KR20170101065A - Light emitting module and display device - Google Patents

Abstract

The present invention relates to a light emitting module, a method for manufacturing the light emitting module, and a display device. According to an embodiment of the present invention, the light emitting module comprises: a substrate; a plurality of light emitting parts disposed on the substrate; and a first black matrix surrounding each of the plurality of light emitting parts. Each of the plurality of the light emitting parts includes: a first light emitting element emitting blue light disposed on the substrate; a second light emitting element emitting the blue light disposed on the substrate; a red phosphor layer disposed on the first light emitting element; and a second black matrix disposed between the first and second light emitting elements, and having the height higher than the red phosphor layer from an upper surface of the substrate. A color difference can be improved by the light emitting elements having similar thermal characteristics and electrical characteristics.

Description

[0001] LIGHT EMITTING MODULE AND DISPLAY DEVICE [0002]

Embodiments relate to a light emitting module, a method of manufacturing a light emitting module, and a display device.

A light emitting diode (LED) is one of light emitting devices that emits light when current is applied. The light emitting diode is capable of emitting light with high efficiency at a low voltage, thus providing excellent energy saving effect. In recent years, the problem of luminance of a light emitting diode has been greatly improved, and it has been applied to various devices such as a backlight unit of a liquid crystal display device, a display board, a display device, and a home appliance.

Conventional liquid crystal display devices display images or images by light passing through a color filter by controlling transmittance of light and liquid crystal in a plurality of light emitting device packages having light emitting diodes mounted thereon.

In recent years, a display device with high image quality such as HD and a display device with a size of 100 inches or more is required. However, a liquid crystal display device and an organic electric field display device having complicated configurations, which are generally used, There was difficulty.

Embodiments provide a light emitting module, a method of manufacturing a light emitting module, and a display device capable of providing full color.

The embodiment provides a light emitting device package and a display device capable of realizing uniform color and uniform luminance.

The embodiment provides a light emitting module, a method of manufacturing a light emitting module, and a display device that can simplify the configuration and are advantageous for slimming.

Embodiments provide a light emitting module, a method of manufacturing a light emitting module, and a display device capable of improving productivity and improving yield.

Embodiments provide a light emitting module, a method of manufacturing a light emitting module, and a display device that improve the color difference by light emitting elements having similar characteristics.

The embodiment provides a light emitting module, a method of manufacturing a light emitting module, and a display device, which simplify the drive circuit by the light emitting elements of similar electrical characteristics and are easy to control.

Embodiments provide a light emitting module, a method of manufacturing a light emitting module, and a display device capable of improving the reliability of each light emitting portion color implementation.

The embodiment provides a display device having excellent image and image straightness.

The embodiment provides a display device capable of realizing a large-sized display device of high resolution.

The embodiment provides a display device having excellent color purity and color reproduction.

The light emitting module of the embodiment includes a substrate; A plurality of light emitting portions disposed on the substrate; And a first black matrix surrounding each of the plurality of light emitting portions, wherein each of the plurality of light emitting portions includes: a first light emitting element that emits blue light disposed on the substrate; A second light emitting element for emitting blue light arranged on the substrate; A red phosphor layer disposed on the first light emitting element; And a second black matrix disposed between the first and second light emitting elements and having a height higher than the red phosphor layer from the upper surface of the substrate.

Embodiments can improve color difference by light emitting devices having similar thermal and emissive properties.

The embodiment can realize full color by the first to third flip chip type light emitting devices individually driven in one pixel.

Embodiments can achieve uniform color and uniform brightness.

The embodiment can simplify the configuration and has advantages advantageous to slimming.

The embodiment can improve the productivity and improve the yield.

The embodiment can improve the color difference by the similar characteristics of the light emitting elements.

The embodiment simplifies the driving circuit by the light emitting elements having similar electrical characteristics, and can be easily controlled.

The embodiment can implement a 100-inch or larger-sized large screen display device of HD image quality that is excellent in straightness of images and images.

Embodiments can realize a display device having excellent color purity and color reproduction.

Embodiments can improve the reliability of each light emitting portion color implementation.

1 is a perspective view showing a light emitting module of an embodiment.
2 is a perspective view showing a light emitting portion of the embodiment.
3 is a plan view showing a substrate and a plurality of light emitting elements of the embodiment.
4 is a cross-sectional view showing a light emitting portion cut along the line I-I 'of FIG.
5 is a plan view showing the lower surface of the substrate of the embodiment.
6 is an exploded perspective view showing a part of the light emitting portion of the first embodiment.
7 to 11 are cross-sectional views showing a manufacturing method of the light emitting module of the first embodiment.
12 is a sectional view showing the light emitting module of the second embodiment.
13 is a sectional view showing the light emitting module of the third embodiment.
14 is a sectional view showing a light emitting module of the fourth embodiment.
15 is a sectional view showing the light emitting module of the fifth embodiment.
16 is a sectional view showing the light emitting module of the sixth embodiment.
17 and 18 are exploded perspective views showing the light emitting module of the seventh embodiment.
Figs. 19 and 20 are a plan view and a disassembly view showing the light emitting module of the eighth embodiment.
21 and 22 are a plan view and an exploded perspective view showing the light emitting module of the ninth embodiment.
23 and 24 are a plan view and an exploded perspective view showing the light emitting module of the tenth embodiment.
25 is a plan view and an exploded perspective view showing the light emitting module of the eleventh embodiment.
26 and 27 are a plan view and an exploded perspective view showing the light emitting module of the twelfth embodiment.
28 is a plan view and an exploded perspective view showing the light emitting module of the thirteenth embodiment.

In the description of the embodiments, it is to be understood that each layer (film), area, pattern or structure may be referred to as being "on" or "under" the substrate, each layer Quot; on "and" under "are intended to include both" directly "or" indirectly " do. Also, the criteria for top, bottom, or bottom of each layer will be described with reference to the drawings.

3 is a plan view showing a substrate and a plurality of light emitting devices of the embodiment, and Fig. 4 is a cross-sectional view taken along the line I- And FIG. 5 is a plan view showing the lower surface of the substrate of the embodiment. FIG.

1 to 5, the light emitting module 10 of the embodiment may include a plurality of light emitting portions 100, a black matrix BM, and a substrate.

The light emitting module 10 of the embodiment can realize a simplified structure, slimness, and high brightness that realize a full color image or image. For this, the light emitting module 10 of the embodiment can be directly mounted on the substrate in a COB (Chip on Board) type, but the present invention is not limited thereto. Although not shown in the drawing, a driving circuit (not shown) for driving the light emitting unit 100 may be mounted on a lower surface of the substrate. The light emitting unit 100 may correspond to one pixel and may include first to third light emitting devices 150a, 150b, and 150c to realize full color.

Generally, red light emitting diodes emitting red light have weak characteristics to deteriorate. In a general red light emitting diode, the droop phenomenon, in which the light output is lowered, is larger than that of the blue light emitting diode after a certain period of time due to deterioration of thermal reliability.

The embodiment can provide a light emitting module having a uniform color tone by using light emitting diodes having similar droop characteristics. The similarity of the droop characteristics can mean that the difference in optical characteristics between adjacent LEDs can not be visually perceived.

 To this end, the embodiment arranges the red phosphor layer 52 on the first light emitting element 150a having thermal and electrical characteristics similar to those of the second and third light emitting elements 150b and 150c emitting light of wavelengths other than red So that a red wavelength can be realized.

The first to third light emitting devices 150a, 150b, and 150c of the embodiment may be light emitting diodes having similar thermal characteristics. For example, the first to third light emitting devices 150a, 150b, and 150c may be GaN-based light emitting diodes, but the present invention is not limited thereto. For example, the first to third light emitting devices 150a, 150b, and 150c may be at least one of a blue light emitting diode, a green light emitting diode, a purple light emitting diode, and a yellow light emitting diode. Embodiments may include light emitting diodes that are similar in thermal and electrical characteristics and capable of full color.

For example, the first light emitting device 150a may include a blue light emitting diode that emits blue light and a red phosphor layer 52 that covers the first light emitting device 150a. The embodiment can be changed as long as the light emitting elements disposed in the light emitting portion 100 have similar thermal and electrical characteristics to the light emitting diodes. For example, the first to third light emitting devices 150a, 150b, and 150c may be all blue light emitting diodes, and may include a red phosphor layer 52 disposed on the first light emitting device 150a, And a green phosphor layer disposed on the green phosphor layer. Alternatively, the first to third light emitting devices 150a, 150b, and 150c may be all green light emitting diodes, and may include a red phosphor layer 52 disposed on the first light emitting device 150a, And a blue phosphor layer disposed on the phosphor layer 153. As another example, a variety of light emitting diodes and phosphor layers capable of emitting red, green, and blue wavelengths may be included.

The light emitting unit 100 may have a polygonal structure. For example, the light emitting unit 100 may include four corners and four outer surfaces, and the upper surface and the lower surface may have a flat plate shape, but the present invention is not limited thereto. The substrate of the embodiment may include first to fourth corners 125, 126, 127 and 128 and first to fourth outer surfaces 121, 122, 123 and 124.

The first outer surface 121 may be symmetrically aligned with the second outer surface 122 in a first direction X-X '. The third outer surface 123 may be symmetrically aligned with the fourth outer surface 124 in a first direction X-X '. The first and second outer surfaces 121 and 122 may be disposed in a second direction Y-Y 'orthogonal to the third and fourth outer surfaces 123 and 124.

The first edge 125 may be disposed in a region where the first outer surface 121 and the third outer surface 123 meet. The second edge 126 may be disposed in a region where the second outer surface 122 and the third outer surface 123 meet. The third edge 127 may be disposed in a region where the first outer surface 121 and the fourth outer surface 124 meet. The fourth edge 128 may be disposed in a region where the second outer surface 122 and the fourth outer surface 124 meet.

The substrate may include a resin-based printed circuit board (PCB), a metal core PCB, a flexible PCB, a ceramic PCB, and an FR-4 substrate. The substrate 120 of the first embodiment may include a printed circuit board having a metal layer. The substrate includes upper electrode patterns 131, 132, 133 and 134 on a sub-substrate 120S, lower electrode patterns 141, 142, 143 and 144 below the sub-substrate 120S, The first to third connection electrodes 161, 162, and 163 may be formed.

The first to third light emitting devices 150a, 150b, and 150c may be disposed at regular intervals. The first, second, and third light emitting devices 150a, 150b, 150c may be staggered in a first direction X-X ', but the present invention is not limited thereto. For example, the first to third light emitting devices 150a, 150b and 150c may be arranged in a first direction X-X 'or a second direction Y-Y' orthogonal to the first direction X-X ' As shown in FIG. The first to third light emitting devices 150a, 150b, and 150c may be directly mounted on a substrate in a COB (Chip on Board) type. In the light emitting module 10 of the embodiment, the first to third light emitting devices 150a, 150b and 150c are mounted on the substrate in a COB type so that the configuration can be simplified, and slimness and high brightness can be realized. The first to third light emitting devices 150a, 150b, and 150c may be mounted on a substrate by SMT (Surface Mounting Technology). The SMT is a method of mounting the first to third light emitting devices 150a, 150b and 150c on a substrate using a solder paste (not shown), and the solder paste may be a metal paste. For example, the solder paste may include an alloy such as AuSn and NiSn, but is not limited thereto.

The first to third light emitting devices 150a, 150b and 150c may include a sapphire substrate 51, a light emitting layer 53, and first and second light emitting device electrodes 57 and 59. The first, second, and third light emitting devices 150a, 150b, and 150c may have a flip chip structure in which the first and second light emitting device electrodes 57 and 59 are disposed below and directly mounted on the substrate.

The red phosphor layer 52 may be disposed on the upper surface and the side surface of the first light emitting device 150a, but the present invention is not limited thereto. The red phosphor layer 52 may be in direct contact with the first light emitting device 150a. The thickness of the red phosphor layer 52 may be 300 mu m or less and 150 mu m, but is not limited thereto.

The red phosphor layer 52 may include a phosphor of a fluoride compound, and may include at least one of an MGF-based phosphor, a KSF-based phosphor, and a KTF-based phosphor. The MGF-base phosphor has a composition formula of Mg ₄ Ge _{1 -x} O _y F: Mn ⁴⁺ _x , where x satisfies 0.001? X? 0.1 and y can satisfy 1? Y? 5. A KsF-based phosphor, for example, K _a Si _{1 -c} F _b : Mn ⁴⁺ _c , where a is 1? A? 2.5, b is 5? B? 6.5, and c is 0.001? C ≪ / = 0.1. The KTF-based fluorescent material, for example, K _d Ti _1-e F _g: may have a composition formula Mn ⁴⁺ _g, wherein d is 1 ≤ d ≤ 2.5, wherein e is 5 ≤ e ≤ 6.5, wherein g is 0.001 ≤ g ≪ / = 0.1. The red phosphor layer 52 has a high luminescence efficiency and strong absorption at the blue peak wavelength, which is a Mn ⁴⁺ activator phosphor. The red phosphor layer 52 may include a sulfide phosphor, for example, (Ca, Sr) S: Eu ²⁺ or a nitride-based phosphor such as CaAlSiN 3: Eu ²⁺ phosphor. The active material may be a tetravalent transition metal ion such as Mn ⁴⁺ or a metal ion selected from a variety of rare earth ions and transition metal ions. For example, Eu ²⁺ _, Ce ³⁺ , Pr ^Trivalent rare earth metal ions such as ³⁺ , Nd ³⁺ , Sm ³⁺ , Eu ³⁺ , Gd ³⁺ , Tb ³⁺ , Dy ³⁺ , Ho ³⁺ , Er ³⁺ , Tm ³⁺ , Yb ³⁺ , Divalent rare earth metal ions such as Sm ²⁺ , Eu ²⁺ and Yb ²⁺ , divalent transition metal ions such as Mn ^2+, and trivalent transition metal ions such as Cr ³⁺ and Fe ³⁺ .

The embodiment can realize a red wavelength by using a light emitting diode and a red phosphor 52 having similar thermal characteristics and electrical characteristics without using a general red light emitting diode.

The embodiment may include the red color filter (not shown) that passes the red wavelength in the excited wavelength from the red phosphor layer 52. Since the red color filter passes only the red wavelength, it can be blocked by the red color filter even though the light of the blue light emitting diode passes through the red phosphor layer 52. In the embodiment, the light of the blue light emitting diode passing through the red phosphor layer 52 is within 10% of the total light passing through the red phosphor layer 52 and the color of the blue light passing through the red phosphor layer 52 Deterioration may not be perceived visually.

The molding part 170 may be disposed on the substrate 120. The molding unit 170 may be disposed on the top and sides of the first to third light emitting devices 150a, 150b, and 150c. The molding part 170 may directly contact the substrate 120 and the first to third light emitting devices 150a, 150b, and 150c. The molding unit 170 may have a square structure, but the present invention is not limited thereto. The top view shape of the molding part 170 may correspond to the unit pixel structure of the display device. For example, the top view of the molding unit 170 may be varied in various shapes such as a rectangle, a polygon, an ellipse, a circle, and the like. The molding part 170 may include a black filler depending on the application of the light emitting module 10. The black filler can improve the appearance quality by realizing the entire light emitting surface in black color at the time of non-light emission. For example, the black filler may be included in a light emitting module used for signage, indoor and outdoor display boards, public displays, etc. to improve the appearance quality.

The molding unit 170 protects the first to third light emitting devices 150a, 150b and 150c and can improve the light loss from the first to third light emitting devices 150a, 150b, and 150c It can have a certain thickness. For example, the height of the molding part 170 on the first to third light emitting devices 150a, 150b and 150c may be lower than the height of each of the first to third light emitting devices 150a, 150b and 150c, (51). The height of the molding part 170 on the first to third light emitting devices 150a, 150b and 150c can improve the light mixing in the molding part 170 and the straightness to the outside of the molding part 170. [

The black matrix BM may include a function of preventing light leakage and improving appearance quality. The black matrix (BM) may be an opaque organic material. For example, the black matrix BM may be a black resin, and may be a black layer on the surface of the forming structure and the forming structure. The black matrix BM may include openings in which the first to third light emitting devices 150a, 150b, and 150c are disposed. One opening corresponds to one pixel of the display device, and one light emitting portion 100 can be accommodated. The cross-sectional thickness of the black matrix BM may be equal to the maximum cross-sectional thickness of the molding portion 170, but is not limited thereto. The black matrix BM may have a matrix structure that covers the outer surfaces of the plurality of light emitting units 100. The black matrix BM blocks light interference between adjacent light emitting units 100 and provides a screen of black color at the time of stopping the driving of the display device, thereby improving the appearance quality, and the color of each pixel The reliability of implementation can be improved.

In the embodiment, the first to third light emitting devices 150a, 150b, and 150c and the molding unit 170, which can be individually driven, are disposed directly on the substrate, and the matrix type black matrix The light emitting module 10 having a simplified structure in which the light emitting device BM is disposed on the substrate can be provided. That is, the embodiment provides a light emitting module 10 capable of realizing images and images by implementing full color, and the structure of the light emitting module 10 can be simplified to realize a slim and high brightness.

The embodiment can improve the color difference by the first to third light emitting devices 150a, 150b, and 150c having similar thermal characteristics and empirical characteristics.

In the embodiment, the electrical connection structure is simplified by the COB type light emitting module 10 structure, so that the power consumption can be reduced.

The embodiment requires a constant driving voltage or driving current by the first to third light emitting devices 150a, 150b, and 150c having similar thermal characteristics and advanced characteristics, thereby simplifying the driving circuit and facilitating the control Respectively.

FIG. 6 is an exploded perspective view showing a part of the light emitting portion of the first embodiment, and FIGS. 7 to 11 are sectional views showing a manufacturing method of the light emitting module of the first embodiment.

6 to 11, the light emitting portion of the first embodiment can employ the technical features of the light emitting portion 100 of Figs. 1 to 5, except for the red color filter 190. Fig. The first embodiment may include a red color filter 190 disposed on the molding portion 170. The red color filter 190 may include a function of passing a red wavelength through a wavelength converted through the red phosphor layer 52. For example, light emitted through the red phosphor layer 52 may include a red wavelength and a blue wavelength. Since the red color filter 190 passes the red wavelength, a pure red wavelength can be realized. That is, the first embodiment includes the blue and green light emitting diodes, the red phosphor layer 52, and the red color filter 190 so that the first and second light emitting elements 152 and 153 contain the same physical properties, And the color difference that varies with time can be improved.

The molding part 170 of the first embodiment may include a black filler 171. [ The black filler 171 can improve the appearance quality by realizing the entire light emitting surface in black color at the time of non-light emission. For example, the black filler 171 may be included in a light emitting module used for signage, indoor and outdoor display boards, public displays, etc. to improve the appearance quality.

7, a method of manufacturing a light emitting module according to the first embodiment includes a first light emitting device 151, a second light emitting device 152, and a third light emitting device 153 substrate 120 on a substrate 120, Lt; RTI ID = 0.0 > COB < / RTI > The first to third light emitting devices 151, 152, and 153 may be mounted on the substrate 120 by SMT. The SMT may use solder paste. The solder paste may be a metal paste. For example, the solder paste may include an alloy such as AuSn and NiSn, but is not limited thereto. The first light emitting device 151 may be a blue light emitting diode, and the second light emitting device 153 may be a green light emitting diode. Although the first and second light emitting devices 151 and 152 of the first embodiment have been described by limiting the blue light emitting diode that emits the blue wavelength, it is not limited thereto. For example, the first light emitting device 151 may be replaced with a green light emitting diode that emits green light.

Referring to FIG. 8, the red phosphor layer 52 may be disposed on the first light emitting device 151. The red phosphor layer 52 may be disposed on the top and side surfaces of the first light emitting device 151. The red phosphor layer 52 may be in direct contact with the first light emitting device 151. The red phosphor layer 52 may change the light from the first light emitting device 151 to a red wavelength. The red phosphor layer 52 may include a phosphor of a fluoride compound, and may include at least one of an MGF-based phosphor, a KSF-based phosphor, and a KTF-based phosphor. The MGF-base phosphor has a composition formula of Mg ₄ Ge _{1 -x} O _y F: Mn ⁴⁺ _x , where x satisfies 0.001? X? 0.1 and y can satisfy 1? Y? 5. A KsF-based phosphor, for example, K _a Si _{1 -c} F _b : Mn ⁴⁺ _c , where a is 1? A? 2.5, b is 5? B? 6.5, and c is 0.001? C ≪ / = 0.1. The KTF-based fluorescent material, for example, K _d Ti _1-e F _g: may have a composition formula Mn ⁴⁺ _g, wherein d is 1 ≤ d ≤ 2.5, wherein e is 5 ≤ e ≤ 6.5, wherein g is 0.001 ≤ g ≪ / = 0.1. The fluorophor layer 52, which is a Mn ⁴⁺ activator phosphor, has a high luminescence efficiency and a strong absorption at a blue peak wavelength. The phosphor layer 52 may include a sulfide-based phosphor such as (Ca, Sr) S: Eu ²⁺ or a nitride-based, e.g., CaAlSiN 3: Eu ²⁺ phosphor. The active material may be a tetravalent transition metal ion such as Mn ⁴⁺ or a metal ion selected from a variety of rare earth ions and transition metal ions. For example, Eu ²⁺ _, Ce ³⁺ , Pr ^Trivalent rare earth metal ions such as ³⁺ , Nd ³⁺ , Sm ³⁺ , Eu ³⁺ , Gd ³⁺ , Tb ³⁺ , Dy ³⁺ , Ho ³⁺ , Er ³⁺ , Tm ³⁺ , Yb ³⁺ , Divalent rare earth metal ions such as Sm ²⁺ , Eu ²⁺ and Yb ²⁺ , divalent transition metal ions such as Mn ^2+, and trivalent transition metal ions such as Cr ³⁺ and Fe ³⁺ .

Referring to FIG. 9, a molding layer 170a may be formed on the substrate 120, the first to third light emitting devices 151, 152, and 153. The molding layer 170a may include a light transmitting resin material such as epoxy or silicon. In the molding layer 170a, the molding layer 170a may include a black filler. The black filler can improve the appearance quality by realizing the entire light emitting surface in black color at the time of non-emission of the light emitting module. For example, the black filler can improve the appearance quality in a light emitting module used for signage, indoor and outdoor display boards, public displays, and the like.

Referring to FIG. 10, a unit light emitting unit 100 may be formed on a substrate 120 by a cutting process. The cutting step may form the molding part 170 by etching or physically removing the molding layer.

Referring to FIG. 11, a black matrix (BM) may be formed on the substrate 120. The black matrix BM may be formed to surround the outer surface of the light emitting unit 100. The black matrix BM may be formed by a screen printing process, a dispensing process, or an injection process, but is not limited thereto.

A red color filter 190 may be formed on the molding part 170. The red color filter 190 may be vertically overlapped with the red phosphor layer 52. The red color filter 190 may include a function of passing only red wavelengths through the red phosphor layer 52. For example, light emitted through the red phosphor layer 52 may include wavelengths other than red. The red color filter 190 may pass the red wavelength and block wavelengths other than red.

By implementing the red wavelength using the first light emitting device 151, the red phosphor layer 52 and the red color filter 190 of the first embodiment, the first to third light emitting elements 151, 152, Thermal < / RTI > and electrical properties. Therefore, the first embodiment can improve the thermal stability and improve the color difference that varies with time.

The method of manufacturing the light emitting module of the first embodiment includes mounting the first to third light emitting devices 151, 152 and 153 directly on the substrate 120 in a COB type, forming the molding part 170 and the black matrix BM So that the manufacturing process can be simplified.

12 is a sectional view showing the light emitting module of the second embodiment.

12, the light emitting module of the second embodiment includes the light emitting module 10 of the first embodiment of Figs. 1 to 11 except for the black matrix BM, the molding portion 170 and the step portion 171. [ ) Can be adopted.

In the second embodiment, the step portion 171 may be disposed on the molding portion 170. The stepped portion 171 may be formed through a physical or chemical etching process. For example, the stepped portion 171 may have a concave shape from the upper surface of the molding portion 170 toward the substrate 120. For example, the bottom of the stepped portion 171 may be disposed below the upper surface of the first to third light emitting devices 151, 152, and 153. The stepped portion 171 can determine the position of the black matrix BM. The bottom of the stepped portion 171 is disposed below the upper surface of the first to third light emitting devices 151, 152 and 153 and is reflected toward the bottom of the black matrix BM to be lost toward the substrate 120 Light can be reduced. The height of the stepped portion 171 may be greater than the height of the molding portion 170. The height of the stepped portion 171 may be 50% or more of the height of the molding portion 170.

The method of manufacturing the light emitting module of the second embodiment may employ the technical features of the method of manufacturing the light emitting module of the first embodiment, except for the molding part 170 and the black matrix (BM) forming step.

In the method of manufacturing the light emitting module of the second embodiment, a molding layer is formed on the substrate 120, the first to third light emitting devices 151, 152, and 153, and a physical or chemical etching process is performed, The step portion 171 can be formed with a depth equal to or greater than the depth of the step portion 171. [ The black matrix BM may be formed in the step portion 171 by a screen printing, a dispensing or an injection process, but is not limited thereto. The lower surface of the black matrix BM may be disposed below the upper surfaces of the first to third light emitting devices 151, 152 and 153 to improve light interference between adjacent light emitting units.

The second embodiment differs from the first embodiment in that the first to third light emitting devices 151 to 152 and 153 to be separately driven and the molding part 170 are disposed directly on the substrate 120, A light emitting module of a simplified structure in which a black matrix (BM) of a matrix type is disposed on the substrate 120 can be provided. That is, the embodiment provides a light emitting module capable of realizing images and images by implementing a full color, and can simplify the structure of the light emitting module and realize slimness and high brightness.

The second embodiment improves the thermal stability and realizes a certain color feeling by the light emitting elements having the same physical properties.

In the second embodiment, the red color is realized by using the red phosphor layer 52, thereby improving the thermal stability of a general red light emitting diode and realizing a uniform color.

13 is a sectional view showing the light emitting module of the third embodiment.

13, the light emitting module of the third embodiment includes the light emitting module 10 of the first embodiment of Figs. 1 to 11 except for the first light emitting element 151 including the red color filter 290, Can be adopted.

The red color filter 290 may be formed on the red phosphor layer 52. The red color filter 290 may be in contact with the upper surface of the red phosphor layer 52. The red color filter 290 may be disposed within the molding layer 170.

In the method of manufacturing the light emitting module of the third embodiment, the red color filter 190 may be formed after the step of forming the red phosphor layer 52, and then the molding part 170 and the black matrix BM may be sequentially formed.

The third embodiment differs from the first embodiment in that the first to third light emitting devices 151, 152 and 153 and the molding part 170 which can be individually driven are disposed directly on the substrate 120 and the matrix type It is possible to provide a light emitting module having a simplified structure in which a black matrix (BM) is disposed on the substrate 120. That is, the third embodiment provides a light emitting module capable of realizing images and images by implementing a full color, and the structure of the light emitting module can be simplified to realize a slim and high brightness.

The third embodiment can improve the thermal stability and realize a uniform color feeling by the first to third light emitting devices 151, 152, 153 having similar thermal characteristics and electrical characteristics.

In the third embodiment, the red color is realized by using the red phosphor layer 52 and the red color filter 290, thereby improving the thermal stability of the red light emitting diode and achieving a uniform color.

14 is a sectional view showing a light emitting module of the fourth embodiment.

As shown in Fig. 14, the light emitting module of the fourth embodiment can employ the technical features of the light emitting module 10 of the first embodiment of Figs. 1 to 11 except for the wavelength conversion filter 380. Fig.

The wavelength conversion filter 380 may be disposed in the first light emitting device 151. The wavelength conversion filter 380 may be disposed on the upper surface and the side surface of the first light emitting device 151. The wavelength conversion filter 380 may be in direct contact with the first light emitting device 151. The wavelength conversion filter 380 may include a red color filter and a red phosphor layer. The wavelength conversion filter 380 may include a function of converting light of the first light emitting device 151 into a red wavelength, blocking wavelengths other than red, and passing only red wavelengths.

The method of manufacturing the light emitting module of the fourth embodiment is characterized in that the wavelength conversion filter 380 in which the red color filter and the red phosphor are mixed is formed on the first light emitting device 151 and then the molding part 170 and the black matrix BM ) Can be sequentially formed.

The fourth embodiment differs from the first embodiment in that the first through third light emitting devices 151 152 153 and the molding part 170 are disposed directly on the substrate 120 and the matrix type It is possible to provide a light emitting module having a simplified structure in which a black matrix (BM) is disposed on the substrate 120. That is, the fourth embodiment provides a light emitting module capable of realizing images and images by implementing a full color, and the structure of the light emitting module can be simplified to realize slimness and high brightness.

The fourth embodiment can improve the thermal stability and realize a uniform color by the first to third light emitting devices 151, 152, and 153 having similar thermal characteristics and electrical characteristics.

In the fourth embodiment, the red color is implemented by using the wavelength conversion filter 380 including the red phosphor layer and the red color filter, thereby improving the thermal stability and achieving a uniform color tone compared to a general red light emitting diode.

15 is a sectional view showing the light emitting module of the fifth embodiment.

As shown in Fig. 15, the light emitting module of the fifth embodiment can employ the technical features of the light emitting module of the fourth embodiment of Fig. 14, except for the wavelength conversion filter 480. Fig.

The wavelength conversion filter 480 may be disposed in the plurality of first light emitting devices 151. The wavelength conversion filter 480 may be disposed on the upper surface of the first light emitting device 151. The wavelength conversion filter 480 may be in direct contact with the first light emitting device 151. The wavelength conversion filter 480 may include a red color filter and a red phosphor layer. The wavelength conversion filter 480 may include a function of converting the light of the first light emitting device 151 into a red wavelength, blocking wavelengths other than red, and passing only red wavelengths.

The method of manufacturing the light emitting module of the fifth embodiment can adopt the technical features of the method of manufacturing the light emitting module of the fourth embodiment.

The fifth embodiment differs from the first embodiment in that the first through third light emitting devices 151 152 153 and the molding part 170 are disposed directly on the substrate 120 and the matrix type It is possible to provide a light emitting module having a simplified structure in which a black matrix (BM) is disposed on the substrate 120. That is, the fifth embodiment provides a light emitting module capable of realizing images and images by implementing a full color, and the structure of the light emitting module can be simplified to realize a slim and high brightness.

The fifth embodiment can realize a certain color feeling by the first to third light emitting devices 151, 152, 153 having similar thermal characteristics and electrical characteristics.

The fifth embodiment realizes a red color using the wavelength conversion filter 480 including the red phosphor layer and the red color filter, thereby realizing a uniform color.

16 is a sectional view showing the light emitting module of the sixth embodiment.

16, the light emitting module of the sixth embodiment includes, except for the upper substrate TG including the red color filter 190, the light emitting module 10 of the first embodiment of Figs. 1 to 11 Feature can be adopted.

The upper substrate TG may be disposed on the molding part 170. The upper substrate TG may be a transparent glass substrate, but is not limited thereto.

The red color filter 190 may be disposed on the upper substrate TG. The red color filter 190 may be disposed on the lower surface of the upper substrate TG. The red color filter 190 may be vertically overlapped with the red phosphor layer 52.

The method of manufacturing the light emitting module of the sixth embodiment may adopt the technical features of the method of manufacturing the light emitting module of the first embodiment except for forming the red color filter 190 on the upper substrate TG. The upper substrate TG may be vertically overlapped with the red phosphor layer 52.

The sixth embodiment differs from the first embodiment in that the first to third light emitting devices 151, 152 and 153 and the molding part 170 which can be individually driven are disposed directly on the substrate 120 and the matrix type It is possible to provide a light emitting module having a simplified structure in which a black matrix (BM) is disposed on the substrate 120. That is, the sixth embodiment provides a light emitting module capable of realizing images and images by implementing full color, and can simplify the structure of the light emitting module and realize slimness and high brightness.

The sixth embodiment can realize a uniform color feeling by the first to third light emitting devices 151, 152, and 153 having similar thermal characteristics and electrical characteristics.

In the sixth embodiment, the red color is realized by using the red color filter 190 of the red phosphor layer 52 and the upper substrate TG, thereby improving the thermal stability and achieving a uniform color tone compared to a general red light emitting diode .

17 and 18 are exploded perspective views showing the light emitting module of the seventh embodiment.

17 and 18, the seventh embodiment includes the first to third light emitting devices 151, 152, and 153, and the red phosphor layer 252 And a green color filter layer 293 and a green color filter layer 293 may be disposed on the second light emitting element 152. The seventh embodiment is similar to the first embodiment except that the green phosphor layer 254 and the green color filter 293 are formed on the second light emitting element 152 and the technical characteristics of the light emitting module 10 of the first embodiment of Figs. Can be adopted.

The green phosphor layer 254 may emit a peak wavelength of 570 nm or less, for example, 540 nm to 560 nm. For example, the green phosphor layer 254 is (Y, Gd, Lu, Tb ) 3 (Al, Ga) 5 O 12: Ce, (Mg, Ca, Sr, Ba) 2 SiO 4: Eu, (Ca, Sr) _{3 SiO 5: Eu, (La} , Ca) 3 Si 6 N11: Ce, α-SiAlON: Eu, β-SiAlON: Eu, Ba 3 Si 6 O 12 N 2: Eu, Ca 3 (Sc, Mg) 2 Si (Al, Ga, In) ₂ S (Ca, Sr, Ba) Al ₂ O ₄ : Eu, Ba ₃ O ₁₂ : Ce, CaSc ₂ O ₄ : Eu, BaAl ₈ O ₁₃ : Eu, ₄ : Eu, (Ca, Sr) ₈ (Mg, Zn) (SiO ₄ ) ₄ C ₁₂ : Eu / Mn, (Ca, Sr, Ba) ₃ MgSi ₂ O ₈ : Eu / _{) 2 (Mg, Zn) Si} 2 O 7: Eu, Zn 2 SiO 4: Mn, (Y, Gd) BO 3: Tb, ZnS: Cu, Cl / Al, ZnS: Ag, Cl / Al, (Sr, _{Ca) 2 Si 5 N 8:} Eu, (Li, Na, K) 3 ZrF 7: Mn, (Li, Na, K) 2 (Ti, Zr) F 6: Mn, (Ca, Sr, Ba) (Ti (Y, Gd) BO ₃ : Eu, (Y, Gd) (V, P) O ₄ : Eu, (Zr) F ₆ : Mn, Ba _0.65 Zr _0.35 F _2.7 : Mn, _{, Y 2 O 3: Eu,} (Sr, Ca, Ba, Mg) 5 (PO 4) 3 Cl: Eu, (Ca, Sr, Ba) MgAl 10 O 17: Eu, (Ca, Sr, Ba) Si 2 O ₂ N ₂ : Eu, and 3.5MgO-0.5MgF ₂ -GeO ₂ : Mn. The green phosphor layer 254 may include a quantum dot, and the quantum dot may include a II-VI compound or a III-V compound semiconductor, and may emit green light. The quantum dot is, for example, ZnS, ZnSe, ZnTe, CdS , CdSe, CdTe, GaN, GaP, GaAs, GaSb, InP, InAs, In, Sb, AlS, AlP, AlAs, PbS, PbSe, Ge, Si, CuInS 2, CuInSe _2, and the like, and combinations thereof.

The seventh embodiment has an advantage in productivity because the first to third light emitting devices 151, 152, and 153 use blue light emitting diodes.

The manufacturing method of the seventh embodiment can adopt the technical features of the manufacturing method of the first embodiment.

The seventh embodiment is different from the first embodiment in that the first to third light emitting devices 151 to 152 and 153 of the blue light emitting diode and the red phosphor layer 252, the red color filter 291, the green phosphor layer 254, And a molding unit 170 are directly disposed on the substrate 120 and a black matrix BM of a matrix type surrounding each side of the light emitting units is disposed on the substrate 120 . That is, the seventh embodiment provides a light emitting module capable of realizing images and images by implementing a full color, and the structure of the light emitting module can be simplified to realize slimness and high brightness.

The seventh embodiment can improve the thermal stability and realize a uniform color feeling by the first to third light emitting devices 151, 152, and 153 having similar thermal characteristics and electrical characteristics.

The seventh embodiment uses the first light emitting element 151 and the red phosphor layer 252, the red color filter 291, the second light emitting element 152, the green phosphor layer 254 and the green color filter 293 By implementing red and green colors, it is possible to improve the thermal stability of a general red light emitting diode and achieve a uniform color.

Figs. 19 and 20 are a plan view and a disassembly view showing the light emitting module of the eighth embodiment.

19 and 20, the eighth embodiment may include a plurality of white light emitting diodes 350, a red color filter 391, a blue color filter 392, and a green color filter 393 .

In the eighth embodiment, four white light emitting diodes 350 may be disposed in one light emitting portion corresponding to one pixel.

The white light emitting diode 350 may include first to fourth white light emitting diodes 350a, 350b, 350c and 350d.

The red color filter 391 may be disposed on the first white light emitting diode 350a. The red color filter 391 may be vertically overlapped with the first white light emitting diode 350a. The red color filter 391 may be in direct contact with the first white light emitting diode 350a. The red color filter 391 may transmit light of a red wavelength to the light emitted from the first white light emitting diode 350a.

The blue color filter 392 may be disposed on the second white light emitting diode 350b. The blue color filter 392 may overlap the second white light emitting diode 350b in the vertical direction. The blue color filter 392 may be in direct contact with the second white light emitting diode 350b. The blue color filter 392 can pass the red wavelength light through the light emitted from the second white light emitting diode 350b.

The green color filter 393 may be disposed on the third white light emitting diode 350c. The green color filter 393 may overlap the third white light emitting diode 350c in the vertical direction. The green color filter 393 may be in direct contact with the third white light emitting diode 350c. The green color filter 393 can pass the red wavelength light through the light emitted from the third white light emitting diode 350c.

All the light emitting elements are arranged in the white light emitting diode 350 and the full color is realized by using the red color filter 391, the blue color filter 392 and the green color filter 393, 4 white light emitting diode 350d can be used to compensate for color balance, brightness, and the like. The eighth embodiment can have advantages of excellent productivity, and can achieve color purity and high brightness.

The eighth embodiment can realize a uniform color tone by the white light emitting diodes having similar thermal and electrical characteristics.

The eighth embodiment improves the thermal stability of a general red light emitting diode by implementing full color using white light emitting diodes and a red color filter 391, a blue color filter 392 and a green color filter 393, A certain color can be realized.

21 and 22 are a plan view and an exploded perspective view showing the light emitting module of the ninth embodiment.

As shown in FIGS. 21 and 22, the ninth embodiment can employ the technical features of the light emitting module 10 of the first embodiment of FIGS. 1 to 11 except for the white light emitting diode 550.

In the ninth embodiment, a white light emitting diode 550 is included in each light emitting unit to compensate for color balance, brightness, and the like. The ninth embodiment can have the advantages of excellent productivity and realize color purity and high luminance.

In the ninth embodiment, full color is realized by using the first to third light emitting devices 151, 152, and 153, and the color balance, brightness, and the like can be compensated by using the white light emitting diode 550. The ninth embodiment can have the advantages of excellent productivity and realize color purity and high luminance.

The ninth embodiment can realize a certain color feeling by the blue light emitting diode and the green light emitting diode having similar thermal characteristics and electrical characteristics.

In the ninth embodiment, full color is realized by using a blue light emitting diode, a green light emitting diode, a red phosphor layer, and a red color filter, thereby improving thermal stability and achieving a uniform color tone compared to a general red light emitting diode.

23 and 24 are a plan view and an exploded perspective view showing the light emitting module of the tenth embodiment.

As shown in Figs. 23 and 24, the light emitting module of the tenth embodiment can adopt the technical features of the light emitting modules of the first to ninth embodiments, except for the second black matrix BM2.

The second black matrix BM2 may be a black resin, and may be a black layer coated on the forming structure and the surface of the forming structure. The second black matrix BM2 may be disposed in one light emitting portion. The second black matrix BM2 may be disposed between the first light emitting device 151 and the second and third light emitting devices 152 and 153 in contact with the red phosphor layer 152. [ The second black matrix BM2 surrounds the first light emitting device 151 in contact with the red phosphor layer 52 and may be spaced apart from the red phosphor layer 52 by a predetermined distance. The second black matrix BM2 may extend from the first black matrix BM1. The second black matrix BM2 may have a height higher than the height of the red phosphor layer 52. For example, the upper surface of the second black matrix BM2 may have the same height as the first black matrix BM1, but the present invention is not limited thereto. The second black matrix BM2 has a height higher than that of the red phosphor layer 52 to prevent interference between blue light and green light emitted from the second and third light emitting devices 152 and 153. Specifically, the tenth embodiment can realize a desired color by blocking blue and green light of the second and third light emitting devices 152 and 153 spaced apart from the red phosphor layer 52. For example, the second black matrix BM2 of the tenth embodiment improves the problem that the green wavelength light emitted from the second light emitting device 153 is excited into the red phosphor layer 52 and converted to the red wavelength in the green implementation .

The method of manufacturing the light emitting module of the tenth embodiment can employ the technical features of the method of manufacturing the light emitting module of the first embodiment except for the step of forming the second black matrix (BM2).

The second black matrix BM2 may be formed by a screen printing process, a dispensing process, or an injection process, but is not limited thereto. The second black matrix BM2 may be formed simultaneously with the formation of the first black matrix BM1, but is not limited thereto.

The tenth embodiment is different from the first embodiment in that the first to third light emitting devices 151, 152 and 153 and the molding part 170 are disposed directly on the substrate 120, and the matrix type It is possible to provide a light emitting module having a simplified structure in which the first black matrix BM is disposed on the substrate 120. [ That is, the embodiment provides a light emitting module capable of realizing images and images by implementing a full color, and can simplify the structure of the light emitting module and realize slimness and high brightness.

The tenth embodiment improves the thermal stability and can realize a uniform color tone by the light emitting elements having similar thermal characteristics and electrical characteristics.

In the tenth embodiment, the red color is realized by using the red phosphor layer 52 and the red color filter 190, thereby improving the thermal stability of the red light emitting diode and achieving a uniform color.

The tenth embodiment is characterized in that the red phosphor layer 52 and the second black matrix BM2 disposed between the second and third light emitting devices 152 and 153 spaced from the red phosphor layer 52 emit light The reliability of each color implementation can be improved.

25 is a plan view and an exploded perspective view showing the light emitting module of the eleventh embodiment.

As shown in Fig. 25, the light emitting module of the eleventh embodiment can employ the technical features of the light emitting modules of the first to ninth embodiments, except for the second black matrix BM2. The second black matrix BM2 may be a black resin. The second black matrix BM2 may be disposed in one light emitting portion. The second black matrix BM2 may be disposed between the first light emitting device 151 including the red phosphor layer 52 and the second and third light emitting devices 152 and 153. [ The second black matrix BM2 surrounds the first light emitting device 151 including the red phosphor layer 52 and may be separated from the red phosphor layer 52 by a predetermined distance. The second black matrix BM2 may extend from the first black matrix BM1. The second black matrix BM2 may have a height higher than the height of the red phosphor layer 52. For example, the upper surface of the second black matrix BM2 may be disposed above the upper surface of the red phosphor layer 52.

The second black matrix BM2 may have a lower height than the first black matrix BM1. The second black matrix BM2 has a height higher than that of the red phosphor layer 52 to prevent interference between blue light and green light emitted from the second and third light emitting devices 152 and 153. Specifically, the eleventh embodiment can achieve a desired color by blocking blue and green light of the second and third light emitting devices 152 and 153 spaced from the red phosphor layer 52. For example, the second black matrix BM2 of the eleventh embodiment improves the problem that the green wavelength light emitted from the third light emitting device 153 is excited into the red phosphor layer 52 to be converted into the red wavelength in the green implementation .

The manufacturing method of the light emitting module of the eleventh embodiment can employ the technical features of the method of manufacturing the light emitting module of the first embodiment except for the step of forming the second black matrix (BM2). For example, the second black matrix BM2 may be formed by an injection process after the molding portion 170 is formed by a cutting process of a molding layer. As another example, the second black matrix BM2 may be formed at the same time or sequentially with the first black matrix BM1 through an injection process, and then the molding part 170 may be formed.

In the eleventh embodiment, the first to third light emitting devices 151, 152, 153 and the molding part 170, which can be individually driven, are disposed directly on the substrate 120, and a matrix type It is possible to provide a light emitting module having a simplified structure in which the first black matrix BM1 is disposed on the substrate 120. [ That is, the embodiment provides a light emitting module capable of realizing images and images by implementing a full color, and can simplify the structure of the light emitting module and realize slimness and high brightness.

The eleventh embodiment can improve the thermal stability and realize a uniform color tone by the light emitting elements having similar thermal characteristics and electrical characteristics.

In the eleventh embodiment, the red color is realized by using the red phosphor layer 52 and the red color filter 190, thereby improving the thermal stability of the red light emitting diode and achieving a uniform color.

The eleventh embodiment is characterized in that the first light emitting device 151 is in contact with the red phosphor layer 52 and the second black matrix BM2 is disposed between the second and third light emitting devices 152, Each color implementation reliability can be improved.

26 and 27 are a plan view and an exploded perspective view showing the light emitting module of the twelfth embodiment.

As shown in Figs. 26 and 27, the light emitting module of the twelfth embodiment can employ the technical features of the light emitting module of the tenth embodiment, except for the red color filter 190. Fig.

The twelfth embodiment may include a red color filter 190 disposed on the molding part 170. [ The red color filter 190 may include a function of passing a red wavelength through a wavelength converted through the red phosphor layer 52. For example, light emitted through the red phosphor layer 52 may include wavelengths other than red. Since the red color filter 190 passes only the red wavelength, a pure red wavelength can be realized. That is, the twelfth embodiment may include the red phosphor layer 52 and the red color filter 190 to improve the color of the red wavelength.

28 is a plan view and an exploded perspective view showing the light emitting module of the thirteenth embodiment.

As shown in Fig. 28, the light emitting module of the thirteenth embodiment can adopt the technical features of the light emitting module of the eleventh embodiment, except for the color color filter 190. Fig.

The thirteenth embodiment may include a red color filter 190 disposed on the molding part 170. [ The red color filter 190 may include a function of passing a red wavelength through a wavelength converted through the red phosphor layer 52. For example, light emitted through the red phosphor layer 52 may include wavelengths other than red. Since the red color filter 190 passes only the red wavelength, a pure red wavelength can be realized. That is, the thirteenth embodiment includes the red phosphor layer 52 and the red color filter 190 to improve the color of the red wavelength.

The light emitting module 100 according to the embodiment can be applied not only to the display device but also to a lighting unit, a pointing device, a lamp, a streetlight, a vehicle lighting device, a vehicle display device, a smart watch, and the like.

The features, structures, effects and the like described in the embodiments are included in at least one embodiment and are not necessarily limited to only one embodiment. Furthermore, the features, structures, effects and the like illustrated in the embodiments can be combined and modified by other persons skilled in the art to which the embodiments belong. Accordingly, the contents of such combinations and modifications should be construed as being included in the scope of the embodiments.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention. It can be seen that the modification and application of branches are possible. For example, each component specifically shown in the embodiments can be modified and implemented. It is to be understood that the present invention may be embodied in many other specific forms without departing from the spirit or essential characteristics thereof.

52: Red phosphor layer
100:
150a: a first light emitting element
150b: a second light emitting element
150c: third light emitting element

Claims (20)

Board;
A plurality of light emitting portions disposed on the substrate; And
And a first black matrix surrounding each of the plurality of light emitting portions,
Wherein each of the plurality of light-
A first light emitting element for emitting blue light arranged on the substrate;
A second light emitting element for emitting blue light arranged on the substrate;
A red phosphor layer disposed on the first light emitting element;
And a second black matrix disposed between the first and second light emitting elements and having a height higher than the red phosphor layer from the upper surface of the substrate.
The method according to claim 1,
Wherein the first light emitting device includes a blue light emitting diode or a green light emitting diode.
The method according to claim 1,
And a red color filter disposed on the red phosphor layer.
The method of claim 3,
And the red color filter is disposed on the upper surface of the red phosphor layer.
3. The method of claim 2,
And the red phosphor layer is disposed on an upper surface of the first light emitting device.
The method according to claim 1,
And a red color filter mixed with the red phosphor layer.
The method according to claim 1,
Wherein the first and second light emitting devices include a blue light emitting diode, and the third light emitting device includes a green phosphor layer that converts light to a green wavelength.
8. The method of claim 7,
And a green color filter disposed on the green phosphor layer.
9. The method of claim 8,
And the green color filter is disposed on the upper surface of the green phosphor layer.
8. The method of claim 7,
And the green phosphor layer is disposed on an upper surface of the third light emitting device.
8. The method of claim 7,
And a green color filter mixed with the green phosphor layer.
The method according to claim 1,
And a fourth light emitting element for emitting white light disposed on the substrate.
The method according to claim 1,
Further comprising an upper substrate spaced apart from the molding part by a predetermined distance, and the upper substrate includes a red color filter superimposed on the first light emitting device in a vertical direction.
The method according to claim 1,
And the second black matrix has the same height as the first black matrix.
The method according to claim 1,
And the upper surface of the second black matrix is disposed between the upper surface of the red phosphor layer and the upper surface of the first black matrix.
The method according to claim 1,
And the red phosphor layer has a blue wavelength transmittance of 10% or less.
The method according to claim 1,
Wherein the thickness of the red phosphor layer is 300 mu m or less.
Board;
A plurality of light emitting portions disposed on the substrate; And
And a black matrix surrounding each of the plurality of light emitting portions,
Wherein each of the plurality of light-
A plurality of first light emitting elements for emitting blue light arranged on the substrate;
A second light emitting element for emitting green light arranged on the substrate;
And a red phosphor layer disposed on any one of the plurality of first light emitting elements.
Board;
A plurality of light emitting portions disposed on the substrate; And
And a black matrix surrounding each of the plurality of light emitting portions,
Wherein each of the plurality of light-
A first light emitting element for emitting green light arranged on the substrate;
A second light emitting element for emitting green light arranged on the substrate;
And a second black matrix disposed between the first and second light emitting elements and having a height higher than the red phosphor layer from the upper surface of the substrate. A display device comprising a light-emitting mode according to any one of claims 1 to 19.

Images