KR102564376B1 - 화학 기계적 폴리싱 스마트 링 - Google Patents

화학 기계적 폴리싱 스마트 링 Download PDF

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Publication number
KR102564376B1
KR102564376B1 KR1020227023278A KR20227023278A KR102564376B1 KR 102564376 B1 KR102564376 B1 KR 102564376B1 KR 1020227023278 A KR1020227023278 A KR 1020227023278A KR 20227023278 A KR20227023278 A KR 20227023278A KR 102564376 B1 KR102564376 B1 KR 102564376B1
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South Korea
Prior art keywords
retaining ring
sensor
accelerometer
transmitter
coupled
Prior art date
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KR1020227023278A
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English (en)
Korean (ko)
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KR20220100110A (ko
Inventor
주빈 황
스티븐 에이. 웰스
라메쉬 고팔란
갠가드하르 쉬엘라반트
사이먼 야벨베르그
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어플라이드 머티어리얼스, 인코포레이티드
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Publication of KR20220100110A publication Critical patent/KR20220100110A/ko
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B24B37/32—Retaining rings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/046—Lapping machines or devices; Accessories designed for working plane surfaces using electric current
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/003—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving acoustic means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01H—MEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES
    • G01H1/00—Measuring characteristics of vibrations in solids by using direct conduction to the detector
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01H—MEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES
    • G01H11/00—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties
    • G01H11/06—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties by electric means
    • G—PHYSICS
    • G08—SIGNALLING
    • G08C—TRANSMISSION SYSTEMS FOR MEASURED VALUES, CONTROL OR SIMILAR SIGNALS
    • G08C17/00—Arrangements for transmitting signals characterised by the use of a wireless electrical link
    • G08C17/02—Arrangements for transmitting signals characterised by the use of a wireless electrical link using a radio link
    • H01L21/30625—
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04Q—SELECTING
    • H04Q9/00—Arrangements in telecontrol or telemetry systems for selectively calling a substation from a main station, in which substation desired apparatus is selected for applying a control signal thereto or for obtaining measured values therefrom
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/402—Chemomechanical polishing [CMP] of semiconductor materials
    • G—PHYSICS
    • G08—SIGNALLING
    • G08C—TRANSMISSION SYSTEMS FOR MEASURED VALUES, CONTROL OR SIMILAR SIGNALS
    • G08C2201/00—Transmission systems of control signals via wireless link
    • G08C2201/50—Receiving or transmitting feedback, e.g. replies, status updates, acknowledgements, from the controlled devices
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04Q—SELECTING
    • H04Q2209/00—Arrangements in telecontrol or telemetry systems
    • H04Q2209/40—Arrangements in telecontrol or telemetry systems using a wireless architecture
    • H04Q2209/43—Arrangements in telecontrol or telemetry systems using a wireless architecture using wireless personal area networks [WPAN], e.g. 802.15, 802.15.1, 802.15.4, Bluetooth® or Zigbee®
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04Q—SELECTING
    • H04Q2209/00—Arrangements in telecontrol or telemetry systems
    • H04Q2209/40—Arrangements in telecontrol or telemetry systems using a wireless architecture
    • H04Q2209/47—Arrangements in telecontrol or telemetry systems using a wireless architecture using RFID associated with sensors
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04Q—SELECTING
    • H04Q2209/00—Arrangements in telecontrol or telemetry systems
    • H04Q2209/80—Arrangements in the sub-station, i.e. sensing device
    • H04Q2209/88—Providing power supply at the sub-station

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Acoustics & Sound (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
KR1020227023278A 2016-09-15 2017-09-08 화학 기계적 폴리싱 스마트 링 Active KR102564376B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
IN201641031439 2016-09-15
IN201641031439 2016-09-15
PCT/US2017/050822 WO2018052816A1 (en) 2016-09-15 2017-09-08 Chemical mechanical polishing smart ring
KR1020197010665A KR102420044B1 (ko) 2016-09-15 2017-09-08 화학 기계적 폴리싱 스마트 링

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020197010665A Division KR102420044B1 (ko) 2016-09-15 2017-09-08 화학 기계적 폴리싱 스마트 링

Publications (2)

Publication Number Publication Date
KR20220100110A KR20220100110A (ko) 2022-07-14
KR102564376B1 true KR102564376B1 (ko) 2023-08-04

Family

ID=61559452

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Application Number Title Priority Date Filing Date
KR1020227023278A Active KR102564376B1 (ko) 2016-09-15 2017-09-08 화학 기계적 폴리싱 스마트 링
KR1020197010665A Active KR102420044B1 (ko) 2016-09-15 2017-09-08 화학 기계적 폴리싱 스마트 링

Family Applications After (1)

Application Number Title Priority Date Filing Date
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Country Status (7)

Country Link
US (1) US10513008B2 (https=)
JP (1) JP7312103B2 (https=)
KR (2) KR102564376B1 (https=)
CN (1) CN109689295B (https=)
SG (1) SG11201901352XA (https=)
TW (2) TWI758323B (https=)
WO (1) WO2018052816A1 (https=)

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US12296428B2 (en) * 2018-10-29 2025-05-13 Taiwan Semiconductor Manufacturing Co., Ltd. Chemical mechanical polishing apparatus and method
US11731232B2 (en) 2018-10-30 2023-08-22 Taiwan Semiconductor Manufacturing Company, Ltd. Irregular mechanical motion detection systems and method
CN113767404A (zh) 2019-03-29 2021-12-07 圣戈班磨料磨具有限公司 高效研磨解决方案
BR112021019766A2 (pt) 2019-04-03 2021-12-07 Saint Gobain Abrasifs Sa Artigo abrasivo, sistema abrasivo e método para uso e formação dos mesmos
DE102019207168A1 (de) * 2019-05-16 2020-11-19 Prüftechnik Dieter Busch GmbH Vorrichtung zum Erfassen mechanischer Schwingungen
KR102753436B1 (ko) * 2019-10-22 2025-01-13 삼성디스플레이 주식회사 연마 헤드 유닛, 이를 포함하는 기판 처리 장치, 그리고 이를 이용하는 기판 처리 방법
CN113118966B (zh) * 2019-12-31 2022-08-16 清华大学 一种用于化学机械抛光的承载头及其使用方法
JP7671297B2 (ja) * 2020-06-24 2025-05-01 アプライド マテリアルズ インコーポレイテッド 圧電圧力制御によるキャリアヘッドの研磨
JP2023177421A (ja) * 2022-06-02 2023-12-14 株式会社荏原製作所 研磨装置
WO2023234973A1 (en) * 2022-06-03 2023-12-07 Applied Materials, Inc. Acoustic monitoring of cmp retaining ring
US20230390891A1 (en) * 2022-06-06 2023-12-07 Applied Materials, Inc. Acoustic monitoring of conditioner during polishing
JP2024047143A (ja) * 2022-09-26 2024-04-05 双葉電子工業株式会社 稼働判定装置、稼働判定方法、プログラム
US20240139900A1 (en) * 2022-10-27 2024-05-02 Applied Materials, Inc. Acoustic carrier head monitoring
KR20250092244A (ko) * 2022-10-27 2025-06-23 어플라이드 머티어리얼스, 인코포레이티드 플래튼의 센서를 이용한 캐리어 헤드 음향 모니터링

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JP2001035822A (ja) * 1999-07-08 2001-02-09 United Microelectronics Corp 完了点観測デバイスを備えた化学機械研磨ステーション
JP2006525878A (ja) * 2003-05-16 2006-11-16 株式会社荏原製作所 基板研磨装置
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JP2001035822A (ja) * 1999-07-08 2001-02-09 United Microelectronics Corp 完了点観測デバイスを備えた化学機械研磨ステーション
JP2006525878A (ja) * 2003-05-16 2006-11-16 株式会社荏原製作所 基板研磨装置
JP2009542449A (ja) * 2006-06-28 2009-12-03 スリーエム イノベイティブ プロパティズ カンパニー 研磨物品、ｃｍｐモニタリングシステム及び方法
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Also Published As

Publication number Publication date
KR20190042744A (ko) 2019-04-24
US20180071889A1 (en) 2018-03-15
KR20220100110A (ko) 2022-07-14
CN109689295A (zh) 2019-04-26
JP2019532825A (ja) 2019-11-14
SG11201901352XA (en) 2019-04-29
TW201822952A (zh) 2018-07-01
US10513008B2 (en) 2019-12-24
TW202200308A (zh) 2022-01-01
WO2018052816A1 (en) 2018-03-22
JP7312103B2 (ja) 2023-07-20
TWI758323B (zh) 2022-03-21
KR102420044B1 (ko) 2022-07-11
CN109689295B (zh) 2021-08-06

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