KR102471687B1 - Light emitting module and display device - Google Patents

Abstract

Embodiments relate to a light emitting module, a method for manufacturing a light emitting module, and a display device.
The light emitting module of the embodiment includes a substrate, a plurality of light emitting units disposed on the substrate, and a first black matrix surrounding each of the plurality of light emitting units, and each of the plurality of light emitting units emits blue light disposed on the substrate. A first light emitting element, a second light emitting element emitting blue light disposed on a substrate, a red phosphor layer disposed on the first light emitting element, and a red phosphor layer disposed between the first and second light emitting elements and extending from the upper surface of the substrate A second black matrix having a higher height may be included.
In the embodiment, color difference may be improved by light emitting devices having similar thermal characteristics and novel characteristics.

Description

Light emitting module and display device {LIGHT EMITTING MODULE AND DISPLAY DEVICE}

Embodiments relate to a light emitting module, a method for manufacturing a light emitting module, and a display device.

A light emitting diode (LED) is one of light emitting devices that emits light when a current is applied thereto. A light emitting diode can emit light with high efficiency at a low voltage and thus has an excellent energy saving effect. Recently, the luminance problem of light emitting diodes has been greatly improved, and they are applied to various devices such as backlight units of liquid crystal display devices, electronic signboards, displays, and home appliances.

A typical liquid crystal display displays an image or video with light passing through a color filter by controlling transmittance of light and liquid crystal of a plurality of light emitting device packages in which light emitting diodes are mounted.

Recently, display devices with a high resolution of HD or higher and a size of 100 inches or more are required, but liquid crystal displays and organic electric field displays having complex configurations, which are mainly used in general, are difficult to implement high-definition display devices with a size of 100 inches or more due to yield and cost. There were difficulties.

Embodiments provide a light emitting module capable of providing full color, a method for manufacturing a light emitting module, and a display device.

The embodiment provides a light emitting device package and a display device capable of implementing uniform color and uniform luminance.

Embodiments provide a light emitting module, a light emitting module manufacturing method, and a display device that can simplify the configuration and are advantageous for slimming.

Embodiments provide a light emitting module, a light emitting module manufacturing method, and a display device capable of improving productivity and yield.

Embodiments provide a light emitting module, a method for manufacturing a light emitting module, and a display device that improve a color difference by light emitting elements having similar characteristics.

The embodiment simplifies a driving circuit by using light emitting elements having similar electrical characteristics, and provides a light emitting module that is easy to control, a method for manufacturing a light emitting module, and a display device.

Embodiments provide a light emitting module, a method for manufacturing a light emitting module, and a display device capable of improving the reliability of color implementation of each light emitting unit.

The embodiment provides a display device with excellent linearity of images and videos.

The embodiment provides a display device capable of realizing a high-resolution, large-sized display device.

The embodiment provides a display device excellent in color purity and color reproduction.

The light emitting module of the embodiment includes a substrate; a plurality of light emitting units disposed on the substrate; and a first black matrix surrounding each of the plurality of light emitting units, wherein each of the plurality of light emitting units includes: a first light emitting element disposed on the substrate and emitting blue light; a second light emitting element disposed on the substrate and emitting blue light; a red phosphor layer disposed on the first light emitting element; A second black matrix disposed between the first and second light emitting devices and having a height higher than the red phosphor layer from the upper surface of the substrate may be included.

In the embodiment, color difference may be improved by light emitting devices having similar thermal characteristics and novel characteristics.

In the embodiment, full color may be implemented by flip chip type first to third light emitting devices that are individually driven in one pixel.

The embodiment may implement uniform color and uniform luminance.

The embodiment can simplify the configuration and has an advantage in slimming.

Examples can improve productivity and improve yield.

In the embodiment, color difference may be improved by using light emitting devices having similar characteristics.

The embodiment simplifies the driving circuit by using light emitting devices having similar electrical characteristics, and can be easily controlled.

The embodiment can implement a 100-inch or larger screen display device of HD quality with excellent linearity of images and videos.

The embodiment may implement a display device having excellent color purity and color reproduction.

The embodiment may improve the reliability of color implementation of each light emitting unit.

1 is a perspective view showing a light emitting module according to an embodiment.
2 is a perspective view illustrating a light emitting unit according to an embodiment.
3 is a plan view illustrating a substrate and a plurality of light emitting devices according to an embodiment.
FIG. 4 is a cross-sectional view of a light emitting unit taken along line I-I' of FIG. 3 .
5 is a plan view illustrating a lower surface of a substrate according to an embodiment.
6 is an exploded perspective view showing a part of the light emitting unit according to the first embodiment.
7 to 11 are cross-sectional views illustrating a method of manufacturing a light emitting module according to a first embodiment.
12 is a cross-sectional view showing a light emitting module according to a second embodiment.
13 is a cross-sectional view showing a light emitting module according to a third embodiment.
14 is a cross-sectional view showing a light emitting module according to a fourth embodiment.
15 is a cross-sectional view showing a light emitting module according to a fifth embodiment.
16 is a cross-sectional view showing a light emitting module according to a sixth embodiment.
17 and 18 are exploded perspective views illustrating a light emitting module according to a seventh embodiment.
19 and 20 are plan views and exploded views illustrating a light emitting module according to an eighth embodiment.
21 and 22 are a plan view and an exploded perspective view illustrating a light emitting module according to a ninth embodiment.
23 and 24 are a plan view and an exploded perspective view illustrating a light emitting module according to a tenth embodiment.
25 is a plan view and an exploded perspective view illustrating a light emitting module according to an eleventh embodiment.
26 and 27 are a plan view and an exploded perspective view illustrating a light emitting module according to a twelfth embodiment.
28 is a plan view and an exploded perspective view illustrating a light emitting module according to a thirteenth embodiment.

In the description of the embodiment, each layer (film), region, pattern or structure is "on/over" or "under" the substrate, each layer (film), region, pad or pattern. In the case where it is described as being formed in, "on/over" and "under" include both "directly" or "indirectly" formed through another layer. do. In addition, the criteria for the top/top or bottom of each layer will be described based on the drawings.

1 is a perspective view showing a light emitting module according to an embodiment, FIG. 2 is a perspective view showing a light emitting unit according to an embodiment, FIG. 3 is a plan view showing a substrate and a plurality of light emitting devices according to an embodiment, and FIG. It is a cross-sectional view showing the light emitting part cut along line Ⅰ', and FIG. 5 is a plan view showing the lower surface of the substrate according to the embodiment.

As shown in FIGS. 1 to 5 , the light emitting module 10 of the embodiment may include a plurality of light emitting units 100 , a black matrix BM, and a substrate.

The light emitting module 10 of the embodiment can implement a simplified structure, slimming, and high brightness for realizing full-color images or images. To this end, in the light emitting module 10 of the embodiment, the light emitting unit 100 may be directly mounted on a substrate in a COB (Chip on Board) type, but is not limited thereto. Although not shown in the drawing, a driving circuit (not shown) for driving the light emitting unit 100 may be mounted on a lower surface of the substrate. The light emitting unit 100 may correspond to one pixel and may include first to third light emitting devices 150a, 150b, and 150c to implement full color.

In general, a red light emitting diode emitting red light has characteristics that are weak against deterioration. A typical red light emitting diode suffers from a droop phenomenon in which light output is reduced after a certain period of time due to a decrease in thermal reliability than a blue light emitting diode.

The embodiment can provide a light emitting module having a uniform color tone by using light emitting diodes having similar droop characteristics. Similar droop characteristics may mean a level at which a difference in light characteristics between adjacent light emitting diodes cannot be recognized with the naked eye.

To this end, in the embodiment, a red phosphor layer 52 is disposed on the first light emitting device 150a having similar thermal and electrical characteristics to those of the second and third light emitting devices 150b and 150c emitting wavelengths other than red. Thus, a red wavelength can be realized.

The first to third light emitting devices 150a, 150b, and 150c of the embodiment may be light emitting diodes having similar thermal characteristics. For example, the first to third light emitting devices 150a, 150b, and 150c may be GaN-based light emitting diodes, but are not limited thereto. For example, at least one of a blue light emitting diode, a green light emitting diode, a purple light emitting diode, and a yellow light emitting diode may be selected as the first to third light emitting devices 150a, 150b, and 150c. The embodiment may include light emitting diodes having similar thermal characteristics and electrical characteristics and capable of realizing full color.

For example, the red wavelength may be implemented using a blue light emitting diode emitting blue wavelength in the first light emitting element 150a and a red phosphor layer 52 covering the first light emitting element 150a. The embodiment can be changed as long as the light emitting diodes disposed in the light emitting unit 100 have similar thermal and electrical characteristics. For example, all of the first to third light emitting devices 150a, 150b, and 150c may be blue light emitting diodes, and the red phosphor layer 52 disposed on the first light emitting device 150a and the second light emitting device 150b ) may include a green phosphor layer disposed on top. As another example, all of the first to third light emitting devices 150a, 150b, and 150c may be green light emitting diodes, and the red phosphor layer 52 disposed on the first light emitting device 150a and the third light emitting device (153) may include a blue phosphor layer disposed on top. As another example, various light emitting diodes and phosphor layers capable of implementing red, green, and blue wavelengths may be included.

The light emitting unit 100 may have a polygonal structure. For example, the light emitting unit 100 may include four corners and four outer surfaces, and may have a flat plate shape with upper and lower surfaces, but is not limited thereto. The substrate of the embodiment may include first to fourth corners 125 , 126 , 127 , and 128 , and first to fourth outer surfaces 121 , 122 , 123 , and 124 .

The first outer surface 121 may be parallel to and symmetrical with the second outer surface 122 in the first direction (XX'). The third outer surface 123 may be parallel to and symmetrical with the fourth outer surface 124 in the first direction (XX'). The first and second outer surfaces 121 and 122 may be disposed in a second direction (Y-Y′) orthogonal to the third and fourth outer surfaces 123 and 124 .

The first corner 125 may be disposed in a region where the first outer surface 121 and the third outer surface 123 meet. The second corner 126 may be disposed in a region where the second outer surface 122 and the third outer surface 123 meet. The third corner 127 may be disposed in a region where the first outer surface 121 and the fourth outer surface 124 meet. The fourth edge 128 may be disposed in a region where the second outer surface 122 and the fourth outer surface 124 meet.

The substrate may include a resin-based printed circuit board (PCB), a metal core PCB, a flexible PCB, a ceramic PCB, and an FR-4 substrate. The substrate 120 of the first embodiment may include a printed circuit board having a metal layer. The substrate includes upper electrode patterns 131, 132, 133, and 134 on the sub-substrate 120S, lower electrode patterns 141, 142, 143, and 144 under the sub-substrate 120S, and the sub-substrate 120S. ) may include first to third connection electrodes 161, 162, and 163 penetrating.

The first to third light emitting devices 150a, 150b, and 150c may be arranged at regular intervals from each other. The first to third light emitting elements 150a, 150b, and 150c may be alternately arranged in the first direction (X-X'), but are not limited thereto. For example, the first to third light emitting devices 150a, 150b, and 150c may be directed in a first direction (X-X') or in a second direction (Y-Y') orthogonal to the first direction (X-X'). can be placed side by side. The first to third light emitting devices 150a, 150b, and 150c may be directly mounted on a substrate in a COB (Chip on Board) type. In the light emitting module 10 of the embodiment, since the first to third light emitting devices 150a, 150b, and 150c are directly mounted on the substrate in a COB type, the configuration can be simplified, and slimness and high brightness can be implemented. The first to third light emitting devices 150a, 150b, and 150c may be mounted on a substrate by Surface Mounting Technology (SMT). The SMT is a method of mounting the first to third light emitting devices 150a, 150b, and 150c on a board using a solder paste (not shown), and the solder paste may be a metal paste. For example, the solder paste may include an alloy such as AuSn or NiSn, but is not limited thereto.

The first to third light emitting devices 150a, 150b, and 150c may include a sapphire substrate 51, a light emitting layer 53, and first and second light emitting device electrodes 57 and 59. The first to third light emitting devices 150a, 150b, and 150c may have a flip chip structure in which the first and second light emitting device electrodes 57 and 59 are disposed below and directly mounted on a substrate.

The red phosphor layer 52 may be disposed on the upper and side surfaces of the first light emitting element 150a, but is not limited thereto. The red phosphor layer 52 may directly contact the first light emitting element 150a. The thickness of the red phosphor layer 52 may be 300 μm or less and may be 150 μm, but is not limited thereto.

The red phosphor layer 52 may include a phosphor of a fluoride compound, for example, at least one of an MGF-based phosphor, a KSF-based phosphor, or a KTF-based phosphor. The MGF-based phosphor has a composition formula of, for example, Mg ₄ Ge _1-x O _y F:Mn ⁴⁺ _x , where x satisfies 0.001 ≤ x ≤ 0.1, and y may satisfy 1 ≤ y ≤5. The KSF-based phosphor, for example, may have a composition formula of K _a Si _1-c F _b :Mn ⁴⁺ _c , wherein a is 1 ≤ a ≤ 2.5, b is 5 ≤ b ≤ 6.5, and c is 0.001 ≤ c ≤ 0.1 can be satisfied. The KTF-based phosphor, for example, may have a compositional formula of K _d Ti _1-g F _e :Mn ⁴⁺ _g , wherein d is 1 ≤ d ≤ 2.5, e is 5 ≤ e ≤ 6.5, and g is 0.001 ≤ g ≤ 0.1 can be satisfied. The red phosphor layer 52 is a fluoride compound phosphor, which is an Mn ⁴⁺ activator phosphor, and has high luminous efficiency and strong absorption at a blue peak wavelength. The red phosphor layer 52 may include a sulfide phosphor such as (Ca,Sr)S:Eu ²⁺ or a nitride phosphor such as CaAlSiN3:Eu ²⁺ . The activator may be a tetravalent transition metal ion such as Mn ⁴⁺ , or a metal ion selected from various rare earth ions or transition metal ions, if necessary, and may be appropriately selected, for example, Eu ²⁺ _, Ce ³⁺ , Pr Trivalent rare earth metal ions such as ³⁺ , Nd ³⁺ , Sm ³⁺ , Eu ³⁺ , Gd ³⁺ , Tb ³⁺ , Dy ³⁺ , Ho ³⁺ , Er ³⁺ , Tm ³⁺ , Yb ³⁺ , divalent rare earth metal ions such as Sm ²⁺ , Eu ²⁺ , and Yb ²⁺ , divalent transition metal ions such as Mn ²⁺ , and trivalent transition metal ions such as Cr ³⁺ and Fe ³⁺ .

In the embodiment, a red wavelength may be implemented using a light emitting diode and a red phosphor 52 having similar thermal and electrical characteristics without using a general red light emitting diode.

An embodiment may include the red color filter (not shown) passing a red wavelength among wavelengths excited from the red phosphor layer 52 . Since the red color filter passes only red wavelengths, even if the light of the blue light emitting diode passes through the red phosphor layer 52, it can be blocked by the red color filter. In the embodiment, the light of the blue light emitting diode passing through the red phosphor layer 52 is within 10% of the total light passing through the red phosphor layer 52, so that the color of the blue light passing through the red phosphor layer 52 Deterioration may be invisible to the naked eye.

The molding part 170 may be disposed on the substrate 120 . The molding part 170 may be disposed on top and side surfaces of the first to third light emitting devices 150a, 150b, and 150c. The molding part 170 may directly contact the substrate 120 and the first to third light emitting devices 150a, 150b, and 150c. The molding part 170 may have a top view square structure, but is not limited thereto. A top view shape of the molding part 170 may correspond to a unit pixel structure of a display device. For example, the top view of the molding part 170 may be variously changed such as a rectangle, a polygon, an ellipse, and a circle. The molding part 170 may include a black filler according to an application field of the light emitting module 10 . The black pillar can improve the appearance quality by implementing the entire light emitting surface in black color during non-emission. For example, a black filler may be included to improve the appearance quality of a light emitting module used in signage, indoor/outdoor electronic signboards, public displays, and the like.

The molding part 170 may protect the first to third light emitting devices 150a, 150b, and 150c and reduce light loss from the first to third light emitting devices 150a, 150b, and 150c. can have any thickness. For example, the height of the molding part 170 above the first to third light emitting devices 150a, 150b and 150c may be lower than the height of each of the first to third light emitting devices 150a, 150b and 150c, and the sapphire substrate It may be lower than the height of (51). The height of the molding part 170 above the first to third light emitting devices 150a, 150b, and 150c may improve light mixing within the molding part 170 and straightness out of the molding part 170.

The black matrix BM may include a function of preventing light leakage and improving appearance quality. The black matrix BM may be an opaque organic material. For example, the black matrix BM may be a black resin, and may be a black layer on a molding structure and a surface of the molding structure. The black matrix BM may include openings in which the first to third light emitting elements 150a, 150b, and 150c are disposed. One opening corresponds to one pixel of the display device and can accommodate one light emitting unit 100 . The cross-sectional thickness of the black matrix BM may be the same as the maximum cross-sectional thickness of the molding part 170, but is not limited thereto. The black matrix BM may have a matrix structure covering all outer surfaces of the plurality of light emitting units 100 . The black matrix BM blocks light interference between adjacent light emitting units 100 and provides a black screen when the driving of the display device is stopped, thereby improving appearance quality and color of each pixel. Implementation reliability can be improved.

In the embodiment, the first to third light emitting devices 150a, 150b, and 150c that can be individually driven and the molding unit 170 are directly disposed on a substrate, and the matrix-type black matrix surrounds each side of the light emitting unit 100. (BM) can provide a light emitting module 10 of a simplified structure disposed on the substrate. That is, the embodiment provides the light emitting module 10 capable of realizing full color images and images, but it is possible to realize slimness and high brightness by simplifying the configuration of the light emitting module 10 .

In the embodiment, color difference may be improved by using the first to third light emitting devices 150a, 150b, and 150c having similar thermal characteristics and novel characteristics.

According to the embodiment, power consumption can be reduced by simplifying the electrical connection structure by the structure of the COB type light emitting module 10 .

In the embodiment, a constant driving voltage or driving current is required by the first to third light emitting devices 150a, 150b, and 150c having similar thermal characteristics and novel characteristics, so that the driving circuit can be simplified and the control is easy. have

6 is an exploded perspective view showing a part of the light emitting unit according to the first embodiment, and FIGS. 7 to 11 are cross-sectional views showing a manufacturing method of the light emitting module according to the first embodiment.

As shown in FIGS. 6 to 11 , the light emitting unit of the first embodiment may adopt technical features of the light emitting unit 100 of FIGS. 1 to 5 except for the red color filter 190 . The first embodiment may include a red color filter 190 disposed on the molding part 170 . The red color filter 190 may include a function of passing a red wavelength among wavelengths converted through the red phosphor layer 52 . For example, light emitted through the red phosphor layer 52 may include a red wavelength and a blue wavelength. Since the red color filter 190 passes the red wavelength, a pure red wavelength can be implemented. That is, in the first embodiment, the first and second light emitting elements 152 and 153 including the blue or green light emitting diode, the red phosphor layer 52, and the red color filter 190 include the same physical properties, thereby providing thermal stability. It is possible to improve the color difference that changes over time.

The molding part 170 of the first embodiment may include a black pillar 171 . The black pillar 171 can improve the appearance quality by implementing the entire light emitting surface in black color when not emitting light. For example, the black pillar 171 may be included to improve the appearance quality of a light emitting module used for signage, indoor/outdoor electronic signboards, public displays, and the like.

Referring to FIG. 7 , in the method of manufacturing a light emitting module according to the first embodiment, first, a first light emitting device 151, a second light emitting device 152, and a third light emitting device 153 are formed on a substrate 120. It can be placed in a COB type on the top. The first to third light emitting devices 151 , 152 , and 153 may be mounted on the substrate 120 by SMT. The SMT may use solder paste. The solder paste may be a metal paste. For example, the solder paste may include an alloy such as AuSn or NiSn, but is not limited thereto. The first light emitting device 151 may be a blue light emitting diode, and the second light emitting device 153 may be a green light emitting diode. Although the first and second light emitting devices 151 and 152 of the first embodiment are limited to blue light emitting diodes emitting blue wavelengths, they are not limited thereto. For example, the first light emitting device 151 may be changed to a green light emitting diode emitting green wavelength.

Referring to FIG. 8 , a red phosphor layer 52 may be disposed on the first light emitting device 151 . The red phosphor layer 52 may be disposed on top and side surfaces of the first light emitting device 151 . The red phosphor layer 52 may directly contact the first light emitting element 151 . The red phosphor layer 52 may change the light from the first light emitting device 151 into a red wavelength. The red phosphor layer 52 may include a phosphor of a fluoride compound, for example, at least one of an MGF-based phosphor, a KSF-based phosphor, or a KTF-based phosphor. The MGF-based phosphor has a composition formula of, for example, Mg ₄ Ge _1-x O _y F:Mn ⁴⁺ _x , where x satisfies 0.001 ≤ x ≤ 0.1, and y may satisfy 1 ≤ y ≤5. The KSF-based phosphor, for example, may have a composition formula of K _a Si _1-c F _b :Mn ⁴⁺ _c , wherein a is 1 ≤ a ≤ 2.5, b is 5 ≤ b ≤ 6.5, and c is 0.001 ≤ c ≤ 0.1 can be satisfied. The KTF-based phosphor, for example, may have a compositional formula of K _d Ti _1-g F _e :Mn ⁴⁺ _g , wherein d is 1 ≤ d ≤ 2.5, e is 5 ≤ e ≤ 6.5, and g is 0.001 ≤ g ≤ 0.1 can be satisfied. In the phosphor layer 52, a fluoride compound phosphor, which is an Mn ⁴⁺ activator phosphor, has high luminous efficiency and strong absorption at a blue peak wavelength. The phosphor layer 52 may include a sulfide-based phosphor such as (Ca,Sr)S:Eu ²⁺ or a nitride-based phosphor such as CaAlSiN3:Eu ²⁺ phosphor. The activator may be a tetravalent transition metal ion such as Mn ⁴⁺ , or a metal ion selected from various rare earth ions or transition metal ions, if necessary, and may be appropriately selected, for example, Eu ²⁺ _, Ce ³⁺ , Pr Trivalent rare earth metal ions such as ³⁺ , Nd ³⁺ , Sm ³⁺ , Eu ³⁺ , Gd ³⁺ , Tb ³⁺ , Dy ³⁺ , Ho ³⁺ , Er ³⁺ , Tm ³⁺ , Yb ³⁺ , divalent rare earth metal ions such as Sm ²⁺ , Eu ²⁺ , and Yb ²⁺ , divalent transition metal ions such as Mn ²⁺ , and trivalent transition metal ions such as Cr ³⁺ and Fe ³⁺ .

Referring to FIG. 9 , a molding layer 170a may be formed on the substrate 120 and the first to third light emitting devices 151 , 152 , and 153 . The molding layer 170a may include a light-transmissive resin material such as epoxy or silicon. The molding layer 170a may include a black filler. The black pillar can improve the appearance quality by implementing the entire light emitting surface in black color when the light emitting module is not light emitting. For example, black pillars can improve the appearance quality of light emitting modules used in signage, indoor and outdoor electronic signboards, public displays, and the like.

Referring to FIG. 10 , unit light emitting units 100 may be formed on a substrate 120 by a cutting process. In the cutting process, the molding part 170 may be formed by etching or physically removing the molding layer.

Referring to FIG. 11 , a black matrix BM may be formed on the substrate 120 . The black matrix BM may be formed to surround an outer surface of the light emitting part 100 . The black matrix BM may be formed through a screen printing, dispensing, or injection process, but is not limited thereto.

A red color filter 190 may be formed on the molding part 170 . The red color filter 190 may vertically overlap the red phosphor layer 52 . The red color filter 190 may include a function of passing only red wavelengths among wavelengths converted through the red phosphor layer 52 . For example, light emitted through the red phosphor layer 52 may include wavelengths other than red. The red color filter 190 may pass the red wavelength and block wavelengths other than red.

By implementing a red wavelength using the first light emitting element 151, the red phosphor layer 52 and the red color filter 190 of the first embodiment, the first to third light emitting elements 151, 152, and 153 are similar to each other. It may include thermal properties and electrical properties. Therefore, the first embodiment can improve thermal stability and improve color difference that changes over time.

In the light emitting module manufacturing method of the first embodiment, the first to third light emitting elements 151, 152, and 153 are directly mounted on a substrate 120 in a COB type, and a molding part 170 and a black matrix BM are formed. This can simplify the manufacturing process.

12 is a cross-sectional view showing a light emitting module according to a second embodiment.

As shown in FIG. 12, the light emitting module of the second embodiment is the light emitting module 10 of the first embodiment of FIGS. ) can be employed.

In the second embodiment, the stepped portion 171 may be disposed on the molding portion 170 . The stepped portion 171 may be formed through a physical or chemical etching process. For example, the stepped portion 171 may have a concave shape from the upper surface of the molding portion 170 toward the substrate 120 . For example, the bottom portion of the stepped portion 171 may be disposed below the upper surfaces of the first to third light emitting devices 151 , 152 , and 153 . The stepped portion 171 may determine the position of the black matrix BM. The bottom portion of the stepped portion 171 is disposed below the top surface of the first to third light emitting devices 151, 152, and 153, and is reflected on the bottom portion of the black matrix BM and lost toward the substrate 120. light can be reduced. The height of the stepped portion 171 may be greater than that of the molding portion 170 . The height of the stepped portion 171 may be 50% or more of the height of the molding portion 170 .

The manufacturing method of the light emitting module of the second embodiment may adopt the technical features of the manufacturing method of the light emitting module of the first embodiment except for the molding part 170 and the black matrix (BM) forming step.

In the light emitting module manufacturing method of the second embodiment, a molding layer is formed on the substrate 120 and the first to third light emitting elements 151, 152, and 153, and 50% of the thickness of the molding layer is formed through a physical or chemical etching process. The stepped portion 171 can be formed to the above depth. The black matrix BM may be formed in the stepped portion 171 by a screen printing, dispensing, or injection process, but is not limited thereto. The lower surface of the black matrix BM is disposed below the upper surfaces of the first to third light emitting devices 151, 152, and 153 to improve light interference between adjacent light emitting units.

In the second embodiment, the first to third light emitting devices 151, 152, and 153 and the molding part 170, which can be individually driven, are directly disposed on the substrate 120 and surround each side of the light emitting part 100. A light emitting module having a simplified structure in which a matrix type black matrix BM is disposed on the substrate 120 may be provided. That is, the embodiment provides a light emitting module capable of realizing full color images and images, but it is possible to realize slimness and high brightness by simplifying the configuration of the light emitting module.

In the second embodiment, thermal stability can be improved and a certain color can be implemented by light emitting devices having the same physical properties.

The second embodiment implements red color using the red phosphor layer 52, thereby improving thermal stability and implementing a constant color compared to general red light emitting diodes.

13 is a cross-sectional view showing a light emitting module according to a third embodiment.

As shown in FIG. 13, the light emitting module of the third embodiment is the light emitting module 10 of the first embodiment of FIGS. 1 to 11 except for the first light emitting element 151 including the red color filter 290. technical features can be employed.

The red color filter 290 may be formed on the red phosphor layer 52 . The red color filter 290 may contact the upper surface of the red phosphor layer 52 . The red color filter 290 may be disposed in the molding layer 170 .

In the light emitting module manufacturing method of the third embodiment, the red color filter 190 may be formed after the red phosphor layer 52 is formed, and then the molding part 170 and the black matrix BM may be sequentially formed.

In the third embodiment, the first to third light emitting devices 151, 152, and 153 that can be individually driven and the molding part 170 are directly disposed on the substrate 120 and surround the side surfaces of each of the light emitting parts. A light emitting module having a simplified structure in which the black matrix BM is disposed on the substrate 120 may be provided. That is, the third embodiment provides a light emitting module capable of realizing full color images and images, but can implement slimming and high luminance by simplifying the configuration of the light emitting module.

In the third embodiment, thermal stability can be improved and a certain color can be implemented by using the first to third light emitting devices 151, 152, and 153 having similar thermal and electrical characteristics.

The third embodiment implements red color using the red phosphor layer 52 and the red color filter 290, thereby improving thermal stability and implementing a constant color compared to general red light emitting diodes.

14 is a cross-sectional view showing a light emitting module according to a fourth embodiment.

As shown in FIG. 14 , the light emitting module of the fourth embodiment may adopt technical features of the light emitting module 10 of the first embodiment of FIGS. 1 to 11 except for the wavelength conversion filter 380 .

The wavelength conversion filter 380 may be disposed on the first light emitting element 151 . The wavelength conversion filter 380 may be disposed on the top and side surfaces of the first light emitting element 151 . The wavelength conversion filter 380 may directly contact the first light emitting element 151 . The wavelength conversion filter 380 may include a red color filter and a red phosphor layer. The wavelength conversion filter 380 may include a function of converting light from the first light emitting element 151 into a red wavelength, blocking wavelengths other than red, and passing only the red wavelength.

In the manufacturing method of the light emitting module of the fourth embodiment, the wavelength conversion filter 380 in which the red color filter and the red phosphor are mixed is formed on the first light emitting element 151, and then the molding part 170 and the black matrix (BM) are formed. ) can be formed sequentially.

In the fourth embodiment, the first to third light emitting devices 151, 152, 153 and the molding part 170, which can be individually driven, are directly disposed on the substrate 120 and surround each side of the light emitting part. A light emitting module having a simplified structure in which the black matrix BM is disposed on the substrate 120 may be provided. That is, the fourth embodiment provides a light emitting module capable of realizing full color images and images, but can realize slimming and high luminance by simplifying the configuration of the light emitting module.

In the fourth embodiment, thermal stability can be improved and a certain color can be implemented by using the first to third light emitting devices 151, 152, and 153 having similar thermal and electrical characteristics.

The fourth embodiment implements red color using the wavelength conversion filter 380 including a red phosphor layer and a red color filter, thereby improving thermal stability and implementing a constant color compared to general red light emitting diodes.

15 is a cross-sectional view showing a light emitting module according to a fifth embodiment.

As shown in FIG. 15 , the light emitting module of the fifth embodiment may adopt technical features of the light emitting module of the fourth embodiment of FIG. 14 except for the wavelength conversion filter 480 .

The wavelength conversion filter 480 may be disposed on the plurality of first light emitting elements 151 . The wavelength conversion filter 480 may be disposed on an upper surface of the first light emitting element 151 . The wavelength conversion filter 480 may directly contact the first light emitting element 151 . The wavelength conversion filter 480 may include a red color filter and a red phosphor layer. The wavelength conversion filter 480 may include a function of converting light from the first light emitting device 151 into a red wavelength, blocking wavelengths other than red, and passing only the red wavelength.

The manufacturing method of the light emitting module of the fifth embodiment may employ technical features of the manufacturing method of the light emitting module of the fourth embodiment.

In the fifth embodiment, the first to third light emitting devices 151, 152, and 153 that can be individually driven and the molding unit 170 are directly disposed on the substrate 120 and surround the side surfaces of each of the light emitting units. A light emitting module having a simplified structure in which the black matrix BM is disposed on the substrate 120 may be provided. That is, the fifth embodiment provides a light emitting module capable of realizing full color images and images, but can realize slimming and high luminance by simplifying the configuration of the light emitting module.

In the fifth embodiment, a certain color can be implemented by the first to third light emitting devices 151, 152, and 153 having similar thermal and electrical characteristics.

In the fifth embodiment, red color is implemented using the wavelength conversion filter 480 including the red phosphor layer and the red color filter, so that uniform color can be implemented.

16 is a cross-sectional view showing a light emitting module according to a sixth embodiment.

As shown in FIG. 16, the light emitting module of the sixth embodiment is technically similar to the light emitting module 10 of the first embodiment of FIGS. 1 to 11 except for the upper substrate TG including the red color filter 190. features can be employed.

The upper substrate TG may be disposed on the molding part 170 . The upper substrate TG may be a transparent glass substrate, but is not limited thereto.

The red color filter 190 may be disposed on the upper substrate TG. The red color filter 190 may be disposed on a lower surface of the upper substrate TG. The red color filter 190 may vertically overlap the red phosphor layer 52 .

The manufacturing method of the light emitting module of the sixth embodiment may adopt the technical features of the manufacturing method of the light emitting module of the first embodiment except for forming the red color filter 190 on the upper substrate TG. A step of aligning the upper substrate TG so as to vertically overlap the red phosphor layer 52 may be included.

In the sixth embodiment, the first to third light emitting devices 151, 152, and 153 that can be individually driven and the molding unit 170 are directly disposed on the substrate 120 and surround the side surfaces of each of the light emitting units. A light emitting module having a simplified structure in which the black matrix BM is disposed on the substrate 120 may be provided. That is, the sixth embodiment provides a light emitting module capable of realizing full color images and images, but can realize slimming and high luminance by simplifying the configuration of the light emitting module.

In the sixth embodiment, a certain color can be implemented by the first to third light emitting devices 151, 152, and 153 having similar thermal and electrical characteristics.

The sixth embodiment implements red color using the red phosphor layer 52 and the red color filter 190 of the upper substrate TG, thereby improving thermal stability and implementing a constant color compared to general red light emitting diodes. .

17 and 18 are exploded perspective views illustrating a light emitting module according to a seventh embodiment.

17 and 18, the seventh embodiment includes first to third light emitting devices 151, 152, and 153, and a red phosphor layer 252 on the first light emitting device 151. ) and a red color filter 291 may be disposed, and a green phosphor layer 254 and a green color filter 293 may be disposed on the second light emitting element 152 . The seventh embodiment has technical characteristics of the light emitting module 10 of the first embodiment of FIGS. 1 to 11 except for the green phosphor layer 254 and the green color filter 293 on the second light emitting element 152. can be employed.

The green phosphor layer 254 may emit light with a peak wavelength of 570 nm or less, for example, 540 nm to 560 nm. For example, the green phosphor layer 254 is (Y,Gd,Lu,Tb) ₃ (Al,Ga) ₅ O ₁₂ :Ce, (Mg,Ca,Sr,Ba) ₂ SiO ₄ :Eu, (Ca,Sr) ₃ SiO ₅ :Eu, (La,Ca) ₃ Si ₆ N11:Ce, α-SiAlON:Eu, β-SiAlON:Eu, Ba ₃ Si ₆ O ₁₂ N ₂ :Eu, Ca ₃ (Sc,Mg) ₂ Si ₃ O ₁₂ :Ce, CaSc ₂ O ₄ :Eu, BaAl ₈ O ₁₃ :Eu, (Ca,Sr,Ba)Al ₂ O ₄ :Eu, (Sr,Ca,Ba)(Al,Ga,In) ₂ S ₄ :Eu, (Ca,Sr) ₈ (Mg,Zn)(SiO ₄ ) ₄ C _l2 :Eu/Mn, (Ca,Sr,Ba) ₃ MgSi ₂ O ₈ :Eu/Mn, (Ca,Sr,Ba ) ₂ (Mg,Zn)Si ₂ O ₇ :Eu, Zn ₂ SiO ₄ :Mn, (Y,Gd)BO ₃ :Tb, ZnS:Cu,Cl/Al, ZnS:Ag,Cl/Al, (Sr, Ca) ₂ Si ₅ N ₈ :Eu, (Li,Na,K) ₃ ZrF ₇ :Mn, (Li,Na,K) ₂ (Ti,Zr)F ₆ :Mn, (Ca,Sr,Ba)(Ti ,Zr)F ₆ :Mn, Ba _0.65 Zr _0.35 F _2.7 :Mn, (Sr,Ca)S:Eu, (Y,Gd)BO ₃ :Eu, (Y,Gd)(V,P)O ₄ :Eu , Y ₂ O ₃ :Eu, (Sr,Ca,Ba,Mg) ₅ (PO ₄ ) ₃ Cl:Eu, (Ca,Sr,Ba)MgAl ₁₀ O ₁₇ :Eu, (Ca,Sr,Ba)Si ₂ O ₂ N ₂ :Eu, 3.5MgO·0.5MgF ₂ ·GeO ₂ :Mn, etc., one type or two or more types may be selected. The green phosphor layer 254 may include quantum dots, and the quantum dots may include a II-VI compound or a III-V compound semiconductor, and may emit green light. The quantum dots may be, for example, ZnS, ZnSe, ZnTe, CdS, CdSe, CdTe, GaN, GaP, GaAs, GaSb, InP, InAs, In,Sb, AlS, AlP, AlAs, PbS, PbSe, Ge, Si, CuInS ₂ , CuInSe ₂ and the like, and combinations thereof.

Since the seventh embodiment uses blue light emitting diodes for all of the first to third light emitting devices 151, 152, and 153, it can have an advantage of excellent productivity.

The manufacturing method of the seventh embodiment may employ technical features of the manufacturing method of the first embodiment.

In the seventh embodiment, the first to third light emitting elements 151, 152, and 153 of a blue light emitting diode, a red phosphor layer 252, a red color filter 291, a green phosphor layer 254, and a green color filter 293 ) and the molding unit 170 are directly disposed on the substrate 120, and a matrix-type black matrix (BM) surrounding each side of the light emitting unit is disposed on the substrate 120 to provide a light emitting module having a simplified structure. can That is, the seventh embodiment provides a light emitting module capable of realizing full color images and images, but can realize slimming and high luminance by simplifying the configuration of the light emitting module.

The seventh embodiment can improve thermal stability and implement a constant color sense by using the first to third light emitting devices 151, 152, and 153 having similar thermal and electrical characteristics.

The seventh embodiment uses a first light emitting element 151, a red phosphor layer 252, a red color filter 291, a second light emitting element 152, a green phosphor layer 254, and a green color filter 293. By implementing red and green colors, thermal stability can be improved compared to general red light emitting diodes, and a constant color can be implemented.

19 and 20 are plan views and exploded views illustrating a light emitting module according to an eighth embodiment.

19 and 20, the eighth embodiment may include a plurality of white light emitting diodes 350, a red color filter 391, a blue color filter 392, and a green color filter 393. .

In the eighth embodiment, four white light emitting diodes 350 may be disposed in one light emitting part corresponding to one pixel.

The white light emitting diode 350 may include first to fourth white light emitting diodes 350a, 350b, 350c, and 350d.

The red color filter 391 may be disposed on the first white light emitting diode 350a. The red color filter 391 may overlap the first white light emitting diode 350a in a vertical direction. The red color filter 391 may directly contact the first white light emitting diode 350a. The red color filter 391 may pass light of a red wavelength among the light emitted from the first white light emitting diode 350a.

The blue color filter 392 may be disposed on the second white light emitting diode 350b. The blue color filter 392 may overlap the second white light emitting diode 350b in a vertical direction. The blue color filter 392 may directly contact the second white light emitting diode 350b. The blue color filter 392 may pass light of a red wavelength among light emitted from the second white light emitting diode 350b.

The green color filter 393 may be disposed on the third white light emitting diode 350c. The green color filter 393 may overlap the third white light emitting diode 350c in a vertical direction. The green color filter 393 may directly contact the third white light emitting diode 350c. The green color filter 393 may pass light of a red wavelength among the light emitted from the third white light emitting diode 350c.

In the eighth embodiment, all light emitting devices are arranged as white light emitting diodes 350, and full color is implemented using a red color filter 391, a blue color filter 392, and a green color filter 393, and at the same time, Color balance, brightness, etc. may be compensated for using the 4 white light emitting diodes 350d. The eighth embodiment may have an advantage of excellent productivity, and may realize color purity and high luminance.

In the eighth embodiment, a certain color can be implemented by white light emitting diodes having similar thermal and electrical characteristics.

The eighth embodiment implements full color using white light emitting diodes and a red color filter 391, a blue color filter 392, and a green color filter 393, thereby improving thermal stability compared to general red light emitting diodes, A certain color can be realized.

21 and 22 are a plan view and an exploded perspective view illustrating a light emitting module according to a ninth embodiment.

As shown in FIGS. 21 and 22 , the ninth embodiment may employ technical features of the light emitting module 10 of the first embodiment of FIGS. 1 to 11 except for the white light emitting diode 550 .

In the ninth embodiment, a white light emitting diode 550 is included in each light emitting unit to compensate for color balance and brightness. The ninth embodiment may have an advantage of excellent productivity, and implement color purity and high luminance.

In the ninth embodiment, full color may be implemented using the first to third light emitting devices 151, 152, and 153, and color balance and brightness may be compensated for using the white light emitting diode 550. The ninth embodiment may have an advantage of excellent productivity, and implement color purity and high luminance.

In the ninth embodiment, a constant color can be implemented by using blue light emitting diodes and green light emitting diodes having similar thermal and electrical characteristics.

The ninth embodiment implements full color by using a blue light emitting diode, a green light emitting diode, a red phosphor layer, and a red color filter, thereby improving thermal stability and realizing a constant color compared to general red light emitting diodes.

23 and 24 are a plan view and an exploded perspective view illustrating a light emitting module according to a tenth embodiment.

As shown in FIGS. 23 and 24 , the light emitting module of the tenth embodiment may adopt technical features of the light emitting modules of the first to ninth embodiments, except for the second black matrix BM2.

The second black matrix BM2 may be black resin, and may be a forming structure and a black layer coated on a surface of the forming structure. The second black matrix BM2 may be disposed within one light emitting unit. The second black matrix BM2 may be disposed between the first light emitting element 151 contacting the red phosphor layer 152 and the second and third light emitting elements 152 and 153 . The second black matrix BM2 surrounds the first light emitting element 151 in contact with the red phosphor layer 52 and may be spaced apart from the red phosphor layer 52 by a predetermined interval. The second black matrix BM2 may extend from the first black matrix BM1. The second black matrix BM2 may have a height higher than that of the red phosphor layer 52 . For example, the upper surface of the second black matrix BM2 may have the same height as the first black matrix BM1, but is not limited thereto. Since the second black matrix BM2 has a higher height than the red phosphor layer 52 , interference between blue light and green light emitted from the second and third light emitting devices 152 and 153 can be prevented. Specifically, the tenth embodiment can implement a desired color by blocking blue and green light of the second and third light emitting devices 152 and 153 spaced apart from the red phosphor layer 52 . For example, the second black matrix BM2 of the tenth embodiment can improve the problem that the green wavelength light emitted from the second light emitting element 153 is excited by the red phosphor layer 52 and converted into red wavelength when implementing green color. can

The manufacturing method of the light emitting module according to the tenth embodiment may employ technical features of the manufacturing method of the light emitting module according to the first embodiment except for the step of forming the second black matrix BM2.

The second black matrix BM2 may be formed through a screen printing, dispensing, or injection process, but is not limited thereto. The second black matrix BM2 may be formed simultaneously with the formation of the first black matrix BM1, but is not limited thereto.

In the tenth embodiment, the first to third light emitting elements 151, 152, 153 and the molding part 170, which can be individually driven, are directly disposed on the substrate 120 and surround each side of the light emitting part. A light emitting module having a simplified structure in which the first black matrix BM is disposed on the substrate 120 may be provided. That is, the embodiment provides a light emitting module capable of realizing full color images and images, but it is possible to realize slimness and high brightness by simplifying the configuration of the light emitting module.

The tenth embodiment can improve thermal stability and implement a constant color sense by light emitting devices having similar thermal and electrical characteristics.

The tenth embodiment implements red color using the red phosphor layer 52 and the red color filter 190, thereby improving thermal stability and implementing a constant color compared to general red light emitting diodes.

In the tenth embodiment, light is emitted by the red phosphor layer 52 and the second black matrix BM2 disposed between the second and third light emitting devices 152 and 153 spaced apart from the red phosphor layer 52. Reliability of color implementation of each unit may be improved.

25 is a plan view and an exploded perspective view illustrating a light emitting module according to an eleventh embodiment.

As shown in FIG. 25 , the light emitting module of the eleventh embodiment may adopt technical features of the light emitting modules of the first to ninth embodiments except for the second black matrix BM2. The second black matrix BM2 may be black resin. The second black matrix BM2 may be disposed within one light emitting unit. The second black matrix BM2 may be disposed between the first light emitting device 151 including the red phosphor layer 52 and the second and third light emitting devices 152 and 153 . The second black matrix BM2 surrounds the first light emitting element 151 including the red phosphor layer 52 and may be spaced apart from the red phosphor layer 52 by a predetermined interval. The second black matrix BM2 may extend from the first black matrix BM1. The second black matrix BM2 may have a height higher than that of the red phosphor layer 52 . For example, an upper surface of the second black matrix BM2 may be disposed above an upper surface of the red phosphor layer 52 .

The second black matrix BM2 may have a lower height than the first black matrix BM1. Since the second black matrix BM2 has a higher height than the red phosphor layer 52 , interference between blue light and green light emitted from the second and third light emitting devices 152 and 153 can be prevented. In detail, the eleventh embodiment can implement a desired color by blocking blue and green light of the second and third light emitting devices 152 and 153 spaced apart from the red phosphor layer 52 . For example, the second black matrix BM2 of the eleventh embodiment can improve the problem that green wavelength light emitted from the third light emitting element 153 is excited by the red phosphor layer 52 and converted into red wavelength when implementing green color. can

Except for the step of forming the second black matrix BM2, the manufacturing method of the light emitting module according to the eleventh embodiment may adopt the technical features of the manufacturing method of the light emitting module according to the first embodiment. For example, the second black matrix BM2 may be formed by an injection process after forming the molding part 170 by a cutting process of the molding layer. As another example, the molding part 170 may be formed after the second black matrix BM2 is formed simultaneously or sequentially with the first black matrix BM1 through an injection process.

In the eleventh embodiment, the first to third light emitting devices 151, 152, and 153 that can be individually driven and the molding part 170 are directly disposed on the substrate 120 and surround the side surfaces of each of the light emitting parts. A light emitting module having a simplified structure in which the first black matrix BM1 is disposed on the substrate 120 may be provided. That is, the embodiment provides a light emitting module capable of realizing full color images and images, but it is possible to realize slimness and high brightness by simplifying the configuration of the light emitting module.

The eleventh embodiment can improve thermal stability and implement a constant color sense by using light emitting devices having similar thermal and electrical characteristics.

In the eleventh embodiment, by implementing red color using the red phosphor layer 52 and the red color filter 190, thermal stability can be improved compared to general red light emitting diodes, and a constant color can be implemented.

In the eleventh embodiment, the first light emitting element 151 in contact with the red phosphor layer 52 and the second black matrix BM2 disposed between the second and third light emitting elements 152 and 153 constitute a light emitting unit. Reliability of each color implementation can be improved.

26 and 27 are a plan view and an exploded perspective view illustrating a light emitting module according to a twelfth embodiment.

As shown in FIGS. 26 and 27 , the light emitting module of the twelfth embodiment may adopt technical features of the light emitting module of the tenth embodiment, except for the red color filter 190 .

The twelfth embodiment may include a red color filter 190 disposed on the molding part 170 . The red color filter 190 may include a function of passing a red wavelength among wavelengths converted through the red phosphor layer 52 . For example, light emitted through the red phosphor layer 52 may include wavelengths other than red. Since the red color filter 190 passes only the red wavelength, a pure red wavelength can be implemented. That is, the twelfth embodiment can improve the color sense of a red wavelength by including the red phosphor layer 52 and the red color filter 190 .

28 is a plan view and an exploded perspective view illustrating a light emitting module according to a thirteenth embodiment.

As shown in FIG. 28 , the light emitting module of the thirteenth embodiment may adopt technical features of the light emitting module of the eleventh embodiment, except for the color filter 190 .

The thirteenth embodiment may include a red color filter 190 disposed on the molding part 170 . The red color filter 190 may include a function of passing a red wavelength among wavelengths converted through the red phosphor layer 52 . For example, light emitted through the red phosphor layer 52 may include wavelengths other than red. Since the red color filter 190 passes only the red wavelength, a pure red wavelength can be implemented. That is, the thirteenth embodiment includes the red phosphor layer 52 and the red color filter 190 to improve the color sense of the red wavelength.

The light emitting module 100 according to the embodiment may be applied to not only the display device but also a lighting unit, an indicator device, a lamp, a street light, a vehicle lighting device, a vehicle display device, and a smart watch, but is not limited thereto.

Features, structures, effects, etc. described in the embodiments above are included in at least one embodiment, and are not necessarily limited to only one embodiment. Furthermore, the features, structures, and effects illustrated in each embodiment can be combined or modified with respect to other embodiments by those skilled in the art in the field to which the embodiments belong. Therefore, contents related to these combinations and modifications should be construed as being included in the scope of the embodiments.

Although the above has been described centering on the embodiment, this is only an example and does not limit the embodiment, and those skilled in the art in the field to which the embodiment belongs may find various things not exemplified above to the extent that they do not deviate from the essential characteristics of the embodiment. It will be appreciated that variations and applications of branches are possible. For example, each component specifically shown in the embodiment can be modified and implemented. And differences related to these modifications and applications should be construed as being included in the scope of the embodiments set forth in the appended claims.

52: red phosphor layer
100: light emitting part
150a: first light emitting element
150b: second light emitting element
150c: third light emitting element

Claims (20)

Board;
a plurality of light emitting units disposed on the substrate; and
A first black matrix surrounding each of the plurality of light emitting units;
Each of the plurality of light emitting units,
a first light emitting element disposed on the substrate and emitting blue light;
a second light emitting element disposed on the substrate and emitting blue light;
a third light emitting element disposed on the substrate and emitting blue light;
a red phosphor layer disposed on the first light emitting element;
a green phosphor layer disposed on the second light emitting element;
A second black matrix extending from the first black matrix and surrounding a side surface of the first light emitting element adjacent to the second and third light emitting elements;
The second black matrix has a height higher than the upper surface of the red phosphor layer from the upper surface of the substrate and is disposed to be spaced apart from the red phosphor layer. According to claim 1,
The height of the second black matrix is higher than the heights of the second and third light emitting elements,
An upper surface of the second black matrix is disposed above upper surfaces of the green phosphor layer and upper surfaces of the second and third light emitting elements. According to claim 2,
The second black matrix has a height smaller than or equal to that of the first black matrix. According to claim 1,
A light emitting module further comprising a red color filter disposed on the red phosphor layer. According to claim 1,
A light emitting module further comprising a green color filter disposed on the green phosphor layer. According to claim 1,
The red phosphor layer has a blue wavelength transmittance of 10% or less,
The thickness of the red phosphor layer is 300㎛ or less light emitting module. delete delete delete delete delete delete delete delete delete delete delete delete delete delete

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