KR102556597B1 - Substrate processing device - Google Patents

Abstract

The rotation of the substrate is suppressed. A holding part ( 52a) was formed.

Description

Substrate processing device

The present invention relates to a substrate processing apparatus that performs an etching process or a cleaning process on a substrate such as a semiconductor wafer.

BACKGROUND OF THE INVENTION In a semiconductor device manufacturing process, a substrate such as a semiconductor wafer is immersed in a treatment tank to perform an etching process or a cleaning process on the substrate semiconductor. In such a treatment tank, a blower pipe for ejecting the treatment liquid toward the center of the bottom of the treatment tank is provided on both sides of the bottom of the treatment tank, and a plurality of bubble supply pipes for supplying bubbles from the bottom of the treatment tank are interposed between the blower pipes. The structure provided is known (for example, refer patent document 1).

In such a processing tank, a lifter for immersing the substrate in the stored processing liquid is further provided. The lifter collectively holds a plurality of substrates in a standing posture by means of three holding rods. In addition, the lifter is formed to be movable in the vertical and horizontal directions, and raises and lowers the plurality of substrates held between a treatment position in which a plurality of substrates are immersed in the treatment liquid in the treatment tank and a delivery position in which the treatment liquid is raised upward. Together, they can be moved to the adjacent treatment tank.

Japanese Patent Publication No. 6356727

When processing is performed on a substrate, the flow of the processing liquid and bubbles from the bottom to the upper side acts on the substrate held by the holding rod and immersed in the processing tank. Under this action, the substrate may rotate in the circumferential direction. However, since the rotation of the substrate does not necessarily occur equally for a plurality of substrates held by the lifter, there is a concern that variation may occur in the processing effect.

Thus, one aspect of the disclosed technique is to suppress the rotation occurring in the substrate.

One aspect of the disclosed technology is exemplified by the following substrate processing apparatus.

This substrate processing apparatus,

a tank for storing a processing liquid for treating a substrate and immersing the substrate;

a holding member formed to hold the substrate in a standing position and to be able to move up and down between a delivery position and a processing position of the substrate with respect to the jaw;

to provide,

The holding member has a holding groove for holding the substrate from below,

In a state where the holding member holds the substrate at the processing position, the substrate is at a position above the holding groove and at a position on both sides of a virtual horizontal direction in a vertical direction including a normal line of the surface of the substrate. It is characterized in that a holding part for contacting and suppressing rotation of the substrate is formed in the jaw.

According to the present invention, when liquid or air bubbles are supplied upstream from the bottom of the tank to the substrate at a processing position where the substrate is immersed in the processing liquid, a downward flow is generated in the substrate held by the holding groove of the holding member. Rotation can be suppressed by the holding portion that abuts against the substrate above the holding groove.

In addition, the present invention,

Corresponding to each of the plurality of substrates held and arranged by the holding member, the holding groove and the holding portion are formed in the arrangement direction;

The phases of the plurality of retaining grooves formed in the array direction are set to be further shifted from the phases of the plurality of retaining grooves formed in the array direction to the phases shifted by half the pitch between adjacent retaining grooves. You can do it.

Also, in the present invention,

The holding portion may be formed at a position below a horizontal plane passing through the center of the substrate held by the holding member.

Also, in the present invention,

The holding groove may have a wedge shape in a cross section parallel to a vertical plane including a normal line of the substrate.

Also, in the present invention,

The holding groove may have a shape in a cross section parallel to a vertical plane including a normal line of the substrate mimicking a shape in the cross section of a bevel portion of the substrate.

Also, in the present invention,

A conveyance mechanism capable of horizontally changing a distance between the holding member and the surface of the substrate held by the holding member may be provided at a position where the holding member is lowered into the tank.

Also, in the present invention,

The holding portion may have a substantially conical protrusion or groove shape.

Also, in the present invention,

In the state in which the holding member holds the substrate at the processing position, the substrate is located above the holding groove and at a position on both sides of a virtual plane in the vertical direction including a normal line of the surface of the substrate in the horizontal direction. A second holding portion that abuts against and suppresses rotation of the substrate may be provided below the holding portion.

In this way, rotation occurring in the substrate can be more reliably suppressed by the holding portion and the second holding portion formed below the holding portion.

The number of holding portions is not limited to the case of forming two in the vertical direction, and an appropriately selected number of three or more can be formed.

Also, in the present invention,

In the above article,

a discharge pipe for discharging the treatment liquid;

a bubble supply pipe for supplying bubbles from the bottom of the tank;

may be provided.

In this way, rotation of the substrate can be effectively suppressed even in a substrate processing apparatus in which an upstream is generated from the bottom of the tank upward through the ejection pipe or the bubble supply pipe.

In addition, another aspect of the disclosed technology is exemplified by the following substrate processing apparatus.

This substrate processing apparatus,

A tank for storing a treatment liquid and immersing and treating a substrate of a flat plate in a standing position;

Relative to the tank, the holder having a plurality of concave holding grooves formed so as to be able to move up and down between a receiving position of the substrate and a processing position in the tank, and holding and placing the substrate from a lower position in an upright position. absence and

Above the holding groove of the holding member in the processing position and below the center of the depth of the nail, have apex spaced apart at intervals equal to the intervals of the adjacent holding grooves, and the direction of the apex is the direction of the holding groove. An abutting portion having a sharp body extending in a direction parallel to the longitudinal direction;

to provide

According to such an invention, a holding member having a plurality of concave holding grooves for holding and placing a substrate from below, and at intervals equal to the intervals between the holding grooves adjacent above the holding grooves and below the center of the depth of the nail. Rotation of the substrate can be suppressed by forming an abutting portion having a pointed main body having spaced vertices and extending in a direction parallel to the longitudinal direction of the holding groove. Tops above the holding groove and below the center of the depth of the nail are formed in the main body of each abutting portion with vertices spaced apart at intervals equal to the spacing between adjacent holding grooves.

Also, in the present invention,

You may make it the said pointed shape to be a conical shape or a needle shape.

Also, in the present invention,

A second abutting portion may be further provided below the abutting portion and includes a main body having an acute shape having vertices spaced apart at intervals equal to the intervals between adjacent holding grooves.

In this way, rotation occurring in the substrate can be more reliably suppressed by the holding portion and the second holding portion formed below the holding portion.

The number of abutting portions is not limited to the case of forming two in the vertical direction, and an appropriately selected number of abutting portions of three or more can be formed.

According to the substrate processing apparatus according to the present invention, rotation occurring in the substrate can be suppressed.

1 is a diagram showing an example of a substrate processing apparatus according to an embodiment.
2 is a block diagram showing an example of functional blocks of the substrate processing apparatus.
3 : is a figure which shows the positional relationship of a board|substrate and a holding part in an inner tank.
Fig. 4 is an overall perspective view of the support.
Fig. 5 is a diagram showing the positional relationship between a substrate held in a holding groove and a holding part in an inner tank.
6 is an enlarged view showing the positional relationship between the substrate held in the holding groove and the holding part.
Fig. 7 is a diagram showing the effect of suppressing rotation when processing is performed by changing the position of the holding part relative to the holding groove.
Fig. 8 is a diagram showing cross-sectional shapes of the substrate and holding grooves in Example 2;
Fig. 9 is a diagram showing the cross-sectional shape of the holder in Example 4;
Fig. 10 is a diagram showing the positional relationship between the substrate held in the holding groove and the holding part in the inner tank in Example 5;

<Example 1>

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In addition, the Example shown below is one aspect of this invention, and does not limit the technical scope of this invention. 1 is a perspective view showing a schematic configuration of a substrate processing apparatus 1 according to Example 1. FIG. This substrate processing apparatus 1 mainly performs an etching process or a cleaning process (hereinafter, simply referred to as "process") with respect to a flat substrate W. In the substrate processing apparatus 1, in FIG. 1, a buffer unit 2 for stocking the substrate W is disposed on the right side, and further on the right side of the buffer unit 2, the substrate processing apparatus 1 A front panel (not shown) for manipulating is formed. Further, on the side opposite to the front panel in the buffer section 2, a substrate loading/unloading port 3 is formed. In addition, processing units 5, 7, and 9 that perform processing on the substrate W from the opposite side of the buffer unit 2 in the longitudinal direction of the substrate processing apparatus 1 (front left in FIG. 1). is attached.

Each processing part 5, 7, and 9 has two processing tanks 5a and 5b, 7a and 7b, and 9a and 9b, respectively. Further, in the substrate processing apparatus 1, a plurality of substrates W are only placed between the processing tanks 5a and 5b, 7a and 7b, or 9a and 9b in the respective processing units 5, 7, and 9. A sub-transport mechanism 43 for moving in the direction and range of the short arrow in Fig. 1 is provided. In addition, this sub-transport mechanism 43 immerses the plurality of substrates W in the treatment tanks 5a and 5b, 7a and 7b, and 9a and 9b, or to lift the plurality of substrates W from these treatment tanks, The substrate W is also moved up and down. Each sub-transport mechanism 43 is provided with lifters 11, 13 and 15 capable of moving up and down to hold a plurality of substrates W. In addition, the substrate processing apparatus 1 includes a main transport mechanism 17 that is movable in the direction and range of the long arrow in FIG. ) is provided.

The main transport mechanism 17 has two movable arms 17a. A plurality of holding grooves (not shown) for mounting the substrate W are formed in these arms 17a, and each substrate W is held in a standing posture in a state shown in FIG. 1 . The standing posture is a posture in which a normal line orthogonal to the surface Wf of the substrate W (see Figs. 3 and 5) follows a horizontal direction. In addition, the two arms 17a in the main transport mechanism 17 swing from a "V" shape to an inverse "V" shape when viewed from the right oblique downward direction in FIG. 1, so that each substrate W open the By this operation, the substrate W can be transferred between the main transport mechanism 17 and the lifters 11, 13 and 15.

2, a functional block diagram of the substrate processing apparatus 1 is shown. The main transport mechanism 17, the sub transport mechanism 43, and the processing units 5, 7, and 9 described above are collectively controlled by the control unit 55. The hardware configuration of the control unit 55 is the same as that of a general computer. That is, the control unit 55 includes a CPU for performing various arithmetic processes, a read-only memory for storing basic programs, a ROM that is a read-only memory, a RAM that is a freely readable and writable memory for storing various information, and a control application or data for storing them. A magnetic disk and the like are provided. In this embodiment, when the CPU of the control unit 55 executes a predetermined program, the substrate W is conveyed to the processing units 5, 7, and 9, and the units are controlled to perform processing according to the program. The program is stored in the storage unit 57.

In FIG. 3 , among the treatment tanks 5a, 7a, and 9a in the treatment units 5, 7, and 9, treatment tank 5a is described as an example. The following description is also applied to the other treatment tanks 7a and 9a.

Here, in the manufacturing process of a semiconductor wafer, for example, a single crystal ingot of silicon or the like is sliced in the direction of its peak axis, and processing such as chamfering, lapping, etching, and polishing is sequentially performed on the obtained product. As a result, a plurality of layers, structures, and circuits made of different materials are formed on the surface of the substrate. Then, the etching treatment of the substrate W performed in the treatment tank 5a is performed for the purpose of, for example, removing metal such as tungsten remaining on the substrate W, and the substrate W as a treatment liquid. It is carried out by immersing in a phosphoric acid aqueous solution or the like for a predetermined time.

The treatment tank 5a has a double tank structure composed of an inner tank 501 in which the substrate W is immersed in an aqueous phosphoric acid solution and an outer tank (not shown) in which the aqueous phosphoric acid solution overflowing from the top of the inner tank 501 is recovered. Have. The inner tank 501 is a rectangular box-shaped member in plan view made of quartz or a fluororesin material excellent in corrosion resistance to aqueous phosphoric acid. As described above, the inner tank 501 is provided with a lifter 13 for immersing the substrate W in the stored phosphoric acid aqueous solution. The lifter 13 has a back plate 131 on the transport mechanism side, and three holding rods 132, 133, 134 extending horizontally from the bottom of the back plate 131 and formed parallel to each other. . The plurality of substrates W are collectively held parallel to each other in an upright posture by means of holding grooves (to be described later) formed in the holding rods 132, 133, and 134. The lifter 13 is formed to be movable in the up, down, left, and right directions by the sub-transport mechanism 43, and has a processing position in which a plurality of substrates W held are immersed in an aqueous phosphoric acid solution in the inner tub 501 and a phosphoric acid solution. It is possible to move it to the processing tank 5b next to it while raising it between the delivery positions raised from the aqueous solution. Here, the lifter 13 corresponds to the holding member.

An aqueous phosphoric acid solution is supplied from pipes 20a and 20b disposed at the bottom of the inner tank 501 . As a result, an upflow of the aqueous phosphoric acid solution from the bottom to the top of the inner tub 501 occurs. Also, bubbles of nitrogen gas are supplied from bubble pipes 30a, 30b, 30c, and 30d disposed at the bottom of the inner tank 501. As a result, an upflow of nitrogen gas from the bottom to the top of the inner tub 501 also occurs. Here, the pipe 20a, 20b corresponds to the blowing pipe of the present invention, and the bubble pipe 30a, 30b, 30c, 30d corresponds to the bubble supply pipe of the present invention.

FIG. 3 is a view when viewed from the direction orthogonal to the side wall 501a on the transport mechanism side of the inner tub 501 (from the lower right to the upper left in FIG. 1 ). The substrate W is held in an upright position by the holding rods 132, 133, and 134 in the forward direction from the inner side in FIG. 3 and is arranged. In the side walls 501b and 501c of the inner tub 501 located on both sides along the surface of the substrate W, substantially cones orthogonal to the side walls 501b and 501c and protruding in a direction along the surface of the substrate W are formed. Shape holding portions 52a and 53a are formed. As shown in FIG. 4, the holding part 52a (the holding part 53a is also the same) is a sharp shape which has the vertex 52ap and the side surface 52as. The direction of the apex 52ap of the holding portion 52a (the holding portion 53a is the same) extends in a direction parallel to the longitudinal direction of the holding groove 1321 (a direction parallel to the paper plane in FIG. 3). The holding portions 52a and 53a are provided with a virtual plane (vertical plane) Vp in the vertical direction including the normal of the surface Wf of the substrate W (in the vertical direction passing through the center Wc in FIG. 3 and perpendicular to the paper surface). Corresponds to the plane of), at positions on both sides in the horizontal direction with respect to the surface of the substrate W, it comes into contact with the peripheral edge portions Wfp, Wfp of the surface of the substrate W. The contact position of the holding portions 52a and 53a is, for example, a position 13 mm below the horizontal plane passing through the center Wc of the substrate W, when the diameter of the substrate W is 300 mm. can Here, the holding parts 52a and 53a correspond to the holding parts of the present invention and the abutting parts of the present invention. Here, the center of the depth of the inner tub 501 is described as coincident with the position of the center Wc of the substrate W, but it is not limited thereto.

The holding portions 52a and 53a correspond to the number of substrates W that can be held by the lifter 13 in the horizontal direction along the side walls 501b and 501c, that is, along the direction in which the plurality of substrates W are arranged. A plurality is formed. These holding parts 52a and 53a are formed at predetermined positions of the supports 52 and 53 attached to the inner tub 501 . 4 shows a perspective view of the support 52 . The support tool 52 extends in the horizontal direction along the side wall 501b, extends upward from the plate-shaped portion 521 where the holding portion 52a is formed, and both ends of the plate-shaped portion 521, and extends upward from the side wall 501b. ), plate-shaped engaging portions 522 and 523 bent at the upper edge portion and extending outwardly of the side wall 501b and extending inwardly of the inner tub 501 from both ends of the plate-shaped portion 521 It has positioning parts 524 and 525. Since the support 53 on which the holding portion 53a is formed is configured in the same manner, description thereof is omitted. Engaging portions 522 and 523 of the support tool 52 are engaged with the upper edge of the side wall 501b of the inner tub 501, thereby engaging the inner tub 501. Further, in the positioning portions 524 and 525 of the support tool 52, there are position adjustment bolts 5012a and 5013a formed by standing on the side wall 501a on the transport mechanism side of the inner tub 501 and the side wall 501d on the step side, respectively. ) through which holes 524a and 525a are inserted. The nuts 5012b and 5013b are screwed from the ends of the positioning bolts 5012a and 5013a on the side opposite to the side walls 501a and 501d with the positioning portions 524 and 525 interposed therebetween (Fig. see 5). By horizontally adjusting the position at which the nuts 5012b and 5013b are screwed to the positioning bolts 5012a and 5013a, the support 52 caught on the inner tub 501 by the engaging portions 522 and 523 and The horizontal position of the holding part 52a supported by this can be adjusted. The main bodies of the supports 52 and 53 are made of a heat-resistant material such as quartz, and the holding portions 52a and 53a can be made of PFA (perfluoroalkoxyalkane). The material to form is not limited to this.

FIG. 5 is a diagram showing the positional relationship between the lifter 13, the substrate W, the support 52, and the holder 52a in the inner tub 501. As shown in FIG. In FIG. 5 , a view viewed from a direction orthogonal to the side wall 501b , a cross section of the lifter 13 and the holding bar 132 with a vertical plane passing through the center of the substrate W is indicated by a broken line. In FIG. 5 , a plurality of wedge-shaped holding grooves 1321 (only 12 are shown on the drawing) are formed in the holding rod 132 (in FIG. 5 , each part related to the substrate W at the right end) is formed. Only the numerals are given, and the numerals are omitted because each part related to the other substrate W has the same configuration.).

Referring to Fig. 6 showing the holding groove 1321 in an enlarged manner, the positional relationship between the substrate W and the holding groove 1321 will be described. The edge portions We, We (see FIG. 6) of the surface of the substrate W are separated from the inclined surface 1321a (see FIG. 6) on the step side of the holding groove 1321 and the conveying mechanism side of the holding groove 1321. By contacting each of the slopes 1321b (see FIG. 6 ) of the substrate W, the lower end of the substrate W engages with the holding groove 1321 and is held. On the other hand, as described above, the holding portion 52a is in contact with the peripheral portion Wfp (see FIG. 3 ) on the surface of the substrate W. The substrate W is held from below by the holding groove 1321 and held from above by the holding portion 52a when viewed from a direction orthogonal to the paper surface of FIG. 5 . Since the holding groove 1321 of the holding rod 132 is formed along the outer circumference of the substrate W from the front side of the drawing toward the inside, in reality, the edge portion We of the board W is the holding groove ( 1321) is in contact with each of the slopes 1321a and 1321b by a curved area. Although omitted in FIG. 5 , between the holding rod 132 and the side wall 501b, the holding rod 133 is held by the step side of the holding groove 1331 having a wedge shape in cross section and the slope on the conveying mechanism side. It is becoming. 5, between the holding rod 132 and the side wall 501c, on the step side of the holding groove 1341 having a wedge shape in cross section and on the slope on the conveying mechanism side of the holding rod 134 is maintained by And, also in the front side of FIG. 5, by means of the support 53 formed on the side wall 501c, along the surface of the substrate W, at a position that is line symmetric with respect to a straight line passing through the center of the substrate W in the vertical direction. , the holding portion 53a is in contact with the peripheral portion Wfp of the surface of the substrate W.

FIG. 6 is a diagram explaining the relationship between the holding groove 1321 of the holding rod 132 of the lifter 13 and the position of the holding portion 52a. 6 is a sectional view in a cross section parallel to a vertical plane passing through the center of the substrate W. The distance between the center 1321c of the holding groove 1321 and the center 1321c of the adjacent holding groove 1321 (the holding groove ( 1321) is L1, a position at a distance of L1/2 from the center 1321c of the holding groove 1321 is taken as the reference position 132S. In other words, the reference position 132S is the center position between the centers 1321c of adjacent holding grooves 1321 . In the present embodiment, the substrate W is inclined toward the transport mechanism side (left side in the drawing), and the substrate W is tilted horizontally from a position vertically above the reference position 132S with the holder 52a. The holding portion 52a is formed at a position at a predetermined distance L2 (L2 > 0) to the side, that is, at a position shifted by L2. In this embodiment, L1 is set to 5 mm. As shown in FIG. 3 , with respect to the center Wc of the substrate W with a diameter of 300 mm held by the holding rod 132, the holding portion 52a is vertically L0 (here set to 13 mm, but the substrate (W) can be appropriately set.) The support 52 is positioned relative to the side wall 501b of the inner tub 501 so as to be positioned downward. As shown in FIG. 6 , the holding portions 52a corresponding to each of the plurality of holding grooves 1321 formed in the pitch L1 and the arrangement direction of the substrate W also have a pitch ( L1) is formed. That is, the holding part 52a is spaced apart at an interval equal to the distance between the center 1321c of the holding groove 1321, which is the distance between the adjacent holding grooves 1321, and the center 1321c of the adjacent holding groove 1321. (vertex 52ap) is arranged. At this time, as is clear from Fig. 6, the phases of the plurality of holding grooves 1321 and the phases of the corresponding plurality of holding portions 52a are shifted. That is, the positional relationship between the centers 1321c of the plurality of holding grooves 1321 arranged at equal intervals and the positional relationship of the plurality of holding portions 52a arranged at equal intervals correspondingly deviate from each other. The plurality of holding portions 52a are further out of phase with respect to the holding groove 1321 by an amount corresponding to the distance L2 to the left with respect to the reference position 132S out of phase by half the pitch L1. this is out of sync In FIG. 6 , the plurality of holding portions 52a are out of phase with respect to the holding groove 1321 to the left by one-half of the pitch L1, but out of phase with respect to the reference position 132S, to the right. It may be configured so as to be out of sync.

When viewed from a direction orthogonal to the side wall 501b of the inner tub 501, based on a position vertically upward of the reference position 132S, which is the center between the centers 1321c of the holding grooves 1321 of the holding bar 132 When the holding part 52a was arranged by changing the distance L2, the rotation angle of the substrate W was measured, and the result shown in FIG. 7 was obtained. At this time, the treatment temperature was 160.3 ° C., the treatment time was 120 minutes, the treatment flow was phosphoric acid treatment-washing-drying, and the bubbling with nitrogen gas was set at 13 liters per minute, among the four bubble pipes. It was set as the condition that one of the front side was closed and discharged from three. About the position of the holding part, it measured about the case where there was no shift|deviation from the vertical direction above the reference position 132S, and the case where it shifted vertically above the reference position 132S by 0.5 mm, 0.8 mm, and 1.0 mm. The rotation angle of the substrate W when the holder 52a was placed vertically above the reference position 132S was distributed in the range of -19 degrees to -39 degrees. In contrast, when the holding portion 52a is displaced by 0.5 mm, 0.8 mm, or 1.0 mm vertically above the reference position 132S, the rotation angles of the substrate W are -5 degrees to -10 degrees, respectively; It was distributed in the range of -2 degrees to -8 degrees and -6 degrees to -10 degrees. In this way, the rotation of the substrate W can be suppressed by displacing the holding portion 52a from a position above the reference position 132S, which is the center between the centers 1321c of the holding groove 1321, in the vertical direction. Could know. When the lifter 13 is lowered to the processing position, rotation of the substrate W can be suppressed by the holding portion and the holding groove.

<Example 2>

Hereinafter, Example 2 of the present invention will be described. The same reference numerals are used for components identical to those in Example 1, and detailed descriptions are omitted.

In Example 1, as shown in FIGS. 5 and 6 , the shape of the holding groove 1321 of the holding rod 132 (the holding rods 133 and 134 are the same) was wedge-shaped in cross section, but in Example 2 , the cross-sectional shape of the retaining groove 1322 is different.

As shown in Fig. 8(a), the circumferential edge portion (bevel portion) Wp of the substrate W may have a curved surface shape in which the circumferential end surface V is convex to the outer diameter side. In such a case, as shown in FIG. 8(b), the cross-sectional shape of the holding groove 1322 of the holding rod 132 is copied from the cross-sectional shape of the peripheral portion Wp of the substrate W, and the groove By making the bottom portion 1322a curved and straight toward the opening, the contact area between the substrate W and the holding groove 1322 increases, and the substrate W can be held more stably. Further, as shown in Fig. 8(b), the holding groove 1322 may be formed inclined in the arrangement direction of the substrate W so as to be inclined along the direction of the processing surface of the substrate W, or not inclined. You may form the holding groove 1322 in the vertical direction without it.

Further, in Example 1, the holding portions 52a and 53a are configured to come into contact with the peripheral portion Wfp of the surface of the substrate W, but the holding portions 52a and 53a have a curved surface shape of the substrate W It may be made to come into contact with the circumferential section (V) forming the. In this way, the substrate W can be held without the holding portions 52a and 53a contacting the surface of the substrate W.

<Example 3>

Hereinafter, Example 3 of the present invention will be described. The same reference numerals are used for components identical to those of Embodiments 1 and 2, and descriptions thereof are omitted.

In Example 3, the lifters 11, 13, and 15 move not only up and down, left and right, but also in the direction of the main transport mechanism and in the step direction, that is, the rear plate 131 side of the lifter 13 is rearward and the holding rod is moved relative to the back plate 131. When the direction in which (132, 133, 134) extends is made forward, it is comprised so that it can also move back and forth.

By moving the lifter 13 back and forth, the lifter 13 is lowered, and from the relative position of the lifter 13 with respect to the treatment tanks 5, 7, and 9 when the substrate W is immersed in the treatment liquid, (13) can be moved in the forward and backward directions in a state where it is lowered to the treatment position. The lifter 13 is lowered at a position where it does not interfere with the set holders 52a and 53a, and the lifter 13 is moved forward and backward so that the holders 52a and 53a are at an optimal position with respect to the substrate W. can be moved to That is, the conveying mechanism is configured such that the horizontal direction of the interval between the holding portions 52a and 53a and the substrate W can be changed. Then, when the lifter 13 is raised, the lifter 13 can be raised again after the substrate W is moved in the front-back direction to a position where it does not interfere with the holding portions 52a and 53a. In Examples 1 and 2, the holding portions 52a and 53a are attached to the inner tub 501 so that their positions can be adjusted, but the relative positions of the holding portions 52a and 53a with respect to the inner tub 501 in the front-back direction are fixed. It may be installed in such a way that the relative position of the substrate W and the holders 52a and 53a is adjusted to an appropriate position by moving the lifter 13 in the forward and backward directions. Further, as in Examples 1 and 2, the holding portions 52a and 53a are attached to the inner tub 501 by the supports 52 and 53, and by the forward and backward movement of the lifter 13, the substrate (W ) and the relative positions of the holding portions 52a and 53a may be finely adjusted.

<Example 4>

Hereinafter, Example 4 of the present invention will be described. The same reference numerals are used for components identical to those in Example 1, and detailed descriptions are omitted. Fig. 9(a) is a diagram showing the shape of the holding parts 52a, 53a and the relationship with the substrate W in Example 4 in a cross section passing through the central axis of the holding parts 52a, 53a. Fig. 9(b) is a cross-section showing the shape of the holders 52a and 53a and their relationship with the substrate W according to the modified example of Example 4, in a cross-section through the central axis of the holders 52a and 53a.

In Example 1, the holding portions 52a and 53a are formed as substantially conical projections, but in Example 4, the shapes of the holding portions 52a and 53a are different. Here, the holding portion 52a includes a needle-shaped main body 52a1 composed of a substantially conical portion having an apex 52a1p and a cylindrical portion, and a needle-shaped body composed of a substantially conical portion having an apex 52a2p and a cylindrical portion. It includes a body (52a2) of. The holding portion 53a includes a needle-shaped main body 53a1 composed of a substantially conical portion having an apex 53a1p and a cylindrical portion, and a needle-shaped main body composed of a substantially conical portion having an apex 53a2p and a cylindrical portion. Includes (53a2). At this time, the directions of the apex 52a1p, the apex 52a2p, the apex 53a1p, and the apex 53a2p all extend in a direction parallel to the longitudinal direction of the retaining groove 1321 .

As shown in Fig. 9(a), by making the cross-sectional shape of the holding portions 52a and 53a wedge-shaped sandwiched in the thickness direction of the substrate W, the contact area with the peripheral edge of the substrate W This increases, and the substrate W can be held more stably. The main body 52a1 of the holding portion 52a has a pointed shape having an apex 52a1p and a side surface 52a1s. Moreover, the main body 52a2 of the holding part 52a also has a pointed shape having an apex 52a2p and a side surface 52a2s. The main body 53a1 of the holding portion 53a has a pointed shape having an apex 53a1p and a side surface 53a1s. Moreover, the main body 53a2 of the holding part 53a also has a pointed shape having an apex 53a2p and a side surface 53a2s.

Moreover, as shown in FIG.9(b), the cross-sectional shape of holding part 52a, 53a may be a shape in which the both sides of the thickness direction of the board|substrate W are inserted. By sandwiching the circumferential edge of the substrate W from both sides in the thickness direction of the substrate W, the circumferential edge of the substrate W has a curved shape convex to the outer diameter side, or a wedge shape in FIG. 9(a) Even if it is not suitable, the substrate W can be held more stably by sandwiching the periphery of the substrate W from both sides. Here, the holding part 52a is configured in a concave groove shape by 52a1 and 52a2. The holding portion 53a is also configured in a concave groove shape by 53a1 and 53a2. The main body 52a1 of the holding portion 52a has a pointed shape having an apex 52a1p and a side surface 52a1s. Moreover, the main body 52a2 of the holding part 52a also has a pointed shape having an apex 52a2p and a side surface 52a2s. The main body 53a1 of the holding portion 53a has a pointed shape having an apex 53a1p and a side surface 53a1s. Moreover, the main body 53a2 of the holding part 53a also has a pointed shape having an apex 53a2p and a side surface 53a2s.

<Example 5>

Hereinafter, Example 5 of the present invention will be described. The same reference numerals are used for components identical to those in Example 1, and detailed descriptions are omitted. FIG. 10(a) is a diagram showing the positional relationship of the lifter 13, the substrate W, the support tool 52, and the holders 52a and 52b in the inner tub 501, as in FIG. 5 . Fig. 10(b) is an enlarged view showing the positional relationship between a part of the substrate W and the holding portions 52a and 52b in Fig. 10(a).

In Example 1, as shown in FIGS. 4 and 5 , holding portions 52a and 53a are attached to the supports 52 and 53 in the vertical direction including the normal line of the surface Wf of the substrate W. One each is formed for each substrate W on both sides of the virtual plane Vp in the horizontal direction, but in Example 5, the supports 52 and 53 hold the holding portions 52a and 53a and the lower side thereof. Each of the portions 52b and 53b is formed for each substrate W. The apex of the holding portion 52b is arranged on a substantially straight line tying the apex of the holding portion 52a and the end of the holding groove 1321 (positional relationship between the apex of the holding portion 53b, the apex of the holding portion 53a, and the end of the holding groove 1321 is also the same). The holding portions 52b and 53b are formed at positions shifted toward the positioning portion 524 side of the support tool 52 with respect to the corresponding holding portions 52a and 53a, and hold portions 52a and 53a and the corresponding holding portions 52a and 53a. It is located between the holding groove which holds the board|substrate W. Here, the holding portions 52b and 53b correspond to the second holding portion and the second abutting portion of the present invention.

There may be a plurality of holding units between L0 and the center 1321c of the holding groove 1321 in the above-described vertical direction, and the number and position thereof depend on the strength of the flow of the treatment liquid and bubbles upward from the bottom and the lifter It can be adjusted to suppress the rotation occurring in the substrate according to the elevation speed of the substrate due to the elevation of the substrate.

<Example of modification>

In the embodiment described above, the holding portions 52a and 53a are formed in substantially conical protrusions, needle-shaped protrusions, or grooves, but the shape of the holding portions 52a and 53a is not limited to this.

Further, in the above-described embodiment, the case where an aqueous phosphoric acid solution was used as the treatment liquid was described, but the treatment liquid is not limited to this, and other treatment liquids such as mixed acid (phosphoric acid, nitric acid, acetic acid, pure water) aqueous solution are used. The same can be applied to the case of

The embodiments and modified examples disclosed above can be combined respectively.

1: substrate processing device
13 : Lifter
1321, 1322, 1331, 1341: retaining groove
43: sub-transport mechanism
52a, 52b, 53a, 53b: holding part
501: domestic help
W: Substrate
Wp: bevel part

Claims (23)

a tank for storing a processing liquid for treating a substrate and immersing the substrate;
a holding member formed to hold the substrate in a standing position and to be able to move up and down between a delivery position and a processing position of the substrate with respect to the tank;
The holding member has a holding groove for holding the substrate from below,
In the state in which the holding member holds the substrate at the processing position, the substrate is located above the holding groove and at a position on both sides of a virtual plane in the vertical direction including a normal line of the surface of the substrate in the horizontal direction. A substrate processing apparatus characterized in that a holding portion for contacting with and suppressing rotation of the substrate is formed in the tank. According to claim 1,
Corresponding to each of the plurality of substrates held and arranged by the holding member, the holding groove and the holding portion are formed in the arrangement direction of the substrate,
With respect to a phase shifted from the phase of the plurality of holding grooves formed in the arrangement direction by half the pitch between adjacent holding grooves, the phases of the plurality of holding portions formed in the arrangement direction are set to be further shifted. A substrate processing apparatus characterized in that. According to claim 1 or 2,
The substrate processing apparatus according to claim 1, wherein the holding portion is formed at a position below a horizontal plane passing through the center of the substrate held by the holding member. According to claim 1 or 2,
The substrate processing apparatus according to claim 1, wherein the holding groove has a wedge shape in a cross section parallel to a vertical plane including a normal to the surface of the substrate. According to claim 1 or 2,
The substrate processing apparatus according to claim 1, wherein the holding groove has a shape in a cross section parallel to a vertical plane including a normal line of the surface of the substrate mimicking a shape in the cross section of a bevel portion of the substrate. According to claim 1 or 2,
A substrate processing apparatus comprising: a transport mechanism capable of horizontally changing a distance between the holding member and a surface of the substrate held by the holding member at a position where the holding member is lowered into the tank. According to claim 1 or 2,
The substrate processing apparatus, characterized in that the holding portion has a conical protrusion or groove shape. According to claim 1 or 2,
In the state in which the holding member holds the substrate at the processing position, the substrate is located above the holding groove and at a position on both sides of a virtual plane in the vertical direction including a normal line of the surface of the substrate in the horizontal direction. A substrate processing apparatus comprising: a second holding portion that abuts against and suppresses rotation of the substrate, provided below the holding portion. According to claim 1 or 2,
In the above article,
a discharge pipe for discharging the treatment liquid;
A substrate processing apparatus comprising a bubble supply pipe for supplying bubbles from the bottom of the tank. According to claim 1 or 2,
The holding portion has vertices spaced apart at intervals equal to intervals of the adjacent holding grooves above the holding groove of the holding member in the processing position and below the center of the depth of the nail, and the direction of the apex is A substrate processing apparatus characterized in that it has a sharp body extending in a direction parallel to the longitudinal direction of the holding groove. According to claim 10,
The substrate processing apparatus according to claim 1, wherein the pointed shape is a conical shape or a needle shape. According to claim 10,
A substrate processing apparatus further comprising a second holding portion below the holding portion and having a main body having an acute shape having apex spaced apart at an interval equal to an interval between adjacent holding grooves. According to claim 1 or 2,
The substrate processing apparatus according to claim 1, wherein the holding portion has a pointed shape. According to claim 1 or 2,
The holding part includes two main bodies formed to be sandwiched from both sides in the thickness direction of the substrate,
A substrate processing apparatus characterized in that at least one of the two main bodies abuts against the substrate. 15. The method of claim 14,
The two main bodies each have a conical conical portion and a columnar cylindrical portion. According to claim 1 or 2,
The substrate processing apparatus according to claim 1 , wherein the holding portion abuts against a circumferential edge portion of a surface of the substrate. According to claim 1 or 2,
Corresponding to each of the plurality of substrates held and arranged by the holding member, a plurality of the holding grooves and a plurality of the holding portions are formed at equal intervals in the arrangement direction of the substrates;
The substrate processing apparatus according to claim 1 , wherein a positional relationship between the centers of the plurality of holding grooves and a positional relationship between the plurality of holding portions arranged at equal intervals are shifted in the arrangement direction of the substrates. A tank for storing a treatment liquid and immersing and treating a substrate of a flat plate in a standing position;
a holding member having a plurality of concave holding grooves formed to be able to move up and down between the transfer position of the substrate and a processing position in the tank with respect to the tank, and holding and placing the board from below an upright position;
Above the holding groove of the holding member in the processing position and below the center of the depth of the nail, have apex spaced apart at intervals equal to the intervals of the adjacent holding grooves, and the direction of the apex is the direction of the holding groove. a main body having an acute shape extending in a direction parallel to the longitudinal direction, and having an abutting portion that abuts against the substrate held in the holding groove;
The substrate processing apparatus characterized in that the abutting portion is formed in the tank. According to claim 18,
The substrate processing apparatus according to claim 1, wherein the pointed shape is a conical shape or a needle shape. According to claim 18 or 19,
A substrate processing apparatus further comprising a second abutting portion below the abutting portion and having a main body having an acute shape having apex spaced apart at an interval equal to an interval between adjacent holding grooves. According to claim 18 or 19,
The substrate processing apparatus according to claim 1 , wherein the abutting portion abuts on a circumferential edge portion of a surface of the substrate. According to claim 18 or 19,
Corresponding to each of the plurality of substrates held and arranged by the holding member, a plurality of the holding grooves and a plurality of the abutting portions are formed at equal intervals in the arrangement direction of the substrates;
The substrate processing apparatus according to claim 1, wherein a positional relationship between the centers of the plurality of holding grooves and a positional relationship between the plurality of contact portions disposed at equal intervals are displaced in the arrangement direction of the substrates. According to claim 18 or 19,
The substrate processing apparatus according to claim 1, wherein the abutting portion suppresses rotation of the substrate.

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