JP3905239B2 - Substrate holder and substrate processing apparatus - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a substrate holder suitable for holding a substrate such as a semiconductor substrate, an FPD (Flat Panel Display) substrate such as a liquid crystal display or a plasma display substrate, a glass substrate for a photomask, and the substrate holder. The present invention relates to a substrate processing apparatus provided.
[0002]
[Prior art]
Conventionally, for example, a substrate processing apparatus in which a substrate such as a semiconductor substrate is held by a substrate holder, and the substrate is integrally immersed in the processing liquid stored in a processing tank so as to be processed integrally with the substrate holder is generally used. Are known.
[0003]
In this type of apparatus, for example, a substrate holding groove is formed in the substrate holder at regular intervals, and a plurality of substrates are in a standing posture, and the substrates are arranged in a line at regular intervals in parallel with each other. It comes to hold.
[0004]
In addition, since the substrate holder holds a plurality of substrates as described above, it needs to have sufficient rigidity, and since it is immersed in the processing liquid integrally with the substrate, it has chemical resistance and heat resistance. It must also be excellent in performance. Therefore, in general, the substrate holder is made of quartz that satisfies these conditions and is relatively easily available.
[0005]
[Problems to be solved by the invention]
However, the conventional substrate holder made of quartz has a problem that the substrate and the holding portion thereof are rubbed to generate particles or cracks are likely to occur in the substrate. Therefore, in recent years, it has been considered that the entire substrate holder is made of a resin material so that particles are not generated or cracks are not generated even if the substrate and the holding portion thereof are rubbed.
[0006]
However, since the substrate holder made of a resin material is deformed due to thermal expansion, for example, when immersed in a high-temperature processing solution, the pitch of the substrate holding groove changes, which changes the pitch of the substrate being processed. This may adversely affect the processing quality of the substrate or hinder the delivery of the substrate to a subsequent process.
[0007]
The present invention has been made in view of the above circumstances, can prevent the generation of particles and cracks due to rubbing between the substrate and its holding portion, and can appropriately process the substrate, and also delivers the substrate. It is an object of the present invention to provide a substrate holder and a substrate processing apparatus that can be satisfactorily performed.
[0008]
[Means for Solving the Problems]
In order to solve the above-described problems, a substrate holder of the present invention includes a holder body, a support member that is attached to the holder body and supports a plurality of substrates, and a fixing unit that fixes the support member to the holder body. The support member is made of a resin material having a lower hardness than the substrate to be supported and has a plurality of guide portions for arranging the substrate, and the fixing means is Protrusions having a triangular cross-section provided on the support member and mounting holes having a triangular cross-section provided on the holder body side into which the protrusions are fitted, and the holder body has V-grooves at a predetermined interval on a flat surface. A first member having a flat surface, and a second member fastened integrally with the first member in a state where the flat surface is superimposed on the V groove forming surface of the first member. The mounting hole is formed by a gap formed by the V-groove formed between the first and second members. (Claim 1).
[0009]
According to this substrate holder, the substrate is supported by the support member. However, since the hardness of the support member is lower than the hardness of the substrate, even if the substrate and its supporting portion are rubbed, particles and cracks of the substrate are hardly generated.
[0010]
In addition, since it is possible to configure only the portion that supports the substrate from the resin material, such a configuration results from the thermal expansion of the portion that supports the substrate as compared to the case where the entire substrate holder is configured from the resin material. Deformation is reduced. In addition, since the support member is restrained by the holder main body at one or a plurality of locations in the arrangement direction of the substrates and deformation at the restraint portion is suppressed, this suppresses deformation due to thermal expansion of the support member. Thus, the position variation of the guide portion is prevented. Therefore, even when the substrate is immersed in a high-temperature processing solution or the like integrally with the substrate holder, the arrangement of the substrates is favorably maintained.
[0011]
In the above configuration, the support member can be configured from a plurality of unit members separable in the arrangement direction of the substrate by the guide portion, and the fixing means can be configured to fix each unit member to the holder body. (Claim 2).
[0012]
In this way, when the support member is subdivided, deformation due to thermal expansion of the support member is smaller than when the entire support member is integrally formed.
[0013]
According to a first aspect of the present invention, the support member is composed of a plurality of guide pieces arranged in a row, and the guide portion is formed by a pair of adjacent guide pieces. The fixing means may be configured to fix the piece to the holder body (Claim 3).
[0014]
Also in this case, since the support member is subdivided, deformation due to thermal expansion of the support member is reduced as compared with the case where the entire support member is integrally formed. And since the position of each guide piece is restrained, the displacement of a guide part is prevented reliably.
[0016]
In the case of a substrate holder in which the guide portion is formed of a groove that supports the edge of the substrate, the substrates are in a standing posture, and the substrates are arranged so that adjacent substrates are parallel to each other, the interval between the substrates is set. Maintaining it properly is important for ensuring the processing quality of the substrate or for delivering the substrate satisfactorily. Therefore, the substrate holder having such a configuration is provided in the above-described claims. 3 It is effective to adopt one of the configurations (claims) 4 ).
[0017]
Claims 1 to 4 In the described substrate holder, the holder body is preferably made of quartz or silicon carbide (claims). 5 ).
[0018]
On the other hand, the guide member is preferably made of a resin material having a durometer hardness of D90 or less. 6 ). Specifically, a tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer or polytetrafluoroethylene can be used as a material (claims). 7 ).
[0019]
In order to solve the above problems, a substrate processing apparatus according to the present invention comprises the above-described claims. 7 The substrate holder according to any one of the above, a processing liquid supply means for supplying a processing liquid to the substrate held by the substrate holder, and a delivery means for delivering the substrate to and from the substrate holder. (Claims) 8 ).
[0020]
According to this apparatus, even when processing is performed by supplying a high-temperature processing liquid to the substrate, the arrangement of the substrates held by the substrate holder is less likely to vary. Therefore, the processing quality of the substrate can be kept good, and the substrate can be successfully delivered between the substrate holder and the delivery means.
[0021]
In addition, in an apparatus that includes a processing tank for storing a processing liquid as processing liquid supply means and supplies the processing liquid to the substrate by immersing the substrate in the processing liquid integrally with the substrate holder, a plurality of substrates are fixed. The apparatus is soaked in the treatment liquid while being held parallel to each other at intervals of 8 It is effective to adopt the following structure (claims) 9 ).
[0022]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described with reference to the drawings.
FIG. 1 is a schematic perspective view showing a substrate processing apparatus according to the present invention. Here, in order to clarify the directional relationship, XYZ rectangular coordinate axes are also shown.
[0023]
In this figure, a substrate processing apparatus 10 is an apparatus for processing a semiconductor substrate (simply referred to as a substrate W in the following description), a cassette carry-in / out stage 12, a cassette transfer robot 14, a substrate transfer unit 16, and a substrate transfer. A robot 18, a substrate processing unit 20, a substrate drying unit 22, and a cassette cleaning unit 24 are provided.
[0024]
The cassette loading / unloading stage 12 is located on the front side (+ Y direction), and two transfer cassettes C (hereinafter simply referred to as cassettes C) in which a plurality of substrates W before processing are stored in a standing posture are loaded from the outside. The loading unit 30 to be placed, and the unloading unit on which two cassettes C that are positioned in the rear side (−Y direction) and in which the plurality of substrates W processed by the substrate processing unit 20 are stored in a standing posture are placed. 32. Note that, for example, 25 substrates W in each cassette C in the cassette carry-in / out stage 12 are stored, for example, and are arranged in a line in the left-right direction (X direction) as shown in the figure. ing.
[0025]
The cassette carrying robot 14 is configured to be movable in the front-rear direction (Y direction) and the up-down direction (Z direction) and capable of reversing 180 degrees, and reversing 180 degrees while holding the cassette C loaded into the loading section 30. Then, the cassette C is conveyed to the substrate transfer unit 16, while the cassette C storing the processed substrate W in the substrate transfer unit 16 is turned 180 degrees while being gripped, and the cassette C is unloaded. To be taken out.
[0026]
The substrate transfer unit 16 takes out the unprocessed substrate W in the cassette C transported from the carry-in unit 30 to the upper side of the cassette C, while the substrate W processed by the substrate processing unit 20 enters the cassette C from above. It is to be stored.
[0027]
That is, the substrate transfer section 16 is provided with turntables 34 and 36 having openings 34a and 36a, respectively, and a substrate loading / unloading member (not shown) is provided below the turntables 34 and 36. Each of the substrate entry / exit members can be moved up and down over a drive position protruding above the table and a retracted position below the table via the openings 34a and 36a. Then, when the two cassettes C in which the unprocessed substrates W are stored are placed on the turntables 34 and 36, the turntables 34 and 36 are rotated 90 degrees in the opposite directions to each other. The orientations of the substrates W in the cassette C are set in a state in which they are aligned in the front-rear direction, and the substrate insertion / removal member is driven through the opening (not shown) formed below the cassette C. Thus, the substrate W is taken out of the cassette C. In addition, the substrate W processed by the substrate processing unit 20 is stored in each cassette C by the reverse operation.
[0028]
The substrate transfer robot 18 is configured to be movable in the left-right direction. The substrate transfer robot 16 integrally unifies a plurality of substrates W taken out from the two cassettes C by the substrate transfer unit 16 and aligned in a row. The substrate W is transferred to a later-described lifter 48 of the substrate processing unit 20, and the substrate W on the lifter 48 processed by the substrate processing unit 20 is held and transferred to the substrate loading / unloading member of the substrate transfer unit 16. Is. The substrate transfer robot 18 also transfers the substrate W between the plurality of lifters 48 of the substrate processing unit 20.
[0029]
For example, as shown in the figure, the substrate transfer robot 18 has a pair of substrate chucks 42 and 44 attached to a pair of arms 38 and 40, respectively. It is designed to be held in a damp manner.
[0030]
The substrate chucks 42 and 44 are rotatable with respect to the arms 38 and 40, respectively, and have holding portions for the substrate W on both front and back surfaces. A holding groove is formed at a fixed pitch in the front-rear direction in the holding part of the substrate W in the substrate chucks 42, 44, and each substrate W is held by holding the substrate W in the holding groove. W is held at equal intervals in the front-rear direction. For example, when the substrate W is transported from the substrate transfer unit 16 to the substrate processing unit 20, the substrate W is held on each surface of the substrate chucks 42 and 44, and is transferred from the substrate processing unit 20 to the substrate transfer unit 16. When transporting the substrate W, the substrate W is held on the back surfaces of the substrate chucks 42 and 44. In other words, the unprocessed substrate W and the processed substrate W are held on different surfaces of the substrate chucks 42 and 44 to prevent contamination of the processed substrate W.
[0031]
The substrate processing unit 20 processes the substrate W taken out from the cassette C by the substrate transfer unit 16. The substrate processing unit 20 includes a plurality (three in the figure) of processing tanks 46 in which processing liquid is stored, and each processing tank 46. The substrate W is disposed so as to be movable up and down and enters the processing tank while holding the substrate W, so that the substrate W is immersed in the processing liquid, while the substrate W which has exited from the processing tank and has been processed is removed from the processing liquid. And a lifter 48 for lifting. A predetermined process is performed on the substrate W in each processing tank 46 sequentially while delivering the substrate W between the substrate transfer robot 18 and the lifter 48 corresponding to each processing tank 46. The configuration of the lifter 48 will be described in detail later.
[0032]
The substrate drying unit 22 receives the substrate W processed by the substrate processing unit 20 from the lifter 48 by the substrate transport robot 18 and performs a drying process on the received substrate W. The cassette cleaning unit 24 cleans the empty cassette C after the unprocessed substrate W is taken out before storing the processed substrate W. The cassette cleaning unit 24 is an empty cassette in the substrate transfer unit 16. C is transported to the cassette cleaning section 24 by the cassette transport robot 14 for cleaning.
[0033]
2 to 5 show a specific configuration of the lifter 48 of the substrate processing unit 20.
As shown in FIG. 2, the lifter 48 has a lifting shaft 50 that can move in the vertical direction. A head portion 52 is provided at the upper end of the lifting shaft 50, and a substrate holding portion 54 that is a substrate holder according to the present invention is provided on the head portion 52.
[0034]
The substrate holding portion 54 is attached to the head portion 52 and extends downward, the left guide 62 and the right guide 64 that are attached to the left and right lower ends of the back plate 60 and extend in the front-rear direction, and these A central guide 66 that is similarly attached to the back plate 60 and extends in the front-rear direction, and an end plate 68 that connects the tip portions of the guides 62, 64, 66 are provided. They are held in a posture (state shown in the figure) and in parallel with each other in the front-rear direction at regular intervals.
[0035]
The configuration of each of the guides 62, 64, 66 will be described in detail by taking the central guide 66 as an example. The central guide 66 includes a frame 80 and a support member attached to the upper end of the frame 80 as shown in FIG. 82.
[0036]
As shown in FIGS. 4 and 5, the support member 82 is elongated in the front-rear direction, and a plurality of holding grooves 84 (guide portions) are formed at an upper portion thereof at a constant pitch in the front-rear direction. That is, the substrate W is held at a constant interval in the front-rear direction by supporting each holding groove 84 with the edge of the substrate W interposed.
[0037]
On the other hand, a plurality of protrusions 86 are provided on the back surface of the support member 82 at a constant pitch in the front-rear direction. The protrusion 86 is fitted into a mounting hole 81 formed in the frame 80, whereby the support member 82 is fixed to the frame 80. As shown in FIGS. 3 and 6, the frame 80 is configured by fastening a pair of left and right unit plates 80 a and 80 b to each other by bolts and nuts 85. The unit plate 80a on one side is formed with a plurality of V-grooves in the front-rear direction at a pitch corresponding to the protrusions 86. When the unit plates 80a and 80b are fastened and fixed, the mounting holes 81 are formed by the V-grooves. Is to be formed. In this embodiment, as shown in FIG. 6, the attachment hole 81 is a hole having a triangular cross section, and although not clearly shown, the protrusion 86 is formed in a triangular prism shape so as to be fitted into the attachment hole 81. ing.
[0038]
The above is the configuration of the center guide 66, but the left guide 62 and the right guide 64 are basically mounted on the frames 72 and 76 and the upper ends of these frames 72 and 76 in the same manner as the center guide 66. The support members 74 and 78 are included, and therefore detailed description thereof is omitted.
[0039]
In the substrate holding portion 54, the portions that directly support the substrate W, that is, the support members 74, 78, and 82 of the guides 62, 64, and 66 are made of a resin material, and other portions (corresponding to the holder main body of the present invention). Specifically, the back plate 60, the frames 72, 76, and 80 of the guides 62, 64, and 66 and the end plate 68 are made of quartz.
[0040]
As the material of the support members 74, 78, 82, a material having a hardness lower than that of the substrate W (semiconductor substrate) to be processed by the substrate processing apparatus 10 is used. In the present embodiment, the durometer hardness is not more than D90. A material, specifically, PFA (tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer; durometer hardness D60) or PTFE (polytetrafluoroethylene; durometer hardness D55) is applied. The durometer hardness means the hardness measured by ASTM (American Society for Testing and Materials) test method D1706.
[0041]
According to the substrate processing apparatus 10 configured as described above, the substrate W is loaded into the loading section 30 of the cassette loading / unloading stage 12 while being accommodated in the cassette C, and is transferred to the cassette C by the cassette carrying robot 14. The substrate is transferred to the substrate transfer unit 16 integrally. Then, after the substrate W is taken out from the upper part of the cassette C and transferred to the substrate transfer robot 18, it is transferred to the substrate processing unit 20 and transferred to the lifter 48 corresponding to the first processing tank 46 of the substrate processing unit 20. Delivered. Specifically, after the substrate transport robot 18 is set above the lifter 48, the lifter 48 is lifted. As a result, the substrate W is supported by the lifter 48 from below, and then the substrate chucks 42, 44 of the substrate transport robot 18 are moved. Opened. As a result, the substrate W is delivered to the lifter 48.
[0042]
When the substrate W is delivered, the lifter 48 is lowered and the substrate W is immersed in the processing liquid stored in the processing tank 46, whereby the substrate W is processed with the processing liquid. When the processing in the first processing tank 46 is completed, the substrate transfer robot 18 transfers the substrate W to the lifter 48 of the next processing tank 46. When the processing in the processing tank 46 is completed, the substrate transport robot is further transferred. 18, the substrate W is transferred to the lifter 48 of the next processing tank 46 and sequentially processed.
[0043]
When the processing in all the processing tanks 46 is completed in this manner, the substrate transport robot 18 transports the substrate W to the substrate drying unit 22. Next, after the drying process is performed here, the substrate W is transported above the cassette C set in the substrate transfer unit 16 by the substrate transport robot 18 and stored in the cassette C. Then, it is transported to the unloading unit 32 integrally with the cassette C by the cassette transport robot 14. Thus, a series of processing of the substrate W by the substrate processing apparatus 10 is completed.
[0044]
In such a series of processing operations, in the substrate processing apparatus 10, since the substrate holding portions 54 of the lifters 48 in the substrate processing portion 20 are configured as described above, the following operational effects can be obtained. .
[0045]
That is, in the substrate holding portion 54, the portions that directly support the substrate W, that is, the support members 74, 78, and 82 are made of a resin material having a hardness lower than that of the substrate W. Even if the member 74 or the like and the substrate W are rubbed, there is almost no generation of particles or cracks in the substrate W unlike the conventional case.
[0046]
Further, most of the substrate holding portion 54 is made of quartz, and only the portions (support members 74, 78, 82) that support the substrate W are made of a resin material as described above. Compared with the case where the whole is made of a resin material, the deformation due to thermal expansion of the portion supporting the substrate W is extremely small, and even if the substrate holding part 543 is immersed in a high-temperature treatment liquid integrally with the substrate W as described above, The variation in pitch generated in each holding groove 84 is extremely small to a negligible level. In addition, as described above, the support members 74, 78, 82 are fixed to the frames 72, 76, 80 at a plurality of positions in the front-rear direction, thereby effectively preventing the pitch variation of the holding grooves 84. . In other words, at the locations where the support members 74, 78, 82 are fixed, that is, where the projections 86 are inserted into the mounting holes 81, the support members 74, 78, 82 are restrained by the frames 72, 76, 80. Less likely to deform due to expansion. Therefore, in each of the support members 74, 78, 82 in which such restrained portions are provided at a plurality of positions in the front-rear direction, the support members 74, 78, 82 are not easily deformed in the front-rear direction, and thus the holding groove 84 Thus, the pitch fluctuation is prevented.
[0047]
Accordingly, when the substrate processing unit 20 processes the substrate W, it is possible to effectively prevent generation of particles due to rubbing of the substrate W or cracking of the substrate W, and the substrate W is immersed in a high-temperature processing solution. Even in this case, the interval between the supported substrates W can be appropriately maintained. For this reason, it is possible to effectively prevent deterioration of the processing quality due to the variation in the interval between the substrates W, and to transfer the substrate W between the lifter 48 and the substrate transport robot 18 satisfactorily.
[0048]
The substrate processing apparatus 10 described above is an embodiment of the substrate processing apparatus according to the present invention, and the specific configurations of the substrate processing apparatus 10 and the substrate holding part 54 are the same as the gist of the present invention. Changes can be made as appropriate without departing from the scope.
[0049]
For example, in the substrate holding portion 54 of the above-described embodiment, the entire support member 82 is integrally formed. However, the support member 82 has a structure that can be separated into a plurality of parts in the longitudinal direction, and each separated body (unit member) has a structure. A protrusion 86 may be provided. If the support member 82 has such a detailed structure, deformation due to thermal expansion of the entire support member 82 is reduced as compared with the case where the support member 82 is integrally formed. Can be prevented. In the configuration in which the holding groove 84 is formed in the support member 82 as described above, it is desirable that the thickness of the bottom portion of the holding groove 84 (indicated by the symbol h in FIG. 5) be sufficiently thin. In this way, when the support member 82 expands, the side wall portion of the holding groove 84 protrudes into the groove, thereby suppressing the deformation of the support member 82 in the longitudinal direction and causing the holding groove 84 to pitch. Fluctuation is less likely to occur.
[0050]
Further, instead of the configuration of the support member 82, for example, as shown in FIG. 7, conical guide pieces 88 made of a resin material such as PFA or PTFE are arranged in a row at the upper ends of the frames 72, 76, and 80. A structure of a support member that is mounted and that forms a holding groove 89 (see FIG. 8) for holding the substrate W by a guide piece 88 provided adjacently may be adopted. In this case, for example, as shown in FIG. 8, a shaft body 88a is integrally formed below the guide piece 88, and the guide body 88a is fitted into the mounting hole 81 of the frame 80 or the like. May be fixed to the frame 80 or the like. In this case, as shown in the figure, the shaft body 88a may be passed through the mounting hole 81 and welded to the frame 80 or the like from the back side. According to such a configuration, since the position of each guide piece 88 is completely restrained, the pitch of the holding grooves 89 does not fluctuate even if each guide piece 88 is thermally expanded, and the interval between the substrates W is appropriately set. Can keep. The guide piece 88 is not limited to the conical shape as described above, and may be appropriately selected so that the substrate W can be satisfactorily held.
[0051]
In the substrate processing apparatus 10 described above, the configuration of the substrate holder according to the present invention is applied to the lifter 48 of the substrate processing unit 20, but the substrate chucks 42 and 44 of the substrate transfer robot 18 and the substrate transfer unit 16 are also used. The structure of the substrate holder according to the present invention can also be adopted for the substrate in / out member.
[0052]
Further, in this type of substrate processing apparatus, there is also an apparatus for storing a substrate W in a processing cassette and processing the substrate W by immersing the substrate W in a processing liquid integrally with the processing cassette. Then, you may make it employ | adopt the structure of the board | substrate holder which concerns on this invention for the processing cassette. In this case, as shown in FIG. 9, a box-shaped case main body 90 having an upper opening made of quartz is provided, and guide pieces 92 made of a resin material are attached therein at regular intervals, A holding groove 93 for holding the substrate W may be formed inside the case 90 by the guide piece 92 provided adjacently. In this case, as shown in FIG. 10, the guide piece 92 is provided with a projection 94 for attachment, and a through hole 91 for attachment is formed in the case body 90, and the projection 94 is inserted into the through hole 91. The guide piece 92 may be attached to the case main body 90 by being penetrated through and welded from the opposite side. According to such a configuration, even when the substrate W is stored in the processing cassette and immersed in the processing liquid, the processing cassette and the substrate W are rubbed to generate particles, or the substrate W is cracked. In addition, the substrate can be taken in and out from the processing cassette. That is, the configuration of the substrate holder according to the present invention can be applied to various portions that hold the substrate W.
[0053]
In the above-described embodiment, the support members 74, 78, and 82 are made of PFA or PTFE. Of course, the support members 74, 78, and 82 are resin materials having a hardness lower than that of the substrate W. If it is satisfied, it is possible to use other resin materials. In this case, in the above embodiment, it is desirable to use a resin material having a durometer hardness of D90 or less in order to process a semiconductor substrate as the substrate W. When the substrate W is a substrate other than a semiconductor substrate, the resin material constituting the support members 74, 78, and 82 is a resin material having a lower hardness than the substrate, depending on the material of the substrate. Appropriate selection may be made within a range that satisfies the corresponding requirements.
[0054]
【The invention's effect】
As described above, in the substrate holder of the present invention, since the supporting member that supports the substrate is made of a resin material having a lower hardness than the substrate that should not be supported, the substrate is rubbed with the supporting portion and particles are generated. Or cracks in the substrate hardly occur. In addition, since it is possible to configure only the portion that supports the substrate from the resin material, such a configuration results from the thermal expansion of the portion that supports the substrate as compared to the case where the entire substrate holder is configured from the resin material. Deformation is reduced. In addition, the support member is fixed to the holder main body at one or a plurality of positions in the arrangement direction of the substrates, thereby preventing the deformation of the support member in the arrangement direction, and thus formed on the support member. Displacement due to thermal expansion of the guide portion is well prevented. Therefore, even when the substrate is immersed in a high-temperature processing liquid or the like integrally with the substrate holder, the substrate arrangement is maintained well, and deterioration of the processing quality due to variations in the interval between the substrates is prevented. Moreover, the delivery of the substrate can be performed well.
[0055]
In the substrate holder as described above, in particular, if the support member is composed of a plurality of unit members that can be separated in the arrangement direction of the substrate by the guide portion, the thermal expansion of the support member as compared with the case where the entire support member is integrally formed. Therefore, the displacement of the guide portion can be more effectively prevented. In addition, the support member is composed of a plurality of guide pieces arranged in a row, and even if the guide portion is formed by a pair of adjacent guide pieces, the support member is similarly subdivided, The displacement of the guide portion can be effectively prevented.
[0057]
In addition, in the substrate holder in which the guide portion is formed of a groove, and the substrates are arranged in an upright posture and adjacent substrates are parallel to each other, it is possible to ensure processing quality by appropriately maintaining the interval between the substrates. It becomes important in the above. Therefore, it is effective to employ each of the above configurations for the substrate holder having such a configuration.
[0058]
In the above configuration, the holder body is made of quartz or silicon carbide, and the support member is a material having a durometer hardness of D90 or less, specifically, a tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer. Alternatively, if polytetrafluoroethylene is used as a material, good results can be obtained.
[0059]
On the other hand, the substrate processing apparatus of the present invention delivers a substrate between the substrate holder, the processing liquid supply means for supplying a processing liquid to the substrate held by the substrate holder, and the substrate holder. Since the delivery means is provided, particles are hardly generated even when the substrate held by the substrate holder is rubbed with the supporting portion, and cracks are hardly generated in the substrate. In addition, even when processing is performed by supplying a high-temperature processing solution to the substrate, the interval between the substrates held by the substrate holder can be appropriately maintained, so that the processing quality due to variations in the interval between the substrates being processed Deterioration of the substrate can be prevented in advance, and the delivery of the substrate between the substrate holder and the delivery means can be performed well.
[Brief description of the drawings]
FIG. 1 is a perspective view showing an embodiment of a substrate processing apparatus according to the present invention.
FIG. 2 is a perspective view showing a configuration of a substrate holding part applied to a lifter.
3 is a cross-sectional view (partial cross-sectional view) of FIG.
FIG. 4 is a view taken in the direction of arrow B in FIG. 3 showing the center guide.
5 is a cross-sectional view taken along the line CC of FIG. 4 showing the center guide.
6 is a cross-sectional view taken along the line DD of FIG. 5 showing the center guide.
FIG. 7 is a perspective view showing another configuration of the substrate holding unit.
8 is a cross-sectional view showing a central guide of the substrate holding part shown in FIG.
FIG. 9 is a perspective view showing an example in which the configuration of the substrate holder according to the present invention is applied to a processing cassette.
FIG. 10 is a sectional view of a processing cassette showing a guide piece mounting structure;
[Explanation of symbols]
10 Substrate processing equipment
18 Substrate transfer robot
20 Substrate processing section
46 treatment tank
48 Lifter
50 Lifting shaft
52 Head
60 Backboard
62 Left guide
64 Right Guide
66 Central Guide
68 End plate
72, 76, 80 Support member
74, 78, 82 Guide member
84 Holding groove
W substrate

Claims (9)

A holder body, a support member attached to the holder body and supporting a plurality of substrates, and a fixing means for fixing the support member to the holder body, wherein the support member is harder than the substrate to be supported. A plurality of guide portions for arranging the substrate and the fixing means are provided on the side of the holder main body and the protrusion having a triangular cross section provided on the support member, A mounting hole having a triangular cross-section into which the protrusion is inserted;
The holder body includes a first member having a V-groove formed on the flat surface at a predetermined interval, and a flat surface, and the flat surface is superimposed on the V-groove forming surface of the first member. A second member integrally fastened to the first member, and the attachment hole is formed by a gap formed by the V-groove formed between the first and second members. Substrate holder.   The said support member is comprised from the several unit member which can be isolate | separated in the sequence direction of the board | substrate by the said guide part, The said fixing means fixes each said unit member to a holder main body. Board holder.   The support member is configured to form the guide portion by a pair of adjacent guide pieces arranged in a row, and the fixing means attaches the guide pieces to the holder body. The substrate holder according to claim 1, wherein the substrate holder is fixed. The said guide part is a groove | channel which supports the edge part of a board | substrate, Comprising: Each board | substrate is arranged so that a board | substrate may be in a standing posture and adjacent board | substrates may become mutually parallel . The substrate holder according to any one of the above. The retainer body has a substrate holder according to any one of claims 1 to 4, characterized that you have configured the quartz or silicon carbide as a material. The substrate holder according to claim 1 , wherein the support member is made of a resin material having a durometer hardness of D90 or less . The support member is a tetrafluoroethylene - perfluoroalkyl vinyl ether copolymer or a substrate holder according to claim 6 Symbol mounting, characterized in that it is configured polytetrafluoroethylene as material. Transfer of a substrate between the substrate holder according to any one of claims 1 to 7, a processing liquid supply means for supplying a processing liquid to the substrate held by the substrate holder, and the substrate holder. it and a transfer means for performing a substrate processing apparatus it said. Said treatment liquid supply means includes a process tank for storing the treating liquid, a substrate of claim 8, wherein that you supplying a processing liquid to a substrate by immersion in the treatment liquid together with the substrate holder Substrate processing equipment.

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