KR102614851B1 - 이미지 센서 - Google Patents
이미지 센서 Download PDFInfo
- Publication number
- KR102614851B1 KR102614851B1 KR1020180085245A KR20180085245A KR102614851B1 KR 102614851 B1 KR102614851 B1 KR 102614851B1 KR 1020180085245 A KR1020180085245 A KR 1020180085245A KR 20180085245 A KR20180085245 A KR 20180085245A KR 102614851 B1 KR102614851 B1 KR 102614851B1
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- South Korea
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- image sensor
- photo diode
- photodiodes
- Prior art date
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Images
Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/813—Electronic components shared by multiple pixels, e.g. one amplifier shared by two pixels
-
- H01L27/14603—
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/802—Geometry or disposition of elements in pixels, e.g. address-lines or gate electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/10—Integrated devices
- H10F39/12—Image sensors
- H10F39/18—Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors
- H10F39/182—Colour image sensors
-
- H01L27/14612—
-
- H01L27/14643—
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/50—Control of the SSIS exposure
- H04N25/57—Control of the dynamic range
- H04N25/59—Control of the dynamic range by controlling the amount of charge storable in the pixel, e.g. modification of the charge conversion ratio of the floating node capacitance
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
- H04N25/78—Readout circuits for addressed sensors, e.g. output amplifiers or A/D converters
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/79—Arrangements of circuitry being divided between different or multiple substrates, chips or circuit boards, e.g. stacked image sensors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/10—Integrated devices
- H10F39/12—Image sensors
- H10F39/18—Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/802—Geometry or disposition of elements in pixels, e.g. address-lines or gate electrodes
- H10F39/8027—Geometry of the photosensitive area
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/803—Pixels having integrated switching, control, storage or amplification elements
- H10F39/8037—Pixels having integrated switching, control, storage or amplification elements the integrated elements comprising a transistor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/807—Pixel isolation structures
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/811—Interconnections
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/10—Integrated devices
- H10F39/12—Image sensors
- H10F39/199—Back-illuminated image sensors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/803—Pixels having integrated switching, control, storage or amplification elements
- H10F39/8033—Photosensitive area
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/805—Coatings
- H10F39/8053—Colour filters
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/806—Optical elements or arrangements associated with the image sensors
- H10F39/8063—Microlenses
Landscapes
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Solid State Image Pick-Up Elements (AREA)
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020180085245A KR102614851B1 (ko) | 2018-07-23 | 2018-07-23 | 이미지 센서 |
| US16/291,345 US11094735B2 (en) | 2018-07-23 | 2019-03-04 | Image sensor |
| JP2019090581A JP7403972B2 (ja) | 2018-07-23 | 2019-05-13 | イメージセンサ |
| CN201910526394.7A CN110753193B (zh) | 2018-07-23 | 2019-06-18 | 图像传感器 |
| US17/370,724 US11791365B2 (en) | 2018-07-23 | 2021-07-08 | Image sensor |
| US18/466,475 US20230420481A1 (en) | 2018-07-23 | 2023-09-13 | Image sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020180085245A KR102614851B1 (ko) | 2018-07-23 | 2018-07-23 | 이미지 센서 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20200010769A KR20200010769A (ko) | 2020-01-31 |
| KR102614851B1 true KR102614851B1 (ko) | 2023-12-19 |
Family
ID=69161340
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020180085245A Active KR102614851B1 (ko) | 2018-07-23 | 2018-07-23 | 이미지 센서 |
Country Status (4)
| Country | Link |
|---|---|
| US (3) | US11094735B2 (enExample) |
| JP (1) | JP7403972B2 (enExample) |
| KR (1) | KR102614851B1 (enExample) |
| CN (1) | CN110753193B (enExample) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2019140528A (ja) | 2018-02-09 | 2019-08-22 | ソニーセミコンダクタソリューションズ株式会社 | 撮像装置、及び電子機器 |
| KR102614851B1 (ko) | 2018-07-23 | 2023-12-19 | 삼성전자주식회사 | 이미지 센서 |
| KR102885349B1 (ko) * | 2019-11-05 | 2025-11-14 | 삼성전자주식회사 | 이미지 센서 |
| EP4062631B1 (en) * | 2019-11-20 | 2024-08-21 | Gigajot Technology, Inc. | Scalable-pixel-size image sensor |
| KR102831295B1 (ko) * | 2020-07-10 | 2025-07-07 | 삼성전자주식회사 | 이미지 센서 |
| KR20220019895A (ko) * | 2020-08-10 | 2022-02-18 | 삼성전자주식회사 | 이미지 센서 |
| WO2022173236A1 (ko) | 2021-02-10 | 2022-08-18 | 삼성전자 주식회사 | 이미지 센서를 포함하는 전자 장치 및 그 동작 방법 |
| KR102828215B1 (ko) * | 2021-03-22 | 2025-07-04 | 삼성전자주식회사 | 이미지 센서 |
| JP2022176568A (ja) * | 2021-05-17 | 2022-11-30 | 株式会社ニコン | 撮像素子、及び、撮像装置 |
| US12101554B2 (en) * | 2021-11-26 | 2024-09-24 | Samsung Electronics Co., Ltd. | Method and apparatus for performing autofocusing using summed signals |
| US11979675B2 (en) * | 2022-04-25 | 2024-05-07 | Sony Semiconductor Solutions Corporation | Image sensing device with event based vision sensor pixels and imaging pixels |
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| US8059174B2 (en) | 2006-05-31 | 2011-11-15 | Ess Technology, Inc. | CMOS imager system with interleaved readout for providing an image with increased dynamic range |
| JP5300414B2 (ja) | 2008-10-30 | 2013-09-25 | キヤノン株式会社 | カメラ及びカメラシステム |
| JP5744545B2 (ja) * | 2011-01-31 | 2015-07-08 | キヤノン株式会社 | 固体撮像装置およびカメラ |
| JP6039165B2 (ja) * | 2011-08-11 | 2016-12-07 | キヤノン株式会社 | 撮像素子及び撮像装置 |
| JP2013084785A (ja) * | 2011-10-11 | 2013-05-09 | Sony Corp | 固体撮像装置、撮像装置 |
| JP2015012127A (ja) * | 2013-06-28 | 2015-01-19 | ソニー株式会社 | 固体撮像素子および電子機器 |
| JP2015216625A (ja) * | 2014-04-22 | 2015-12-03 | キヤノン株式会社 | 撮像素子及び撮像装置 |
| KR102268712B1 (ko) * | 2014-06-23 | 2021-06-28 | 삼성전자주식회사 | 자동 초점 이미지 센서 및 이를 포함하는 디지털 영상 처리 장치 |
| KR102286109B1 (ko) * | 2014-08-05 | 2021-08-04 | 삼성전자주식회사 | 이미지 픽셀, 이를 포함하는 이미지 센서, 및 이를 포함하는 이미지 처리 시스템 |
| JP2016058559A (ja) * | 2014-09-10 | 2016-04-21 | ソニー株式会社 | 固体撮像装置およびその駆動方法、並びに電子機器 |
| US10070088B2 (en) * | 2015-01-05 | 2018-09-04 | Canon Kabushiki Kaisha | Image sensor and image capturing apparatus for simultaneously performing focus detection and image generation |
| US9749556B2 (en) * | 2015-03-24 | 2017-08-29 | Semiconductor Components Industries, Llc | Imaging systems having image sensor pixel arrays with phase detection capabilities |
| GB2537421A (en) | 2015-04-17 | 2016-10-19 | Stmicroelectronics (Research & Development) Ltd | A pixel having a plurality of photodiodes |
| JP6470404B2 (ja) | 2015-05-22 | 2019-02-13 | オリンパス株式会社 | 撮像装置 |
| KR102374112B1 (ko) * | 2015-07-15 | 2022-03-14 | 삼성전자주식회사 | 오토 포커싱 픽셀을 포함하는 이미지 센서, 및 이를 포함하는 이미지 처리 시스템 |
| KR20170019542A (ko) * | 2015-08-11 | 2017-02-22 | 삼성전자주식회사 | 자동 초점 이미지 센서 |
| KR102437162B1 (ko) | 2015-10-12 | 2022-08-29 | 삼성전자주식회사 | 이미지 센서 |
| KR20170056909A (ko) * | 2015-11-16 | 2017-05-24 | 삼성전자주식회사 | 이미지 센서 및 이를 포함하는 전자 장치 |
| JP6736329B2 (ja) | 2016-03-31 | 2020-08-05 | キヤノン株式会社 | 撮像素子 |
| JP2017194558A (ja) | 2016-04-20 | 2017-10-26 | オリンパス株式会社 | 撮像装置および撮像方法 |
| KR102591008B1 (ko) | 2016-05-23 | 2023-10-19 | 에스케이하이닉스 주식회사 | 이미지 센서 |
| US9936123B2 (en) | 2016-08-04 | 2018-04-03 | Omnivision Technologies, Inc. | Camera and method with widescreen image on nearly-square aspect ratio photosensor array |
| US10038863B2 (en) * | 2016-08-17 | 2018-07-31 | Renesas Electronics Corporation | Image sensing device |
| JP6778595B2 (ja) * | 2016-08-17 | 2020-11-04 | ルネサスエレクトロニクス株式会社 | 撮像素子 |
| US11082649B2 (en) * | 2017-06-02 | 2021-08-03 | Sony Semiconductor Solutions Corporation | Solid-state imaging device with pixels having an in-pixel capacitance |
| KR102614851B1 (ko) | 2018-07-23 | 2023-12-19 | 삼성전자주식회사 | 이미지 센서 |
-
2018
- 2018-07-23 KR KR1020180085245A patent/KR102614851B1/ko active Active
-
2019
- 2019-03-04 US US16/291,345 patent/US11094735B2/en active Active
- 2019-05-13 JP JP2019090581A patent/JP7403972B2/ja active Active
- 2019-06-18 CN CN201910526394.7A patent/CN110753193B/zh active Active
-
2021
- 2021-07-08 US US17/370,724 patent/US11791365B2/en active Active
-
2023
- 2023-09-13 US US18/466,475 patent/US20230420481A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| US20210335879A1 (en) | 2021-10-28 |
| JP2020017941A (ja) | 2020-01-30 |
| US11094735B2 (en) | 2021-08-17 |
| JP7403972B2 (ja) | 2023-12-25 |
| KR20200010769A (ko) | 2020-01-31 |
| CN110753193A (zh) | 2020-02-04 |
| CN110753193B (zh) | 2024-04-12 |
| US20230420481A1 (en) | 2023-12-28 |
| US20200027914A1 (en) | 2020-01-23 |
| US11791365B2 (en) | 2023-10-17 |
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