KR102647518B1 - 강도의 변화에 기초하여 물체를 선택가능하게 보유 및 해제하는 전사 요소 - Google Patents
강도의 변화에 기초하여 물체를 선택가능하게 보유 및 해제하는 전사 요소 Download PDFInfo
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- KR102647518B1 KR102647518B1 KR1020200143236A KR20200143236A KR102647518B1 KR 102647518 B1 KR102647518 B1 KR 102647518B1 KR 1020200143236 A KR1020200143236 A KR 1020200143236A KR 20200143236 A KR20200143236 A KR 20200143236A KR 102647518 B1 KR102647518 B1 KR 102647518B1
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Robotics (AREA)
- Micromachines (AREA)
- Die Bonding (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US16/681,215 US11302561B2 (en) | 2019-11-12 | 2019-11-12 | Transfer elements that selectably hold and release objects based on changes in stiffness |
| US16/681,215 | 2019-11-12 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20210057667A KR20210057667A (ko) | 2021-05-21 |
| KR102647518B1 true KR102647518B1 (ko) | 2024-03-15 |
Family
ID=73039945
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020200143236A Active KR102647518B1 (ko) | 2019-11-12 | 2020-10-30 | 강도의 변화에 기초하여 물체를 선택가능하게 보유 및 해제하는 전사 요소 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US11302561B2 (enExample) |
| EP (1) | EP3823011B1 (enExample) |
| JP (1) | JP7519267B2 (enExample) |
| KR (1) | KR102647518B1 (enExample) |
| CN (1) | CN112864046B (enExample) |
| TW (1) | TWI845786B (enExample) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114141716A (zh) * | 2021-11-24 | 2022-03-04 | Tcl华星光电技术有限公司 | 显示面板的制备方法、显示面板及电子设备 |
| US20240170442A1 (en) * | 2022-11-18 | 2024-05-23 | Asmpt Singapore Pte. Ltd. | Hybrid bonding of a thin semiconductor die |
| KR20240123681A (ko) | 2023-02-07 | 2024-08-14 | 포항공과대학교 산학협력단 | 형상기억폴리머를 포함하는 마이크로 스탬프를 이용한 마이크로 잉크를 전사하는 방법 |
| KR20240139185A (ko) * | 2023-03-13 | 2024-09-23 | 한국기계연구원 | 고속 전사공정용 전사필름 및 이를 이용한 전사방법 |
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| TW202119574A (zh) | 2021-05-16 |
| KR20210057667A (ko) | 2021-05-21 |
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| EP3823011B1 (en) | 2023-07-05 |
| US20210143045A1 (en) | 2021-05-13 |
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| EP3823011A1 (en) | 2021-05-19 |
| JP2021077877A (ja) | 2021-05-20 |
| CN112864046B (zh) | 2024-01-12 |
| CN112864046A (zh) | 2021-05-28 |
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