KR102652144B1 - 분할 예정 라인의 검출 방법 - Google Patents

분할 예정 라인의 검출 방법 Download PDF

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Publication number
KR102652144B1
KR102652144B1 KR1020190011819A KR20190011819A KR102652144B1 KR 102652144 B1 KR102652144 B1 KR 102652144B1 KR 1020190011819 A KR1020190011819 A KR 1020190011819A KR 20190011819 A KR20190011819 A KR 20190011819A KR 102652144 B1 KR102652144 B1 KR 102652144B1
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KR
South Korea
Prior art keywords
ultrasonic
semiconductor device
line
detecting
detection
Prior art date
Application number
KR1020190011819A
Other languages
English (en)
Korean (ko)
Other versions
KR20190095134A (ko
Inventor
후미테루 다시노
히로유키 이타니
Original Assignee
가부시기가이샤 디스코
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 가부시기가이샤 디스코 filed Critical 가부시기가이샤 디스코
Publication of KR20190095134A publication Critical patent/KR20190095134A/ko
Application granted granted Critical
Publication of KR102652144B1 publication Critical patent/KR102652144B1/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S15/00—Systems using the reflection or reradiation of acoustic waves, e.g. sonar systems
    • G01S15/02—Systems using the reflection or reradiation of acoustic waves, e.g. sonar systems using reflection of acoustic waves
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H01L22/22—Connection or disconnection of sub-entities or redundant parts of a device in response to a measurement

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Remote Sensing (AREA)
  • Acoustics & Sound (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
  • Dicing (AREA)
  • Length Measuring Devices Characterised By Use Of Acoustic Means (AREA)
  • Interface Circuits In Exchanges (AREA)
  • Time-Division Multiplex Systems (AREA)
  • Communication Control (AREA)
KR1020190011819A 2018-02-05 2019-01-30 분할 예정 라인의 검출 방법 KR102652144B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2018-018494 2018-02-05
JP2018018494A JP7083654B2 (ja) 2018-02-05 2018-02-05 分割予定ラインの検出方法

Publications (2)

Publication Number Publication Date
KR20190095134A KR20190095134A (ko) 2019-08-14
KR102652144B1 true KR102652144B1 (ko) 2024-03-27

Family

ID=67520266

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020190011819A KR102652144B1 (ko) 2018-02-05 2019-01-30 분할 예정 라인의 검출 방법

Country Status (4)

Country Link
JP (1) JP7083654B2 (zh)
KR (1) KR102652144B1 (zh)
CN (1) CN110120356B (zh)
TW (1) TWI810241B (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7408442B2 (ja) * 2020-03-11 2024-01-05 株式会社ディスコ 検査方法
CN111442749B (zh) * 2020-04-13 2022-05-03 石家庄钢铁有限责任公司 一种水浸超声波在线测弯方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004297099A (ja) * 2004-07-21 2004-10-21 Oki Electric Ind Co Ltd 半導体装置の製造方法
JP2011053126A (ja) * 2009-09-03 2011-03-17 Disco Abrasive Syst Ltd 超音波検査方法及び超音波検査装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0797537B2 (ja) * 1993-06-28 1995-10-18 日本電気株式会社 積層セラミックコンデンサの製造方法
JP3065309B1 (ja) * 1999-03-11 2000-07-17 沖電気工業株式会社 半導体装置の製造方法
JP3494948B2 (ja) * 2000-03-22 2004-02-09 シャープ株式会社 固体撮像装置およびその製造方法
US20030137039A1 (en) * 2001-11-16 2003-07-24 Tdk Corporation Packaging substrate and manufacturing method thereof, integrated circuit device and manufacturing method thereof, and saw device
US6822315B2 (en) * 2002-02-14 2004-11-23 National Semiconductor Corporation Apparatus and method for scribing semiconductor wafers using vision recognition
JP2004022936A (ja) 2002-06-19 2004-01-22 Disco Abrasive Syst Ltd 半導体ウエーハの分割方法および分割装置
JP2007283392A (ja) * 2006-04-20 2007-11-01 Seiko Epson Corp レーザスクライブ方法、電気光学装置、電子機器
JP2010164403A (ja) 2009-01-15 2010-07-29 Panasonic Corp 超音波測定方法
JP6328513B2 (ja) * 2014-07-28 2018-05-23 株式会社ディスコ ウエーハの加工方法
JP6530660B2 (ja) 2015-07-16 2019-06-12 オリンパス株式会社 超音波観測装置、超音波観測装置の作動方法および超音波観測装置の作動プログラム
JP6608694B2 (ja) 2015-12-25 2019-11-20 株式会社ディスコ ウエーハの加工方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004297099A (ja) * 2004-07-21 2004-10-21 Oki Electric Ind Co Ltd 半導体装置の製造方法
JP2011053126A (ja) * 2009-09-03 2011-03-17 Disco Abrasive Syst Ltd 超音波検査方法及び超音波検査装置

Also Published As

Publication number Publication date
JP7083654B2 (ja) 2022-06-13
CN110120356A (zh) 2019-08-13
TWI810241B (zh) 2023-08-01
JP2019135754A (ja) 2019-08-15
CN110120356B (zh) 2024-03-15
TW201935537A (zh) 2019-09-01
KR20190095134A (ko) 2019-08-14

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