAM, so that the material constituting the dam DAM is disposed on the first substrate 110. (110) Alternatively, it can be prevented from contaminating the equipment used in the scribing process.

Then, as shown in FIG. 5D, the dam (DAM) protruding outside the organic light emitting display device is cut based on the ends of the first substrate 110 and the second substrate 120 through a grinding process. Remove.

Then, as shown in Figure 5e, the portion where the protruding dam (DAM) was removed by the grinding process is cleaned. The cleaning process may be performed simultaneously with the grinding process. As such, since the method of manufacturing an organic light emitting display device according to an example of the present invention uses an existing process, a narrow bezel can be implemented by reducing the non-display area (NDA) without adding a new process. In addition, the method of manufacturing an organic light emitting display device according to an example of the present invention forms a non-display area (NDA) in which a dam (DAM) is not formed without contaminating the first and second substrates (110, 120) and equipment. Since it can be removed, it is possible to prevent defects due to contamination and scratch defects due to pressure on the outer part, thereby improving reliability.

Although embodiments of the present invention have been described in more detail with reference to the accompanying drawings, the present invention is not necessarily limited to these embodiments, and various modifications may be made without departing from the technical spirit of the present invention. . Accordingly, the embodiments disclosed in the present invention are not intended to limit the technical idea of the present invention, but are for illustrative purposes, and the scope of the technical idea of the present invention is not limited by these embodiments. Therefore, the embodiments described above should be understood in all respects as illustrative and not restrictive. The scope of protection of the present invention should be interpreted in accordance with the claims, and all technical ideas within the equivalent scope should be interpreted as being included in the scope of rights of the present invention.

110: first substrate 120: second substrate
T: thin film transistor PAS: protective layer
PAC: Planarization layer OLED: Organic light emitting device layer
BNK: Bank INC: Envelope layer
FL: Filling layer CF: Color filter
BM: Shading layer DAM: Dam
SL: victim layer

Claims (13)

A first substrate having a display area and a non-display area;
a second substrate disposed to face the first substrate;
a dam disposed between the non-display area of the first substrate and the second substrate;
a first sacrificial layer disposed between the non-display area of the first substrate and the dam; and
It includes a second sacrificial layer disposed between the second substrate and the dam,
The end of the first substrate, the end of the dam, and the end of the second substrate coincide,
An organic light emitting display device in which an end of the first sacrificial layer coincides with an end of the first substrate, and an end of the second sacrificial layer coincides with an end of the second substrate. delete delete delete According to claim 1,
The organic light emitting display device wherein the width of the first sacrificial layer and the width of the second sacrificial layer are smaller than the width of the dam. delete delete delete According to claim 1,
The organic light emitting display device further includes a side sealing member surrounding side surfaces of the first and second substrates. delete According to claim 1,
The first sacrificial layer and the second sacrificial layer have a frame shape. forming a thin film transistor in the display area of a first substrate having a display area and a non-display area;
forming an organic light emitting device layer to be electrically connected to the thin film transistor;
forming a first sacrificial layer in a non-display area of the first substrate;
forming a color filter in a display area of a second substrate having a display area and a non-display area to overlap the first substrate;
forming a second sacrificial layer in a non-display area of the second substrate;
forming a dam on the second sacrificial layer to surround the display area;
bonding the first substrate and the second substrate; and
The end of the first substrate, the end of the dam, and the end of the second substrate coincide, the end of the first sacrificial layer matches the end of the first substrate, and the end of the second sacrificial layer matches the end of the second substrate. 2. A method of manufacturing an organic light emitting display device including the step of forming the ends of the substrate to match. According to claim 12,
The end of the first substrate, the end of the dam, and the end of the second substrate coincide, the end of the first sacrificial layer matches the end of the first substrate, and the end of the second sacrificial layer matches the end of the second substrate. 2 The step of forming the ends of the substrate to match,
irradiating ultraviolet rays or a laser to the first sacrificial layer and the second sacrificial layer;
Cutting and removing the second substrate and the second sacrificial layer through a scribing process based on the midpoint of the second sacrificial layer;
Cutting and removing the first substrate and the first sacrificial layer through a scribing process based on the midpoint of the first sacrificial layer; and
A method of manufacturing an organic light emitting display device comprising grinding and removing the dam protruding from ends of the first and second substrates.

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