CN114450789A - 具有控制器和光发射器的像素模块 - Google Patents

具有控制器和光发射器的像素模块 Download PDF

Info

Publication number
CN114450789A
CN114450789A CN202080051098.7A CN202080051098A CN114450789A CN 114450789 A CN114450789 A CN 114450789A CN 202080051098 A CN202080051098 A CN 202080051098A CN 114450789 A CN114450789 A CN 114450789A
Authority
CN
China
Prior art keywords
module
controller
substrate
light emitter
pixel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202080051098.7A
Other languages
English (en)
Chinese (zh)
Inventor
C·A·鲍尔
M·A·美特尔
R·S·科克
萨瓦托瑞·波纳菲德
B·雷蒙德
A·T·皮尔逊
E·P·维克
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Exxon Optoelectronic Technology Co ltd
Original Assignee
Exxon Optoelectronic Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Exxon Optoelectronic Technology Co ltd filed Critical Exxon Optoelectronic Technology Co ltd
Publication of CN114450789A publication Critical patent/CN114450789A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/83Electrodes
    • H10H20/831Electrodes characterised by their shape
    • H10H20/8316Multi-layer electrodes comprising at least one discontinuous layer
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/20Assemblies of multiple devices comprising at least one light-emitting semiconductor device covered by group H10H20/00
    • H10H29/24Assemblies of multiple devices comprising at least one light-emitting semiconductor device covered by group H10H20/00 comprising multiple light-emitting semiconductor devices
    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09GARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
    • G09G3/22Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
    • G09G3/30Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels
    • G09G3/32Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09GARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
    • G09G3/22Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
    • G09G3/30Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels
    • G09G3/32Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
    • G09G3/3208Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED]
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/84Coatings, e.g. passivation layers or antireflective coatings
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/857Interconnections, e.g. lead-frames, bond wires or solder balls
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/10Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
    • H10H29/14Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components
    • H10H29/142Two-dimensional arrangements, e.g. asymmetric LED layout
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/30Active-matrix LED displays
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/80Constructional details
    • H10H29/85Packages
    • H10H29/857Interconnections
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60Insulating or insulated package substrates; Interposers; Redistribution layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Led Device Packages (AREA)
  • Electroluminescent Light Sources (AREA)
  • Optical Communication System (AREA)
CN202080051098.7A 2019-06-14 2020-06-12 具有控制器和光发射器的像素模块 Pending CN114450789A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US16/442,142 US10944027B2 (en) 2019-06-14 2019-06-14 Pixel modules with controllers and light emitters
US16/442,142 2019-06-14
PCT/EP2020/066401 WO2020249800A1 (en) 2019-06-14 2020-06-12 Pixel modules with controllers and light emitters

Publications (1)

Publication Number Publication Date
CN114450789A true CN114450789A (zh) 2022-05-06

Family

ID=71130951

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202080051098.7A Pending CN114450789A (zh) 2019-06-14 2020-06-12 具有控制器和光发射器的像素模块

Country Status (7)

Country Link
US (2) US10944027B2 (https=)
EP (1) EP3984065A1 (https=)
JP (3) JP7432625B2 (https=)
KR (2) KR102586903B1 (https=)
CN (1) CN114450789A (https=)
TW (1) TWI823010B (https=)
WO (1) WO2020249800A1 (https=)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102601950B1 (ko) * 2018-11-16 2023-11-14 삼성전자주식회사 Led 소자, led 소자의 제조 방법 및 led 소자를 포함하는 디스플레이 장치
US10944027B2 (en) * 2019-06-14 2021-03-09 X Display Company Technology Limited Pixel modules with controllers and light emitters
US11488943B2 (en) 2019-06-14 2022-11-01 X Display Company Technology Limited Modules with integrated circuits and devices
US12027649B2 (en) 2019-12-11 2024-07-02 Mikro Mesa Technology Co., Ltd. Breathable micro light emitting diode display
US11189771B2 (en) * 2019-12-11 2021-11-30 Mikro Mesa Technology Co., Ltd. Breathable micro light emitting diode display
US11387178B2 (en) * 2020-03-06 2022-07-12 X-Celeprint Limited Printable 3D electronic components and structures
US11538849B2 (en) 2020-05-28 2022-12-27 X Display Company Technology Limited Multi-LED structures with reduced circuitry
US11088093B1 (en) * 2020-05-28 2021-08-10 X-Celeprint Limited Micro-component anti-stiction structures
US11735569B2 (en) 2020-06-03 2023-08-22 Seoul Viosys Co., Ltd. Light emitting device module and display apparatus having the same
US11476296B2 (en) * 2020-08-31 2022-10-18 Hong Kong Beida Jade Bird Display Limited Double color micro LED display panel
JP2022079295A (ja) * 2020-11-16 2022-05-26 沖電気工業株式会社 複合集積フィルム、複合集積フィルム供給ウェハ及び半導体複合装置
CN114725158A (zh) * 2021-01-06 2022-07-08 群创光电股份有限公司 发光装置
EP4309169A4 (en) * 2021-03-16 2025-04-02 Google LLC Method for producing a display using groups of micro-LEDs and micro-LED arrays
TWI821986B (zh) * 2021-08-30 2023-11-11 友達光電股份有限公司 顯示組件、包含其之顯示裝置及顯示裝置之製造方法
DE102021125416A1 (de) * 2021-09-30 2023-03-30 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronisches bauteil, optoelektronische vorrichtung und verfahren zur herstellung von optoelektronischen bauteilen oder optoelektronischen vorrichtungen
FR3129246B1 (fr) * 2021-11-16 2024-02-23 Commissariat Energie Atomique Dispositif d'affichage interactif et procédé de fabrication d'un tel dispositif
JP7739964B2 (ja) * 2021-11-17 2025-09-17 沖電気工業株式会社 電子構造体及び電子回路の製造方法
CN117374056A (zh) * 2022-06-30 2024-01-09 深超光电(深圳)有限公司 显示面板及显示面板制造方法
US12588471B2 (en) * 2023-01-17 2026-03-24 X Display Company Technology Limited Micro-device substrate structures with posts and indentations
TWI842468B (zh) * 2023-04-07 2024-05-11 晶呈科技股份有限公司 發光二極體封裝結構及其製備方法
CN121080146A (zh) * 2023-05-10 2025-12-05 艾迈斯-欧司朗国际有限责任公司 堆叠的光电μ-IC器件
TWI842637B (zh) * 2023-06-19 2024-05-11 台灣愛司帝科技股份有限公司 隱藏式顯示裝置及其製作方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120256814A1 (en) * 2011-04-08 2012-10-11 Sony Corporation Pixel chip, display panel, lighting panel, display unit, and lighting unit
US20170025075A1 (en) * 2015-07-23 2017-01-26 X-Celeprint Limited Parallel redundant chiplet system
US20170061842A1 (en) * 2015-08-24 2017-03-02 X-Celeprint Limited Heterogeneous light emitter display system
WO2018114931A2 (de) * 2016-12-20 2018-06-28 Osram Opto Semiconductors Gmbh Videowandmodul
US20180211945A1 (en) * 2017-01-26 2018-07-26 X-Celeprint Limited Stacked pixel structures
US20180226386A1 (en) * 2017-02-08 2018-08-09 X-Celeprint Limited Inorganic light-emitting-diode displays with multi-iled pixels
JP2018141944A (ja) * 2017-02-28 2018-09-13 京セラディスプレイ株式会社 表示装置

Family Cites Families (75)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08123337A (ja) * 1994-10-26 1996-05-17 Nagoya Denki Kogyo Kk 道路情報表示板用表示ユニット
US6142358A (en) 1997-05-31 2000-11-07 The Regents Of The University Of California Wafer-to-wafer transfer of microstructures using break-away tethers
US6608370B1 (en) 2002-01-28 2003-08-19 Motorola, Inc. Semiconductor wafer having a thin die and tethers and methods of making the same
EP1700161B1 (en) 2003-12-01 2018-01-24 The Board of Trustees of the University of Illinois Methods and devices for fabricating three-dimensional nanoscale structures
US7195733B2 (en) 2004-04-27 2007-03-27 The Board Of Trustees Of The University Of Illinois Composite patterning devices for soft lithography
WO2005107128A1 (en) * 2004-04-30 2005-11-10 Research In Motion Limited System and method for securing data
US7799699B2 (en) 2004-06-04 2010-09-21 The Board Of Trustees Of The University Of Illinois Printable semiconductor structures and related methods of making and assembling
US7521292B2 (en) 2004-06-04 2009-04-21 The Board Of Trustees Of The University Of Illinois Stretchable form of single crystal silicon for high performance electronics on rubber substrates
CN102683391B (zh) 2004-06-04 2015-11-18 伊利诺伊大学评议会 用于制造并组装可印刷半导体元件的方法和设备
JP4801337B2 (ja) 2004-09-21 2011-10-26 株式会社半導体エネルギー研究所 半導体装置の作製方法
US7662545B2 (en) 2004-10-14 2010-02-16 The Board Of Trustees Of The University Of Illinois Decal transfer lithography
KR101430587B1 (ko) 2006-09-20 2014-08-14 더 보오드 오브 트러스티스 오브 더 유니버시티 오브 일리노이즈 전사가능한 반도체 구조들, 디바이스들 및 디바이스 컴포넌트들을 만들기 위한 릴리스 방안들
KR101519038B1 (ko) 2007-01-17 2015-05-11 더 보오드 오브 트러스티스 오브 더 유니버시티 오브 일리노이즈 프린팅­기반 어셈블리에 의해 제조되는 광학 시스템
US8354674B2 (en) * 2007-06-29 2013-01-15 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device wherein a property of a first semiconductor layer is different from a property of a second semiconductor layer
WO2009067635A1 (en) 2007-11-20 2009-05-28 Board Of Regents, The University Of Texas System Method and apparatus for detethering mesoscale, microscale, and nanoscale components and devices
US8030674B2 (en) 2008-04-28 2011-10-04 Lextar Electronics Corp. Light-emitting diode package with roughened surface portions of the lead-frame
US20100060553A1 (en) 2008-08-21 2010-03-11 Zimmerman Scott M LED display utilizing freestanding epitaxial LEDs
US9123614B2 (en) 2008-10-07 2015-09-01 Mc10, Inc. Methods and applications of non-planar imaging arrays
KR101736722B1 (ko) 2008-11-19 2017-05-17 셈프리어스 아이엔씨. 전단-보조 탄성 스탬프 전사에 의한 프린팅 반도체 소자
CN106449805B (zh) 2009-02-09 2019-03-12 艾克斯瑟乐普林特有限公司 集中器型光电(cpv)模块、接收器和子接收器及其形成方法
US8877648B2 (en) 2009-03-26 2014-11-04 Semprius, Inc. Methods of forming printable integrated circuit devices by selective etching to suspend the devices from a handling substrate and devices formed thereby
TWI592996B (zh) 2009-05-12 2017-07-21 美國伊利諾大學理事會 用於可變形及半透明顯示器之超薄微刻度無機發光二極體之印刷總成
US9165989B2 (en) 2009-09-16 2015-10-20 Semprius, Inc. High-yield fabrication of large-format substrates with distributed, independent control elements
US8642363B2 (en) 2009-12-09 2014-02-04 Nano And Advanced Materials Institute Limited Monolithic full-color LED micro-display on an active matrix panel manufactured using flip-chip technology
WO2011126726A1 (en) 2010-03-29 2011-10-13 Semprius, Inc. Electrically bonded arrays of transfer printed active components
WO2011123285A1 (en) 2010-03-29 2011-10-06 Semprius, Inc. Selective transfer of active components
TWI478319B (zh) 2010-07-20 2015-03-21 晶元光電股份有限公司 整合式發光裝置及其製造方法
KR101916968B1 (ko) 2010-08-06 2018-11-08 엑스-셀레프린트 리미티드 인쇄가능한 화합물 반도체 장치를 박리시키기 위한 물질 및 방법
US9142468B2 (en) 2010-08-26 2015-09-22 Semprius, Inc. Structures and methods for testing printable integrated circuits
WO2012078139A1 (en) 2010-12-07 2012-06-14 Primaxx, Inc. Process for manufacturing electro-mechanical systems
US8889485B2 (en) 2011-06-08 2014-11-18 Semprius, Inc. Methods for surface attachment of flipped active componenets
US9412727B2 (en) 2011-09-20 2016-08-09 Semprius, Inc. Printing transferable components using microstructured elastomeric surfaces with pressure modulated reversible adhesion
US9620478B2 (en) 2011-11-18 2017-04-11 Apple Inc. Method of fabricating a micro device transfer head
US8426227B1 (en) 2011-11-18 2013-04-23 LuxVue Technology Corporation Method of forming a micro light emitting diode array
KR101891257B1 (ko) 2012-04-02 2018-08-24 삼성전자주식회사 반도체 발광장치 및 그 제조방법
US8933433B2 (en) 2012-07-30 2015-01-13 LuxVue Technology Corporation Method and structure for receiving a micro device
US8941215B2 (en) 2012-09-24 2015-01-27 LuxVue Technology Corporation Micro device stabilization post
US8835940B2 (en) 2012-09-24 2014-09-16 LuxVue Technology Corporation Micro device stabilization post
US9029880B2 (en) 2012-12-10 2015-05-12 LuxVue Technology Corporation Active matrix display panel with ground tie lines
US9166114B2 (en) 2012-12-11 2015-10-20 LuxVue Technology Corporation Stabilization structure including sacrificial release layer and staging cavity
US9153171B2 (en) 2012-12-17 2015-10-06 LuxVue Technology Corporation Smart pixel lighting and display microcontroller
WO2014152617A1 (en) 2013-03-15 2014-09-25 Semprius, Inc. Engineered substrates for semiconductor epitaxy and methods of fabricating the same
US9252375B2 (en) 2013-03-15 2016-02-02 LuxVue Technology Corporation Method of fabricating a light emitting diode display with integrated defect detection test
US8791474B1 (en) 2013-03-15 2014-07-29 LuxVue Technology Corporation Light emitting diode display with redundancy scheme
US9217541B2 (en) 2013-05-14 2015-12-22 LuxVue Technology Corporation Stabilization structure including shear release posts
US8987765B2 (en) 2013-06-17 2015-03-24 LuxVue Technology Corporation Reflective bank structure and method for integrating a light emitting device
US9111464B2 (en) 2013-06-18 2015-08-18 LuxVue Technology Corporation LED display with wavelength conversion layer
US9087764B2 (en) 2013-07-26 2015-07-21 LuxVue Technology Corporation Adhesive wafer bonding with controlled thickness variation
US9367094B2 (en) 2013-12-17 2016-06-14 Apple Inc. Display module and system applications
US9831387B2 (en) 2014-06-14 2017-11-28 Hiphoton Co., Ltd. Light engine array
CN113035851B (zh) 2014-06-18 2022-03-29 艾克斯展示公司技术有限公司 微组装led显示器
US9818725B2 (en) 2015-06-01 2017-11-14 X-Celeprint Limited Inorganic-light-emitter display with integrated black matrix
US20160093600A1 (en) 2014-09-25 2016-03-31 X-Celeprint Limited Compound micro-assembly strategies and devices
US9640715B2 (en) 2015-05-15 2017-05-02 X-Celeprint Limited Printable inorganic semiconductor structures
US9640108B2 (en) 2015-08-25 2017-05-02 X-Celeprint Limited Bit-plane pulse width modulated digital display system
US10468363B2 (en) 2015-08-10 2019-11-05 X-Celeprint Limited Chiplets with connection posts
WO2017094461A1 (ja) * 2015-12-01 2017-06-08 シャープ株式会社 画像形成素子
US9930277B2 (en) 2015-12-23 2018-03-27 X-Celeprint Limited Serial row-select matrix-addressed system
US10091446B2 (en) 2015-12-23 2018-10-02 X-Celeprint Limited Active-matrix displays with common pixel control
US10153256B2 (en) 2016-03-03 2018-12-11 X-Celeprint Limited Micro-transfer printable electronic component
US10153257B2 (en) 2016-03-03 2018-12-11 X-Celeprint Limited Micro-printed display
JP6668455B2 (ja) * 2016-04-01 2020-03-18 株式会社半導体エネルギー研究所 酸化物半導体膜の作製方法
GB2551103B (en) 2016-04-11 2022-03-23 Filtronic Broadband Ltd A method of optimising a mm wave power amplifier
JP7015024B2 (ja) * 2016-10-19 2022-02-02 株式会社オルガノサーキット アクティブマトリクスledディスプレイ
US10395966B2 (en) 2016-11-15 2019-08-27 X-Celeprint Limited Micro-transfer-printable flip-chip structures and methods
WO2018091459A1 (en) 2016-11-15 2018-05-24 X-Celeprint Limited Micro-transfer-printable flip-chip structures and methods
US10224432B2 (en) * 2017-03-10 2019-03-05 Applied Materials, Inc. Surface treatment process performed on devices for TFT applications
US11152512B2 (en) * 2017-05-19 2021-10-19 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, display device, and method for manufacturing semiconductor device
KR102495930B1 (ko) * 2017-09-12 2023-02-03 삼성디스플레이 주식회사 표시 장치 및 그 제조 방법
US10690920B2 (en) * 2018-02-28 2020-06-23 X Display Company Technology Limited Displays with transparent bezels
US10505079B2 (en) * 2018-05-09 2019-12-10 X-Celeprint Limited Flexible devices and methods using laser lift-off
US10607533B2 (en) * 2018-08-03 2020-03-31 Kyocera Corporation Display apparatus with light emitting portions
KR102030323B1 (ko) * 2018-11-23 2019-10-10 엘지디스플레이 주식회사 표시 장치 및 표시 장치의 제조 방법
US12183724B2 (en) * 2019-06-13 2024-12-31 Lite-On Opto Technology (Changzhou) Co., Ltd. Multiple pixel package structure with buried chip and electronic device using the same
US10944027B2 (en) 2019-06-14 2021-03-09 X Display Company Technology Limited Pixel modules with controllers and light emitters

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120256814A1 (en) * 2011-04-08 2012-10-11 Sony Corporation Pixel chip, display panel, lighting panel, display unit, and lighting unit
US20170025075A1 (en) * 2015-07-23 2017-01-26 X-Celeprint Limited Parallel redundant chiplet system
US20170061842A1 (en) * 2015-08-24 2017-03-02 X-Celeprint Limited Heterogeneous light emitter display system
WO2018114931A2 (de) * 2016-12-20 2018-06-28 Osram Opto Semiconductors Gmbh Videowandmodul
US20190326269A1 (en) * 2016-12-20 2019-10-24 Osram Opto Semiconductors Gmbh Video-Wall Module
US20180211945A1 (en) * 2017-01-26 2018-07-26 X-Celeprint Limited Stacked pixel structures
US20180226386A1 (en) * 2017-02-08 2018-08-09 X-Celeprint Limited Inorganic light-emitting-diode displays with multi-iled pixels
JP2018141944A (ja) * 2017-02-28 2018-09-13 京セラディスプレイ株式会社 表示装置

Also Published As

Publication number Publication date
EP3984065A1 (en) 2022-04-20
WO2020249800A4 (en) 2021-02-18
JP2022537701A (ja) 2022-08-29
JP2024069399A (ja) 2024-05-21
JP2023105138A (ja) 2023-07-28
KR20220017947A (ko) 2022-02-14
TWI823010B (zh) 2023-11-21
TW202115862A (zh) 2021-04-16
US10944027B2 (en) 2021-03-09
WO2020249800A1 (en) 2020-12-17
US20210151630A1 (en) 2021-05-20
KR102840512B1 (ko) 2025-07-29
KR102586903B1 (ko) 2023-10-06
JP7432625B2 (ja) 2024-02-16
KR20230145242A (ko) 2023-10-17
US20200395510A1 (en) 2020-12-17
JP7587638B2 (ja) 2024-11-20

Similar Documents

Publication Publication Date Title
JP7587638B2 (ja) コントローラ及び発光体を備えるピクセルモジュール
US11488943B2 (en) Modules with integrated circuits and devices
US10332868B2 (en) Stacked pixel structures
US10453826B2 (en) Voltage-balanced serial iLED pixel and display
TWI681535B (zh) 微轉移可印刷電子元件
US9997501B2 (en) Micro-transfer-printed light-emitting diode device
US11289652B2 (en) OLEDs for micro transfer printing
US20180261658A1 (en) Testing transfer-print micro-devices on wafer
US10749093B2 (en) Interconnection by lateral transfer printing
KR102717340B1 (ko) 반도체 발광 소자를 이용한 디스플레이 장치 및 이의 제조방법
KR20200002733A (ko) 발광 소자를 이용한 디스플레이 장치 및 그 제조 방법
US12020630B1 (en) Stacked structure, display screen, and display apparatus
KR20180093767A (ko) 반도체 발광 소자를 이용한 디스플레이 장치
KR102357645B1 (ko) 반도체 발광소자를 이용한 디스플레이 장치
US20200211879A1 (en) Layout structure between substrate, micro-led array and micro-vacuum module for micro-led array transfer using micro-vacuum module, and method for manufacturing micro-led display using the same
CN114373839B (zh) 发光二极管芯片及其制备方法和显示装置
KR102759226B1 (ko) 마이크로 led 패키지 및 이를 구비한 디스플레이
CN121730001A (zh) 转移基板组装体及利用其的显示装置的制造方法

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination