JP3202898B2 - Transfer device, transfer method, cleaning device and cleaning method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a transfer device, a transfer method, a cleaning device, and a cleaning method.

[0002]

2. Description of the Related Art For example, a cleaning process in a manufacturing process of a semiconductor device such as an LSI will be described. Conventionally, contamination of particles, organic contaminants, metal impurities, and the like on the surface of a semiconductor wafer (hereinafter, referred to as "wafer") is considered. Cleaning devices are used to remove the particles. Among them, a wet type cleaning device can effectively remove particles and can perform batch processing.
Widespread.

In such a cleaning apparatus, there is provided a loading mechanism for loading a predetermined number of wafers, for example, 25 wafers, in a cassette unit, a transfer device for transporting a predetermined number of wafers loaded by the loading mechanism, for example, 50 wafers, and The apparatus includes a plurality of processing tanks arranged so as to collectively wash the wafers transferred by the transfer device, and an unload mechanism for unloading the wafers cleaned by each processing tank.

The transfer device has a holding device called a wafer chuck, which holds a predetermined number of wafers, for example, 50 wafers, simultaneously when transferring the wafers to each of the processing tanks. This holding device usually has a pair of holding members facing each other, and each holding member is provided with an upper holding body and a lower holding body each having a holding groove formed in parallel,
The peripheral edge of the object is held by these holding grooves, and the holding groove of the lower holder supports the load of the object to hold the wafer. The holding groove of the upper holding body prevents the wafer from tipping over, and maintains the alignment between the wafers at a predetermined interval.

In this case, even in the peripheral portion of the wafer where no pattern is formed, it is necessary to minimize the contact area with the holding groove in order to prevent damage to particles and the wafer itself. Moreover, in holding the peripheral portion of the wafer by the holding body, the wider the frontage, the easier it is to deliver the wafer into the groove, and the jump slot and the like can be prevented. Therefore, conventionally, in view of these points, the cross-sectional shape (cross-sectional shape of the groove inner wall) of each of the holding grooves of the upper holding body and the lower holding body has been formed to be substantially V-shaped.

On the other hand, a holder called a boat for holding the wafer transferred by the transfer device is provided in a processing tank for cleaning the wafer. The holding tool collectively receives and holds the wafers held by the holding device, so that a plurality of holding grooves corresponding to the holding grooves in the holding device are formed. Is vertically received to hold the wafer at a predetermined holding position. Also, in the holding grooves of these holders, similarly to the case of the above-described holding body, the cross-sectional shape is formed to be V-shaped.

[0007]

However, if the cross-sectional shape of the holding groove is V-shaped as described above, the range of rotation of the wafer in the surface direction around the groove bottom also becomes large. That is, the so-called "play" is increased. As a result, the wafers contact each other between adjacent wafers,
Particles may be generated or the wafer may be damaged. Even when the wafers do not come into contact with each other, if the spacing between the wafers is too small, when the aligned wafers are pulled up from the processing bath by the wafer chuck, the distance between the wafers may be reduced due to the surface tension of the cleaning solution. Drops of the cleaning liquid may remain in between, which may adversely affect the subsequent processing.

In a processing bath for cleaning a wafer using a high-temperature chemical, for example, the chemical may be boiled while the wafer is immersed in the cleaning liquid. Further, in order to clean the wafer or the wafer chuck, bubbling of N ₂ gas may be performed in the cleaning liquid. However, if the depth of the holding groove supporting the wafer is not sufficient, the wafer moves with the force of the boiling cleaning liquid or the force of N ₂ bubbling during cleaning, and the peripheral edge of the wafer comes off from the holding groove, so-called, Problems such as jump slots may occur.

SUMMARY OF THE INVENTION The present invention has been made in view of such problems, and has a holding device in a transfer device for transferring an object to be processed such as a wafer as described above, and a holding groove in a holding tool in a processing tank. It is an object of the present invention to provide a transfer device that can improve a shape, have a wide frontage, and reduce a contact area with a workpiece as much as possible, while regulating a distance between aligned workpieces within an appropriate range. It is assumed that.

Further, according to the present invention, by using the holding groove having the improved shape, the transfer between the transfer device and the holder can be performed quickly without risk of damaging the workpiece. Another object of the present invention is to provide a new transport method. Further, the present invention also provides a cleaning apparatus and a cleaning method using these transporting apparatuses and transporting methods, and has an object to realize a high-yield and high-throughput cleaning process without a jump slot. is there.

[0011]

According to one aspect of the present invention, there is provided an upper holding member having a pair of holding members opposed to each other, each holding member having a holding groove formed therein. And the lower holding body are provided in parallel, the peripheral edge of the processing target is held by these holding grooves, and the load of the processing target is supported by the holding grooves of the lower holding body. In the transfer device configured to transfer the lower holding body,
The cross-sectional shape of the holding groove is V-shaped, the cross-sectional shape of the holding groove of the upper holding body is a two-step tapered shape, and the opening angle of the first tapered portion on the opening side is the same as that of the second tapered portion on the groove bottom side. A transfer device is provided, wherein the transfer device is set to be larger than the opening angle.

In the case of the transfer device of the first aspect, the cross-sectional shape of the holding groove of the upper holding member for preventing the object to be overturned is a two-step tapered shape, and the opening angle of the first tapered portion on the opening side is
The opening angle of the second tapered portion on the groove bottom side is set to be larger than the opening angle. Therefore, the opening (frontage) of the groove can be widened, and the held peripheral portion of the object can be held in the second tapered portion on the groove bottom side where the opening angle is narrower. As a result, the range of rotation of the held object to be processed in the surface direction can be more restricted than before, and the clearance between the objects can be appropriately maintained.

According to a second aspect of the present invention, a transfer device configured to transfer the object to be processed while holding the object to be processed by a pair of holding members is used. In the transfer method for transferring a body, among the holding grooves of the holder, a cross-sectional shape of a holding groove that supports a load of the processing target is V-shaped, and a cross-sectional shape of a holding groove that does not support the load of the processing target is 2. a stage tapered, the opening angle of the upper tapered portion of the opening side is set larger than the opening angle of the lower tapered portion of the groove bottom side, to convey the result object to be processed to said conveying device
The moving speed of the holding member at the time of
The delivery is characterized by switching to a relatively high speed before delivery to the lower taper portion of the holding groove of the holding tool , and thereafter to a relatively low speed until delivery and holding at least to the lower taper portion. A method is provided.

According to a second aspect of the present invention, there is provided a transfer method for transferring an object to be processed from a holding member to a holder, and supporting a load of the object in a holding groove of the holder. The cross-sectional shape of the holding groove not to be formed is a two-step taper shape in which the opening angle of the upper taper portion on the opening side is larger than the opening angle of the lower taper portion on the groove bottom portion, and the moving speed of the holding member in the transfer device. Is switched to a relatively high speed until the peripheral portion of the object to be processed is delivered to the lower tapered portion of the holding groove, and thereafter is switched to a relatively low speed until at least the lower edge portion is delivered and held at the lower tapered portion. It has become.

That is, it is fast until the peripheral edge of the workpiece enters the upper tapered portion that regulates the rotation direction of the workpiece that is actually held, and then when the workpiece is delivered into the lower tapered portion on the groove bottom side. They will be delivered at a slower rate. Therefore, since the speed is set according to the situation, it is possible to prevent the generation of particles and to carry out the transfer quickly within a range where there is no danger of damaging the workpiece. After the transfer is completed, the holding member may be retracted at a high speed.

According to the second aspect of the present invention, as described in the third aspect, the holding member of the transfer device further includes a holding groove for holding a peripheral portion of the object to be processed. The holding body and the lower holding body are provided in parallel, and the holding groove of the lower holding body is configured to support the load of the object to be processed, and the holding groove of the lower holding body is cut off.
The surface shape is V-shaped, the cross-sectional shape of the holding groove of the upper holding body is a two-step taper shape, and the opening angle of the first taper portion on the opening side is larger than the opening angle of the second taper portion on the groove bottom side. You may set it large.

According to the third aspect of the present invention, the holding groove formed in the upper holding body of the holding member in this case also has a two-step tapered shape. it can. Therefore, the transfer according to claim 2 can be performed while appropriately maintaining the clearance between the objects to be processed.
In this case, since the holding groove formed in the upper holding body of the holding member also has a two-step tapered shape, when the holding member is evacuated after the transfer to the holding member is completed, the holding member is held by the holding member. The holding member is moved and retracted at a relatively low speed while the peripheral edge of the processed object is still in the second tapered portion of the upper holding member, and at a relatively high speed after being detached from the second tapered portion. If this is the case, a more secure evacuation operation of the holding member can be performed.

According to the fourth aspect, the processing is performed by the pair of holding members.
It is configured to transport this object while holding the body.
With a holding device with holding grooves using
The transport method for transporting the processed object from the holder
And each of the holding members in the transfer device is
An upper side retaining groove with a retaining groove for retaining the periphery of the body
The holding body and the lower holding body are provided in parallel, and the holding of the lower holding body is performed.
The holding groove is configured to support the load of the object to be processed.
The cross-sectional shape of the holding groove of the lower holding body is V-shaped.
The cross-sectional shape of the holding groove of the upper holding body is a two-step tapered shape.
And the opening angle of the first taper portion on the opening side is changed to the first angle on the groove bottom side.
2 is set larger than the opening angle of the tapered portion,
To the deviceTherefore, the speed of the holding member when holding the workpiece
The peripheral portion of the object to be processed is theHolding groove of upper holderTo
High speed before delivery to the second tapered part
And then deliver to and hold at least the second taper
Until it is switched to a relatively slow speed
A transport method is provided.

According to a fourth aspect of the present invention, the transfer speed of the holding member when transferring the object from the holder to the holding member of the transfer device is such that the peripheral edge of the object is the holding groove of the upper holder. Is switched to a relatively high speed until it is delivered to the second taper portion, and then to a relatively low speed until the transfer into the second taper portion is completed. Accordingly, the movement in the second tapered portion having a small opening angle is slow, and the transfer can be performed without the risk of damaging the workpiece by preventing the generation of particles. Of course, after the transfer to the holding member is completed, it may be moved at a high speed.

In the transportation method according to the fourth aspect, as described in the fifth aspect, the holding groove of the holder is further provided.
In addition, the cross-sectional shape of the holding groove that supports the load of the workpiece is V-shaped.
The cross-sectional shape of the holding groove that does not support the load of the workpiece is a two-step taper shape, and the opening angle of the upper taper portion on the opening side is set to be larger than the opening angle of the lower taper portion on the groove bottom side. Is also good.

According to the fifth aspect, the holding groove in the holder is also 2
Because of the step taper shape, the range of movement of the object to be held is small, the transfer can be performed smoothly, and the generation and damage of particles at the time of contact can be prevented.

In the transfer method according to the second, third, and fifth aspects, as described in the sixth aspect, in the holder , the lower tapered portion may be deeper than the upper tapered portion .

According to the sixth aspect, the lower tapered portion of the holding groove in the holder is deepened, and when the object to be processed is held by the holder, the peripheral portion of the object to be processed is usually in the lower tapered portion. It is in a state of being fitted deeper. For this reason, there is no fear that the object to be processed held by the holder is removed from the holding groove during cleaning, and problems such as a jump slot caused by boiling of the cleaning solution and bubbling of N ₂ gas are eliminated. .

[0024]

[0025]

According to claim 7 , a plurality of holding grooves are provided on the upper surface.
The formed push-up member accommodates a plurality of workpieces
The storage member is inserted relatively into the opening on the lower surface side of the storage member to
An object to be processed in a member is held in the holding groove and the storage member
Up and then held up by this push-up member
The object to be processed is held by a pair of holding members.
A transfer device configured to transfer the object to be processed as it is
In the method of conveying from the push-up member using
Te, wherein each holding member in the conveying device, provided in parallel with the upper holding member holding grooves are formed for holding the peripheral portion of each target object and the lower retaining member, and retaining the lower retaining member The groove is configured to support the load of the object to be processed, the cross-sectional shape of the holding groove of the lower holding body is V-shaped, and the cross-sectional shape of the holding groove of the upper holding body is a two-step tapered shape,
The opening angle of the first tapered portion of the opening side is set larger than the opening angle of the second tapered portion of the groove bottom side, of the holding member when holding the result workpiece to the transfer device <br/> The speed is relatively high until the peripheral portion of the object to be processed is delivered to the second tapered portion in the holding groove of the upper holding body , and thereafter, the speed is delivered and held at least to the second tapered portion. Up to a relatively low speed.

[0027] A seventh aspect of the present invention is characterized in that when the object to be processed pushed up from the storage member is transferred, the transfer device is transferred to the holding member. Since it has a step taper shape, basically the same operation and effect as the above-described claim 4 can be obtained.

[0028]

[0029]

According to an eighth aspect of the present invention, there is provided a push-up member having a plurality of holding grooves formed on an upper surface thereof by using a transfer device configured to transfer the object to be processed while holding the object to be processed by a pair of holding members. In the method of transporting the object to be processed ,
In each of the holding members in the transport device, an upper holding body and a lower holding body each having a holding groove for holding a peripheral portion of the object to be processed are provided in parallel, and the holding grooves of the lower holding body are provided. The cross-sectional shape of the holding groove of the lower holding body is V-shaped, the cross-sectional shape of the holding groove of the upper holding body is a two-step tapered shape, An opening angle of the first taper portion is set to be larger than an opening angle of the second taper portion on the groove bottom side, and the push-up member is provided.
The retaining groove and two-stage tapered shape, the opening angle of the upper tapered portion of the opening side is set larger than the opening angle of the lower tapered portion of the groove bottom side, to convey the result object to be processed to said conveying device
The moving speed of the holding member at the time of
A transport method characterized by switching to a relatively high speed before delivery to a lower taper portion in the holding groove of the push-up member , and thereafter to a relatively low speed until delivery and holding at least to the lower taper portion. Provided.

[0031] According to claim 8, also holding groove formed in the upper holder of the holding member in this case, since a two-stage tapered shape, to suppress the rotational range of the object being conveyed and held it can. Therefore, it is possible to carry the object while appropriately maintaining the clearance between the objects. In the case of this eighth aspect, the holding groove also because a two-stage tapered shape formed in the upper holder in still retaining member,
When the holding member is evacuated after the transfer to the push-up member is completed, while the peripheral portion of the object held by the push-up member is still in the second taper portion of the upper holding member, the second holding member is moved at a relatively low speed. If the holding member is moved and evacuated at a relatively high speed after being detached from the tapered portion, a further safe evacuating operation of the holding member can be performed.

In a ninth aspect of the present invention, there is provided a transfer device configured to transfer the object to be processed while holding the object to be processed, and a processing tank for storing a cleaning treatment liquid. In the cleaning device configured to transport and immerse the cleaning object in the cleaning treatment liquid to wash the object, the transport device has a pair of holding members facing each other, and each holding member includes
An upper holding body and a lower holding body each having a holding groove are provided in parallel, the peripheral portion of the processing target is held by these holding grooves, and the holding groove of the lower holding body is used to hold the processing target. It is configured to convey the object to be processed while supporting a load, and further has a V-shaped cross section of a holding groove of the lower holding body,
The cross-sectional shape of the holding groove of the upper holding body is a two-step tapered shape, and the opening angle of the first tapered portion on the opening side is set larger than the opening angle of the second tapered portion on the groove bottom side. A cleaning device is provided.

[0033] In the cleaning apparatus of the ninth aspect , the holding member in the transporting apparatus for transporting the object to be processed to the processing tank is the first aspect.
In the same manner as in claim 1, it is possible to carry out the transfer of the workpieces while appropriately maintaining the clearance between the workpieces, and to perform the transport by contact. And the generation of particles is prevented, and the transfer of the cleaning processing liquid while being interposed between the processing objects is also prevented.

According to the tenth aspect, there is provided a transfer device configured to transfer the object to be processed while holding it, and a processing tank for storing a cleaning treatment liquid, and the object to be processed is stored in the processing tank by the transfer device. In a cleaning apparatus configured to wash the object to be processed by being immersed in a cleaning treatment liquid, a holder for holding the object to be processed is installed in the processing tank, and In the holding groove of the holder,
The cross-sectional shape of the holding groove to support is V-shaped,
A cross-sectional shape of a holding groove that does not support weight is a two-step tapered shape, and an opening angle of an upper taper portion on an opening side is set to be larger than an opening angle of a lower taper portion on a groove bottom portion. Is provided.

In the cleaning apparatus according to the tenth aspect , since the holding groove for holding the object to be processed in the processing tank is formed with a two-step tapered holding groove, the cleaning device is provided between the objects to be processed during the cleaning process. By appropriately maintaining the clearance, damage to the object to be processed and generation of particles due to contact are prevented. In addition, since “play” when the object is held can be reduced, the object to be processed can be smoothly transferred to the holding member of the transfer device, and the cleaning effect can be improved. According to claim 11, the object to be processed is held.
And a transport device configured to transport the cleaning solution.
And a processing tank for transferring the object to be processed by the transfer device.
And then immersed in the cleaning solution to remove the object.
In a cleaning apparatus configured to perform cleaning, the transfer device
The device has a pair of holding members facing each other, and each holding member has
Are an upper holding body and a lower holding body each having a holding groove formed therein.
Are provided in parallel, and the peripheral edge of the object is
Holding and the load of the object to be processed in the holding groove of the lower holding body.
The object to be processed is transported while supporting the object.
And the cross-sectional shape of the holding groove of the lower holding body is V-shaped.
And the cross-sectional shape of the holding groove of the upper holding body is two-step tapered.
And the opening angle of the first tapered portion on the opening side is set at the groove bottom.
Set to be larger than the opening angle of the second taper part on the side
A holder for holding the object to be processed is provided in the processing tank.
Install and load the object to be processed in the holding groove of the holder.
The cross-sectional shape of the holding groove supporting the weight is V-shaped,
The cross-sectional shape of the holding groove that does not support the load of
And the opening angle of the upper taper part on the opening side is lower than that of the groove bottom side.
The feature is that it is set larger than the opening angle of the side taper part
A cleaning device is provided.

Further, in the cleaning device according to the tenth or eleventh aspect, as described in the twelfth aspect, in the holder , the lower tapered portion may be deeper than the upper tapered portion .

According to the twelfth aspect of the present invention, since the holding member in the transporting device for transporting the object to be processed to the processing tank has the features described in the sixth aspect, the cleaning device has the same features as in the sixth aspect. In cleaning the object to be processed, it is difficult for the held object to be removed from the holding groove, and the problem such as a jump slot caused by boiling of the cleaning liquid is solved.

[0038]

[0039]

According to a thirteenth aspect of the present invention, the object to be processed is transported by the transport device to the holder installed in the processing tank storing the cleaning treatment liquid, and the object is transferred to the holding groove formed in the holder. In a cleaning method of holding a processing object and cleaning the processing target object with the cleaning treatment liquid, a cross-sectional shape of a holding groove for supporting a load of the processing target among the holding grooves of the holding tool may be V-shaped. the cross-sectional shape of the holding grooves do not support the load of the body a two-stage tapered shape, the opening angle of the upper tapered portion of the opening side is set larger than the opening angle of the lower tapered portion of the groove bottom side, depending on the conveying device When transporting the workpiece
The moving speed of the holding member is relatively high until the object is immersed in the cleaning solution, and then the rim is delivered to the lower tapered portion of the holding groove after the immersion. A cleaning method characterized by switching to a relatively medium speed before performing the cleaning, and then to a relatively low speed until at least the lower tapered portion is delivered and held.

In the cleaning method according to the thirteenth aspect , in the process of transferring the object to be processed into the processing tank storing the cleaning processing liquid, the substrate is immersed in the cleaning processing liquid at a relatively high speed outside the cleaning processing liquid. A holding member that holds the object to be processed at a relatively medium speed until it enters the narrow lower taper portion of the holding groove of the holding tool, and at a relatively low speed until it enters the lower taper portion and is completely held. Is moving. In other words, when immersed in the cleaning solution, move at a relatively medium speed where fluid resistance is large, and then carefully move at a relatively low speed after entering the narrow lower tapered portion of the holding groove, which is a narrow space. Can be. Therefore, since the speed is set according to the situation, safe and quick transfer can be performed, and as a result, cleaning can be performed while preventing a decrease in the yield and improving the throughput.

Further, in the cleaning device according to the thirteenth aspect, as described in the fourteenth aspect, the holder is attached to the holder .
The lower tapered portion may be deeper than the upper tapered portion .

In the cleaning device according to the thirteenth aspect , the holding member in the transport device that transports the object to be processed to the processing tank has the features described in the sixth and twelfth aspects.
As in the case of the sixth and twelfth aspects, in cleaning the object to be processed, the held object to be processed is less likely to fall out of the holding groove, and the problem of a jump slot caused by boiling of the cleaning solution is solved.

According to the fifteenth aspect, the object to be processed, which is held in the holder provided in the processing tank storing the cleaning processing liquid, is immersed in the cleaning processing liquid for cleaning. In the cleaning method in which the object to be processed is held by the holding member and transferred to the outside of the processing tank as it is, a holding groove for holding a peripheral portion of the object to be processed is formed in each holding member in the transfer device. The upper holding member and the lower holding member are provided in parallel with each other, and the holding groove of the lower holding member is configured to support the load of the object to be processed, and further, the cross-sectional shape of the holding groove of the lower holding member Is V-shaped, the cross-sectional shape of the holding groove of the upper holding body is a two-step tapered shape, and the opening angle of the first tapered portion on the opening side is set larger than the opening angle of the second tapered portion on the groove bottom side. and, therefore the workpiece to the transfer device
The holding member is held at a relatively high speed until the peripheral portion of the object to be processed is delivered to the second tapered portion in the holding groove of the upper holding member .
It is relatively slow until it is delivered and held in the taper 2
Switch and transport the workpiece held by the transport device.
The moving speed of the holding member at the time of feeding, the cleaning of the object to be processed
After being lifted from the processing liquid, the object to be processed is
A transport method is provided, characterized in that switching is performed at a relatively high speed as compared with that during immersion . The speed of the holding member at the time of holding the object to be processed as referred to in claim 15 refers to, for example, the speed at which the object to be processed is held by a rotating operation, and the holding member at the time of transporting the held object.
And the moving speed, after holding the workpiece, for example holding portion
The speed at which the material rises.

In the cleaning method according to the fifteenth aspect , in the process of transporting the object to be processed after the cleaning process in the processing tank is finished to the outside of the processing tank, the second holding member of the transporting device may have a narrow second holding member. Until the peripheral part of the object to be processed is delivered to the tapered part, for example, the holding operation by rotation is carefully slow, and after being delivered and held, it is immersed in the cleaning treatment liquid in the tank. During this period, the speed does not increase so much in view of the fluid resistance, and after being lifted from the cleaning solution, it can be moved at a high speed. Therefore, as in the case of the tenth aspect , the speed is set according to the situation, so that the yield can be prevented from lowering and the throughput can be improved.

[0046]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the accompanying drawings. This embodiment is an example applied to a semiconductor wafer (hereinafter, referred to as "wafer") cleaning apparatus. First, the entire cleaning apparatus will be described. As shown in FIG. 1, the cleaning apparatus 1 includes a loading unit 2 for loading a wafer before cleaning processing in a carrier unit and a cleaning processing of the wafer. The cleaning section 3 includes a cleaning section 3 and a carry-out section 4 for taking out the wafer after the cleaning processing in units of carriers.

The carrier C containing a predetermined number of uncleaned wafers, for example, 25, is loaded into the carry-in section 2.
A placement unit 5 on which the carrier is placed and a transfer device 7 for transferring the placed carrier C to the alignment unit 6 are provided. The cleaning unit 3 has three transfer units 11, 12, and 13 arranged on the front side (front side in FIG. 1), and each of the transfer units 11, 12, and 13 has a corresponding wafer. Chucks 14, 15, 16 are provided.
The wafer chuck 14 of the transfer device 11 holds two carriers (50 wafers) from the alignment unit 6 for two carriers.
Thereafter, these wafers are transported to a cleaning tank described later.

Further, also in the unloading section 4, a placing section 8 having substantially the same configuration as the placing section 5, an aligning section (not shown) having the same configuration as the aligning section 6, and the transfer device 7. Transfer devices (not shown) having the same configuration are provided.

The cleaning section 3 includes, in order from the mounting section 5 side, a chuck cleaning / drying processing tank 21 for cleaning and drying the wafer chuck 14 of the transfer device 11, an organic contaminant on the wafer surface, metal impurities, A chemical cleaning tank 22 for cleaning impurities such as particles with a chemical liquid, two water cleaning tanks 23 and 24 for cleaning wafers cleaned in the chemical cleaning tank 22 with pure water, for example, the chemical cleaning tank A chemical cleaning tank 25 for cleaning with a chemical liquid different from the chemical liquid in 22; two cleaning tanks 26 and 27 for cleaning the wafers cleaned in the chemical cleaning tank 25 with pure water, for example; A cleaning / drying processing tank 28 for cleaning and drying the wafer chuck 16 of the above, and the wafer from which the impurities have been removed are, for example, IPA (isopropanol). Drying tank 29 for causing the steam dried pills alcohol) or the like, are respectively disposed. Each of the processing tanks 21 to 29 may be configured such that, for example, bubbling of N ₂ gas is performed from the bottom of the tank in order to improve a cleaning effect or the like. In particular, the chemical cleaning tank 22 and the chemical cleaning tank 25 are configured so that the chemical can be boiled while the wafer is immersed in the cleaning liquid.

Next, the details of the transfer apparatus according to the present embodiment will be described, for example, in such a structure that the wafer is transferred between the rinsing and cleaning tank 24, the chemical cleaning tank 25, and the rinsing tank 26 shown in FIG. The above described wafer chuck 15 in the transfer device 12 is constituted by a pair of left and right holding members 31 and 41 for holding, for example, 50 wafers W in a batch. .

The holding members 31 and 41 are symmetrical in the left and right directions.
Supported by The support 17 is moved in the vertical direction (Z direction) by a drive mechanism 18, and the wafer chuck 15 itself is moved in the front-rear direction (Y direction) by a drive mechanism (not shown) built in the support 17. The drive mechanism 18 itself is configured to be movable, and the drive mechanism 18 itself is provided on an upper portion of a transport base 19 (shown in FIG. 1) that is movable along the longitudinal direction (X direction) of the cleaning section 3. ing. The driving shafts 32 and 42 are reciprocally rotatable by a driving body (not shown) such as a motor provided in the support portion 17 as shown by a reciprocating rotation arrow in FIG. It is configured so that The support portion 17 itself can be finely adjusted in the θ direction.

The pair of holding members 31 and 41 constituting the wafer chuck 15 are bilaterally symmetric.
More specifically, the holding member 31 includes a mounting member 33 fixed to an upper end of the holding member 31 and the forward rotation shaft 32,
A stay 3 suspended from the front and rear ends of the mounting member 33
4, 35, a reinforcing bar 36 extending substantially above the center of the stays 34, 35, a substantially rod-shaped lower support 37 extending between lower ends of the stays 34, 35, and a lower support 37
And a substantially rod-shaped upper support 38 which is passed in parallel above.

On the surface of the upper support 38, a holding groove 39 shown in FIG. 4 is provided at a predetermined interval, for example, an 8-inch wafer, toward the opposite holding member 41 side.
Fifty pieces are formed at 6.35 mm intervals. This holding groove 3
Reference numeral 9 has a two-stage tapered cross section, and is composed of a first tapered portion 39a on the opening side and a second tapered portion 39b on the groove bottom portion 39c side. The opening angle of the first tapered portion 39a is 50 to 70 °, for example, 60 ° ± 4 ° when holding an 8-inch wafer, that is, the opening angle θ ₁ on one side centering on the groove bottom 39c is 30 ° ± 30 °. It is set to be 2 ゜. The opening angle of the second tapered portion 39b is 20 to 40 °, for example, 30 ° ± 4 ° when holding an 8-inch wafer, that is, the opening angle θ ₂ on one side centering on the groove bottom 39c is 15 ° ± 5 °. It is set to be 2 ゜.

In the present embodiment, the groove bottom 39
c is formed so as to have an arcuate cross section, and its radius of curvature is set to 0.3 to 0.8 mm, for example, 0.5 mm ± 0.2 mm. Further say the depth of the retaining groove 39, as shown in FIG. 4, there depth L ₁ of the first taper portion 39a is 3mm, and set the depth L ₂ also 3mm of the second taper portion 39b The total depth of the holding groove 39 is 6 mm. Note the depth L ₁ of the first taper portion 39a, the depth L ₂ of the second taper portion 39b can be arbitrarily set in a suitable range according to the size of the wafer.

According to the holding groove 39 set as described above, for example, as shown in FIG. 5, the peripheral edge of the 8-inch wafer W has a gap with the bottom 39c in the holding groove 39 of about 1 mm. When held at intervals, the left and right rotation is regulated by the second tapered portion 39b, but as described above, in the present embodiment, the second tapered portion 39b
Is set to 28 °, and as shown in FIG. 6, the closest approach width D to another wafer W ′ held by another adjacent holding groove 39 ′ is 2 mm. . Of course, this closest approach width D is ₁ according to the interval between the above-mentioned holding grooves 39 and the opening angle θ1 on _one side about the groove bottom 39c.
It can be arbitrarily selected within a range of up to 3 mm.

On the surface of the lower holding member 37, holding grooves 40 for directly receiving and supporting the load of the wafer W are formed at the same pitch and the same number as the holding grooves 39. . As shown in FIG. 7, the holding groove 40 is formed in a V-shaped cross section, and its opening angle is 50 ° to 70 °, that is, the opening angle θ ₃ on one side centering on the groove bottom 40a. It is set to be between 25 ° and 35 °. The depth L ₃ of the holding groove 40 is set to 4 mm, it is set to the curvature radius 0.3mm~0.8mm the groove bottom 40a.

The other holding member 42 facing the holding member 31 configured in this manner also includes the upper holding member 48 in which the holding groove 39 is formed and the lower holding member 47 in which the holding groove 40 is formed. We have each. And the wafer chuck 15
The holding members 31 and 41 are opened and closed by the rotation of the rotation shafts 32 and 42, and the lower end peripheral portion of the wafer W to be processed is held by the opposed lower holding members 37 and 47 so that the wafer W The load of W is supported, and at the same time, the upper end supports 38 and 48 which are opposed to each other hold the side peripheral edges thereof to prevent the wafer W from tipping over.

More specifically, each lower holding member 37, 47
When the load is supported by the holding groove 40 through the peripheral portion of the wafer W, the holding groove 3 of each of the upper support members 38 and 48 is
In FIG. 9, another peripheral portion of the wafer W is delivered and held in the second tapered portion 39b.
In other words, when the other peripheral portion of the wafer W has not yet entered the second tapered portion 39b, the peripheral portion of the wafer W is not supported by the holding grooves 40 of the lower holding members 37 and 47. State.

The other transfer devices 11 and 13 and their wafer chucks 14 and 16 have the same configuration as the transfer device 12 and the wafer chuck 15 described above.

As shown in FIG. 2 and FIG.
A boat 51 serving as a holder for holding the wafer W in the processing tank is provided. The boat 51 includes a support 5
2, and holding portions 53, 54, and 55 supported by the support body 52 are provided at the lower portion, respectively.

Of the holding parts 53, 54, 55, fifty holding grooves 56 are formed at the same pitch as the holding grooves 39 of the upper holding body 38 on the surface of the holding part 54 located at the center. I have. The holding groove 56 is for preventing the wafer W from tipping over, and has a two-step tapered cross section as shown in FIG.
a, the lower tapered portion 56b on the groove bottom portion 56c side. The opening angle of the upper tapered portion 56a is set to 50 ° to 70 °, that is, the opening angle θ _{4 of} one side centering on the groove bottom 56c is set to 25 ° to 35 °,
The opening angle is 10 ° to 20 ° of the lower tapered portion 56b, i.e., one side of the opening angle theta ₅ around the groove bottom 56c is 5 ° to
It is set to be 10 °.

[0062] Also the depth of the holding groove 56, in the example shown in FIG. 9, the depth L ₅ of the upper tapered portion 56a is 3m
m, the depth L ₄ of the lower tapered portion 56b is also set to 3 mm, and the entire depth of the holding groove 56 is 6 mm. With this setting, the upper holding body 38 of the wafer chuck 15
As in the case of the holding groove 39, the closest distance between the tips of the held wafers W is 2 mm.

[0063] Of course, the depth L ₄ of the depth L ₅ and the lower tapered portion 56b of the upper tapered portion 56a is capable of appropriately changed. In the example shown in FIG. 10, the depth L ₅ of the upper tapered portion 56a of the retention groove 56 Examples as well as 3mm in FIG
Although has a structure depth L ₄ of the lower tapered portion 56b is obtained by deep 5mm than the example of FIG. Thus, in the example of FIG. 10, the ratio L of the depth of the depth L ₅ and the lower tapered portion 56b of the upper tapered portion 56a L _{4 5:} L ₄ is 3: set to be 5 . However, also in the example shown in FIG. 10, the upper tapered portion 56a
The opening angle is 50 ° to 70 ° and the opening angle θ ₄ on one side is 2
The lower taper portion 56 is set to be 5 ° to 35 °.
opening angle of b is set so that the angle theta ₅ open 10 ° to 20 ° on one side is 5 ° to 10 °.

Of the holding portions 53, 54, 55, the holding portions 53, 55 located on both sides are symmetrical, and each surface has 50 holding portions at the same pitch as the holding grooves 56. A groove 57 is formed. This holding groove 57 is for directly supporting the load of the wafer W, and is shown in FIG.
As shown in the figure, the cross-sectional shape is formed in a V-shape, and the opening angle thereof is set to 60 °, that is, the opening angle θ ₆ on one side centering on the groove bottom 57a is set to 30 °.
Further depth L ₆ of the holding groove 57 is set to 4 mm, the radius of curvature of the groove bottom portion 40a is set to 0.4 mm. The opening angle θ ₆ on one side around the groove bottom 57a is also 1
The depth L ₆ of the holding groove 57 is also set to an appropriate depth between 3 and 10 mm, for example, 4 mm.

When the load of the wafer W is supported by the holding grooves 57 of the holding portions 53 and 55 via the peripheral portion,
Another peripheral portion of the wafer W is delivered and held in the lower tape portion 56b of the holding groove 56 of the holding portion 54, and the other peripheral portion of the wafer W is still in the holding groove 56. When the wafer W does not enter the lower tape portion 56b, the peripheral portion of the wafer W is not supported by the holding grooves 57 of the holding portions 53 and 55.

The cleaning apparatus 1 according to the present embodiment is configured as described above. Next, an example of performing a cleaning process on a wafer W using the cleaning apparatus 1 will be described.
For example, when a carrier C containing uncleaned wafers is placed in the loading section 2 by a transfer robot (not shown), the orientation device is aligned, and the transfer device 7 is moved.
Then, only the wafer W is pushed up from the carrier C by the pushing-up device (not shown) installed in the sorting unit 6. Then, first, the wafer chuck 14 of the transfer device 11
The wafers W are collectively held, and thereafter, the wafers W are collectively held by the chemical liquid cleaning processing tank 22, the water cleaning processing tank 23, and then the wafer chuck 15 of the transfer device 12, and the water cleaning cleaning tank 24, the chemical liquid cleaning processing tank 25, the wafer W is immersed in the processing tank, and a predetermined cleaning process is performed on the wafer W.

When the wafer W is immersed in each processing tank,
The wafer W held by the wafer chuck is collectively transferred to a boat installed in each of the processing tanks described above. This will be described in detail. Based on the process of transporting and transferring the wafer W held by the wafer chuck 15 to the boat 51 that has been set, first, as shown in FIG.
When the wafer chuck 15 moves in the X direction to a predetermined position above the chemical cleaning tank 25, the wafer chuck 1
5 moves downward along the Z direction. The moving (falling) speed at this time is relatively high.

Then, the lower end of the held wafer W is
When the liquid W starts to be immersed in the chemical liquid in the chemical liquid cleaning processing tank 25, the moving speed becomes a relatively medium speed (as will be described later, compared to the moving speed after the lower edge of the wafer W enters the lower tapered portion 56b). (High speed), the speed is reduced, and the vehicle descends to a preset stop point. The timing of stopping the wafer chuck 15 is, for example, as shown in FIG.
And the center P of the wafer W held by the difference between the center P ₀ of the wafer W when the wafer W is held by the boat 51, may be set based on the d _1.

In the present embodiment, the state shown in FIG.
That is, while the peripheral edge of the lower end of the wafer W is in the upper tapered portion 56a of the holding groove 56 of the holding portion 54, as shown in FIG.
As shown in FIG. 5, before delivery to the lower tapered portion 56b of the holding groove 56, the relative middle speed (after the lower edge of the wafer W enters the lower tapered portion 56b as described later). (Relatively faster than the moving speed). When the lower edge of the wafer W is further lowered and enters the lower tapered portion 56b, the moving (lowering) speed is switched to a relatively low speed, and thereafter, at least as shown in FIGS. As described above, the load of the wafer W is
5 is moved down at the relative low speed until it is supported by the holding groove 57 of FIG. The setting was changed, and the state shown in FIG.
6 may be set to a relatively middle speed or a high speed until it enters the upper tapered portion 56a, and then delivered to the upper tapered portion 56a and set to a relatively low speed until the state shown in FIG.

In this embodiment, the wafer W shown in FIG. 13B is lowered even after being held by the holding portions 53, 54 and 55, and as shown in FIG. Center P of wafer W when supported by 53, 54, 55
Than _0, towards the center P of the wafer W when not hold the wafer W by the wafer chuck 15 is lowered at a rate of at the relative low speed to 3mm down position (d ₂ in FIG. 13 (c)) It is set to let.

As shown in FIG. 13B, it is conceivable that the peripheral edge of the lower end of the wafer W may come into contact with the bottom 56c of the holding groove 56 of the holding portion 54 due to the problem of processing accuracy of the holding groove and the like. Can be However, the radius of curvature of the periphery of this type of 8-inch wafer is usually 0.3 mm, whereas the width of the bottom 56c of the holding groove 56 in the present embodiment is larger than that. Therefore, even if such a peripheral edge of the lower end of the wafer W and the bottom 56c of the holding groove 56 are in contact with each other, the contact portion is extremely small, and the generation of particles due to the contact is suppressed as much as possible. There is almost no damage from contact.

Then, the wafer chuck 15
After the holding member has descended to the above-described descending point, the rotating shafts 32 and 42 are opened and rotated as shown in FIG. 13D, and as shown in FIGS. 13E and 17, Then, the holding grooves 40 of the lower support members 37 and 47 of the holding members 31 and 41 are opened to a position where they do not cover the peripheral edge of the wafer W. 13 (c) to 13 (d) is relatively low, and FIGS. 13 (d) to 13 (d) are relatively low speeds. A relatively high speed may be set up to (e). Next, after the state of FIG. 13 (e), while maintaining the opening degree of the holding members 31, 41,
The wafer chuck 15 is raised in the Z direction, and the holding members 31 and 41 are pulled up from the chemical liquid cleaning processing tank 25.

Next, the wafer W held by the boat 51 in the chemical cleaning tank 25 is cleaned with a predetermined chemical. In the chemical cleaning tank 25, in order to increase the cleaning efficiency during the cleaning, boiling of the chemical or bubbling of N ₂ gas may be performed while the wafer W is immersed in the chemical. However, the wafer W held by the boat 51 is held in the holding groove 56 of the holding portion 54.
In the cleaning process, the wafer W oscillates due to the flow of the boiling chemical solution and the force of the bubbling gas because the closest distance between the tips of the held wafers W is appropriately set by the lower tapered portion 56b. However, the wafers W do not come into contact with each other. Accordingly, generation, damage, and the like of particles due to contact with the wafer W during cleaning are prevented.

Further, when the wafer W is moved by the force of the boiling cleaning liquid or the force of N ₂ bubbling, the holding grooves 56 and 57 are moved.
Although the problem such as a so-called jump slot in which the peripheral edge of the wafer W comes out of the holding groove 56 tends to occur, such an opening angle of the lower tapered portion 56b in the holding groove 56 is smaller than the opening angle of the upper tapered portion 56a. It is possible to effectively prevent occurrence of a jump slot.
In particular, in the example shown in FIG. 10 described above, since the lower tapered portion 56b is formed deep in the holding groove 56, it is difficult for the wafer W to fall out of the holding groove 56, and the generation of such a jump slot is more effectively performed. It is possible to prevent.

On the other hand, as the lower tapered portion 56b of the holding groove 56 of the holder 54 is deepened, the problem of the jump slot of the wafer W is solved, but on the other hand, if the lower tapered portion 56b is too deep. As shown in FIG. 10, the lower tapered portion 56b extends to a portion (device forming portion of the wafer W) W ″ beyond an edge cut portion (a portion of the peripheral portion of the wafer W where a device is not formed) W ′. undesirably it becomes possible to fit into. the lower the depth L ₅ of the upper tapered portion 56a side tapered portion 56
problem wafer W transfer of difficult as compared to the b depth L ₄ into the holding groove 56 of the holder 54 and much less occur. The device forming portion W "of the wafer W does not fit into the lower tapered portion 56b, the wafer W can be smoothly transferred to the holding groove 56 of the holder 54, and problems such as jump slots can be effectively solved. For this purpose, as shown in FIG.
The depth of the upper tapered portion 56a of 6 L ₅ and the lower tapered part 56
The ratio L of b in the depth L _{4 5:} L ₄ is 3: is most appropriate to the 5.

After the cleaning, when the wafer W is pulled up from the chemical cleaning tank 25 and transferred to the next water cleaning tank 26, the wafer W is basically transferred to the boat 51 described above. It is performed through a procedure that is completely the reverse of the process of transferring. That is, first, the wafer chuck 15
Moves into the chemical solution cleaning tank 25 at a relatively high speed, and then switches to a relative medium speed after being immersed in the chemical solution in the chemical solution cleaning tank 25, and thereafter, until the state shown in FIG. Descent at speed and stop. 13 (e) to 13 (d), the legs of the rotation shafts 32 and 42 are closed at a relatively high speed.

In the course of the closing movement, the boat 51
The peripheral edge of the side of the wafer W held by the upper support members 37, 4 of the holding members 31, 41 of the wafer chuck 15
8 is moved (closed legs) at such a relatively high speed until the wafer W enters the second tapered portion 39b in each holding groove 39, and the wafer W is moved into the second tapered portion 39b at the time of FIG.
After the perimeter of the side edge starts to be delivered, the speed is switched to a relatively low speed, and the legs are closed at the same speed for a while. That is, from FIG. 13 (d) to FIG. 13 (c), the rotation is switched to a relatively low speed, and the legs 32 and 42 are closed. The lowering movement of the wafer chuck 15 and the rotation shafts 32 and 42
And the closed leg movement may be appropriately advanced simultaneously.

Then, at the time point of FIG.
The closing movement of the leg 42 is stopped, and thereafter the wafer chuck 15 is moved upward. In this case, the speed of the upward movement is first set to a relatively low speed. Then, as shown in FIG. 13 (b), the wafer W is placed on the lower support 3 via its peripheral edge.
After the wafer W is supported by the holding groove 40 and the peripheral portion of the wafer W is delivered into the second tapered portion 39b and the wafer W is held, for example, the relative position is maintained until the time of FIG. The wafer W is raised at a low speed, and thereafter the wafer W is
5, the wafer W is moved upward at a relatively medium speed while being immersed in the chemical liquid in the chemical liquid cleaning processing tank 25. After the wafer W is pulled up from the chemical liquid in the chemical liquid cleaning processing tank 25, the wafer W is switched to a relatively high speed, and the next wafer W is moved It is conveyed to the washing and cleaning treatment tank 26.

As described above, the wafer W can be damaged by moving the holding members 31 and 41 of the wafer chuck 15, that is, moving the holding members 31 and 41 at the respective speeds of ascending / descending and opening / closing rotations. It is possible to quickly carry and transfer the wafer W within a range that does not exist. That is, when the wafer W is transferred between the boat 51 and the wafer chuck 15, the transfer can be performed without damaging the wafer W and without generating particles. Since the wafer chuck 15 is moved at a relatively high speed, the transfer of the wafer W can be performed safely and quickly as a result.

In the present embodiment, after the transfer is completed, the wafer chuck 15 is relatively moved at a medium speed while the wafer chuck 15 is still immersed in the chemical solution in the chemical solution cleaning tank 25, and the speed is further increased after being lifted from the chemical solution. The method of moving is adopted.
Therefore, scattering of the chemical solution and the like are also suppressed, and an appropriate transport speed is switched while suppressing contamination in the cleaning device 1.

In addition, each holding groove 3 of each of the upper supports 37 and 48 of the holding members 31 and 41 in the wafer chuck 15.
Reference numeral 9 denotes a two-stage tapered shape. As described above, when the holding groove 39 is held by the second tapered portion 39b, the closest approach distance between the leading ends of the wafer W is 1 to 3 mm. Since the value of the range is set to, for example, 2 mm, when the wafer W is pulled up from the chemical solution in the chemical solution cleaning tank 25, even if a drop of the chemical solution adheres to the surface of the wafer W, it is adjacent to the wafer W. The chemical solution is not caught between the wafers and does not remain between the wafers W due to its surface tension.
Drip down as it is. Therefore, there is no risk of contaminating the wafer W or hindering subsequent processing.

Further, the wafer chuck 15
Since the distance between the wafers W held in the wafer W is appropriately set, there is a possibility that adjacent wafers W may come into contact with each other during transfer by the wafer chuck 15 and generate or damage particles. Not something.

The above-described determination of the speed switching time is performed by using a pulse motor or the like as a driving source for realizing the movement of the wafer chuck 15 in the Z direction and the rotation of the rotation shafts 32 and 42, and the speed switching. This can be done easily if the points are performed based on a preset number of reference pulses. That is, the movement amount of the wafer chuck 15 may be measured by a pulse counter as appropriate, and may be set so that the speed of the pulse motor is switched at a predetermined accumulated pulse number.

In the cleaning apparatus 1, as described above, a process in which only the wafer W is pushed up from the carrier C by the pushing-up device (not shown) provided in the alignment section 6 is performed. In this type of push-up device, for example, as shown in FIG. 18, a predetermined number, for example, 25, holding grooves for holding the wafer W are formed on the upper surface of a vertically movable push-up member 81 at predetermined intervals. . When pushing up, for example, pushing up member 8
1 to raise the opening 82 provided on the lower surface of the carrier C.
, The wafer W in the carrier C is held by the holding groove, and the push-up member 81 is further raised as it is.
The wafer W is pushed up from the carrier C. On the other hand, a method has also been proposed in which the carrier C is lowered to achieve the thrust of the push-up member 81 relative to the wafer W to push the wafer W up.

In any case, such a holding groove may be formed as a holding groove 83 having a two-stage tapered cross section as shown in FIG. This holding groove 83 is
The opening angle of the upper taper portion 83a on the opening side is
It is set larger than the lower tapered portion 83b on the c side.

In the above-described push-up operation, the relative push-up movement is not always performed at the same speed as described above, but the speed is appropriately changed, as shown in FIG. The lower edge is
The wafer W may be moved up at a relatively high speed until it enters the lower tapered portion 83b of the holding groove 83, and then at a relatively low speed until at least the lower peripheral edge of the wafer W is supported by the holding groove 83.

As described above, by performing the speed switching in accordance with the situation, it is possible to perform a quick push-up operation while suppressing damage and generation of particles due to contact between the peripheral edge of the lower end of the wafer W and the inner wall of the holding groove 83. Things.

Further, when the wafer W after being pushed up is transferred by the wafer chuck 14, the wafer W is transferred to the wafer chuck 14 from the boat 51 in the processing tank in the above-described embodiment. Chuck 15
As in the case of transfer to the server, the speed may be switched.

[0089]

According to the first aspect of the present invention, since the cross-sectional shape of the holding groove of the upper holding member for preventing the object to be overturned has a two-step tapered shape, the frontage of the object is wide. This can be done smoothly when receiving, and after holding, since the peripheral edge of the object is contained in the second tapered portion having a small opening angle, the clearance between the objects can be appropriately maintained. Therefore, contact between the objects to be processed is prevented, and transfer to another object can be performed smoothly.

According to the transfer method of the present invention, the moving speed of the holding member of the transfer device is set at a speed according to the situation, thereby preventing generation of particles and damaging the object to be processed. Rapid conveyance is possible within a danger-free range, and yield and throughput can be improved. According to the transfer method of the third aspect, in addition to the above-mentioned effects, it is possible to further appropriately maintain the clearance between the objects to be processed, to prevent contact between the objects to be processed, and to facilitate the transfer.

According to the transfer method of the fourth aspect, when transferring the workpiece from the holder to the holding member of the transfer device, the moving speed of the holding member of the transfer device is set to a speed according to the situation. Therefore, it is possible to prevent the generation of particles and to carry out the transfer quickly within a range where there is no danger of damage to the object to be processed, thereby improving the yield and the throughput.

According to the transfer method of the fifth aspect, in addition to the above-described effects, the holding groove of the holder has a two-step tapered shape. It is possible to prevent contact and facilitate transfer.

According to the transfer method of the sixth aspect, since the lower tapered portion of the holding groove in the holder is further deepened, there is no fear that the object to be processed held by the holder comes off, and a problem such as a so-called jump slot is provided. Will be eliminated.

[0094]

According to the eighth aspect, when the object to be processed is transferred from the holding member of the transfer device to the push-up member, the moving speed of the holding member of the transfer device is set to a speed according to the situation. It is possible to prevent the occurrence of the occurrence and to quickly transport the object within a range where there is no danger of the object itself being damaged, thereby improving the yield and the throughput. In addition to this effect, furthermore, appropriately maintaining the clearance between the objects to be processed, preventing contact between the objects to be processed,
It is possible to facilitate the transfer.

According to the cleaning apparatus of the ninth aspect, when the object to be processed is transported to the processing tank, this can be performed while appropriately maintaining the clearance between the objects to be processed, and the object to be processed can be contacted. Damage and generation of particles are prevented, and the transfer of the cleaning processing liquid while being sandwiched between the processing objects is also prevented.

According to the cleaning apparatus of the tenth aspect , during the cleaning process, the clearance between the objects to be processed is appropriately maintained, and the damage to the object due to the contact and the generation of particles are prevented. Also, the transfer of the object to be processed to the holding member of the transfer device can be performed smoothly.

In the cleaning apparatus according to the twelfth aspect , similarly to the sixth aspect, in cleaning the object, it becomes difficult for the held object to fall out of the holding groove, and the problem of a jump slot is solved.

[0099]

According to the cleaning method of the thirteenth aspect , in the process of transferring an object to be processed into the processing tank storing the cleaning processing liquid, the speed is set according to the situation, so that the speed is safe and quick. Transfer can be performed, and as a result, cleaning that improves the yield and improves the throughput can be performed.

In the cleaning apparatus of the fourteenth aspect , as in the case of the sixth and twelfth aspects, when cleaning the object to be processed,
It is difficult for the held object to fall out of the holding groove, and problems such as jump slots are eliminated.

In the cleaning method according to the fifteenth aspect , in the process of transporting the object to be processed after the cleaning processing in the processing tank to the outside of the processing tank, the speed is set according to the situation, so that the yield is increased. And the throughput can be improved.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an overview of a cleaning apparatus according to an embodiment of the present invention.

FIG. 2 is a perspective view of a transport device in the cleaning device of FIG.

FIG. 3 is a front view of a holding member in the transfer device of FIG. 2;

FIG. 4 is an explanatory cross-sectional view of a two-step tapered holding groove formed in an upper support of the holding member of FIG. 3;

FIG. 5 is an explanatory cross-sectional view showing a state where a peripheral edge of a wafer is held in a holding groove of FIG. 4;

6 is an explanatory diagram showing a state in which the tips of the wafers held in the adjacent holding grooves of FIG. 4 are closest to each other.

FIG. 7 is an explanatory sectional view of a V-shaped holding groove formed in a lower support of the holding member of FIG. 3;

FIG. 8 is an explanatory front view of a boat installed in the chemical cleaning tank of FIG. 2;

9 is an explanatory cross-sectional view of a holding groove having a two-stage taper shape in a holding portion at the center of the boat in FIG. 8;

FIG. 10 is an explanatory cross-sectional view of a two-step tapered holding groove in a holding portion in which a lower tapered portion of a holding groove is deepened.

FIG. 11 is an explanatory cross-sectional view of a V-shaped holding groove in a holding portion on both sides of the boat in FIG. 8;

FIG. 12 is an explanatory diagram showing a state where a wafer is held by a wafer chuck in the transfer device of FIG. 2 above a chemical liquid cleaning tank;

FIG. 13 is an explanatory view showing a process of transferring a wafer held by a wafer chuck in the transfer device of FIG. 2 to a holding portion of a boat in a chemical solution cleaning tank.

FIG. 14 is an explanatory cross-sectional view of a main part when the lower end peripheral portion of the wafer has not yet been delivered to the upper tapered portion of the holding groove in the process of FIG. 13;

FIG. 15 is an explanatory cross-sectional view of a main part showing a state immediately before the lower end peripheral portion of the wafer enters the lower tapered portion of the holding groove in the process of FIG. 13;

FIG. 16 is an explanatory sectional view of a main part showing a state where the lower peripheral edge of the wafer has been delivered to the lower tapered portion of the holding groove in the process of FIG. 13;

FIG. 17 is an explanatory view showing a state immediately before a wafer is held on a boat and a rear wafer chuck is pulled up in the process of FIG. 13;

FIG. 18 is an explanatory view showing a state before a wafer in a carrier is pushed up by a pushing up member.

19 is a cross-sectional explanatory view of a holding groove having a two-step taper shape applicable to the holding groove of the push-up member of FIG. 18;

[Explanation of symbols]

 Reference Signs List 1 cleaning device 11, 12, 13 transfer device 14, 15, 16 wafer chuck 25 chemical cleaning tank 31, 41 holding member 32, 42 rotating shaft 37 lower holding member 38 upper holding member 39 holding groove (two-step tapered section) Shape 39a First taper portion 39b Second taper portion 39c Groove bottom 40 Holding groove (V-shaped cross section) 51 Boat 52, 53, 54 Holding portion 56 Holding groove (two-step tapered shape) 56a Upper taper portion 56b Lower side Tapered portion 56c Groove bottom 57 Holding groove (V-shaped cross section) C Carrier W Wafer

──────────────────────────────────────────────────続 き Continuation of the front page (51) Int.Cl. ⁷ Identification code FI H01L 21/304 648 H01L 21/304 648B (56) References JP-A-5-109877 (JP, A) JP-A-6-168926 (JP, A) JP-A-5-175179 (JP, A) JP-A-7-125804 (JP, A) JP-A-5-326476 (JP, A) JP-A-5-315309 (JP, A) Kaihei 5-200689 (JP, A) JP-A 5-49290 (JP, U) JP-A 5-73938 (JP, U) (58) Fields investigated (Int. Cl. ⁷ , DB name) H01L 21 / 68 B08B 3/04 B65G 49/07 H01L 21/304 648

Claims (15)

(57) [Claims] An upper holding member and a lower holding member each having a holding groove formed in each holding member are provided in parallel with each other. And a transfer device configured to transfer the object to be processed in a state in which the load of the object is supported by the holding grooves of the lower holding member. The cross-sectional shape of the groove is V-shaped, the cross-sectional shape of the holding groove of the upper holding body is a two-step tapered shape, and the opening angle of the first taper portion on the opening side is the opening angle of the second taper portion on the groove bottom side. A transfer device characterized in that the transfer device is set larger than the transfer device. 2. A transfer device for transferring a workpiece to a holder having a holding groove, using a transport device configured to transport the workpiece while holding the workpiece by a pair of holding members. In the method, among the holding grooves of the holder, the cross-sectional shape of the holding groove that supports the load of the object to be processed is V-shaped, and the cross-sectional shape of the holding groove that does not support the load of the object is a two-step tapered shape, the opening angle of the upper tapered portion of the opening side is set larger than the opening angle of the lower tapered portion of the groove bottom portion side, the holding member when conveying the conveying device to result workpiece
At a relatively high speed until the peripheral edge of the object to be processed is delivered to the lower tapered portion in the holding groove of the holder , and thereafter, at least to the lower tapered portion. A transport method characterized by switching to a relatively low speed until it is held. 3. A transfer for transferring the object to a holder having a holding groove, using a transfer device configured to transfer the object while holding the object with a pair of holding members. In the method, an upper holding body and a lower holding body, each having a holding groove for holding a peripheral portion of the object to be processed, are provided in parallel to each holding member in the transfer device, and the lower holding body The holding groove is configured to support the load of the object to be processed, the holding groove of the lower holding body has a V-shaped cross section, and the holding groove of the upper holding body has a two-step tapered shape, The opening angle of the first taper portion on the opening side is set to be larger than the opening angle of the second taper portion on the groove bottom portion, and among the holding grooves of the holder, the holding groove for supporting the load of the object to be processed. Has a V-shaped cross-section and does not support the load of the workpiece. The groove cross-sectional shape as the two-step tapered shape, when the opening angle of the upper tapered portion of the opening side is set larger than the opening angle of the lower tapered portion of the groove bottom side, to convey the conveying device to result workpiece Holding member
At a relatively high speed until the peripheral edge of the object to be processed is delivered to the lower tapered portion in the holding groove of the holder , and thereafter, at least to the lower tapered portion. A transport method characterized by switching to a relatively low speed until it is held. 4. Using a transfer device configured to transfer the object to be processed while holding the object to be processed by a pair of holding members, the object to be processed held by a holder having a holding groove formed therein is transferred to the object. In the transfer method of transferring from the holding tool, in each of the holding members in the transfer device, an upper holding body and a lower holding body in which holding grooves for holding the peripheral edge of the object to be processed are respectively provided in parallel, And it is constituted so that the load of the object to be processed is supported by the holding groove of the lower holding body, the cross-sectional shape of the holding groove of the lower holding body is V-shaped, and the cross-sectional shape of the holding groove of the upper holding body is a two-stage tapered shape, the opening angle of the first tapered portion of the opening side is set larger than the opening angle of the second tapered portion of the groove bottom portion side, the holding at the time of holding the conveying device to result workpiece Element
Speed of the object to be processed is maintained by the periphery of the object to be processed.
A transport method characterized by switching to a relatively high speed before delivery to a second tapered portion of a holding groove, and to a relatively low speed thereafter until delivery to at least the second tapered portion and holding. 5. A transfer device configured to transfer the object to be processed while holding the object to be processed while holding the object to be processed by a pair of holding members, wherein the object to be processed held by a holding tool having a holding groove is formed. In the transfer method of transferring from the holding tool, in each of the holding members in the transfer device, an upper holding body and a lower holding body in which holding grooves for holding the peripheral edge of the object to be processed are respectively provided in parallel, And it is constituted so that the load of the object to be processed is supported by the holding groove of the lower holding body, the cross-sectional shape of the holding groove of the lower holding body is V-shaped, and the cross-sectional shape of the holding groove of the upper holding body is The opening angle of the first taper portion on the opening side is set to be larger than the opening angle of the second taper portion on the groove bottom side. The holding groove for supporting the load has a V-shaped cross section, The cross-sectional shape of the holding groove that do not support load a two-stage tapered shape, the opening angle of the upper tapered portion of the opening side is set larger than the opening angle of the lower tapered portion of the groove bottom side, thus treated in the conveying device Holding member for holding the body
Speed of the object to be processed is maintained by the periphery of the object to be processed.
A transport method characterized by switching to a relatively high speed before delivery to a second tapered portion of a holding groove, and to a relatively low speed thereafter until delivery to at least the second tapered portion and holding. 6. An upper tape in the holding groove of the holder.
The transport method according to any one of claims 2, 3, and 5, wherein the lower tapered portion is deeper than the tapered portion. 7. An object to be processed in the storage member, wherein a push-up member having a plurality of holding grooves formed on an upper surface is relatively inserted into an opening on a lower surface side of a storage member storing a plurality of objects to be processed. Is held in the holding groove and pushed up above the storage member. Then, the object held by the push-up member is transported while holding the object held by the pair of holding members. In the method of carrying from the push-up member using the constituted carrying device, the holding member in the carrying device is provided with an upper holding body and a lower holding body, each of which has a holding groove for holding a peripheral portion of the object to be processed. The holding member is provided in parallel with the holding member, and the holding groove of the lower holding member is configured to support the load of the object to be processed. The holding groove of the lower holding member has a V-shaped cross section, Cross section shape of holding groove of holding body is two steps And over path shape, the opening angle of the first tapered portion of the opening side is set larger than the opening angle of the second tapered portion of the groove bottom portion side, the holding member when holding the conveying device to result workpiece
At a relatively high speed until the peripheral portion of the object to be processed is delivered to the second tapered portion in the holding groove of the upper holding member , and thereafter to at least the second tapered portion. A transport method characterized by switching to a relatively low speed until delivered and held. 8. An object to be processed is held by a pair of holding members.
In addition, a transfer device configured to transfer the workpiece is used.
The push-up member with multiple holding grooves on the top
Method for transporting the object to be processedAt  Each holding member in the transfer device is provided with a
An upper holding body having a holding groove for holding an edge;
Provide the lower holding body in parallel with the holding groove of the lower holding body.
It is configured to support the load of the object to be processed,
The cross-sectional shape of the holding groove of the lower holding body is V-shaped,
The holding groove of the holding body has a two-step tapered cross section,
The opening angle of the first taper portion on the side of the groove is adjusted to the second taper on the bottom side of the groove.
Set the opening angle larger than the opening angle of theHolding groove of the push-up member With a two-stage taper
Opening angle of the upper taper on the side
Is set larger than the opening angle ofTherefore, a holding member for transporting the workpiece
Travel speedThe peripheral portion of the object to be processed isThe push-up part
Material holding grooveBefore delivery to the lower taper part in
Contrary to high speed, and then deliver at least to the lower taper
It is characterized by switching to a relatively low speed until it is held
The transport method. 9. A transfer device configured to transfer an object to be processed while holding the object, and a processing tank storing a cleaning treatment liquid, wherein the object to be processed is transferred into the processing tank by the transfer device. In a cleaning apparatus configured to be immersed in a cleaning treatment liquid to clean the object, the transporting apparatus has a pair of holding members facing each other, and each holding member has a holding groove formed therein. The upper holding body and the lower holding body are provided in parallel, the peripheral portion of the object to be processed is held by these holding grooves, and the load of the object to be processed is supported by the holding grooves of the lower holding body. The holding member is configured to carry the object to be processed, the holding groove of the lower holding member has a V-shaped cross section, the holding groove of the upper holding member has a two-step tapered shape, The opening angle of the tapered portion is larger than the opening angle of the second tapered portion on the groove bottom side. Characterized in that the Ku set, washing device. 10. A transfer device configured to transfer an object to be processed while holding it, and a processing tank for storing a cleaning treatment liquid, wherein the object to be processed is transported into the processing tank by the transfer device.
In a cleaning apparatus configured to wash the object by immersing the object in a cleaning treatment liquid, a holder for holding the object is installed in the processing tank, and a holding groove of the holder is provided. Among them, the cross-sectional shape of the holding groove that supports the load of the object to be processed is V-shaped, the cross-sectional shape of the holding groove that does not support the load of the object to be processed is a two-step tapered shape, and the opening angle of the upper taper portion on the opening side The cleaning device is characterized in that the opening angle is set larger than the opening angle of the lower tapered portion on the groove bottom side. 11. A transfer device configured to transfer an object to be processed while holding the object, and a processing tank for storing a cleaning treatment liquid, wherein the object to be processed is transferred into the processing tank by the transfer device.
In a cleaning apparatus configured to be immersed in a cleaning treatment liquid to clean the object, the transporting apparatus has a pair of holding members facing each other, and each holding member has a holding groove formed therein. The upper holding body and the lower holding body are provided in parallel, the peripheral portion of the object to be processed is held by these holding grooves, and the load of the object to be processed is supported by the holding grooves of the lower holding body. The holding member is configured to carry the object to be processed, the holding groove of the lower holding member has a V-shaped cross section, the holding groove of the upper holding member has a two-step tapered shape, The opening angle of the tapered portion is set to be larger than the opening angle of the second tapered portion on the groove bottom side, and a holder for holding the object to be processed is installed in the processing tank; Of the holding grooves for supporting the load of the object to be processed, The cross-sectional shape of the holding groove that does not support the load of the workpiece is a two-step taper shape, and the opening angle of the upper taper portion on the opening side is set to be larger than the opening angle of the lower taper portion on the groove bottom side. A washing device characterized by the above-mentioned. 12. The holding device , wherein:
Cleaning apparatus according to claim 10 or 11 deeply the remote lower tapered portion. 13. A workpiece to be processed is transported by a transport device to a holder installed in a processing tank storing a cleaning treatment liquid, and the workpiece is held in a holding groove formed in the holder. In the cleaning method for cleaning an object to be processed with the cleaning treatment liquid, among the holding grooves of the holder, a cross-sectional shape of a holding groove that supports a load of the object to be processed is V-shaped and does not support a load of the object to be processed. the cross-sectional shape of the holding groove and a two-stage tapered shape, the opening angle of the upper tapered portion of the opening side is set larger than the opening angle of the lower tapered portion of the groove bottom side, to convey the result object to be processed to said conveying device Holding member
The moving speed of the object is relatively high until the object is immersed in the cleaning solution, and then, after being immersed, the peripheral portion of the object is delivered to the lower tapered portion in the holding groove of the holder. A cleaning method characterized by switching to a relatively medium speed before the cleaning is performed, and then to a relatively low speed until at least the lower tapered portion is delivered and held. 14. A holding groove in the holding tool,
14. The cleaning method according to claim 13, wherein the lower tapered portion is deeper than the tapered portion. 15. An object to be processed held by a holder installed in a processing tank storing a cleaning processing liquid is immersed in the cleaning processing liquid for cleaning. In a cleaning method for holding an object to be processed and transporting the object as it is to the outside of the processing tank, an upper holding body in which a holding groove for holding a peripheral portion of the object to be processed is formed in each holding member of the transfer device. And the lower holding body are provided in parallel, and configured to support the load of the object to be processed by the holding groove of the lower holding body, and further, the holding groove of the lower holding body has a V-shaped cross section, The cross-sectional shape of the holding groove of the upper holding body is a two-step tapered shape, and the opening angle of the first tapered portion on the opening side is set to be larger than the opening angle of the second tapered portion on the groove bottom side. the thus holding member when holding the workpiece
Speed of the object to be processed is maintained by the periphery of the object to be processed.
Before delivery to the second tapered portion of the holding groove, the delivery speed is relatively high, and thereafter, delivery to at least the second tapered portion is performed.
It is switched to a relatively low speed until it is held,
The moving speed of the holding member is changed from the cleaning treatment liquid to the object to be treated.
After being lifted, the object to be processed is immersed in the cleaning solution.
A cleaning method characterized by switching relatively quickly as compared to a period of time .