KR102520089B1 - 광전자 구성요소 및 광전자 구성요소를 생산하는 방법 - Google Patents

광전자 구성요소 및 광전자 구성요소를 생산하는 방법 Download PDF

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KR102520089B1
KR102520089B1 KR1020217005419A KR20217005419A KR102520089B1 KR 102520089 B1 KR102520089 B1 KR 102520089B1 KR 1020217005419 A KR1020217005419 A KR 1020217005419A KR 20217005419 A KR20217005419 A KR 20217005419A KR 102520089 B1 KR102520089 B1 KR 102520089B1
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substituted
alkoxy
optoelectronic component
radiation
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KR20210038604A (ko
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알랜 피켓
막심 엔. 초울
달샨 쿤달리야
아담 스코치
게르트루드 크래우터
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에이엠에스-오스람 인터내셔널 게엠베하
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H01L25/0753—
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04—Polysiloxanes
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    • C09K11/00—Luminescent materials, e.g. electroluminescent or chemiluminescent
    • C09K11/08—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials
    • C09K11/77—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials containing rare earth metals
    • C09K11/7728—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials containing rare earth metals containing europium
    • C09K11/77348—Silicon Aluminium Nitrides or Silicon Aluminium Oxynitrides
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    • C09K11/00—Luminescent materials, e.g. electroluminescent or chemiluminescent
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    • C09K11/77—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials containing rare earth metals
    • C09K11/7766—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials containing rare earth metals containing two or more rare earth metals
    • C09K11/7774—Aluminates
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    • C09K11/00—Luminescent materials, e.g. electroluminescent or chemiluminescent
    • C09K11/08—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials
    • C09K11/77—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials containing rare earth metals
    • C09K11/7766—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials containing rare earth metals containing two or more rare earth metals
    • C09K11/77748—Silicon Aluminium Nitrides or Silicon Aluminium Oxynitrides
    • H01L33/504—
    • H01L33/54—
    • H01L33/56—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
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    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
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    • H10H20/851—Wavelength conversion means
    • H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
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    • H10H20/80—Constructional details
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    • H10H20/851—Wavelength conversion means
    • H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
    • H10H20/8512—Wavelength conversion materials
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    • H10H20/851—Wavelength conversion means
    • H10H20/8514—Wavelength conversion means characterised by their shape, e.g. plate or foil
    • H—ELECTRICITY
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    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • H01L2933/0041—

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
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  • Inorganic Chemistry (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Led Device Packages (AREA)
  • Luminescent Compositions (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
KR1020217005419A 2018-08-17 2019-08-07 광전자 구성요소 및 광전자 구성요소를 생산하는 방법 Active KR102520089B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US16/104,743 US11552228B2 (en) 2018-08-17 2018-08-17 Optoelectronic component and method for producing an optoelectronic component
US16/104,743 2018-08-17
PCT/EP2019/071202 WO2020035363A1 (en) 2018-08-17 2019-08-07 Optoelectronic component and method for producing an optoelectronic component

Publications (2)

Publication Number Publication Date
KR20210038604A KR20210038604A (ko) 2021-04-07
KR102520089B1 true KR102520089B1 (ko) 2023-04-11

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US (1) US11552228B2 (https=)
JP (1) JP2021533576A (https=)
KR (1) KR102520089B1 (https=)
DE (1) DE112019004137T5 (https=)
WO (1) WO2020035363A1 (https=)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019180854A1 (ja) * 2018-03-20 2019-09-26 株式会社 東芝 多接合型太陽電池モジュール及び太陽光発電システム
DE102019129327A1 (de) * 2019-10-30 2021-05-06 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Verfahren zur herstellung eines optoelektronischen halbleiterbauelements und optoelektronisches halbleiterbauelement
US12142622B2 (en) * 2020-08-17 2024-11-12 Au Optronics Corporation Sensing device
KR102877541B1 (ko) 2021-04-30 2025-10-29 삼성디스플레이 주식회사 표시 장치
DE102021117858A1 (de) * 2021-07-09 2023-01-12 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronische leuchtvorrichtung
DE102021131112A1 (de) 2021-11-26 2023-06-01 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Strahlungsemittierendes bauelement und verfahren zur herstellung eines strahlungsemittierenden bauelements
US20230265337A1 (en) * 2022-02-22 2023-08-24 Ams-Osram International Gmbh Converter element, method for producing a converter element and radiation emitting device
DE102023108968A1 (de) * 2023-04-06 2024-10-10 Ams-Osram International Gmbh Verfahren zum prozessieren von optoelektronischen bauelementen und optoelektronisches bauelement
KR102705004B1 (ko) 2024-04-23 2024-09-09 지니지 주식회사 엑소좀 복합체를 포함하는 인텐시브 화이트닝 및 피부 개선용 화장료 조성물

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140175488A1 (en) 2012-12-21 2014-06-26 Shin-Etsu Chemical Co., Ltd. Heat-curable silicone resin sheet having phosphor-containing layer and white pigment-containing layer, method of producing light emitting device using same and encapsulated light emitting semiconductor device produced thereby
US20140367633A1 (en) * 2013-06-18 2014-12-18 LuxVue Technology Corporation Led display with wavelength conversion layer
US20150188007A1 (en) * 2012-05-31 2015-07-02 Konica Minolta, Inc. Sealing material for light emitting device, light emitting device using the same, and manufacturing method for light emitting device
WO2018002334A1 (en) * 2016-06-30 2018-01-04 Osram Opto Semiconductors Gmbh Wavelength converter having a polysiloxane material, method of making, and solid state lighting device containing same

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7497581B2 (en) * 2004-03-30 2009-03-03 Goldeneye, Inc. Light recycling illumination systems with wavelength conversion
US7471040B2 (en) 2004-08-13 2008-12-30 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Mixed-color light emitting diode apparatus, and method for making same
JP2009076749A (ja) 2007-09-21 2009-04-09 Toyoda Gosei Co Ltd Ｌｅｄ装置及びその製造方法
WO2010110204A1 (ja) 2009-03-27 2010-09-30 コニカミノルタオプト株式会社 蛍光体部材、蛍光体部材の製造方法、及び照明装置
JP2011181429A (ja) 2010-03-03 2011-09-15 Konica Minolta Opto Inc Ｌｅｄ照明装置、ｌｅｄ照明装置の製造方法
US8884330B2 (en) * 2011-04-13 2014-11-11 Osram Sylvania Inc. LED wavelength-converting structure including a thin film structure
JP2014122296A (ja) 2012-12-21 2014-07-03 Konica Minolta Inc 発光装置用封止材前駆体溶液、これを用いた発光装置用封止材、ｌｅｄ装置、並びにｌｅｄ装置の製造方法
US9985186B2 (en) 2013-06-06 2018-05-29 Lumileds Llc Light emitting diode laminated with a phosphor sheet and manufacturing method thereof
EP3098266A4 (en) 2014-01-24 2017-10-04 Sumitomo Chemical Company Limited Liquid silicone resin composition
WO2015193554A1 (en) * 2014-06-19 2015-12-23 Inkron Oy Transparent siloxane encapsulant and adhesive
KR101688163B1 (ko) * 2015-03-30 2016-12-20 엘지전자 주식회사 반도체 발광 소자를 이용한 디스플레이 장치 및 이의 제조방법
KR102415331B1 (ko) * 2015-08-26 2022-06-30 삼성전자주식회사 발광 소자 패키지, 및 이를 포함하는 장치
JP2017157724A (ja) 2016-03-02 2017-09-07 デクセリアルズ株式会社 表示装置及びその製造方法、並びに発光装置及びその製造方法
US10833231B2 (en) 2016-04-18 2020-11-10 Osram Oled Gmbh Method for producing an optoelectronic component, and optoelectronic component
JP2017212301A (ja) 2016-05-24 2017-11-30 スタンレー電気株式会社 発光装置、照明装置、車両用照明装置、および、発光装置の製造方法
CN106206871A (zh) * 2016-08-03 2016-12-07 纳晶科技股份有限公司 发光器件的制备方法与发光器件
JP6269753B2 (ja) 2016-08-29 2018-01-31 日亜化学工業株式会社 発光装置
CN114695425A (zh) 2016-12-22 2022-07-01 夏普株式会社 显示装置及制造方法
CN106876562B (zh) * 2017-03-30 2020-03-24 广东普加福光电科技有限公司 一种新型微缩化led结构及其制备方法
US10570333B2 (en) 2017-05-23 2020-02-25 Osram Opto Semiconductors Gmbh Wavelength conversion element, light emitting device and method for producing a wavelength conversion element
CN107302010B (zh) * 2017-06-21 2020-07-24 上海天马微电子有限公司 一种显示面板和显示装置
TWI650398B (zh) * 2017-12-08 2019-02-11 Chi Mei Corporation 發光材料與應用之顯示裝置
US10727379B2 (en) 2018-02-16 2020-07-28 Osram Opto Semiconductors Gmbh Methods for producing a conversion element and an optoelectronic component
US10662310B2 (en) 2018-04-24 2020-05-26 Osram Opto Semiconductors Gmbh Optoelectronic component having a conversation element with a high refractive index

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150188007A1 (en) * 2012-05-31 2015-07-02 Konica Minolta, Inc. Sealing material for light emitting device, light emitting device using the same, and manufacturing method for light emitting device
US20140175488A1 (en) 2012-12-21 2014-06-26 Shin-Etsu Chemical Co., Ltd. Heat-curable silicone resin sheet having phosphor-containing layer and white pigment-containing layer, method of producing light emitting device using same and encapsulated light emitting semiconductor device produced thereby
US20140367633A1 (en) * 2013-06-18 2014-12-18 LuxVue Technology Corporation Led display with wavelength conversion layer
WO2018002334A1 (en) * 2016-06-30 2018-01-04 Osram Opto Semiconductors Gmbh Wavelength converter having a polysiloxane material, method of making, and solid state lighting device containing same

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KR20210038604A (ko) 2021-04-07
US20200056091A1 (en) 2020-02-20
WO2020035363A1 (en) 2020-02-20
JP2021533576A (ja) 2021-12-02
DE112019004137T5 (de) 2021-05-06
US11552228B2 (en) 2023-01-10

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