KR102644471B1 - Test apparatus for semiconductor package - Google Patents

Abstract

A semiconductor package testing device according to the present invention is coupled to a pusher, an upper package having a plurality of upper package terminals is mounted, an upper socket connected to a lower package placed on the lower side, and the lower package mounted on a tester and placed on the upper side. A semiconductor package test device for testing a semiconductor package of a package-on-package type (POP), including a lower socket connected to and a vacuum picker movably coupled to the pusher to adsorb and pressurize the lower package. wherein the upper socket includes a plurality of upper conductive parts containing a plurality of conductive particles in an elastic insulating material, and a non-elastic insulating pad made of a non-elastic insulating material that insulates and supports the plurality of upper conductive parts from each other. A guide part is formed on an edge of the inelastic insulating pad, which is attached to the pusher and guides the upper package to connect the plurality of upper package terminals to the plurality of upper conductive parts.

Description

Test device for semiconductor package {TEST APPARATUS FOR SEMICONDUCTOR PACKAGE}

The present invention relates to the testing of semiconductor packages, and more specifically, to a semiconductor package testing device for checking whether a semiconductor package of the package-on-package type (POP), in which a lower package and an upper package are stacked vertically, operates normally. will be.

Semiconductor packages are formed by high-density integration of fine electronic circuits, and during the manufacturing process, each electronic circuit goes through a test process to determine whether it is normal. The test process is a process that tests whether the semiconductor package operates normally and selects good and defective products.

To test a semiconductor package, a test device is used to electrically connect a terminal of the semiconductor package to a tester that applies a test signal. Test devices have various structures depending on the type of semiconductor package being tested.

Recently, as the use of semiconductor packages in the form of package-on-package (POP), which minimizes component size and enables fast signal transmission, has increased, demand for test devices to test such semiconductor packages continues to grow.

The package-on-package method consists of stacking packages with different functions on top of one package, so the length of the connection wiring can be minimized, thereby minimizing losses such as signal delay and impedance mismatch that occur during two-dimensional arrangement. By utilizing the spatial vertical direction, the mounting area per unit area can be maximized to implement high-capacity, ultra-small components.

Figure 1 schematically shows a conventional semiconductor package testing device. As shown in FIG. 1, a conventional test device 100 for testing a semiconductor package in the package-on-package form includes a pogo pin (pogo pin) for transmitting an electrical signal to the upper circuit board 120 on which the upper package 20 is mounted. An upper test socket (60, hereinafter simply referred to as 'upper socket') having an upper conductive part 61 made of a pogo pin, and a lower test socket (40, hereinafter simply referred to as 'lower socket') mounted on the tester 30. ) and a pusher 50 coupled to the lower package 10 located on the top and the upper socket.

In the conventional test device 100, the upper conductive portion 61 of the upper socket 60 presses the upper terminal of the lower package 10 by the operation of the pusher 50, thereby forming the upper package 20 and the upper circuit board. (120), the upper socket 60, the lower package 10, the lower socket 40, and the tester 30 are electrically connected to each other to test the semiconductor package.

However, in the conventional test device, the length of the signal transmission path is long due to the nature of the pogo pin, which requires a certain length, so the length of the signal transmission path between the upper package 20 and the lower package 10 is long, so high-speed signal transmission It is easy for signal distortion to occur. Therefore, there is a problem in which detailed inspection of semiconductor packages operating at high speeds is impossible.

In addition, the conventional test device requires alignment between the upper package 20 and the upper circuit board 120, and also requires alignment between the upper circuit board 120 and the upper socket 60, etc. Requires a lot of sorting. However, in the many alignments of each device, alignment errors may accumulate, and these accumulated alignment errors become even larger when testing fine-pitch semiconductor packages, making precise testing difficult.

In addition, in the conventional test device, a plurality of holes are formed in the upper socket 60 for installation of a pogo pin for electrically connecting the upper package 20 and the lower package 10, so that vacuum pressure is provided to the pusher. When the vacuum picker 70 picks up a semiconductor package, vacuum pressure may be lost through multiple holes, making it easy for pickup errors to occur.

Public Patent Publication No. 2016-0118796 (2016. 10. 12.)

The present invention was conceived in consideration of the above-described points, and its purpose is to provide a semiconductor package test device that can precisely test a semiconductor package in the form of a package-on-package that operates at high speed.

Another object of the present invention is to provide a test device for a semiconductor package that can easily align each device constituting the upper socket assembly.

Additionally, the purpose of the present invention is to provide a semiconductor package test device that can prevent pickup errors when picking up a semiconductor package.

A test device for a semiconductor package according to the present invention for solving the above-mentioned object is coupled to a pusher, an upper package having a plurality of upper package terminals is mounted, an upper socket connected to a lower package placed below, and a tester. A semiconductor package of the package-on-package type (POP), including a lower socket connected to the lower package placed on the upper side and a vacuum picker movably coupled to the pusher to adsorb and pressurize the lower package. In the test device of a semiconductor package for testing, the upper socket includes a plurality of upper conductive parts containing a plurality of conductive particles in an elastic insulating material, and an inelastic insulating material that insulates and supports the plurality of upper conductive parts from each other. It includes a non-elastic insulating pad made of, and a guide portion is formed on an edge of the inelastic insulating pad, which is attached to the pusher and guides the upper package to connect the plurality of upper package terminals to the plurality of upper conductive parts. There may be.

The guide portion may be formed in a fence shape parallel to the side of the upper package.

The guide portion may have a fence-shaped receiving portion parallel to the side of the upper package, and a tapered guide portion that becomes wider from the receiving portion toward the pusher.

The thickness of the receiving portion may be 0.1 times or more than the side thickness of the upper package.

The inelastic insulating pad and the guide portion may be formed integrally.

The inelastic insulation pad and the guide portion may be made of polyimide.

The semiconductor package testing device according to the present invention is coupled to a pusher, has an upper circuit board on which the upper package is mounted, an upper socket connected to a lower package placed on the lower side, and the lower package mounted on the tester and placed on the upper side. A semiconductor package test device for testing a semiconductor package of a package-on-package type (POP), including a lower socket connected to and a vacuum picker movably coupled to the pusher to adsorb and pressurize the lower package. wherein the upper socket includes a plurality of upper conductive parts containing a plurality of conductive particles in an elastic insulating material, and a non-elastic insulating pad made of a non-elastic insulating material that insulates and supports the plurality of upper conductive parts from each other. A guide part may be formed on an edge of the inelastic insulating pad, which is attached to the pusher and guides the upper circuit board on which the upper package is mounted so that the via hole of the upper circuit board is connected to the upper conductive part.

The guide portion may be formed in a fence shape parallel to the side of the upper circuit board.

The guide portion may have a fence-shaped receiving portion parallel to the side of the upper circuit board, and a tapered guide portion that becomes wider from the receiving portion toward the pusher.

The semiconductor package testing device according to the present invention allows the upper package or the upper circuit board on which the upper package is mounted to be naturally aligned through a guide portion provided in the upper socket, and the upper socket is aligned to the lower package along the inclined surface of the socket housing. By doing so, precise joining is possible by minimizing the cumulative alignment error resulting from joining between devices, and precise testing of fine pitch semiconductor packages is possible without error.

In addition, the test device for a semiconductor package according to the present invention consists of a test socket with a rubber socket, and the length of the signal transmission path can be shortened compared to a test device with a conventional pogo pin structure, thereby reducing signal distortion in high-speed signal transmission. This allows for precise testing of semiconductor packages that operate at high speeds.

In addition, the semiconductor package test device according to the present invention has an upper socket made of a rubber socket, so that vacuum pressure loss is minimized compared to a conventional pogo pin-type test device with a fine gap, and the semiconductor package can be picked up stably. .

In addition, the upper socket is connected to the pusher using adhesive, making it easy to separate and combine the upper package, and the adhesive absorbs some of the shock that occurs when the upper socket assembly contacts the lower package, thereby reducing the impact. .

Figure 1 schematically shows a conventional semiconductor package testing device.
Figure 2 schematically shows a test device for a semiconductor package according to an embodiment of the present invention.
Figure 3 is for explaining the operation of a semiconductor package testing device according to an embodiment of the present invention.
4 and 5 show various modifications of the semiconductor package testing device according to the present invention.
FIG. 6 is to sequentially show how the test device for the semiconductor package according to FIG. 5 is aligned.

Hereinafter, a test device for a semiconductor package according to the present invention will be described in detail with reference to the drawings.

Figure 2 schematically shows a semiconductor package testing device according to an embodiment of the present invention, and Figure 3 is for explaining the operation of the semiconductor package testing device according to an embodiment of the present invention.

As shown in the drawing, the semiconductor package test device 200 according to an embodiment of the present invention is coupled to the pusher 50, the upper circuit board 120 on which the upper package 20 is mounted, and the lower side. An upper socket 60 connected to the lower package 10 placed on the tester 30, a lower socket 40 connected to the lower package 10 placed on the upper side, and movable by the pusher 50. A semiconductor package test device for testing a package-on-package type (POP) semiconductor package, including a vacuum picker 70 capable of adsorbing and pressurizing the lower package 10 by being coupled to the upper socket 60. Silver, a plurality of upper conductive parts 61 containing a plurality of conductive particles in an elastic insulating material, and a non-elastic insulating pad 62 made of a non-elastic insulating material that insulates and supports the plurality of upper conductive parts 61 from each other. It is attached to the edge of the inelastic insulation pad 62 with a pusher 50, and guides the upper circuit board 120 on which the upper package 20 is mounted to the via hole 121 of the upper circuit board and the upper part. It includes a guide portion 621 that allows the conductive portion 61 to be connected.

Below, we will look in detail at the components that make up the semiconductor package test device 200 according to an embodiment of the present invention.

The lower socket 40 is mounted on the tester 30 and electrically connects the tester 30 and the lower package 10. The lower socket 40 is accommodated in the socket housing 140 and includes a lower conductive portion 41 and an insulating portion 42.

The lower conductive portion 41 is made of a plurality of conductive particles aligned in the thickness direction within an elastic insulating material. A plurality of lower conductive parts 41 are spaced apart from each other inside the insulating part 42 to correspond to the lower terminals 11 of the lower package 10 to be connected. One end of the lower conductive part 41 contacts an electrode (not shown) provided in the tester 30, and the other end of the lower conductive part 41 contacts the lower terminal 11 of the lower package 10.

The insulating portion 42 insulates between the lower conductive portions 41, forms the exterior of the lower socket 40, and serves to support the lower conductive portion 41 when it receives a contact load. The insulating portion 42 may be formed of the same elastic insulating material that constitutes the lower conductive portion 41. Of course, it may be formed of an inelastic insulating material or other insulating materials that can insulate and support the lower conductive portions 41.

The socket housing 140 has a receiving space for accommodating the lower socket 40 and an inclined surface 141 at the top. The inclined surface 141 of the socket housing 140 adsorbs the lower package 10 and guides the pusher 50 to descend toward the lower socket 40. That is, when the pusher 50 moves toward the lower socket 40 while being biased to one side, it comes into contact with the inclined surface 141, so the pusher 50 is guided along the inclined surface 141 and moves to the upper package located within the pusher 50. (20) can be aligned into position on the lower package (10).

The upper socket assembly (TSA) includes a pusher 50, an upper circuit board 120 on which the upper package 20 is mounted, an upper socket 60 coupled to the lower part of the upper circuit board 120, and an upper socket ( It is configured to include a vacuum picker 70 disposed at the lower part of 60).

The pusher 50 located in the upper socket assembly (TSA) receives a moving force from a driving unit (not shown) and can move toward or away from the lower socket 40. The pressing unit 51 presses the upper package 20 toward the upper socket 60 so that the upper package 20 is connected to the upper socket 60 through the upper circuit board 120.

A plurality of via holes 121 and substrate holes 123 are formed in the upper circuit board 120. The via hole 121 is plated with a conductive material to form a conductive path connecting the upper and lower parts of the upper circuit board 120. The upper end of the via hole 121 of the upper circuit board 120 is connected to the upper package 20, and the lower end of the via hole 121 is connected to the upper conductive portion 61 of the upper socket 60. When testing the lower package 10 by constructing the upper package 20 with golden devices pre-selected as good products, the upper package terminal 21 of the upper package 20 is soldered to the top of the via hole 121 to It may also be mounted on the circuit board 120.

The board hole 123 of the upper circuit board 120 is a passage through which vacuum pressure generated from an external vacuum pressure generator (not shown) is transmitted, and forms the space between the upper package 20 and the upper circuit board 120. Vacuum pressure is transmitted to the substrate hole 123 through the vacuum pressure.

The upper socket 60 is coupled to the lower end of the pusher 50 to seal the pusher 50. The upper socket 60 is electrically connected to the upper circuit board 120 on which the upper package 20 is mounted. The upper socket 60 includes an inelastic insulating pad 62, a plurality of upper conductive portions 61 disposed in the center of the inelastic insulating pad 62 and supported by the inelastic insulating pad 62, and an inelastic insulating pad. It includes a guide portion 621 disposed at the edge of (62).

The inelastic insulation pad 62 is advantageous for pressing the lower package 10 toward the lower socket 40 when the upper socket 60 is in contact with the lower package 10. When the inelastic insulation pad 62 stably presses the lower package 10, the lower terminal 11 of the lower package 10 can be stably connected to the lower conductive portion 41 of the lower socket 40. The inelastic insulating pad 62 can be made of various synthetic resins made of inelastic insulating materials such as polyimide (PI).

An insulating pad hole 63 is provided at the center of the inelastic insulating pad 62. The insulating pad hole 63 is connected to the substrate hole 123 of the upper circuit board 120.

A vacuum picker 70 is coupled to the insulating pad hole 63. The vacuum picker 70 receives vacuum pressure generated from an external vacuum pressure generator through the vacuum hole 52, substrate hole 123, and film hole 651 of the pusher 50 to secure the lower package 10. It can be absorbed.

The upper conductive portion 61 is disposed in the central portion of the inelastic insulating pad 62 and is formed to penetrate the inelastic insulating pad 62 in the thickness direction, and has a plurality of conductive particles aligned in the thickness direction within the elastic insulating material. It is made in the form The upper conductive portions 61 disposed adjacent to each other are insulated and supported by the inelastic insulating pad 62.

One end of the upper conductive portion 61 of the upper socket 60 is in contact with the via hole 121 of the upper circuit board 120, and the other end is connected to the upper terminal 12 of the lower package 10. If the upper conductive portion 61 is configured to include an upper bump 611 protruding from the upper surface of the inelastic insulating pad 62, the upper bump 611 of the upper conductive portion 61 is a via of the upper circuit board 120. Since the contact is pressed against the hole 121, the contact can be made more stably. Of course, a lower bump protruding from the lower surface of the inelastic insulating pad 62 may be formed on the upper conductive portion 61.

A support film 65 may be attached to the upper surface of the inelastic insulating pad 62 on which the upper conductive portion 61 is disposed. The support film 65 supports the upper bump 611 of the upper conductive portion 61 and separates the upper circuit board 120 and the upper socket 60. A film hole 651 connected to the insulating pad hole 63 of the inelastic insulating pad 62 is formed in the support film 65.

As described above, in the semiconductor package test device 200 according to an embodiment of the present invention, the lower socket 40 and the upper socket 60 have a plurality of conductive particles in the elastic insulating material instead of the pogo socket having a pogo pin. Since it is made of a rubber socket with conductive parts aligned in the thickness direction, it does not have multiple holes like a pogo pin, and has a conductive part of a significantly shorter length than a pogo pin, preventing pickup errors and enabling high-speed operation. It has the advantage of being able to precisely inspect semiconductor packages.

As shown in FIGS. 2 and 3, an upper circuit board 120 on which the upper package 20 is mounted is placed on the edge of the inelastic insulation pad 62, that is, outside the portion where the plurality of upper conductive portions 61 are disposed. A guide portion 621 is formed to guide the user.

The guide part 621 guides the upper circuit board 120 on which the upper package 20 is mounted so that the via hole 121 of the upper circuit board and the upper conductive part 61 are connected at the correct position, and the upper circuit The side 122 of the board 120 may be formed in a fence shape parallel to the side 122 of the upper circuit board so that it can move while being in close contact with it.

One end of the guide portion 621 is connected to the edge of the inelastic insulating pad 62, and the other end 622 is attached to the bottom of the pusher 50. The guide portion 621 may be formed integrally with the inelastic insulating pad 62, or may be formed as a separate component from the inelastic insulating pad 62, but is formed integrally in the process of manufacturing the inelastic insulating pad 62. This is more desirable in terms of robustness, etc. When the guide portion 621 is formed as a separate member from the inelastic insulating pad 62, one end of the guide portion 621 may be attached to the inelastic insulating pad 62 with adhesive, and the inelastic insulating pad 62 and the Materials of the same material may be used.

In the test device according to an embodiment of the present invention, as the guide portion 621 is formed in the upper socket 60, the upper circuit board 120 on which the upper package 20 is mounted moves downward along the guide portion 621. As it moves, it is naturally aligned with the upper socket 60. Therefore, alignment between each device is easily achieved, enabling precise testing.

In this way, with the upper circuit board 120 on which the upper package 20 is mounted and the upper socket 60 aligned through the guide portion 621, the other end 622 of the guide portion is placed on the lower part of the pusher 50. It is attached with an adhesive, and the attached portion is vacuum sealed to prevent vacuum pressure from being lost between the upper socket 60 having the guide portion 621 and the pusher 50.

Adhesives for adhering the guide part 621 and the inelastic insulation pad 62, which are formed as separate members, or for adhering the guide part 621 of the upper socket 60 to the pusher 50 include double-sided tape and liquid. A variety of adhesives, such as instant adhesives, can be used, and the adhesive strength of the adhesive is preferably such that it can sufficiently withstand even if vacuum pressure is transmitted to the vacuum picker.

As shown in FIG. 3, the semiconductor package test device 200 according to an embodiment of the present invention operates as follows. With the upper circuit board 120 on which the upper socket 60 is mounted and the upper package 20 mounted, the pusher 130 is moved by the drive unit to adsorb the lower package 10 and transport it onto the lower socket 40. Next, when the pressing part 51 of the pusher 50 presses the upper package 20, the upper package 20 and the upper socket 60 are electrically connected, and the upper socket 60 is connected to the lower package 10. By pressing, the lower socket 40 and the tester 30 are electrically connected. In this state, the test signal generated by the tester 30 is transmitted to the lower package 10 and the upper package 20, thereby performing an electrical test on the lower package 10 and the upper package 20. After the test is completed, the lower package 10 may be unloaded from the lower socket 40 according to the movement of the pusher 50.

As described above, the semiconductor package test device 200 according to an embodiment of the present invention allows the upper package or the upper circuit board on which the upper package is mounted to be naturally aligned through the guide portion provided in the upper socket, and the upper socket By aligning the socket housing to the lower package along the slope, precise coupling is possible by minimizing cumulative alignment errors resulting from coupling between devices, and even fine-pitch semiconductor packages can be precisely tested without error.

In addition, by configuring the test socket with a rubber socket, the length of the signal transmission path can be shortened compared to a conventional pogo pin structure test device, so signal distortion can be prevented during high-speed signal transmission, and semiconductors that operate at high speeds can be used. Precise testing of the package is possible.

In addition, by configuring the upper socket as a rubber socket, vacuum pressure loss is minimized compared to a conventional pogo pin-type test device with a fine gap, making it possible to stably pick up a semiconductor package.

In addition, the upper socket is connected to the pusher using adhesive, making it easy to separate and combine the upper package, and the adhesive absorbs some of the shock that occurs when the upper socket assembly contacts the lower package, thereby reducing the impact. .

FIGS. 4 and 5 show various modifications of the semiconductor package test device according to the present invention, and FIG. 6 shows the sequential alignment of the semiconductor package test device according to FIG. 5 .

The test device shown in FIGS. 4 and 5 illustrates only the upper socket assembly, and the test device 200 described with reference to FIGS. 1 and 2 and the test device shown in FIG. 4 include the upper package and the upper socket. The only difference is that it is directly connected without an upper circuit board, and the only difference in FIG. 5 is that the guide portion of the upper socket is modified from the test socket of FIG. 4, so the differences will be mainly explained.

The upper socket assembly of the test device shown in FIG. 4 has a structure in which the upper package 20 and the upper socket 60 are directly connected without the upper circuit board 120. In a structure in which the upper package 20 and the upper socket 60 are directly connected, the vacuum hole 52 of the pusher 50, the upper package terminal 21 of the upper package 20, and the upper conductive part of the upper socket 60 A vacuum path may be formed through the space on the side where 61 is joined and the film hole 651 of the inelastic insulating pad 62.

The guide portion 621 may be formed in a fence shape parallel to the side 22 of the upper package 20 so that the side 22 of the upper package 20 can move while being in close contact with the side 22 . As the guide portion 621 is formed in the upper socket 60, the upper package 20 moves downward along the guide portion 621 and is naturally aligned with the upper socket 60. Therefore, alignment between each device is easily achieved, enabling precise testing.

The upper socket assembly of the test device shown in FIG. 5 has a modified shape of the guide portion 621.

The guide portion 621 includes a fence-shaped receiving portion 6211 parallel to the side 22 of the upper package 20, and a tapered guide portion 6212 that becomes wider from the receiving portion 6211 toward the pusher 50. is provided. The receiving portion 6211 is formed in the shape of a fence parallel to the upper package side 22 so that the side of the upper package 20 can move while being in close contact, and the guide portion 6212 allows the upper package 20 to move as the receiving portion ( 6211) may be formed in a tapered shape that widens from the receiving portion 6211 toward the top.

To ensure alignment between the upper package 20 and the upper socket 60, the thickness (s) of the receiving portion (6211) has a thickness that accommodates at least 0.1 times the thickness (p) of the upper package side (22). It is preferable, and it is more preferable to have a thickness that accommodates 0.6 to 0.7 times the thickness (p) of the upper package side 22.

The modified shape of the guide portion 621 as shown in FIG. 5 can also be applied to the test device having the upper circuit board 120 shown in FIGS. 2 and 3. In this case, it is preferable that at least 0.1 times the thickness of the side 122 of the upper circuit board 120 on which the upper package 20 is mounted is accommodated in the receiving portion 6211 of the guide portion 621.

FIG. 6 shows each structure of the upper socket assembly of FIG. 5 being coupled to each other. As shown in (a) of FIG. 6, when the upper package 20 is inserted into the upper socket 60 in which the guide portion 621 is formed, the upper package 20 moves along the guide portion 6212 of the guide portion 621, As shown in (b) of FIG. 6, a portion of the upper package side 22 is seated in the receiving portion 6211, and the upper package 20 and the upper socket 60 are aligned. In this state, when the guide portion 621 of the upper socket 60 is attached to the pusher 50 as shown in (c) of FIG. 6, an upper socket assembly with the upper package 20 naturally aligned with the upper socket 60 is formed. It is composed. Therefore, alignment between each device is easily achieved, enabling precise testing.

The guide portion 621 may be configured in various shapes as long as it can align the upper package 20 or the upper circuit board 120 on which the upper package 20 is mounted to the upper socket 60 in the correct position.

Although the present invention has been shown and described in connection with preferred embodiments for illustrating the principles of the invention, the invention is not limited to the construction and operation as shown and described. Rather, those skilled in the art will be able to understand that numerous changes and modifications can be made to the present invention without departing from the spirit and scope of the appended claims.

10: lower package 11: lower terminal
12: upper terminal 20: upper package
21: upper package terminal 22: upper package side
30: tester 40: lower socket
41: lower conductive part 42: insulating part
50: Pusher 51: Pressure part
52: vacuum hole 60: upper socket
61: upper conductive part 62: inelastic insulation pad
63: Insulating pad hole 65: Support film
70: Vacuum picker
100, 200: Test device for semiconductor package
120: upper circuit board 121: via hole
122: Upper circuit board side 123: Board hole
140: socket housing 141: inclined plane
621: Guide part 622: Other end
651: film hole 6211: receiving portion
6212: Information Department

Claims (9)

An upper socket coupled to a pusher and connected to a lower package placed on the lower side on which an upper package having a plurality of upper package terminals is mounted, a lower socket connected to the lower package mounted on a tester and placed on the upper side, and moving to the pusher A semiconductor package test device for testing a package-on-package type (POP) semiconductor package, comprising a vacuum picker capable of being coupled to adsorb and pressurize the lower package, comprising:
The upper socket includes a plurality of upper conductive parts containing a plurality of conductive particles in an elastic insulating material, an inelastic insulating pad that insulates and supports the plurality of upper conductive parts from each other, and one end connected to an edge of the inelastic insulating pad. It includes a guide part, wherein the inelastic insulating pad and the guide part are made of polyimide, a non-elastic insulating material,
The other end of the guide part is attached to the pusher to guide the upper package so that the plurality of upper package terminals and the plurality of upper conductive parts are connected at the correct position,
A test device for a semiconductor package, wherein the guide portion is formed integrally in a process of manufacturing the inelastic insulating pad in a fence shape parallel to the side of the upper package. delete According to claim 1,
A test device for a semiconductor package, wherein the guide part has a fence-shaped receiving part parallel to the side of the upper package, and a tapered guide part that becomes wider from the receiving part toward the pusher. According to claim 3,
A test device for a semiconductor package, characterized in that the thickness of the receiving portion is 0.1 times or more than the side thickness of the upper package. delete delete It is coupled to a pusher, and an upper circuit board on which an upper package is mounted is mounted, an upper socket connected to a lower package placed on the lower side, a lower socket connected to the lower package placed on the upper side and mounted on a tester, and movable by the pusher. A semiconductor package test device for testing a package-on-package type (POP) semiconductor package, comprising a vacuum picker capable of being coupled to adsorb and pressurize the lower package, comprising:
The upper socket includes a plurality of upper conductive parts containing a plurality of conductive particles in an elastic insulating material, an inelastic insulating pad that insulates and supports the plurality of upper conductive parts from each other, and one end connected to an edge of the inelastic insulating pad. It includes a guide part, wherein the inelastic insulating pad and the guide part are made of polyimide, a non-elastic insulating material,
The other end of the guide part is attached to the pusher, and guides the upper circuit board on which the upper package is mounted so that the via hole of the upper circuit board and the upper conductive part are connected at the correct position,
A test device for a semiconductor package, wherein the guide portion is formed integrally in a process of manufacturing the inelastic insulating pad in a fence shape parallel to the side of the upper circuit board. delete According to claim 7,
A test device for a semiconductor package, wherein the guide part has a fence-shaped receiving part parallel to the side of the upper circuit board, and a tapered guide part that becomes wider from the receiving part toward the pusher.

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