CN213266755U - Electroplating device for printed circuit board - Google Patents

Electroplating device for printed circuit board Download PDF

Info

Publication number
CN213266755U
CN213266755U CN202022068788.3U CN202022068788U CN213266755U CN 213266755 U CN213266755 U CN 213266755U CN 202022068788 U CN202022068788 U CN 202022068788U CN 213266755 U CN213266755 U CN 213266755U
Authority
CN
China
Prior art keywords
circuit board
printed circuit
electroplating
shaft
driving assembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202022068788.3U
Other languages
Chinese (zh)
Inventor
夏东
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sichuan Ruijiexin Electronic Co ltd
Original Assignee
Sichuan Ruijiexin Electronic Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sichuan Ruijiexin Electronic Co ltd filed Critical Sichuan Ruijiexin Electronic Co ltd
Priority to CN202022068788.3U priority Critical patent/CN213266755U/en
Application granted granted Critical
Publication of CN213266755U publication Critical patent/CN213266755U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

The utility model provides an electroplating device for printed circuit board, including plating bath and drive assembly, drive assembly set up in the upside of plating bath is still including installing in two sets of storage part on the drive assembly. The receiving part includes a plurality of clamping units connected to each other, the clamping units including a vibration part and a receiving part connected to each other from bottom to top, the receiving part being connected to the driving assembly. The driving assembly is used for driving the two groups of accommodating parts to alternately enter the electroplating bath. The utility model discloses can carry out the electroplating of circuit board uninterruptedly, can effectively improve the electroplating quality of circuit board.

Description

Electroplating device for printed circuit board
Technical Field
The utility model relates to an electroplate device technical field particularly, relate to an electroplate device for printed circuit board.
Background
Electroplating is one of the important processes in the production and processing of circuit boards, and the principle thereof is the process of forming a plating layer on a substrate of a circuit board by an electrolytic method, and the metal forming the plating layer is usually used as an anode, the circuit board is used as a cathode, and the two are immersed into a plating solution to carry out electroplating operation. The traditional electroplating device is difficult to realize continuous operation, has poor electroplating effect on holes on a circuit board, and influences the production efficiency and the product quality.
SUMMERY OF THE UTILITY MODEL
To the deficiency of the prior art, the utility model aims to provide an electroplating device for printed circuit board, the device can carry out the electroplating of circuit board uninterruptedly, can overcome the difficult problem of hole electroplating on the circuit board base plate.
The embodiment of the utility model discloses a realize through following technical scheme:
the electroplating device for the printed circuit board comprises an electroplating bath and a driving assembly, wherein the driving assembly is arranged on the upper side of the electroplating bath, and the electroplating device further comprises two groups of containing parts arranged on the driving assembly. The receiving part includes a plurality of clamping units connected to each other, the clamping units including a vibration part and a receiving part connected to each other from bottom to top, the receiving part being connected to the driving assembly. The driving assembly is used for driving the two groups of accommodating parts to alternately enter the electroplating bath.
According to a preferred embodiment, the drive assembly comprises a power section and a tensioning section, the power section comprises a horizontally arranged first shaft and a chain, and the first shaft is provided with a driving sprocket. The tensioning part comprises two second shafts arranged in parallel, and a tensioning chain wheel is rotatably arranged on each second shaft. The first shaft is parallel to the second shaft and is arranged on the upper side of the second shaft, the chain is connected with the driving chain wheel and the tensioning chain wheel in a matched mode, and the two ends of the chain are connected with the containing parts.
According to a preferred embodiment, the power part further comprises a cylinder and a gear, the end of the piston rod of the cylinder is provided with a rack, and the gear is arranged on the first shaft. The rack is connected with the gear in a meshed manner.
According to a preferred embodiment, the vibrating part comprises a vibrating box, the vibrating box is internally provided with a vibrating cavity, and a vibrating component is arranged in the vibrating cavity.
According to a preferred embodiment, the upper end surface of the vibration box is rectangular. The holding portion including all set up in baffle and the chucking piece of the up end of vibrating bin, wherein: the two baffles are symmetrically arranged along the width direction of the upper end face of the vibration box, and the clamping blocks are distributed between the two baffles. The clamping block is provided with a clamping groove in a manner of extending along the length of the upper end face of the vibration box.
According to a preferred embodiment, a plurality of slots are provided through the baffle.
According to a preferred embodiment, the two baffles are connected through a hanging shaft, the hanging shaft is distributed close to the upper side of the baffles, and the end part of the chain is connected to the hanging shaft.
According to a preferred embodiment, said plurality of slots are uniformly distributed.
The utility model discloses technical scheme has following advantage and beneficial effect at least:
the utility model relates to a rationally, simple structure make two sets of storage parts get into the plating bath in turn through the drive assembly who sets up, can carry out incessant electroplating treatment, effectively improved production efficiency, set up the vibration portion on the centre gripping unit and can make the centre gripping unit constantly vibrate in the plating solution, be favorable to the electroplating in hole on the circuit board, can effectively improve electroplating quality.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
Fig. 1 is a schematic structural view of the present invention;
fig. 2 is a schematic perspective view of the vibration box of the present invention.
Icon: 1-electroplating bath, 2-vibrating part, 3-vibrating cavity, 4-clamping unit, 41-vibrating box, 5-circuit board, 6-tensioning chain wheel, 61-second shaft, 7-driving chain wheel, 71-first shaft, 8-gear, 9-cylinder, 10-rack, 11-chain, 12-clamping groove, 13-clamping block, 14-slotted hole, 15-baffle plate and 16-hanging shaft.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention, as generally described and illustrated in the figures herein, may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present invention, presented in the accompanying drawings, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the present invention, it should be noted that, if the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" and the like indicate the position or positional relationship based on the position or positional relationship shown in the drawings, or the position or positional relationship which is usually placed when the product of the present invention is used, the description is only for convenience of description and simplification, but the indication or suggestion that the device or element to be referred must have a specific position, be constructed and operated in a specific position, and thus, cannot be understood as a limitation of the present invention.
In the description of the present invention, it should be further noted that unless otherwise explicitly stated or limited, the terms "disposed," "mounted," "connected," and "connected" should be interpreted broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Referring to fig. 1 to 2, an electroplating apparatus for a printed circuit board includes an electroplating bath 1 and a driving assembly disposed on an upper side of the electroplating bath 1, and further includes two sets of receiving members mounted on the driving assembly. The receiving part includes a plurality of clamping units 4 connected to each other, and the clamping units 4 include a vibrating portion and a receiving portion connected to each other from bottom to top, and the receiving portion is connected to the driving assembly. The driving assembly is used for driving the two groups of accommodating components to alternately enter the electroplating bath 1. As shown in fig. 1, the driving assembly includes a power part and a tension part, the power part includes a first shaft 71 and a chain 11 horizontally arranged, and a driving sprocket 7 is mounted on the first shaft 71. The tensioning part comprises two parallel second shafts 61, and a tensioning chain wheel 6 is rotatably mounted on the second shafts 61. The first shaft 71 is parallel to the second shaft 61 and is disposed above the second shaft 61, the chain 11 is connected to the drive sprocket 7 and the tension sprocket 6 in a fitting manner, and the storage members are connected to both ends of the chain 11.
Specifically, the accommodating component in this embodiment is a clamping unit 4 for accommodating therein the circuit board 5 to be electroplated, as shown in fig. 2, in the actual production, after the circuit board 5 is placed in the clamping unit 4, the driving assembly drives one of the clamping units 4 to enter the electroplating bath 1 for electroplating treatment, and the other clamping unit 4 is located outside the electroplating bath 1, at this time, the worker mounts the circuit board 5 to be electroplated in the clamping unit 4 located outside the electroplating bath 1, after the circuit board 5 in the clamping unit 4 located in the electroplating bath 1 is completely processed, the driving assembly is started to separate the processed clamping unit 4 from the electroplating bath 1, and at the same time, the clamping unit 4 to be processed enters the electroplating bath 1, the processed circuit board 5 is taken down, and the circuit board 5 to be processed is clamped again, and the next round of treatment is waited, so that the continuous electroplating treatment can be realized, and the processing efficiency is improved. It should be noted that when the storage member is a plurality of gripper units 4, the chain 11 in the drive assembly is connected to the gripper unit 4 in the central position to keep the storage member stable. For example, when the receiving member is three gripping units 4, the chain 11 is connected to the second gripping unit 4; when the receiving means is four gripper units 4, the chain 11 is connected between the second and third gripper units 4. The plurality of holding units 4 can improve the processing efficiency.
As shown in fig. 1, the power unit further includes a cylinder 9 and a gear 8, a rack 10 is mounted on an end of a piston rod of the cylinder 9, and the gear 8 is mounted on the first shaft 71. The rack 10 is engaged with the gear 8. Specifically, the cylinder 9 is started, and the piston rod thereof pushes the rack 10 to move, so that the gear 8 rotates, and the gear 8 drives the first shaft 71 to rotate, and further drives the driving sprocket 7 to rotate. The tension sprockets 6 are rotatably mounted on the second shaft 61 through bearings, and as shown in fig. 1, the two tension sprockets 6 are disposed at the same height and are symmetrical with respect to the first shaft 71 so that a certain distance is maintained between the two clamping units 4 without interference. Specifically, the chain 11 pulls the gripper unit 4 closer to or away from the plating tank 1 under the rotation of the driving sprocket 7.
Further, the vibrating portion includes a vibrating case 41, the vibrating case 41 forms a vibrating chamber 3 therein, and the vibrating member 2 is provided in the vibrating chamber 3. The vibration member 2 may be a vibrator, and after the clamping unit 4 is completely placed in the plating tank 1, the vibration member 2 in the vibration box 41 vibrates to make the clamping unit 4 in a vibration state, and further agitate the plating solution in the plating tank 1, so that the hole in the circuit board 5 is more easily plated, which is beneficial to improving the plating quality of the circuit board 5. Meanwhile, the vibrating part can also play a role of a counterweight, so that the accommodating part can be conveniently and smoothly immersed in the electroplating solution.
As shown in fig. 2, the upper end surface of the vibration box 41 has a rectangular shape. The holding portion includes baffle 15 and chucking block 13 that all set up in the up end of vibration case 41, wherein: the two baffles 15 are symmetrically arranged along the width direction of the upper end face of the vibration box 41, and the five clamping blocks 13 are distributed between the two baffles 15. The chucking groove 12 is provided in the chucking block 13 so as to extend along the length of the upper end surface of the vibration box 41. The baffle 15 is provided with a plurality of slotted holes 14 which are uniformly distributed and have rectangular shapes, so that the electroplating solution can conveniently enter the accommodating part to carry out electroplating treatment on the circuit board 5. The clamping groove 12 is used for clamping the circuit board 5.
In this embodiment, the two baffles 15 are connected through the hanging shaft 16, the hanging shaft 16 is distributed near the upper side of the baffles 15, and the end of the chain 11 is connected to the hanging shaft 16.
The utility model discloses a theory of operation: first all the circuit board 5 is clamped with two clamping units 4, then start cylinder 9 and make one of them clamping unit 4 get into plating bath 1 and carry out electroplating treatment, then clamping unit 4 stirs the plating solution under the effect of vibrating part 2 and makes circuit board 5 fully electroplated, after the clamping unit 4 who is in plating bath 1 electroplates, start cylinder 9 and make this clamping unit 4 who handles break away from plating bath 1, meanwhile, another clamping unit 4 gets into plating bath 1 and carries out electroplating treatment, the circuit board 5 that the staff will break away from the end of electroplating in the clamping unit 4 of plating bath 1 at this moment takes off and changes the circuit board 5 of waiting to electroplate, wait for a new round of electroplating treatment can.
The above is only a preferred embodiment of the present invention, and is not intended to limit the present invention, and various modifications and changes will occur to those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (8)

1. An electroplating device for a printed circuit board, characterized in that: the electroplating tank comprises an electroplating tank (1) and a driving assembly, wherein the driving assembly is arranged on the upper side of the electroplating tank (1), and the electroplating tank further comprises two groups of accommodating parts arranged on the driving assembly;
the receiving part comprises a plurality of clamping units (4) connected with each other, the clamping units (4) comprise vibrating parts and accommodating parts connected with each other from bottom to top, and the accommodating parts are connected to the driving assembly;
the driving assembly is used for driving the two groups of accommodating parts to alternately enter the electroplating tank (1).
2. A plating apparatus for a printed circuit board according to claim 1, wherein: the driving assembly comprises a power part and a tensioning part, the power part comprises a first shaft (71) and a chain (11) which are horizontally arranged, and a driving chain wheel (7) is mounted on the first shaft (71);
the tensioning part comprises two second shafts (61) which are arranged in parallel, and a tensioning chain wheel (6) is rotatably arranged on each second shaft (61);
the first shaft (71) is parallel to the second shaft (61) and is arranged on the upper side of the second shaft (61), the chain (11) is connected with the driving chain wheel (7) and the tensioning chain wheel (6) in a matched mode, and the two ends of the chain (11) are connected with the containing parts.
3. A plating apparatus for a printed circuit board according to claim 2, characterized in that: the power part also comprises a cylinder (9) and a gear (8), a rack (10) is installed at the end part of a piston rod of the cylinder (9), and the gear (8) is installed on the first shaft (71);
the rack (10) is meshed with the gear (8).
4. A plating apparatus for a printed circuit board according to claim 2 or 3, wherein: the vibration part comprises a vibration box (41), a vibration cavity (3) is formed inside the vibration box (41), and a vibration component (2) is arranged in the vibration cavity (3).
5. A plating apparatus for a printed circuit board according to claim 4, characterized in that: the upper end surface of the vibration box (41) is rectangular;
the holding portion comprises a baffle (15) and a clamping block (13) which are arranged on the upper end face of the vibration box (41), wherein:
the two baffles (15) are symmetrically arranged along the width direction of the upper end face of the vibration box (41), and the plurality of clamping blocks (13) are distributed between the two baffles (15);
the clamping block (13) is provided with a clamping groove (12) in a manner of extending along the length of the upper end face of the vibration box (41).
6. An electroplating apparatus for a printed circuit board according to claim 5, wherein: the baffle (15) is provided with a plurality of slotted holes (14) in a penetrating way.
7. A plating apparatus for a printed circuit board according to claim 6, wherein: two baffle (15) are connected through peg (16), peg (16) are close to the upside distribution of baffle (15), the tip of chain (11) is connected to peg (16).
8. A plating apparatus for a printed circuit board according to claim 6, wherein: the plurality of slots (14) are evenly distributed.
CN202022068788.3U 2020-09-18 2020-09-18 Electroplating device for printed circuit board Active CN213266755U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202022068788.3U CN213266755U (en) 2020-09-18 2020-09-18 Electroplating device for printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202022068788.3U CN213266755U (en) 2020-09-18 2020-09-18 Electroplating device for printed circuit board

Publications (1)

Publication Number Publication Date
CN213266755U true CN213266755U (en) 2021-05-25

Family

ID=75943258

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202022068788.3U Active CN213266755U (en) 2020-09-18 2020-09-18 Electroplating device for printed circuit board

Country Status (1)

Country Link
CN (1) CN213266755U (en)

Similar Documents

Publication Publication Date Title
CN110965096B (en) Semiconductor lead electroplating equipment
TWI648434B (en) Electroplating device for small parts
JPH0953197A (en) Electroplating method and work housing implement
CN213266755U (en) Electroplating device for printed circuit board
CN114775021A (en) Uniform chemical copper deposition equipment for circuit board
US4933049A (en) Cradle for supporting printed circuit board between plating manifolds
CN218959217U (en) Copper-depositing feeding parent basket
CN213896054U (en) Cell body improvement mechanism of perpendicular continuous electroplating line
CN210945843U (en) Household electrical appliances part coating paint device
KR101388678B1 (en) Up and down digestion plating apparatus
KR100704685B1 (en) A fabrication device of a continuous metal mesh by cathode drum electrodeposition process
EP3733934A1 (en) Electroplating assembly mechanism
JPH03294497A (en) Surface treatment in small hole
CN112376107A (en) High-efficiency electroplating device and method for small parts
CN114182329B (en) Electroplating device
CN111472037A (en) Single-side electroplating device and electroplating process thereof
JPH0241873Y2 (en)
CN215404604U (en) Surface conductive medium electroplating device for processing cathode plate
CN211938136U (en) Prevent piling up abluent belt cleaning device
CN217266005U (en) Nickel cylinder device for nickel plating with load and nickel plating time control function
CN220300903U (en) Equipment for improving electroplating production efficiency
CN214142596U (en) Efficient electroplating device for small parts
CN218710843U (en) Vertical continuous chemical plating line
CN220788856U (en) Vibration type electroplating device
CN216192661U (en) Steel mesh vacuum electroplating device

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant