JP2003280539A - Organic el display device - Google Patents
Organic el display deviceInfo
- Publication number
- JP2003280539A JP2003280539A JP2002082532A JP2002082532A JP2003280539A JP 2003280539 A JP2003280539 A JP 2003280539A JP 2002082532 A JP2002082532 A JP 2002082532A JP 2002082532 A JP2002082532 A JP 2002082532A JP 2003280539 A JP2003280539 A JP 2003280539A
- Authority
- JP
- Japan
- Prior art keywords
- organic
- panel
- display device
- flexible wiring
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims abstract description 17
- 238000007789 sealing Methods 0.000 claims abstract description 16
- 230000001681 protective effect Effects 0.000 claims description 5
- 238000005401 electroluminescence Methods 0.000 abstract description 2
- 239000005394 sealing glass Substances 0.000 description 13
- 239000010410 layer Substances 0.000 description 12
- 239000011521 glass Substances 0.000 description 7
- 239000012044 organic layer Substances 0.000 description 5
- 239000004642 Polyimide Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000005525 hole transport Effects 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 2
- 229910001887 tin oxide Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 229910006404 SnO 2 Inorganic materials 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 229910003437 indium oxide Inorganic materials 0.000 description 1
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 238000007733 ion plating Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- -1 polypropylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 239000007779 soft material Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、第一の電極と第二
の電極で発光層を挟持した有機エレクトロルミネッセン
スパネル（以下、有機ＥＬパネルと記す）を用いた有機
ＥＬ表示装置に関するものである。TECHNICAL FIELD The present invention relates to an organic EL display device using an organic electroluminescence panel (hereinafter referred to as an organic EL panel) in which a light emitting layer is sandwiched between a first electrode and a second electrode. .
【０００２】[0002]
【従来の技術】図５に示すように、有機ＥＬパネル１
は、ガラス基板２に積層体３を形成したものであり、こ
の積層体３は、透明電極４，有機層５，アルミニウム
（Al）からなる背面電極６を有する。透明電極４は、Ｉ
ＴＯ（Indium Tin Oxide）からなるものである。有機層
５は正孔注入層，正孔輸送層，発光層及び電子輸送層か
らなるものであり、透明電極４と背面電極６に挟持され
ている。積層体３は封止ガラス７に覆われ、この封止ガ
ラス７はガラス基板２に紫外線硬化性の接着剤で接着さ
れている。2. Description of the Related Art As shown in FIG.
Is a glass substrate 2 on which a laminate 3 is formed. The laminate 3 has a transparent electrode 4, an organic layer 5, and a back electrode 6 made of aluminum (Al). The transparent electrode 4 is I
It consists of TO (Indium Tin Oxide). The organic layer 5 is composed of a hole injection layer, a hole transport layer, a light emitting layer and an electron transport layer, and is sandwiched between the transparent electrode 4 and the back electrode 6. The laminated body 3 is covered with a sealing glass 7, and the sealing glass 7 is adhered to the glass substrate 2 with an ultraviolet curable adhesive.
【０００３】有機ＥＬパネル１には、可撓性配線板８が
電気的に接続されている。可撓性配線板８は、ポリイミ
ドからなる可撓性基板９に配線パターン１０を形成した
ものであり、一端が有機ＥＬパネル１に接続され、他端
が硬質回路板１１に接続されている。硬質回路板１１
は、ガラスエポキシ樹脂からなる硬質基板１２上に配線
パターン１３を形成したものである。硬質回路板１１に
は、有機ＥＬパネル１を駆動する駆動回路１４が搭載さ
れている。A flexible wiring board 8 is electrically connected to the organic EL panel 1. The flexible wiring board 8 is formed by forming a wiring pattern 10 on a flexible substrate 9 made of polyimide, and has one end connected to the organic EL panel 1 and the other end connected to a hard circuit board 11. Rigid circuit board 11
Is a wiring pattern 13 formed on a hard substrate 12 made of glass epoxy resin. A drive circuit 14 that drives the organic EL panel 1 is mounted on the hard circuit board 11.
【０００４】[0004]
【発明が解決しようとする課題】上述した有機ＥＬ表示
装置は、自発光表示素子である有機ＥＬパネル１を用い
るため、非自発光表示素子（例えば液晶表示素子）を用
いた表示装置と異なり、バックライト装置が不要であ
り、小型化が可能であった。しかしながら、可撓性配線
板８がＵ字状に屈曲されており、この可撓性配線板８が
有機ＥＬパネル１の側端面から幅Ｗ１だけ突出するた
め、有機ＥＬ表示装置の更なる小型化は困難であった。
本発明は、この問題に鑑みなされたものであり、更なる
小型化が可能な有機ＥＬ表示装置を提供するものであ
る。Since the organic EL display device described above uses the organic EL panel 1 which is a self-luminous display element, it differs from a display device which uses a non-self-luminous display element (for example, a liquid crystal display element). A backlight device was not required and it was possible to reduce the size. However, since the flexible wiring board 8 is bent in a U shape and the flexible wiring board 8 projects from the side end surface of the organic EL panel 1 by the width W1, the organic EL display device is further miniaturized. Was difficult.
The present invention has been made in view of this problem, and provides an organic EL display device that can be further miniaturized.
【０００５】[0005]
【課題を解決するための手段】本発明は、前記課題を解
決するため、少なくとも第一の電極２１と発光層２２ｃ
と第二の電極２３とを有する積層体１９を基板１８に形
成した有機ＥＬパネル１７と、前記第一の電極２１及び
前記第二の電極２３の少なくとも一方に導通する配線パ
ターン２７を有し前記有機ＥＬパネル１７に電気的に接
続された可撓性配線部材２５と、を有する有機ＥＬ表示
装置において、前記可撓性配線部材２５を前記有機ＥＬ
パネル１７の後面に沿うように配置したものである。According to the present invention, in order to solve the above problems, at least a first electrode 21 and a light emitting layer 22c are provided.
And an organic EL panel 17 in which a laminate 19 having a second electrode 23 is formed on a substrate 18, and a wiring pattern 27 electrically connected to at least one of the first electrode 21 and the second electrode 23. In the organic EL display device having a flexible wiring member 25 electrically connected to the organic EL panel 17, the flexible wiring member 25 is connected to the organic EL panel.
It is arranged along the rear surface of the panel 17.
【０００６】また、本発明は、前記有機ＥＬパネル１７
を駆動する駆動回路２８を前記可撓性配線部材２５に搭
載したものである。The present invention also relates to the organic EL panel 17 described above.
The flexible wiring member 25 is mounted with a drive circuit 28 for driving the.
【０００７】また、本発明は、前記有機ＥＬパネル１７
は、前記基板１８に接着され前記積層体１９を覆う封止
部材２０，３０，３１を有するものである。The present invention also relates to the organic EL panel 17 described above.
Has sealing members 20, 30, 31 which are adhered to the substrate 18 and cover the laminated body 19.
【０００８】また、本発明は、前記可撓性配線部材２５
が前記封止部材２０の角部２０ｂに接触することを防ぐ
保護部材２９を前記角部２０ｂに設けたものである。The present invention also provides the flexible wiring member 25.
The protective member 29 is provided at the corner portion 20b to prevent the sealing member 20 from coming into contact with the corner portion 20b.
【０００９】また、本発明は、前記封止部材３０は、前
記可撓性配線部材２５が前記封止部材３０で損傷するこ
とを防ぐ面取り部３０ａを有するものである。Further, according to the present invention, the sealing member 30 has a chamfered portion 30a for preventing the flexible wiring member 25 from being damaged by the sealing member 30.
【００１０】また、本発明は、前記封止部材３１は、前
記可撓性配線部材２５が前記封止部材３１で損傷するこ
とを防ぐ曲面部３１ａを有するものである。Further, according to the present invention, the sealing member 31 has a curved surface portion 31a for preventing the flexible wiring member 25 from being damaged by the sealing member 31.
【００１１】[0011]
【発明の実施の形態】以下、本発明の一実施形態を添付
の図面に基いて説明する。図１及び図２は第一実施形態
を示すものである。BEST MODE FOR CARRYING OUT THE INVENTION An embodiment of the present invention will be described below with reference to the accompanying drawings. 1 and 2 show the first embodiment.
【００１２】有機ＥＬパネル１７は、ガラス基板１８
（基板）に積層体１９を形成し、封止ガラス２０を接着
したものである。積層体１９は、透明電極２１（第一の
電極），有機層２２，背面電極２３（第二の電極）から
なるものであり、ガラス基板１８の後面に順次積層形成
されている。封止ガラス２０には凹部２０ａが形成され
ており、積層体１９を覆うように封止ガラス２０がガラ
ス基板１８に接着されている。The organic EL panel 17 includes a glass substrate 18
The laminate 19 is formed on the (substrate) and the sealing glass 20 is adhered thereto. The laminated body 19 includes a transparent electrode 21 (first electrode), an organic layer 22, and a back electrode 23 (second electrode), and is sequentially laminated on the rear surface of the glass substrate 18. A recess 20 a is formed in the sealing glass 20, and the sealing glass 20 is bonded to the glass substrate 18 so as to cover the laminated body 19.
【００１３】透明電極２１は、酸化スズ（SnO２）に酸
化インジウム（In２O３）をドープしたＩＴＯ（Indium
Tin Oxide）からなるものであり、スパッタリング，イ
オンプレーティング等の方法でガラス基板１２に形成さ
れる。有機層２２は、正孔注入層２２ａ，正孔輸送層２
２ｂ，発光層２２ｃ及び電子輸送層２２ｄからなるもの
である（図２参照）。The transparent electrode 21 is made of tin oxide (SnO 2 ) doped with indium oxide (In 2 O 3 ).
Tin Oxide), and is formed on the glass substrate 12 by a method such as sputtering or ion plating. The organic layer 22 includes a hole injection layer 22a and a hole transport layer 2
2b, a light emitting layer 22c and an electron transporting layer 22d (see FIG. 2).
【００１４】可撓性配線板２５（可撓性配線部材）は、
ポリイミドからなる可撓性基板２６に、銅箔からなる配
線パターン２７を形成したものである。可撓性配線板２
５は、有機ＥＬパネル１７の後面に沿うように配置さ
れ、一端が有機ＥＬパネル１７に接続されている。可撓
性配線板２５は有機ＥＬパネル１７に電気的接続されて
おり、配線パターン２７は有機ＥＬパネル１７の透明電
極２１に導通している。可撓性配線板２５には、有機Ｅ
Ｌパネル１７を駆動する駆動回路２８が搭載されてい
る。この駆動回路２８を可撓性配線板２５に搭載したも
のは、ＣＯＦ（ChipOn Flexible printed circuit）と
称される。The flexible wiring board 25 (flexible wiring member) is
A wiring pattern 27 made of copper foil is formed on a flexible substrate 26 made of polyimide. Flexible wiring board 2
5 is arranged along the rear surface of the organic EL panel 17, and one end thereof is connected to the organic EL panel 17. The flexible wiring board 25 is electrically connected to the organic EL panel 17, and the wiring pattern 27 is electrically connected to the transparent electrode 21 of the organic EL panel 17. The flexible wiring board 25 has an organic E
A drive circuit 28 that drives the L panel 17 is mounted. The drive circuit 28 mounted on the flexible wiring board 25 is called a COF (Chip On Flexible printed circuit).
【００１５】封止ガラス２０の角部２０ｂには、可撓性
配線板２５が角部２０ｂで損傷を受けないように、ポリ
プロピレン等の合成樹脂からなる保護部材２９が設けら
れている。保護部材２９は、断面Ｖ字状になっており、
封止ガラス２０の角部２０ｂに貼着されている。At the corner portion 20b of the sealing glass 20, a protective member 29 made of synthetic resin such as polypropylene is provided so that the flexible wiring board 25 is not damaged at the corner portion 20b. The protection member 29 has a V-shaped cross section,
It is attached to a corner portion 20b of the sealing glass 20.
【００１６】本実施形態は、可撓性配線板２５を有機Ｅ
Ｌパネル１７の後面に沿うように配置したことにより、
可撓性配線板２５が有機ＥＬパネル１７の側端面から突
出することがないため、有機ＥＬ表示装置の幅を小さく
することが可能となる。また、硬質回路板１１に比較す
ると可撓性配線板２５は薄いので、有機ＥＬ表示装置を
薄くすることができる。また、保護部材２９を設けたこ
とにより、封止ガラス２０の角部２０ａで可撓性配線板
２５が損傷を受ける虞を低減できる。なお、保護部材２
９は、例えば、スポンジ等の軟質材料からなるものであ
っても良い。In this embodiment, the flexible wiring board 25 is made of organic E
By arranging along the rear surface of the L panel 17,
Since the flexible wiring board 25 does not project from the side end surface of the organic EL panel 17, the width of the organic EL display device can be reduced. Moreover, since the flexible wiring board 25 is thinner than the hard circuit board 11, the organic EL display device can be made thinner. Further, since the protective member 29 is provided, it is possible to reduce the risk that the flexible wiring board 25 is damaged at the corner portion 20a of the sealing glass 20. The protective member 2
9 may be made of a soft material such as sponge.
【００１７】また、図３に示す第二実施形態ように、封
止ガラス３０に面取り部３０ａを形成しても良く、第一
実施形態と同様な効果を得ることができる。なお、面取
り部３０ａは当業者において「Ｃ面」と称される。ま
た、図４に示す第三実施形態ように、封止ガラス３１に
曲面部３１ａを形成しても良く、同様な効果を得ること
ができる。Further, as in the second embodiment shown in FIG. 3, the chamfered portion 30a may be formed on the sealing glass 30, and the same effect as in the first embodiment can be obtained. The chamfered portion 30a is referred to as "C surface" by those skilled in the art. Further, as in the third embodiment shown in FIG. 4, the curved surface portion 31a may be formed on the sealing glass 31, and the same effect can be obtained.
【００１８】なお、各実施形態は、可撓性配線板２５に
駆動回路２８を搭載したものであるが、例えば可撓性配
線板２５の他端に硬質回路板を接続し、この硬質回路板
に駆動回路を搭載しても良い。In each of the embodiments, the drive circuit 28 is mounted on the flexible wiring board 25. For example, a hard circuit board is connected to the other end of the flexible wiring board 25, A drive circuit may be mounted on.
【００１９】[0019]
【発明の効果】本発明は、少なくとも第一の電極と発光
層と第二の電極とを有する積層体を基板に形成した有機
ＥＬパネルと、前記第一の電極及び前記第二の電極の少
なくとも一方に導通する配線パターンを有し前記有機Ｅ
Ｌパネルに電気的に接続された可撓性配線部材と、を有
する有機ＥＬ表示装置において、前記可撓性配線部材を
前記表示パネルの後面に沿うように配置したものであ
り、有機ＥＬ表示装置を小型化することが可能である。The present invention provides an organic EL panel in which a laminate having at least a first electrode, a light emitting layer and a second electrode is formed on a substrate, and at least the first electrode and the second electrode. The organic E having a wiring pattern that conducts to one side
An organic EL display device having a flexible wiring member electrically connected to an L panel, wherein the flexible wiring member is arranged along a rear surface of the display panel. Can be miniaturized.
【図１】 本発明の第一実施形態を示す断面図。FIG. 1 is a sectional view showing a first embodiment of the present invention.
【図２】 同上実施形態を示す有機層の拡大断面図。FIG. 2 is an enlarged cross-sectional view of an organic layer showing the embodiment.
【図３】 本発明の第二実施形態を示す断面図。FIG. 3 is a sectional view showing a second embodiment of the present invention.
【図４】 本発明の第三実施形態を示す断面図。FIG. 4 is a sectional view showing a third embodiment of the present invention.
【図５】 従来例を示す断面図。FIG. 5 is a sectional view showing a conventional example.
１７ 有機ＥＬパネル １８ 基板 １９ 積層体 ２０ 封止ガラス（封止部材） ２０ｂ 角部 ２１ 透明電極（第一の電極） ２２ｃ 発光層 ２３ 背面電極（第二の電極） ２５ 可撓性配線板（可撓性配線部材） ２７ 配線パターン ２８ 駆動回路 ３０ 封止ガラス（封止部材） ３０ａ 面取り部 ３１ 封止ガラス（封止部材） ３１ａ 曲面部 17 Organic EL panel 18 substrates 19 laminate 20 Sealing glass (sealing member) 20b corner 21 Transparent electrode (first electrode) 22c light emitting layer 23 Back electrode (second electrode) 25 Flexible wiring board (flexible wiring member) 27 wiring pattern 28 Drive circuit 30 Sealing glass (sealing member) 30a Chamfer 31 Sealing glass (sealing member) 31a curved surface
Claims (6)
電極とを有する積層体を基板に形成した有機ＥＬパネル
と、前記第一の電極及び前記第二の電極の少なくとも一
方に導通する配線パターンを有し前記有機ＥＬパネルに
電気的に接続された可撓性配線部材と、を有する有機Ｅ
Ｌ表示装置において、 前記可撓性配線部材を前記有機ＥＬパネルの後面に沿う
ように配置したことを特徴とする有機ＥＬ表示装置。1. An organic EL panel in which a laminated body having at least a first electrode, a light emitting layer, and a second electrode is formed on a substrate and at least one of the first electrode and the second electrode is electrically connected. An organic E having a wiring pattern and a flexible wiring member electrically connected to the organic EL panel
The L display device, wherein the flexible wiring member is arranged along the rear surface of the organic EL panel.
いて、前記有機ＥＬパネルを駆動する駆動回路を前記可
撓性配線部材に搭載したことを特徴とする有機ＥＬ表示
装置。2. The organic EL display device according to claim 1, wherein a drive circuit for driving the organic EL panel is mounted on the flexible wiring member.
いて、前記有機ＥＬパネルは、前記基板に接着され前記
積層体を覆う封止部材を有することを特徴とする有機Ｅ
Ｌ表示装置。3. The organic EL display device according to claim 1, wherein the organic EL panel has a sealing member that is adhered to the substrate and covers the laminated body.
L display device.
いて、前記可撓性配線部材が前記封止部材の角部に接触
することを防ぐ保護部材を前記角部に設けたことを特徴
とする有機ＥＬ表示装置。4. The organic EL display device according to claim 3, wherein a protective member is provided at the corner to prevent the flexible wiring member from coming into contact with the corner of the sealing member. Organic EL display device.
いて、前記封止部材は、前記可撓性配線部材が前記封止
部材で損傷することを防ぐ面取り部を有することを特徴
とする有機ＥＬ表示装置。5. The organic EL display device according to claim 3, wherein the sealing member has a chamfered portion that prevents the flexible wiring member from being damaged by the sealing member. EL display device.
いて、前記封止部材は、前記可撓性配線部材が前記封止
部材で損傷することを防ぐ曲面部を有することを特徴と
する有機ＥＬ表示装置。6. The organic EL display device according to claim 3, wherein the sealing member has a curved surface portion that prevents the flexible wiring member from being damaged by the sealing member. EL display device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002082532A JP2003280539A (en) | 2002-03-25 | 2002-03-25 | Organic el display device |
Applications Claiming Priority (1)
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| JP2002082532A JP2003280539A (en) | 2002-03-25 | 2002-03-25 | Organic el display device |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012002272A1 (en) * | 2010-06-29 | 2012-01-05 | シャープ株式会社 | Flexible display device and method for manufacturing flexible display device |
| EP2983226A1 (en) * | 2014-08-06 | 2016-02-10 | LG Display Co., Ltd. | Organic light emitting display device and method for manufacturing the same |
| CN105590559A (en) * | 2016-03-07 | 2016-05-18 | 京东方科技集团股份有限公司 | Display device and manufacturing method thereof |
| WO2016117439A1 (en) * | 2015-01-20 | 2016-07-28 | コニカミノルタ株式会社 | Surface light-emission module |
| KR20170003873A (en) * | 2015-06-30 | 2017-01-10 | 엘지디스플레이 주식회사 | Structure and methode of manufacturing thereof |
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2002
- 2002-03-25 JP JP2002082532A patent/JP2003280539A/en active Pending
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| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2012002272A1 (en) * | 2010-06-29 | 2012-01-05 | シャープ株式会社 | Flexible display device and method for manufacturing flexible display device |
| CN106206644B (en) * | 2014-08-06 | 2019-11-05 | 乐金显示有限公司 | Organic light-emitting display device and its manufacturing method |
| EP2983226A1 (en) * | 2014-08-06 | 2016-02-10 | LG Display Co., Ltd. | Organic light emitting display device and method for manufacturing the same |
| KR20160017413A (en) * | 2014-08-06 | 2016-02-16 | 엘지디스플레이 주식회사 | Organic light emitting display device and method for manufacturing the same |
| KR102251827B1 (en) * | 2014-08-06 | 2021-05-12 | 엘지디스플레이 주식회사 | Organic light emitting display device and method for manufacturing the same |
| CN106206644A (en) * | 2014-08-06 | 2016-12-07 | 乐金显示有限公司 | Organic light-emitting display device and manufacture method thereof |
| US9812666B2 (en) | 2014-08-06 | 2017-11-07 | Lg Display Co., Ltd. | Organic light emitting display device and method for manufacturing the same |
| WO2016117439A1 (en) * | 2015-01-20 | 2016-07-28 | コニカミノルタ株式会社 | Surface light-emission module |
| KR20170003873A (en) * | 2015-06-30 | 2017-01-10 | 엘지디스플레이 주식회사 | Structure and methode of manufacturing thereof |
| KR102391453B1 (en) * | 2015-06-30 | 2022-04-27 | 엘지디스플레이 주식회사 | Structure and methode of manufacturing thereof |
| KR20220059447A (en) * | 2015-06-30 | 2022-05-10 | 엘지디스플레이 주식회사 | Structure and methode of manufacturing thereof |
| KR102586944B1 (en) * | 2015-06-30 | 2023-10-06 | 엘지디스플레이 주식회사 | Structure and methode of manufacturing thereof |
| CN105590559A (en) * | 2016-03-07 | 2016-05-18 | 京东方科技集团股份有限公司 | Display device and manufacturing method thereof |
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