KR102493013B1 - 기판 처리 장치 및 이에 사용되는 이송 벨트 - Google Patents

기판 처리 장치 및 이에 사용되는 이송 벨트 Download PDF

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Publication number
KR102493013B1
KR102493013B1 KR1020170151457A KR20170151457A KR102493013B1 KR 102493013 B1 KR102493013 B1 KR 102493013B1 KR 1020170151457 A KR1020170151457 A KR 1020170151457A KR 20170151457 A KR20170151457 A KR 20170151457A KR 102493013 B1 KR102493013 B1 KR 102493013B1
Authority
KR
South Korea
Prior art keywords
substrate
belt
delete delete
belt layer
polishing
Prior art date
Application number
KR1020170151457A
Other languages
English (en)
Korean (ko)
Other versions
KR20190054643A (ko
Inventor
이기우
최우철
Original Assignee
주식회사 케이씨텍
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 케이씨텍 filed Critical 주식회사 케이씨텍
Priority to KR1020170151457A priority Critical patent/KR102493013B1/ko
Priority to CN201711456429.1A priority patent/CN109786298B/zh
Publication of KR20190054643A publication Critical patent/KR20190054643A/ko
Application granted granted Critical
Publication of KR102493013B1 publication Critical patent/KR102493013B1/ko

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/24—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding or polishing glass
    • B24B7/242—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding or polishing glass for plate glass
    • B24B7/245—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding or polishing glass for plate glass discontinuous
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G15/00—Conveyors having endless load-conveying surfaces, i.e. belts and like continuous members, to which tractive effort is transmitted by means other than endless driving elements of similar configuration
    • B65G15/30—Belts or like endless load-carriers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
    • H01L51/56—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
    • B65G2201/02—Articles
    • B65G2201/0214—Articles of special size, shape or weigh
    • B65G2201/022—Flat
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2812/00—Indexing codes relating to the kind or type of conveyors
    • B65G2812/02—Belt or chain conveyors
    • B65G2812/02128—Belt conveyors
    • B65G2812/02178—Belt conveyors characterised by the material

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
KR1020170151457A 2017-11-14 2017-11-14 기판 처리 장치 및 이에 사용되는 이송 벨트 KR102493013B1 (ko)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR1020170151457A KR102493013B1 (ko) 2017-11-14 2017-11-14 기판 처리 장치 및 이에 사용되는 이송 벨트
CN201711456429.1A CN109786298B (zh) 2017-11-14 2017-12-28 基板处理装置及用于该基板处理装置的移送带

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020170151457A KR102493013B1 (ko) 2017-11-14 2017-11-14 기판 처리 장치 및 이에 사용되는 이송 벨트

Publications (2)

Publication Number Publication Date
KR20190054643A KR20190054643A (ko) 2019-05-22
KR102493013B1 true KR102493013B1 (ko) 2023-01-31

Family

ID=66495505

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020170151457A KR102493013B1 (ko) 2017-11-14 2017-11-14 기판 처리 장치 및 이에 사용되는 이송 벨트

Country Status (2)

Country Link
KR (1) KR102493013B1 (zh)
CN (1) CN109786298B (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7163944B2 (ja) * 2020-09-15 2022-11-01 日新イオン機器株式会社 基板保持装置およびイオン注入装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005271111A (ja) * 2004-03-23 2005-10-06 Ebara Corp 基板研磨装置及び基板研磨方法
JP2009095923A (ja) * 2007-10-16 2009-05-07 Sd Future Technology Co Ltd 研磨装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2546596Y2 (ja) * 1992-02-03 1997-09-03 バンドー化学株式会社 コンベヤベルト
US5951441A (en) * 1997-12-19 1999-09-14 Icon Health & Fitness, Inc. Cushioned treadmill belts and methods of manufacture
EP2829495A1 (en) * 2013-07-23 2015-01-28 Habasit AG Abrasion-resistant belt
WO2015110350A1 (en) * 2014-01-21 2015-07-30 Agfa Graphics Nv A conveyor belt for an inkjet print device
EP3138691B1 (en) * 2015-09-02 2020-08-12 Agfa Nv Inkjet printing device with dimpled vacuum belt

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005271111A (ja) * 2004-03-23 2005-10-06 Ebara Corp 基板研磨装置及び基板研磨方法
JP2009095923A (ja) * 2007-10-16 2009-05-07 Sd Future Technology Co Ltd 研磨装置

Also Published As

Publication number Publication date
KR20190054643A (ko) 2019-05-22
CN109786298B (zh) 2023-09-22
CN109786298A (zh) 2019-05-21

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