JP7480635B2 - 基板を搬送する装置、基板を処理するシステム、及び基板を処理する方法 - Google Patents

基板を搬送する装置、基板を処理するシステム、及び基板を処理する方法 Download PDF

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JP7480635B2
JP7480635B2 JP2020140298A JP2020140298A JP7480635B2 JP 7480635 B2 JP7480635 B2 JP 7480635B2 JP 2020140298 A JP2020140298 A JP 2020140298A JP 2020140298 A JP2020140298 A JP 2020140298A JP 7480635 B2 JP7480635 B2 JP 7480635B2
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flow passage
exhaust
flow path
section
base
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JP2020140298A
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English (en)
Japanese (ja)
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JP2022035763A (ja
JP2022035763A5 (https=
Inventor
公宏 堂込
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Priority to JP2020140298A priority Critical patent/JP7480635B2/ja
Priority to KR1020210105026A priority patent/KR102584829B1/ko
Priority to US17/404,671 priority patent/US11728205B2/en
Publication of JP2022035763A publication Critical patent/JP2022035763A/ja
Publication of JP2022035763A5 publication Critical patent/JP2022035763A5/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3402—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7626—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B25J11/0095—Manipulators transporting wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J18/00—Arms
    • B25J18/02—Arms extensible
    • B25J18/025—Arms extensible telescopic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J19/00—Accessories fitted to manipulators, e.g. for monitoring, for viewing; Safety devices combined with or specially adapted for use in connection with manipulators
    • B25J19/0075—Means for protecting the manipulator from its environment or vice versa
    • B25J19/0079—Means for protecting the manipulator from its environment or vice versa using an internal pressure system
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Program-controlled manipulators
    • B25J9/0009—Constructional details, e.g. manipulator supports, bases
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Program-controlled manipulators
    • B25J9/02—Program-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
    • B25J9/04—Program-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
    • B25J9/041—Cylindrical coordinate type
    • B25J9/042—Cylindrical coordinate type comprising an articulated arm
    • B25J9/044—Cylindrical coordinate type comprising an articulated arm with forearm providing vertical linear movement
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Program-controlled manipulators
    • B25J9/10—Program-controlled manipulators characterised by positioning means for manipulator elements
    • B25J9/104—Program-controlled manipulators characterised by positioning means for manipulator elements with cables, chains or ribbons
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Program-controlled manipulators
    • B25J9/10—Program-controlled manipulators characterised by positioning means for manipulator elements
    • B25J9/12—Program-controlled manipulators characterised by positioning means for manipulator elements electric
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H10P72/0454—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers surrounding a central transfer chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance

Landscapes

  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
JP2020140298A 2020-08-21 2020-08-21 基板を搬送する装置、基板を処理するシステム、及び基板を処理する方法 Active JP7480635B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2020140298A JP7480635B2 (ja) 2020-08-21 2020-08-21 基板を搬送する装置、基板を処理するシステム、及び基板を処理する方法
KR1020210105026A KR102584829B1 (ko) 2020-08-21 2021-08-10 기판을 반송하는 장치, 기판을 처리하는 시스템, 및 기판을 처리하는 방법
US17/404,671 US11728205B2 (en) 2020-08-21 2021-08-17 Device for transferring substrate, system for processing substrate, and method of processing substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2020140298A JP7480635B2 (ja) 2020-08-21 2020-08-21 基板を搬送する装置、基板を処理するシステム、及び基板を処理する方法

Publications (3)

Publication Number Publication Date
JP2022035763A JP2022035763A (ja) 2022-03-04
JP2022035763A5 JP2022035763A5 (https=) 2023-04-26
JP7480635B2 true JP7480635B2 (ja) 2024-05-10

Family

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JP2020140298A Active JP7480635B2 (ja) 2020-08-21 2020-08-21 基板を搬送する装置、基板を処理するシステム、及び基板を処理する方法

Country Status (3)

Country Link
US (1) US11728205B2 (https=)
JP (1) JP7480635B2 (https=)
KR (1) KR102584829B1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7724227B2 (ja) * 2020-02-27 2025-08-15 ラム リサーチ コーポレーション 放射状ガスカーテンおよび／または内部容積制御を備えたウエハハンドリングロボット
JP7633204B2 (ja) * 2022-03-31 2025-02-19 東京エレクトロン株式会社 ゲートバルブ装置及び半導体製造装置
US12552619B2 (en) * 2023-02-16 2026-02-17 Samsung Electronics Co., Ltd. Wafer transfer apparatus, wafer transfer system, and method for removing particles in wafer transfer apparatus
KR102801887B1 (ko) * 2023-03-20 2025-04-28 세메스 주식회사 타워 리프트

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001300883A (ja) 2000-04-20 2001-10-30 Kawasaki Heavy Ind Ltd ロボット
JP2002338042A (ja) 2001-05-15 2002-11-27 Dainippon Screen Mfg Co Ltd 基板処理装置および基板搬入搬出装置
JP2018197592A (ja) 2017-05-24 2018-12-13 住友重機械工業株式会社 エアアクチュエータ装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3000179B2 (ja) * 1991-08-26 2000-01-17 東京エレクトロン株式会社 搬送駆動装置
JPH0929682A (ja) * 1995-07-11 1997-02-04 Canon Inc クリーン環境用機器のシール装置及びクリーンロボット
JP3361955B2 (ja) * 1996-03-08 2003-01-07 株式会社日立国際電気 基板処理装置および基板処理方法
KR20100006715U (ko) * 2008-12-23 2010-07-01 주식회사 테스 화학 기상 증착 장치의 펌핑 플레이트
JP5500206B2 (ja) * 2012-06-01 2014-05-21 株式会社安川電機 搬送ロボットおよび搬送ロボットを備えた局所クリーン装置
JP6885980B2 (ja) * 2019-03-28 2021-06-16 平田機工株式会社 駆動装置及び搬送装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001300883A (ja) 2000-04-20 2001-10-30 Kawasaki Heavy Ind Ltd ロボット
JP2002338042A (ja) 2001-05-15 2002-11-27 Dainippon Screen Mfg Co Ltd 基板処理装置および基板搬入搬出装置
JP2018197592A (ja) 2017-05-24 2018-12-13 住友重機械工業株式会社 エアアクチュエータ装置

Also Published As

Publication number Publication date
KR20220023710A (ko) 2022-03-02
JP2022035763A (ja) 2022-03-04
US11728205B2 (en) 2023-08-15
KR102584829B1 (ko) 2023-10-04
US20220059395A1 (en) 2022-02-24

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