KR102584829B1 - 기판을 반송하는 장치, 기판을 처리하는 시스템, 및 기판을 처리하는 방법 - Google Patents

기판을 반송하는 장치, 기판을 처리하는 시스템, 및 기판을 처리하는 방법 Download PDF

Info

Publication number
KR102584829B1
KR102584829B1 KR1020210105026A KR20210105026A KR102584829B1 KR 102584829 B1 KR102584829 B1 KR 102584829B1 KR 1020210105026 A KR1020210105026 A KR 1020210105026A KR 20210105026 A KR20210105026 A KR 20210105026A KR 102584829 B1 KR102584829 B1 KR 102584829B1
Authority
KR
South Korea
Prior art keywords
flow path
shaft portion
exhaust
divided
annular
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020210105026A
Other languages
English (en)
Korean (ko)
Other versions
KR20220023710A (ko
Inventor
마사히로 도고메
Original Assignee
도쿄엘렉트론가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 도쿄엘렉트론가부시키가이샤 filed Critical 도쿄엘렉트론가부시키가이샤
Publication of KR20220023710A publication Critical patent/KR20220023710A/ko
Application granted granted Critical
Publication of KR102584829B1 publication Critical patent/KR102584829B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3402—Mechanical parts of transfer devices
    • H01L21/67766—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7626—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B25J11/0095—Manipulators transporting wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J18/00—Arms
    • B25J18/02—Arms extensible
    • B25J18/025—Arms extensible telescopic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J19/00—Accessories fitted to manipulators, e.g. for monitoring, for viewing; Safety devices combined with or specially adapted for use in connection with manipulators
    • B25J19/0075—Means for protecting the manipulator from its environment or vice versa
    • B25J19/0079—Means for protecting the manipulator from its environment or vice versa using an internal pressure system
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Program-controlled manipulators
    • B25J9/0009—Constructional details, e.g. manipulator supports, bases
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Program-controlled manipulators
    • B25J9/02—Program-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
    • B25J9/04—Program-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
    • B25J9/041—Cylindrical coordinate type
    • B25J9/042—Cylindrical coordinate type comprising an articulated arm
    • B25J9/044—Cylindrical coordinate type comprising an articulated arm with forearm providing vertical linear movement
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Program-controlled manipulators
    • B25J9/10—Program-controlled manipulators characterised by positioning means for manipulator elements
    • B25J9/104—Program-controlled manipulators characterised by positioning means for manipulator elements with cables, chains or ribbons
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Program-controlled manipulators
    • B25J9/10—Program-controlled manipulators characterised by positioning means for manipulator elements
    • B25J9/12—Program-controlled manipulators characterised by positioning means for manipulator elements electric
    • H01L21/67017—
    • H01L21/67167—
    • H01L21/68707—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H10P72/0454—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers surrounding a central transfer chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance

Landscapes

  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
KR1020210105026A 2020-08-21 2021-08-10 기판을 반송하는 장치, 기판을 처리하는 시스템, 및 기판을 처리하는 방법 Active KR102584829B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2020-140298 2020-08-21
JP2020140298A JP7480635B2 (ja) 2020-08-21 2020-08-21 基板を搬送する装置、基板を処理するシステム、及び基板を処理する方法

Publications (2)

Publication Number Publication Date
KR20220023710A KR20220023710A (ko) 2022-03-02
KR102584829B1 true KR102584829B1 (ko) 2023-10-04

Family

ID=80271013

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020210105026A Active KR102584829B1 (ko) 2020-08-21 2021-08-10 기판을 반송하는 장치, 기판을 처리하는 시스템, 및 기판을 처리하는 방법

Country Status (3)

Country Link
US (1) US11728205B2 (https=)
JP (1) JP7480635B2 (https=)
KR (1) KR102584829B1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7724227B2 (ja) * 2020-02-27 2025-08-15 ラム リサーチ コーポレーション 放射状ガスカーテンおよび／または内部容積制御を備えたウエハハンドリングロボット
JP7633204B2 (ja) * 2022-03-31 2025-02-19 東京エレクトロン株式会社 ゲートバルブ装置及び半導体製造装置
US12552619B2 (en) * 2023-02-16 2026-02-17 Samsung Electronics Co., Ltd. Wafer transfer apparatus, wafer transfer system, and method for removing particles in wafer transfer apparatus
KR102801887B1 (ko) * 2023-03-20 2025-04-28 세메스 주식회사 타워 리프트

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002338042A (ja) * 2001-05-15 2002-11-27 Dainippon Screen Mfg Co Ltd 基板処理装置および基板搬入搬出装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3000179B2 (ja) * 1991-08-26 2000-01-17 東京エレクトロン株式会社 搬送駆動装置
JPH0929682A (ja) * 1995-07-11 1997-02-04 Canon Inc クリーン環境用機器のシール装置及びクリーンロボット
JP3361955B2 (ja) * 1996-03-08 2003-01-07 株式会社日立国際電気 基板処理装置および基板処理方法
JP2001300883A (ja) * 2000-04-20 2001-10-30 Kawasaki Heavy Ind Ltd ロボット
KR20100006715U (ko) * 2008-12-23 2010-07-01 주식회사 테스 화학 기상 증착 장치의 펌핑 플레이트
JP5500206B2 (ja) * 2012-06-01 2014-05-21 株式会社安川電機 搬送ロボットおよび搬送ロボットを備えた局所クリーン装置
JP6940978B2 (ja) * 2017-05-24 2021-09-29 住友重機械工業株式会社 エアアクチュエータ装置
JP6885980B2 (ja) * 2019-03-28 2021-06-16 平田機工株式会社 駆動装置及び搬送装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002338042A (ja) * 2001-05-15 2002-11-27 Dainippon Screen Mfg Co Ltd 基板処理装置および基板搬入搬出装置

Also Published As

Publication number Publication date
KR20220023710A (ko) 2022-03-02
JP2022035763A (ja) 2022-03-04
US11728205B2 (en) 2023-08-15
JP7480635B2 (ja) 2024-05-10
US20220059395A1 (en) 2022-02-24

Similar Documents

Publication Publication Date Title
KR102584829B1 (ko) 기판을 반송하는 장치, 기판을 처리하는 시스템, 및 기판을 처리하는 방법
CN117276150B (zh) 可索引侧储存仓设备、加热的侧储存仓设备、系统和方法
CN110391160B (zh) 排气喷嘴单元、装载端口和设备前端模块
CN101542713B (zh) 基板处理装置和基板处理方法
KR102626528B1 (ko) 국소 퍼지 기능을 갖는 반송 장치
US8430620B1 (en) Dedicated hot and cold end effectors for improved throughput
US10679878B2 (en) Substrate processing apparatus
US20100022093A1 (en) Vacuum processing apparatus, method of operating same and storage medium
CN102569016B (zh) 真空处理装置
KR102652600B1 (ko) 기판 반송 장치, 기판 반송 방법, 및 기판 처리 시스템
JP2016164929A (ja) ドア開閉装置、搬送装置、ソータ装置、収納容器の開放方法
KR20200006045A (ko) 박판형상 기판 유지 핑거 및 이 핑거를 구비하는 반송 로봇
KR20080080269A (ko) 진공 처리 장치
JP2011124565A (ja) 半導体被処理基板の真空処理システム及び半導体被処理基板の真空処理方法
US20150235885A1 (en) Purge system, pod used with purge system, and load port apparatus
WO2016147980A1 (ja) ドア開閉装置、搬送装置、ソータ装置、収納容器のドッキング方法
JP5923288B2 (ja) 真空処理装置及び真空処理装置の運転方法
JP4642619B2 (ja) 基板処理システム及び方法
JP3121022B2 (ja) 減圧処理装置
KR101840940B1 (ko) 고온 상압 기상성장장치에 마련되는 챔버 간의 개폐 장치
WO2025182731A1 (ja) 基板搬送装置及び基板搬送方法

Legal Events

Date Code Title Description
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

D13-X000 Search requested

St.27 status event code: A-1-2-D10-D13-srh-X000

D14-X000 Search report completed

St.27 status event code: A-1-2-D10-D14-srh-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U11-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000