KR102586903B1 - 제어기 및 광 방출기를 갖는 픽셀 모듈 - Google Patents

제어기 및 광 방출기를 갖는 픽셀 모듈 Download PDF

Info

Publication number
KR102586903B1
KR102586903B1 KR1020217043152A KR20217043152A KR102586903B1 KR 102586903 B1 KR102586903 B1 KR 102586903B1 KR 1020217043152 A KR1020217043152 A KR 1020217043152A KR 20217043152 A KR20217043152 A KR 20217043152A KR 102586903 B1 KR102586903 B1 KR 102586903B1
Authority
KR
South Korea
Prior art keywords
module
delete delete
controller
substrate
light emitter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020217043152A
Other languages
English (en)
Korean (ko)
Other versions
KR20220017947A (ko
Inventor
크리스토퍼 앤드류 바우어
매튜 알렉산더 메이틀
로널드 에스. 콕
살바토레 보나페데
브룩 레이몬드
앤드류 타일러 피어슨
에릭 폴 빅
Original Assignee
엑스 디스플레이 컴퍼니 테크놀로지 리미티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엑스 디스플레이 컴퍼니 테크놀로지 리미티드 filed Critical 엑스 디스플레이 컴퍼니 테크놀로지 리미티드
Priority to KR1020237033857A priority Critical patent/KR102840512B1/ko
Publication of KR20220017947A publication Critical patent/KR20220017947A/ko
Application granted granted Critical
Publication of KR102586903B1 publication Critical patent/KR102586903B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H01L25/0753—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/20—Assemblies of multiple devices comprising at least one light-emitting semiconductor device covered by group H10H20/00
    • H10H29/24—Assemblies of multiple devices comprising at least one light-emitting semiconductor device covered by group H10H20/00 comprising multiple light-emitting semiconductor devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/83—Electrodes
    • H10H20/831—Electrodes characterised by their shape
    • H10H20/8316—Multi-layer electrodes comprising at least one discontinuous layer
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
    • G09G3/22—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
    • G09G3/30—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels
    • G09G3/32—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
    • G09G3/22—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
    • G09G3/30—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels
    • G09G3/32—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
    • G09G3/3208—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED]
    • H01L25/167—
    • H01L33/36—
    • H01L33/62—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/84—Coatings, e.g. passivation layers or antireflective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
    • H10H29/14—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components
    • H10H29/142—Two-dimensional arrangements, e.g. asymmetric LED layout
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/30—Active-matrix LED displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/80—Constructional details
    • H10H29/85—Packages
    • H10H29/857—Interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H01L2224/24—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Led Device Packages (AREA)
  • Electroluminescent Light Sources (AREA)
  • Optical Communication System (AREA)
KR1020217043152A 2019-06-14 2020-06-12 제어기 및 광 방출기를 갖는 픽셀 모듈 Active KR102586903B1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020237033857A KR102840512B1 (ko) 2019-06-14 2020-06-12 제어기 및 광 방출기를 갖는 픽셀 모듈

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US16/442,142 US10944027B2 (en) 2019-06-14 2019-06-14 Pixel modules with controllers and light emitters
US16/442,142 2019-06-14
PCT/EP2020/066401 WO2020249800A1 (en) 2019-06-14 2020-06-12 Pixel modules with controllers and light emitters

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020237033857A Division KR102840512B1 (ko) 2019-06-14 2020-06-12 제어기 및 광 방출기를 갖는 픽셀 모듈

Publications (2)

Publication Number Publication Date
KR20220017947A KR20220017947A (ko) 2022-02-14
KR102586903B1 true KR102586903B1 (ko) 2023-10-06

Family

ID=71130951

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020217043152A Active KR102586903B1 (ko) 2019-06-14 2020-06-12 제어기 및 광 방출기를 갖는 픽셀 모듈
KR1020237033857A Active KR102840512B1 (ko) 2019-06-14 2020-06-12 제어기 및 광 방출기를 갖는 픽셀 모듈

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020237033857A Active KR102840512B1 (ko) 2019-06-14 2020-06-12 제어기 및 광 방출기를 갖는 픽셀 모듈

Country Status (7)

Country Link
US (2) US10944027B2 (https=)
EP (1) EP3984065A1 (https=)
JP (3) JP7432625B2 (https=)
KR (2) KR102586903B1 (https=)
CN (1) CN114450789A (https=)
TW (1) TWI823010B (https=)
WO (1) WO2020249800A1 (https=)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102601950B1 (ko) * 2018-11-16 2023-11-14 삼성전자주식회사 Led 소자, led 소자의 제조 방법 및 led 소자를 포함하는 디스플레이 장치
US10944027B2 (en) * 2019-06-14 2021-03-09 X Display Company Technology Limited Pixel modules with controllers and light emitters
US11488943B2 (en) 2019-06-14 2022-11-01 X Display Company Technology Limited Modules with integrated circuits and devices
US12027649B2 (en) 2019-12-11 2024-07-02 Mikro Mesa Technology Co., Ltd. Breathable micro light emitting diode display
US11189771B2 (en) * 2019-12-11 2021-11-30 Mikro Mesa Technology Co., Ltd. Breathable micro light emitting diode display
US11387178B2 (en) * 2020-03-06 2022-07-12 X-Celeprint Limited Printable 3D electronic components and structures
US11538849B2 (en) 2020-05-28 2022-12-27 X Display Company Technology Limited Multi-LED structures with reduced circuitry
US11088093B1 (en) * 2020-05-28 2021-08-10 X-Celeprint Limited Micro-component anti-stiction structures
US11735569B2 (en) 2020-06-03 2023-08-22 Seoul Viosys Co., Ltd. Light emitting device module and display apparatus having the same
US11476296B2 (en) * 2020-08-31 2022-10-18 Hong Kong Beida Jade Bird Display Limited Double color micro LED display panel
JP2022079295A (ja) * 2020-11-16 2022-05-26 沖電気工業株式会社 複合集積フィルム、複合集積フィルム供給ウェハ及び半導体複合装置
CN114725158A (zh) * 2021-01-06 2022-07-08 群创光电股份有限公司 发光装置
EP4309169A4 (en) * 2021-03-16 2025-04-02 Google LLC Method for producing a display using groups of micro-LEDs and micro-LED arrays
TWI821986B (zh) * 2021-08-30 2023-11-11 友達光電股份有限公司 顯示組件、包含其之顯示裝置及顯示裝置之製造方法
DE102021125416A1 (de) * 2021-09-30 2023-03-30 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronisches bauteil, optoelektronische vorrichtung und verfahren zur herstellung von optoelektronischen bauteilen oder optoelektronischen vorrichtungen
FR3129246B1 (fr) * 2021-11-16 2024-02-23 Commissariat Energie Atomique Dispositif d'affichage interactif et procédé de fabrication d'un tel dispositif
JP7739964B2 (ja) * 2021-11-17 2025-09-17 沖電気工業株式会社 電子構造体及び電子回路の製造方法
CN117374056A (zh) * 2022-06-30 2024-01-09 深超光电（深圳）有限公司 显示面板及显示面板制造方法
US12588471B2 (en) * 2023-01-17 2026-03-24 X Display Company Technology Limited Micro-device substrate structures with posts and indentations
TWI842468B (zh) * 2023-04-07 2024-05-11 晶呈科技股份有限公司 發光二極體封裝結構及其製備方法
CN121080146A (zh) * 2023-05-10 2025-12-05 艾迈斯-欧司朗国际有限责任公司 堆叠的光电μ-IC器件
TWI842637B (zh) * 2023-06-19 2024-05-11 台灣愛司帝科技股份有限公司 隱藏式顯示裝置及其製作方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120018745A1 (en) 2010-07-20 2012-01-26 Epistar Corporation Integrated lighting apparatus and method of manufacturing the same
DE102016124983A1 (de) 2016-12-20 2018-06-21 Osram Opto Semiconductors Gmbh Videowandmodul

Family Cites Families (80)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08123337A (ja) * 1994-10-26 1996-05-17 Nagoya Denki Kogyo Kk 道路情報表示板用表示ユニット
US6142358A (en) 1997-05-31 2000-11-07 The Regents Of The University Of California Wafer-to-wafer transfer of microstructures using break-away tethers
US6608370B1 (en) 2002-01-28 2003-08-19 Motorola, Inc. Semiconductor wafer having a thin die and tethers and methods of making the same
EP1700161B1 (en) 2003-12-01 2018-01-24 The Board of Trustees of the University of Illinois Methods and devices for fabricating three-dimensional nanoscale structures
US7195733B2 (en) 2004-04-27 2007-03-27 The Board Of Trustees Of The University Of Illinois Composite patterning devices for soft lithography
WO2005107128A1 (en) * 2004-04-30 2005-11-10 Research In Motion Limited System and method for securing data
US7799699B2 (en) 2004-06-04 2010-09-21 The Board Of Trustees Of The University Of Illinois Printable semiconductor structures and related methods of making and assembling
US7521292B2 (en) 2004-06-04 2009-04-21 The Board Of Trustees Of The University Of Illinois Stretchable form of single crystal silicon for high performance electronics on rubber substrates
CN102683391B (zh) 2004-06-04 2015-11-18 伊利诺伊大学评议会 用于制造并组装可印刷半导体元件的方法和设备
JP4801337B2 (ja) 2004-09-21 2011-10-26 株式会社半導体エネルギー研究所 半導体装置の作製方法
US7662545B2 (en) 2004-10-14 2010-02-16 The Board Of Trustees Of The University Of Illinois Decal transfer lithography
KR101430587B1 (ko) 2006-09-20 2014-08-14 더 보오드 오브 트러스티스 오브 더 유니버시티 오브 일리노이즈 전사가능한 반도체 구조들, 디바이스들 및 디바이스 컴포넌트들을 만들기 위한 릴리스 방안들
KR101519038B1 (ko) 2007-01-17 2015-05-11 더 보오드 오브 트러스티스 오브 더 유니버시티 오브 일리노이즈 프린팅­기반 어셈블리에 의해 제조되는 광학 시스템
US8354674B2 (en) * 2007-06-29 2013-01-15 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device wherein a property of a first semiconductor layer is different from a property of a second semiconductor layer
WO2009067635A1 (en) 2007-11-20 2009-05-28 Board Of Regents, The University Of Texas System Method and apparatus for detethering mesoscale, microscale, and nanoscale components and devices
US8030674B2 (en) 2008-04-28 2011-10-04 Lextar Electronics Corp. Light-emitting diode package with roughened surface portions of the lead-frame
US20100060553A1 (en) 2008-08-21 2010-03-11 Zimmerman Scott M LED display utilizing freestanding epitaxial LEDs
US9123614B2 (en) 2008-10-07 2015-09-01 Mc10, Inc. Methods and applications of non-planar imaging arrays
KR101736722B1 (ko) 2008-11-19 2017-05-17 셈프리어스 아이엔씨. 전단-보조 탄성 스탬프 전사에 의한 프린팅 반도체 소자
CN106449805B (zh) 2009-02-09 2019-03-12 艾克斯瑟乐普林特有限公司 集中器型光电（cpv）模块、接收器和子接收器及其形成方法
US8877648B2 (en) 2009-03-26 2014-11-04 Semprius, Inc. Methods of forming printable integrated circuit devices by selective etching to suspend the devices from a handling substrate and devices formed thereby
TWI592996B (zh) 2009-05-12 2017-07-21 美國伊利諾大學理事會 用於可變形及半透明顯示器之超薄微刻度無機發光二極體之印刷總成
US9165989B2 (en) 2009-09-16 2015-10-20 Semprius, Inc. High-yield fabrication of large-format substrates with distributed, independent control elements
US8642363B2 (en) 2009-12-09 2014-02-04 Nano And Advanced Materials Institute Limited Monolithic full-color LED micro-display on an active matrix panel manufactured using flip-chip technology
WO2011126726A1 (en) 2010-03-29 2011-10-13 Semprius, Inc. Electrically bonded arrays of transfer printed active components
WO2011123285A1 (en) 2010-03-29 2011-10-06 Semprius, Inc. Selective transfer of active components
KR101916968B1 (ko) 2010-08-06 2018-11-08 엑스-셀레프린트 리미티드 인쇄가능한 화합물 반도체 장치를 박리시키기 위한 물질 및 방법
US9142468B2 (en) 2010-08-26 2015-09-22 Semprius, Inc. Structures and methods for testing printable integrated circuits
WO2012078139A1 (en) 2010-12-07 2012-06-14 Primaxx, Inc. Process for manufacturing electro-mechanical systems
JP5966412B2 (ja) 2011-04-08 2016-08-10 ソニー株式会社 画素チップ、表示パネル、照明パネル、表示装置および照明装置
US8889485B2 (en) 2011-06-08 2014-11-18 Semprius, Inc. Methods for surface attachment of flipped active componenets
US9412727B2 (en) 2011-09-20 2016-08-09 Semprius, Inc. Printing transferable components using microstructured elastomeric surfaces with pressure modulated reversible adhesion
US9620478B2 (en) 2011-11-18 2017-04-11 Apple Inc. Method of fabricating a micro device transfer head
US8426227B1 (en) 2011-11-18 2013-04-23 LuxVue Technology Corporation Method of forming a micro light emitting diode array
KR101891257B1 (ko) 2012-04-02 2018-08-24 삼성전자주식회사 반도체 발광장치 및 그 제조방법
US8933433B2 (en) 2012-07-30 2015-01-13 LuxVue Technology Corporation Method and structure for receiving a micro device
US8941215B2 (en) 2012-09-24 2015-01-27 LuxVue Technology Corporation Micro device stabilization post
US8835940B2 (en) 2012-09-24 2014-09-16 LuxVue Technology Corporation Micro device stabilization post
US9029880B2 (en) 2012-12-10 2015-05-12 LuxVue Technology Corporation Active matrix display panel with ground tie lines
US9166114B2 (en) 2012-12-11 2015-10-20 LuxVue Technology Corporation Stabilization structure including sacrificial release layer and staging cavity
US9153171B2 (en) 2012-12-17 2015-10-06 LuxVue Technology Corporation Smart pixel lighting and display microcontroller
WO2014152617A1 (en) 2013-03-15 2014-09-25 Semprius, Inc. Engineered substrates for semiconductor epitaxy and methods of fabricating the same
US9252375B2 (en) 2013-03-15 2016-02-02 LuxVue Technology Corporation Method of fabricating a light emitting diode display with integrated defect detection test
US8791474B1 (en) 2013-03-15 2014-07-29 LuxVue Technology Corporation Light emitting diode display with redundancy scheme
US9217541B2 (en) 2013-05-14 2015-12-22 LuxVue Technology Corporation Stabilization structure including shear release posts
US8987765B2 (en) 2013-06-17 2015-03-24 LuxVue Technology Corporation Reflective bank structure and method for integrating a light emitting device
US9111464B2 (en) 2013-06-18 2015-08-18 LuxVue Technology Corporation LED display with wavelength conversion layer
US9087764B2 (en) 2013-07-26 2015-07-21 LuxVue Technology Corporation Adhesive wafer bonding with controlled thickness variation
US9367094B2 (en) 2013-12-17 2016-06-14 Apple Inc. Display module and system applications
US9831387B2 (en) 2014-06-14 2017-11-28 Hiphoton Co., Ltd. Light engine array
CN113035851B (zh) 2014-06-18 2022-03-29 艾克斯展示公司技术有限公司 微组装led显示器
US9818725B2 (en) 2015-06-01 2017-11-14 X-Celeprint Limited Inorganic-light-emitter display with integrated black matrix
US20160093600A1 (en) 2014-09-25 2016-03-31 X-Celeprint Limited Compound micro-assembly strategies and devices
US9640715B2 (en) 2015-05-15 2017-05-02 X-Celeprint Limited Printable inorganic semiconductor structures
US10255834B2 (en) 2015-07-23 2019-04-09 X-Celeprint Limited Parallel redundant chiplet system for controlling display pixels
US9640108B2 (en) 2015-08-25 2017-05-02 X-Celeprint Limited Bit-plane pulse width modulated digital display system
US10468363B2 (en) 2015-08-10 2019-11-05 X-Celeprint Limited Chiplets with connection posts
US10380930B2 (en) * 2015-08-24 2019-08-13 X-Celeprint Limited Heterogeneous light emitter display system
WO2017094461A1 (ja) * 2015-12-01 2017-06-08 シャープ株式会社 画像形成素子
US9930277B2 (en) 2015-12-23 2018-03-27 X-Celeprint Limited Serial row-select matrix-addressed system
US10091446B2 (en) 2015-12-23 2018-10-02 X-Celeprint Limited Active-matrix displays with common pixel control
US10153256B2 (en) 2016-03-03 2018-12-11 X-Celeprint Limited Micro-transfer printable electronic component
US10153257B2 (en) 2016-03-03 2018-12-11 X-Celeprint Limited Micro-printed display
JP6668455B2 (ja) * 2016-04-01 2020-03-18 株式会社半導体エネルギー研究所 酸化物半導体膜の作製方法
GB2551103B (en) 2016-04-11 2022-03-23 Filtronic Broadband Ltd A method of optimising a mm wave power amplifier
JP7015024B2 (ja) * 2016-10-19 2022-02-02 株式会社オルガノサーキット アクティブマトリクスｌｅｄディスプレイ
US10395966B2 (en) 2016-11-15 2019-08-27 X-Celeprint Limited Micro-transfer-printable flip-chip structures and methods
WO2018091459A1 (en) 2016-11-15 2018-05-24 X-Celeprint Limited Micro-transfer-printable flip-chip structures and methods
US10332868B2 (en) 2017-01-26 2019-06-25 X-Celeprint Limited Stacked pixel structures
US10468391B2 (en) 2017-02-08 2019-11-05 X-Celeprint Limited Inorganic light-emitting-diode displays with multi-ILED pixels
JP6781087B2 (ja) * 2017-02-28 2020-11-04 京セラ株式会社 表示装置
US10224432B2 (en) * 2017-03-10 2019-03-05 Applied Materials, Inc. Surface treatment process performed on devices for TFT applications
US11152512B2 (en) * 2017-05-19 2021-10-19 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, display device, and method for manufacturing semiconductor device
KR102495930B1 (ko) * 2017-09-12 2023-02-03 삼성디스플레이 주식회사 표시 장치 및 그 제조 방법
US10690920B2 (en) * 2018-02-28 2020-06-23 X Display Company Technology Limited Displays with transparent bezels
US10505079B2 (en) * 2018-05-09 2019-12-10 X-Celeprint Limited Flexible devices and methods using laser lift-off
US10607533B2 (en) * 2018-08-03 2020-03-31 Kyocera Corporation Display apparatus with light emitting portions
KR102030323B1 (ko) * 2018-11-23 2019-10-10 엘지디스플레이 주식회사 표시 장치 및 표시 장치의 제조 방법
US12183724B2 (en) * 2019-06-13 2024-12-31 Lite-On Opto Technology (Changzhou) Co., Ltd. Multiple pixel package structure with buried chip and electronic device using the same
US10944027B2 (en) 2019-06-14 2021-03-09 X Display Company Technology Limited Pixel modules with controllers and light emitters

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120018745A1 (en) 2010-07-20 2012-01-26 Epistar Corporation Integrated lighting apparatus and method of manufacturing the same
DE102016124983A1 (de) 2016-12-20 2018-06-21 Osram Opto Semiconductors Gmbh Videowandmodul

Also Published As

Publication number Publication date
EP3984065A1 (en) 2022-04-20
WO2020249800A4 (en) 2021-02-18
JP2022537701A (ja) 2022-08-29
JP2024069399A (ja) 2024-05-21
JP2023105138A (ja) 2023-07-28
KR20220017947A (ko) 2022-02-14
TWI823010B (zh) 2023-11-21
TW202115862A (zh) 2021-04-16
US10944027B2 (en) 2021-03-09
WO2020249800A1 (en) 2020-12-17
US20210151630A1 (en) 2021-05-20
KR102840512B1 (ko) 2025-07-29
JP7432625B2 (ja) 2024-02-16
CN114450789A (zh) 2022-05-06
KR20230145242A (ko) 2023-10-17
US20200395510A1 (en) 2020-12-17
JP7587638B2 (ja) 2024-11-20

Similar Documents

Publication Publication Date Title
KR102586903B1 (ko) 제어기 및 광 방출기를 갖는 픽셀 모듈
US12482799B2 (en) Modules with integrated circuits and devices
US10332868B2 (en) Stacked pixel structures
TWI681535B (zh) 微轉移可印刷電子元件
US11430774B2 (en) Bezel-free displays
US10453826B2 (en) Voltage-balanced serial iLED pixel and display
KR102761865B1 (ko) 마이크로 led를 이용한 디스플레이 장치 및 이의 제조 방법
US9997501B2 (en) Micro-transfer-printed light-emitting diode device
US20210384290A1 (en) Devices with a single metal layer
US9899465B2 (en) Redistribution layer for substrate contacts
EP3544386B1 (en) Display apparatus using semiconductor light emitting device, and manufacturing method therefor
US20180261658A1 (en) Testing transfer-print micro-devices on wafer
KR102700205B1 (ko) 반도체 발광 소자를 이용한 디스플레이 장치
KR101771460B1 (ko) 반도체 발광 소자를 이용한 디스플레이 장치
KR20180093767A (ko) 반도체 발광 소자를 이용한 디스플레이 장치
US20200211879A1 (en) Layout structure between substrate, micro-led array and micro-vacuum module for micro-led array transfer using micro-vacuum module, and method for manufacturing micro-led display using the same
KR102357645B1 (ko) 반도체 발광소자를 이용한 디스플레이 장치
TW200923871A (en) Integrated display module
US11742471B2 (en) Surface-mountable pixel packages and pixel engines
US20250078733A1 (en) Displays with optical backplanes
KR102759226B1 (ko) 마이크로 led 패키지 및 이를 구비한 디스플레이

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

A201 Request for examination
A302 Request for accelerated examination
E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

PA0302 Request for accelerated examination

St.27 status event code: A-1-2-D10-D17-exm-PA0302

St.27 status event code: A-1-2-D10-D16-exm-PA0302

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PA0104 Divisional application for international application

St.27 status event code: A-0-1-A10-A18-div-PA0104

St.27 status event code: A-0-1-A10-A16-div-PA0104

PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000