KR102614851B1 - 이미지 센서 - Google Patents

이미지 센서 Download PDF

Info

Publication number
KR102614851B1
KR102614851B1 KR1020180085245A KR20180085245A KR102614851B1 KR 102614851 B1 KR102614851 B1 KR 102614851B1 KR 1020180085245 A KR1020180085245 A KR 1020180085245A KR 20180085245 A KR20180085245 A KR 20180085245A KR 102614851 B1 KR102614851 B1 KR 102614851B1
Authority
KR
South Korea
Prior art keywords
pixel
pixels
image sensor
photo diode
photodiodes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020180085245A
Other languages
English (en)
Korean (ko)
Other versions
KR20200010769A (ko
Inventor
이경호
Original Assignee
삼성전자주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼성전자주식회사 filed Critical 삼성전자주식회사
Priority to KR1020180085245A priority Critical patent/KR102614851B1/ko
Priority to US16/291,345 priority patent/US11094735B2/en
Priority to JP2019090581A priority patent/JP7403972B2/ja
Priority to CN201910526394.7A priority patent/CN110753193B/zh
Publication of KR20200010769A publication Critical patent/KR20200010769A/ko
Priority to US17/370,724 priority patent/US11791365B2/en
Priority to US18/466,475 priority patent/US20230420481A1/en
Application granted granted Critical
Publication of KR102614851B1 publication Critical patent/KR102614851B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70SSIS architectures; Circuits associated therewith
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80Constructional details of image sensors
    • H10F39/813Electronic components shared by multiple pixels, e.g. one amplifier shared by two pixels
    • H01L27/14603
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80Constructional details of image sensors
    • H10F39/802Geometry or disposition of elements in pixels, e.g. address-lines or gate electrodes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10Integrated devices
    • H10F39/12Image sensors
    • H10F39/18Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors
    • H10F39/182Colour image sensors
    • H01L27/14612
    • H01L27/14643
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/50Control of the SSIS exposure
    • H04N25/57Control of the dynamic range
    • H04N25/59Control of the dynamic range by controlling the amount of charge storable in the pixel, e.g. modification of the charge conversion ratio of the floating node capacitance
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70SSIS architectures; Circuits associated therewith
    • H04N25/76Addressed sensors, e.g. MOS or CMOS sensors
    • H04N25/78Readout circuits for addressed sensors, e.g. output amplifiers or A/D converters
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70SSIS architectures; Circuits associated therewith
    • H04N25/79Arrangements of circuitry being divided between different or multiple substrates, chips or circuit boards, e.g. stacked image sensors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10Integrated devices
    • H10F39/12Image sensors
    • H10F39/18Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80Constructional details of image sensors
    • H10F39/802Geometry or disposition of elements in pixels, e.g. address-lines or gate electrodes
    • H10F39/8027Geometry of the photosensitive area
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80Constructional details of image sensors
    • H10F39/803Pixels having integrated switching, control, storage or amplification elements
    • H10F39/8037Pixels having integrated switching, control, storage or amplification elements the integrated elements comprising a transistor
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80Constructional details of image sensors
    • H10F39/807Pixel isolation structures
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80Constructional details of image sensors
    • H10F39/811Interconnections
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10Integrated devices
    • H10F39/12Image sensors
    • H10F39/199Back-illuminated image sensors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80Constructional details of image sensors
    • H10F39/803Pixels having integrated switching, control, storage or amplification elements
    • H10F39/8033Photosensitive area
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80Constructional details of image sensors
    • H10F39/805Coatings
    • H10F39/8053Colour filters
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80Constructional details of image sensors
    • H10F39/806Optical elements or arrangements associated with the image sensors
    • H10F39/8063Microlenses

Landscapes

  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Solid State Image Pick-Up Elements (AREA)
KR1020180085245A 2018-07-23 2018-07-23 이미지 센서 Active KR102614851B1 (ko)

Priority Applications (6)

Application Number Priority Date Filing Date Title
KR1020180085245A KR102614851B1 (ko) 2018-07-23 2018-07-23 이미지 센서
US16/291,345 US11094735B2 (en) 2018-07-23 2019-03-04 Image sensor
JP2019090581A JP7403972B2 (ja) 2018-07-23 2019-05-13 イメージセンサ
CN201910526394.7A CN110753193B (zh) 2018-07-23 2019-06-18 图像传感器
US17/370,724 US11791365B2 (en) 2018-07-23 2021-07-08 Image sensor
US18/466,475 US20230420481A1 (en) 2018-07-23 2023-09-13 Image sensor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020180085245A KR102614851B1 (ko) 2018-07-23 2018-07-23 이미지 센서

Publications (2)

Publication Number Publication Date
KR20200010769A KR20200010769A (ko) 2020-01-31
KR102614851B1 true KR102614851B1 (ko) 2023-12-19

Family

ID=69161340

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020180085245A Active KR102614851B1 (ko) 2018-07-23 2018-07-23 이미지 센서

Country Status (4)

Country Link
US (3) US11094735B2 (enExample)
JP (1) JP7403972B2 (enExample)
KR (1) KR102614851B1 (enExample)
CN (1) CN110753193B (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019140528A (ja) 2018-02-09 2019-08-22 ソニーセミコンダクタソリューションズ株式会社 撮像装置、及び電子機器
KR102614851B1 (ko) 2018-07-23 2023-12-19 삼성전자주식회사 이미지 센서
KR102885349B1 (ko) * 2019-11-05 2025-11-14 삼성전자주식회사 이미지 센서
EP4062631B1 (en) * 2019-11-20 2024-08-21 Gigajot Technology, Inc. Scalable-pixel-size image sensor
KR102831295B1 (ko) * 2020-07-10 2025-07-07 삼성전자주식회사 이미지 센서
KR20220019895A (ko) * 2020-08-10 2022-02-18 삼성전자주식회사 이미지 센서
WO2022173236A1 (ko) 2021-02-10 2022-08-18 삼성전자 주식회사 이미지 센서를 포함하는 전자 장치 및 그 동작 방법
KR102828215B1 (ko) * 2021-03-22 2025-07-04 삼성전자주식회사 이미지 센서
JP2022176568A (ja) * 2021-05-17 2022-11-30 株式会社ニコン 撮像素子、及び、撮像装置
US12101554B2 (en) * 2021-11-26 2024-09-24 Samsung Electronics Co., Ltd. Method and apparatus for performing autofocusing using summed signals
US11979675B2 (en) * 2022-04-25 2024-05-07 Sony Semiconductor Solutions Corporation Image sensing device with event based vision sensor pixels and imaging pixels

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8059174B2 (en) 2006-05-31 2011-11-15 Ess Technology, Inc. CMOS imager system with interleaved readout for providing an image with increased dynamic range
JP5300414B2 (ja) 2008-10-30 2013-09-25 キヤノン株式会社 カメラ及びカメラシステム
JP5744545B2 (ja) * 2011-01-31 2015-07-08 キヤノン株式会社 固体撮像装置およびカメラ
JP6039165B2 (ja) * 2011-08-11 2016-12-07 キヤノン株式会社 撮像素子及び撮像装置
JP2013084785A (ja) * 2011-10-11 2013-05-09 Sony Corp 固体撮像装置、撮像装置
JP2015012127A (ja) * 2013-06-28 2015-01-19 ソニー株式会社 固体撮像素子および電子機器
JP2015216625A (ja) * 2014-04-22 2015-12-03 キヤノン株式会社 撮像素子及び撮像装置
KR102268712B1 (ko) * 2014-06-23 2021-06-28 삼성전자주식회사 자동 초점 이미지 센서 및 이를 포함하는 디지털 영상 처리 장치
KR102286109B1 (ko) * 2014-08-05 2021-08-04 삼성전자주식회사 이미지 픽셀, 이를 포함하는 이미지 센서, 및 이를 포함하는 이미지 처리 시스템
JP2016058559A (ja) * 2014-09-10 2016-04-21 ソニー株式会社 固体撮像装置およびその駆動方法、並びに電子機器
US10070088B2 (en) * 2015-01-05 2018-09-04 Canon Kabushiki Kaisha Image sensor and image capturing apparatus for simultaneously performing focus detection and image generation
US9749556B2 (en) * 2015-03-24 2017-08-29 Semiconductor Components Industries, Llc Imaging systems having image sensor pixel arrays with phase detection capabilities
GB2537421A (en) 2015-04-17 2016-10-19 Stmicroelectronics (Research & Development) Ltd A pixel having a plurality of photodiodes
JP6470404B2 (ja) 2015-05-22 2019-02-13 オリンパス株式会社 撮像装置
KR102374112B1 (ko) * 2015-07-15 2022-03-14 삼성전자주식회사 오토 포커싱 픽셀을 포함하는 이미지 센서, 및 이를 포함하는 이미지 처리 시스템
KR20170019542A (ko) * 2015-08-11 2017-02-22 삼성전자주식회사 자동 초점 이미지 센서
KR102437162B1 (ko) 2015-10-12 2022-08-29 삼성전자주식회사 이미지 센서
KR20170056909A (ko) * 2015-11-16 2017-05-24 삼성전자주식회사 이미지 센서 및 이를 포함하는 전자 장치
JP6736329B2 (ja) 2016-03-31 2020-08-05 キヤノン株式会社 撮像素子
JP2017194558A (ja) 2016-04-20 2017-10-26 オリンパス株式会社 撮像装置および撮像方法
KR102591008B1 (ko) 2016-05-23 2023-10-19 에스케이하이닉스 주식회사 이미지 센서
US9936123B2 (en) 2016-08-04 2018-04-03 Omnivision Technologies, Inc. Camera and method with widescreen image on nearly-square aspect ratio photosensor array
US10038863B2 (en) * 2016-08-17 2018-07-31 Renesas Electronics Corporation Image sensing device
JP6778595B2 (ja) * 2016-08-17 2020-11-04 ルネサスエレクトロニクス株式会社 撮像素子
US11082649B2 (en) * 2017-06-02 2021-08-03 Sony Semiconductor Solutions Corporation Solid-state imaging device with pixels having an in-pixel capacitance
KR102614851B1 (ko) 2018-07-23 2023-12-19 삼성전자주식회사 이미지 센서

Also Published As

Publication number Publication date
US20210335879A1 (en) 2021-10-28
JP2020017941A (ja) 2020-01-30
US11094735B2 (en) 2021-08-17
JP7403972B2 (ja) 2023-12-25
KR20200010769A (ko) 2020-01-31
CN110753193A (zh) 2020-02-04
CN110753193B (zh) 2024-04-12
US20230420481A1 (en) 2023-12-28
US20200027914A1 (en) 2020-01-23
US11791365B2 (en) 2023-10-17

Similar Documents

Publication Publication Date Title
KR102614851B1 (ko) 이미지 센서
US11189651B2 (en) Image sensor
US11637979B2 (en) Image sensor using a boosting capacitor and a negative bias voltage
US10950640B2 (en) Image sensor
US12199115B2 (en) Image sensor
KR102890086B1 (ko) 이미지 센서
US11658193B2 (en) Image sensor
US12087791B2 (en) Image sensor
US11082644B2 (en) Image sensor
KR102656526B1 (ko) 이미지 센서
KR102497658B1 (ko) 이미지 센서

Legal Events

Date Code Title Description
PA0109 Patent application

Patent event code: PA01091R01D

Comment text: Patent Application

Patent event date: 20180723

PG1501 Laying open of application
A201 Request for examination
PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 20210721

Comment text: Request for Examination of Application

Patent event code: PA02011R01I

Patent event date: 20180723

Comment text: Patent Application

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 20230412

Patent event code: PE09021S01D

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

Patent event code: PE07011S01D

Comment text: Decision to Grant Registration

Patent event date: 20230914

GRNT Written decision to grant
PR0701 Registration of establishment

Comment text: Registration of Establishment

Patent event date: 20231213

Patent event code: PR07011E01D

PR1002 Payment of registration fee

Payment date: 20231214

End annual number: 3

Start annual number: 1

PG1601 Publication of registration