KR102532724B1 - Clamping device for horizontal electroplating of printed circuit boards - Google Patents

Abstract

The present invention relates to a clamping device for horizontal plating. An objective of the present invention is to horizontally immerse a circuit board to plate the circuit board to reduce defect rates caused by a plating solution member in a hole of the substrate and immerse more circuit boards than a plating bath for vertical plating of the same volume to plate circuit boards to maximize production. To achieve the objective, the clamping device for horizontal plating comprises: a plating bath filled with a plating solution; anodes arranged at equal intervals on the inside of the plating bath and allowing external power to be connected thereto to form a plating layer on the upper surface of a circuit board; a plane rack horizontally arranged to be lifted in the plating bath, and provided with two pairs of horizontal beams, two pairs of vertical beam, and two pairs of front and rear beams connected perpendicularly to form a horizontal mounting space for horizontally mounting circuit boards to horizontally mount a plurality of circuit boards in multiple levels in the horizontal mounting space, and a conductive support part for supporting the overall weight and supplying a current to each beam diagonally connected to each corner to be installed; and a lifting member installed above the plane rack, and lifting the plane rack in the plating bath with a vertical reciprocating motion by a linear actuator motor. The clamping device for horizontal plating reduces defect rates and can prepare for the trend of reduced hole sizes of circuit boards by a high aspect ratio.

Description

Clamping device for horizontal electroplating of printed circuit boards}

The present invention relates to a clamping device for horizontal plating, and more particularly, by allowing a substrate to be immersed and plated horizontally so that air in a hole of the substrate can escape relatively easily compared to vertical immersion plating. A clamping device for horizontal plating that can reduce the occurrence of defects due to the absence of plating solution, maximize production output by immersing more substrates compared to plating baths of the same volume, and prepare for the trend of miniaturizing the hole size of substrates due to the recent high aspect ratio. It is about.

A typical printed circuit board (Printed Circuit Board, hereinafter referred to as 'PCB') manufacturing process includes an inner layer circuit formation process, a lamination process, a drilling process, a copper plating process, an outer layer circuit formation process, a PSR (Photo Solder Resist) printing process, and a surface treatment process in order.

In particular, the copper plating process related to the present invention is a process for connecting PCB layers, and copper plating is applied to holes caused by drilling. It is done.

In general, in a copper plating process in a PCB manufacturing process, a vertical plating method in which a substrate is plated by standing it vertically is used.

In the case of this vertical plating method, as shown in FIG. 1A, since the substrate 1 is placed vertically in the plating bath to proceed with plating, the air 3 in the hole 2 of the substrate 1 cannot easily escape. As illustrated in FIG. 1B, a plating void defect 4 due to air in the hole of the substrate 1 may occur, and these defects may be caused by oscillation, vibration, or air agitation. ), e-ductor, etc.

However, in recent years, as the aspect ratio of the PCB has gradually increased, the plating void defect 4 in the hole of the board 1 remains even when the above equipment is used, and recently, the board has been gripped with a clamp so as not to flow to make it horizontal. A horizontal plating method is being introduced.

In this regard, Korean Patent Registration No. 10-1788678 (published on October 16, 2017; hereinafter abbreviated as 'Patent Document 1') is for horizontal plating, which can more stably and efficiently hold a plate for plating that is placed horizontally. A device for clamping a substrate is described.

However, in Patent Document 1, a substrate is placed in a horizontal direction inside a plating bath filled with a plating solution, a lower portion of the horizontally disposed substrate is supported by a jig, a press member is disposed on the top of the jig, and the jig or press member is moved up and down. Since the substrate is gripped between the jig and the pressing member by the vertical movement of the elevating unit including the elevating unit, in the state where the substrate is placed on the top of the jig, the substrate is held between the jig and the pressing member. As a result, there is a limit to the increase in production.

On the other hand, recent PCBs tend to develop with high aspect ratios in which the thickness of the board is thick while the hole size is getting smaller. As the high aspect ratio is expected to increase in the future, not only is it expected to be very difficult to remove air from the hole of the board, but also the wall of the hole is exposed to the plating solution. Contacting also becomes more difficult, and such defects in plating cavities are expected to increase further, so countermeasures against this are required.

KR 10-1788678 B1 2017.10.16. Announcement

Therefore, the present invention was derived to solve the above problems, and the technical problem to be solved by the present invention is to allow the substrate to be immersed and plated horizontally, so that the air in the hole of the substrate is relatively It is possible to reduce the rate of defects due to the absence of a plating solution in the hole and to maximize production by allowing more substrates to be immersed and plated compared to a plating bath for vertical plating of the same volume. It is intended to provide a clamping device for horizontal plating that can prepare for the trend of gradually miniaturizing the hole size of the board.

In one embodiment of the present invention for achieving the above object, a plating bath filled with a plating solution, an anode disposed inside the plating bath at equal intervals and connected to an external power source to form a plating layer on the upper surface of a substrate, and an anode lifted inside the plating bath 2 pairs of horizontal beams, 2 pairs of vertical beams, and 2 pairs of front and rear beams are vertically connected to each other to form a horizontal mounting space for horizontal mounting of substrates, and multiple substrates are stacked in multiple stages within the horizontal mounting space. A flat rack installed horizontally and with conductive supports for supporting the entire load and supplying current to each beam diagonally connected to each corner, and a flat rack installed on the top of the flat rack and reciprocating up and down by a linear actuator motor It is a clamping device for horizontal plating, including a flat rack lifting member that lifts the inside of the plating bath.

According to the present invention, by allowing the substrate to be plated by immersing it horizontally, air in the hole of the substrate can escape relatively easily compared to vertical immersion plating, thereby reducing the rate of defects due to the absence of a plating solution in the hole. will be able to provide

In addition, according to the present invention, a plurality of substrates can be immersed and plated by arranging a plurality of substrates horizontally in multiple stages, so that more substrates can be immersed and plated compared to a plating bath of the same volume. Thus, the effect of maximizing production capacity can be obtained In addition, it provides an advantage that can effectively prepare for the trend of gradually miniaturizing the hole size of the substrate due to the recent high aspect ratio.

1A is a schematic diagram illustrating a vertical cross-section of a substrate of a conventional vertical plating method, and FIG. 1B is a sample photo for reference in which a plating cavity defect due to air in a hole is photographed.
2 is a perspective view illustrating the overall configuration of a clamping device for horizontal plating according to the present invention.
3 is a detailed view exemplified by extracting the main parts of the flat rack of FIG. 2 .
4 is a schematic diagram illustrating a horizontal cross-section of a substrate during horizontal plating by the clamping device for horizontal plating of the present invention.

Hereinafter, the configuration and operation of a clamping device for horizontal plating according to a preferred embodiment of the present invention and its effect will be described in detail with reference to the accompanying drawings.

The terms or words used in this specification and claims are not limited to the usual or dictionary meanings, and the inventor can properly define the concept of the term in order to explain his or her invention in the best way. Based on this, it should be interpreted as a meaning and concept consistent with the technical spirit of the present invention. Therefore, since the embodiments described in this specification and the configurations shown in the drawings are only the most preferred embodiments of the present invention, it is understood that there may be various equivalents and modifications that can replace them at the time of this application. shall.

Figure 2 is a perspective view illustrating the overall configuration of the clamping device for horizontal plating according to the present invention, Figure 3 is a detailed view illustrating the main parts of the rack for horizontal plating of Figure 2, Figure 4 is for horizontal plating of the present invention As a schematic diagram exemplified by extracting a horizontal section of a substrate during horizontal plating by the clamping device, the clamping device for horizontal plating according to an embodiment of the present invention includes a plating bath 10, an anode 20, a flat rack 100, and It may be configured to include a flat rack elevating member (40).

The plating bath 10 is a normal tank filled with a plating solution, and has an open upper portion, and circulation and filtering devices 11 may be further provided on both left and right sides to facilitate circulation and filtration of the plating solution.

The anodes 20 are disposed inside the plating bath 10 at regular intervals and connected to an external power source to form a plating layer on the upper surface of the substrate. These anodes 20 are phosphorus-filled copper and are arranged at equal intervals on the slope along the inner edge of the plating bath 10 to reduce the thickness variation of the plating layer.

The flat rack 100 is horizontally arranged so as to be able to move up and down inside the plating bath 10, and includes two pairs of horizontal beams 101, two pairs of vertical beams 102, and two pairs of titanium-coated titanium to prevent plating. The front and rear beams 103 are vertically connected to each other to form a mounting space, and conductive supports 104 for supporting the load of the flat rack and supplying current to each beam are diagonally connected to each corner and installed. The flat rack 100 includes a plurality of substrate holding parts 110 installed inside the holding space, a plurality of substrate pressing parts 120 installed on each substrate holding part 110, and substrate holding according to the thickness of the substrate. It may be configured to include a terminal height adjusting member 130 for adjusting the height of each press terminal spaced apart from the unit 110.

The horizontal beams 101 are composed of two pairs, spaced apart from each other in parallel in the first direction, and are stretchable beams that can expand or contract in length, and are coated with titanium to prevent plating. To this end, each horizontal beam 101 has, for example, a hollow first beam 101a with one end open and hollow, and an outer diameter that can be inserted or drawn into the inside through the open end of the first beam 101a. It consists of a second beam (101b), the total length can be configured to be adjusted by the sum of the length of the exposed portion of the second beam (101b) drawn out of the first beam (101a) and the length of the first beam (101a) there is. In this case, the first beam 101a may further include a terminal width adjusting bolt 101c at one side of an end into which the second beam 101b is inserted. The terminal width adjusting bolt 101c presses and fixes the second beam 101b inserted into or drawn out of the first beam 101a according to the horizontal width of the substrate mounted on the substrate holding unit 110, thereby forming the first beam 101b. It is possible to stretch and adjust the overall length of each horizontal beam 101 by the length of the exposed portion of the beam 101a and the second beam 101b.

The vertical beams 102 are composed of two pairs, are arranged parallel to each other in a second direction perpendicular to the first direction and spaced apart from each other by the length of the horizontal beam, and connect the ends of the two horizontal beams disposed adjacent to each other at both ends (eg For example, connecting the ends of a pair of horizontal beams disposed next to each other in parallel to the front side and connecting the ends of the remaining pairs of horizontal beams disposed next to each other in parallel to the rear side) to extend the two pairs of horizontal beams 101, or It is installed so that the separation distance can be changed by the shrinking operation, and it is coated with titanium to prevent plating. The vertical beam 102 may further include a terminal fixing part 102a capable of fixing the substrate pressing part 120 with a bolt connection at a lower part spaced apart from the upper end by a predetermined interval.

The front and rear beams 103 are made of two pairs, arranged parallel to each other in a third direction perpendicular to both the first and second directions, coated with titanium to prevent plating, and perpendicular to the horizontal beam 101. Two pairs of horizontal beams 101 and two pairs of vertical beams 102 are connected to two adjacent edges where the beams 102 meet to form a mounting space for horizontal mounting of the substrate.

The conductive support 104 is installed on the top of the flat rack 100, and while supporting the entire load of the flat rack 100, the horizontal beam 101, the vertical beam 102, and the front and rear beams 103 provide maximum uniformity. It is made of conductive beams to enable current supply, and is installed diagonally connected to each corner where the horizontal beam 101, vertical beam 102, and front and rear beams 103 on the top of the flat rack 100 intersect.

The substrate holder 110 is composed of a plurality of holders 111a-111n capable of horizontally mounting a plurality of substrates to be plated separately in multiple stages, and one end is parallel by a pair of vertical beams 102. It is supported and installed, but is spaced apart at equal intervals up and down along the longitudinal direction of the vertical beam 102. In addition, these substrate holders 110 are supported on the left and right (or front and rear) by two pairs of vertical beams 102, respectively, and are installed facing each other into the mounting space.

The substrate pressing unit 120 is disposed to be able to move up and down on the upper part of the substrate holding unit 110 and presses the upper surface of each substrate mounted on the substrate holding unit 110, and the elevation height is controlled by the terminal height adjusting member 130 do. To this end, the substrate pressing unit 120 includes a plurality of pressing terminals 121a-121n installed horizontally at a predetermined height apart from each other on the upper part of the substrate holder 110 to press the upper surface of the substrate, and a plurality of pressing terminals 121a-121n. 121n) is commonly connected up and down at one end to integrate the vertical connecting rod 122, and the terminal of the vertical beam 102 formed in the same direction as each of the pressing terminals 121a-121n at the upper end of the vertical connecting rod 122 It includes an upper fixing table 123 that is detachable to the fixing part 102a by bolting.

The terminal height adjusting member 130 is bolted to the terminal fixing part 102a of the upper part of each vertical beam 102 and can be made of a fastening bolt capable of adjusting the lifting height of the substrate pressing part 120 according to the degree of coupling. . The terminal height adjusting member 130 combines the upper end holder 123 of the substrate pressing unit 120 with the terminal fixing unit 102a of each vertical beam 102 so as to be able to move up and down to press each of the substrate pressing units 120. The terminals 121a to 121n are integrally fixed on the top of each holder 111a to 111n of the board holder 110 so as to be liftable, and each pressing terminal 121a of the board pressing unit 120 depends on the degree of assembly of the fastening bolt. -121n) is lifted from the top of each substrate holder 110 as a whole, and each holder 111a- 111n) and the pressurizing terminals 121a to 121n of the substrate pressing unit 120 are adjusted.

The flat rack elevating member 40 includes a linear actuator motor 41 installed and supported by a separate support 40a on the top of the plating bath 10, and an elevating rod reciprocating up and down by the linear actuator motor 41 ( 42), and a detachable bracket 43 detachably coupling or separating the conductive support 104 on the top of the flat rack 100 at the end of the lifting rod 42, and a flat surface at the end of the lifting rod 42. In a state where the conductive support 104 on the top of the rack 100 is detachably coupled, the lift rod 42 reciprocates up and down by the linear actuator motor 41 to move the flat surface rack 100 inside the plating bath 10. down or vice versa. The detachable bracket 43 of the flat rack lifting member 40 may be, for example, a U-type bracket or an H-type bracket, and through this bracket, the flat rack lifting member 40 is conductive to the top of the flat rack 100. It is detachably connected to the support part 104 .

The operation of the clamping device for horizontal plating of the present invention configured as described above and the effect thereof will be described as follows.

First, loosen the terminal width adjusting bolt 101c of each horizontal beam 101 of the flat rack 100 and adjust the length of the exposed part of the second beam 101b inserted or drawn into the first beam 101a. After that, the second beam 101b is pressed and fixed to the end of the first beam 101a by tightening the terminal width adjusting bolt 101c of each horizontal beam 101 again, thereby connecting the first beam 101a and the second beam 101b to the end of the first beam 101a. The overall length of each horizontal beam 101 determined by the length of the exposed portion of the beam 101b is adjusted according to the width of the substrate to be plated mounted on the substrate holder 110.

As described above, when the overall length of each horizontal beam 101 is adjusted according to the width of the substrate to be plated, the plurality of substrates are horizontally mounted individually and separately on each holder 111a to 111n of the substrate holder 110. let it

When the plurality of substrates are mounted on each of the holders 111a to 111n of the board holder 110, the degree of bolt coupling of the terminal height adjusting member 130 is adjusted according to the thickness of the substrate mounted on the board holder 110. The height of each pressing terminal 121a-121n of the substrate pressing part 120 spaced apart from each holder 111a-111n of the substrate holding part 110 is adjusted according to the height of the substrate placed on the substrate holding part 110. do. Accordingly, the pressing terminals 121a to 121n of the substrate pressing unit 120 can stably press the upper surface of each substrate mounted on each holder 111a to 111n of the substrate holding unit 110 .

As described above, when the pressing terminals 121a to 121n of the substrate pressing unit 120 stably press the upper surface of each substrate mounted on each holder 111a to 111n of the substrate holding unit 110, the flat rack The conductive support part 104 on the top of the flat surface rack 100 is detachably coupled to the end of the lifting rod 42 of the lifting member 40 through the detachable bracket 43, and in that state, the linear actuator motor 41 By reciprocating the lifting rod 42 up and down, the flat surface rack 100 is lowered into the plating bath 10 so that the flat surface rack 100 is entirely immersed in the plating solution filled in the plating bath 10 and is raised and lowered as necessary. make it possible

Thereafter, external power is supplied to the elevating rod 42 of the elevating member 40 of the flat rack and the plating bath 10 so that the elevating rod 42 of the elevating member 40 of the flat rack and the detachable bracket 43 pass through the flat rack ( 100), the current is maximally uniform by the conductive support 104 connected diagonally to the top of the flat rack 100 to each horizontal beam 101 and vertical beam 102 of the flat rack 100 and to the front and back Beam 103 can be supplied. Therefore, a uniform current can be supplied to the substrate pressing part 120 supported on each vertical beam 102 of the flat rack 100, and each pressing terminal of the substrate pressing part 120 through the vertical connecting rod 122 A uniform current can also be supplied to (121a-121n), so that the upper surface of each substrate mounted on each holder (111a-111n) of the substrate holder 110 is disposed inside the plating bath 10 at equal intervals. A plating layer can be formed by the anode 20 .

At this time, since circulation and filtering devices 11 are installed on both left and right sides of the plating bath 10 to circulate the plating liquid and remove impurities, the circulation and filtration of the plating liquid can be smoothly performed, and the inside of the plating bath 10 Air in the holes of multiple substrates arranged horizontally by the lifting movement of the flat rack 100 can escape more easily than in the vertical plating method, so it is possible to reduce defects in plating cavities that are not partially plated in the holes, and the plating layer is uniform and clean. will be able to obtain

In addition, since the anodes 20 installed in the plating bath 10 are phosphorus copper and are arranged along the inner edge of the plating bath 10 at equal intervals on the slopes, a large amount of copper ions can be generated uniformly on all four surfaces of the plating bath. As a result, it is possible to reduce the thickness deviation of the plating layer.

According to the present invention, by allowing the substrate to be immersed and plated horizontally, air in the hole of the substrate can escape relatively easily compared to vertical immersion plating, thereby reducing the rate of defects due to the absence of a plating solution in the hole. Compared to a plating bath for vertical plating of the same volume, more substrates can be immersed and plated, thereby maximizing production output, and providing an effect to prepare for the recent trend of miniaturizing the hole size of the substrate due to the high aspect ratio.

As described above, the present invention has been described by the limited embodiments and drawings, but the present invention is not limited to the above embodiments, and those skilled in the art in the field to which the present invention belongs can make various modifications and transformation is possible Therefore, the spirit of the present invention should be grasped only by the scope of the claims described below, and all equivalent or equivalent modifications thereof will be said to belong to the scope of the spirit of the present invention.

1: substrate 2: hole
3: air 4: defective plating void
10: plating tank 11: circulation and filtering device
20: anode 40: flat rack lifting member
40a: support 41: linear actuator motor
42: lifting rod 43: detachable bracket
100: flat rack 101: horizontal beam
101a: first beam 101b: second beam
101c: terminal width adjustment bolt 102: vertical beam
102a: terminal fixing part 103: front and rear beam
104: conductive support part 110: substrate mounting part
111a-111n: cradle 120: substrate pressing unit
121a-121n: press terminal 122: vertical connecting rod
123: upper bracket 130: terminal height adjustment member

Claims (10)

a plating bath 10 filled with a plating solution;
anodes 20 disposed inside the plating bath 10 at regular intervals and connected to an external power source to form a plating layer on the upper surface of the substrate;
The plating tank 10 is horizontally arranged so as to be able to move up and down, and two pairs of horizontal beams 101, two pairs of vertical beams 102, and two pairs of front and rear beams 103 are vertically connected to each other so that the substrate is leveled. A horizontal mounting space is formed to horizontally mount a plurality of substrates in multiple stages in the horizontal mounting space, and conductive supports 104 for supporting the load of the flat rack and supplying current to each beam are diagonally connected to each corner. A flat rack 100 that is installed; and
A flat rack elevating member 40 installed on the upper part of the flat rack 100 and lifting the flat rack 100 inside the plating bath 10 by up and down reciprocating motion by a linear actuator motor; includes,
The flat rack 100,
Two pairs of horizontal beams 101 arranged parallel to each other in a first direction and made of extensible beams to expand or contract in length;
It is arranged parallel to each other in the second direction perpendicular to the first direction by the length of the horizontal beam and connects the ends of the two adjacent horizontal beams, respectively, so that the separation distance is increased by the expansion and contraction of the length of the two pairs of horizontal beams 101. Two pairs of vertical beams 102 that are variable, and are provided with terminal fixing parts 102a for fixing the substrate pressing part to a lower part spaced apart from the upper part by a bolt coupling;
Two pairs of horizontal beams 101 are arranged parallel to each other in a third direction perpendicular to both the first and second directions and connect two adjacent corners where the horizontal beam 101 and the vertical beam 102 meet. and two pairs of vertical beams 102 and two pairs of front and rear beams 103 forming a horizontal mounting space for horizontally mounting a substrate; and
The horizontal beam 101, the vertical beam 102, and the front and rear beams 103 are made of conductive beams to enable maximum uniform current supply while supporting the entire load of the flat rack 100, and the horizontal beam 101 and Clamping for horizontal plating, characterized in that it comprises a; conductive support 104 installed diagonally connected to each corner of the upper part of the flat rack 100 where the vertical beam 102 and the front and rear beams 103 intersect. Device. The method of claim 1, wherein the plating bath 10,
A clamping device for horizontal plating, characterized in that circulation and filtering devices 11 for facilitating circulation and filtration of the plating solution are provided on both left and right sides of the plating bath. The method of claim 1, wherein the anode (20),
The clamping device for horizontal plating, characterized in that the phosphorus copper is arranged at equal intervals on the slope along the inner edge of the plating bath (10) to reduce the thickness variation of the plating layer. delete The method of claim 1, wherein each horizontal beam 101,
A hollow first beam 101a with one end open and hollow;
A clamping device for horizontal plating characterized in that it consists of a second beam (101b) having an outer diameter that can be inserted or pulled out into the inside through the open end of the first beam (101a). The method of claim 5, wherein each horizontal beam 101,
The second beam 101b is installed on one side of the end of the first beam 101a into which the second beam 101b is inserted, and presses and fixes the second beam 101b inserted or drawn into the first beam 101a to thereby press and fix the second beam 101b. A clamping device for horizontal plating, characterized in that it is further provided; a terminal width adjusting bolt (101c) for expanding and contracting the overall length of each horizontal beam (101) by adjusting the length of the exposed portion of ). The method of claim 1, wherein the flat rack 100,
A substrate holder 110 comprising a plurality of holders 111a to 111n capable of horizontally mounting a plurality of substrates to be plated separately in multiple stages and spaced apart at equal intervals up and down along the longitudinal direction of the vertical beam 102 ;
A substrate pressurizing unit 120 that is disposed above the substrate holder 110 to be able to move up and down, and whose height is adjusted by a terminal height adjusting member to press the upper surface of each substrate mounted on the substrate holder 110; and
For horizontal plating, characterized in that it is configured to further include; a terminal height adjusting member 130 that is fixed to the upper part of each vertical beam by bolting and adjusts the elevation height of the substrate pressing unit 120 according to the degree of bolting. clamping device. The method of claim 7, wherein the substrate pressing unit 120,
A plurality of pressing terminals 121a-121n installed horizontally at a predetermined height and spaced apart from each other on each holder of the substrate holder 110 to press the upper surface of the substrate, respectively;
a vertical connector 122 for integrating the plurality of pressurizing terminals 121a-121n by commonly connecting them vertically at one end; and
An upper fixing base 123 formed at the upper end of the vertical connecting rod 122 in the same direction as each of the pressing terminals 121a-121n and detachable to the terminal fixing part 102a of the vertical beam 102 by bolting. Clamping device for horizontal plating, characterized in that. The method of claim 8, wherein the terminal height adjusting member 130,
Each of the pressing terminals 121a-121n of the substrate pressing unit 120 is mounted on the substrate by combining the upper fixing table 123 of the substrate pressing unit 120 with the terminal fixing unit 102a of each vertical beam 102 so as to be able to move up and down. It is fixed so as to be able to move up and down integrally at the upper part of each holder 111a-111n of the part 110, and each press terminal 121a-121n of the substrate press part 120 as a whole is each substrate holder according to the assembly degree of the fastening bolt. Each holder 111a-111n of the substrate holder 110 and the substrate pressing unit 120 are moved up and down from the top of the substrate holder 110 according to the thickness of the substrate mounted on each holder 111a-111n of the substrate holder 110 Clamping device for horizontal plating, characterized in that for adjusting the separation height between each of the pressing terminals (121a-121n) of the. The method of claim 1, wherein the flat rack elevating member 40,
a linear actuator motor 41 supported and installed above the plating bath 10 by a separate support 40a;
a lifting rod 42 reciprocating up and down by a linear actuator motor 41; and
a detachable bracket 43 detachably coupling or detaching the conductive support 104 on the top of the flat rack 100 to the end of the lift rod 42; Clamping device for horizontal plating, characterized in that comprises a.

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