KR102462049B1 - 고순도 분배 시스템 - Google Patents

고순도 분배 시스템 Download PDF

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Publication number
KR102462049B1
KR102462049B1 KR1020170102403A KR20170102403A KR102462049B1 KR 102462049 B1 KR102462049 B1 KR 102462049B1 KR 1020170102403 A KR1020170102403 A KR 1020170102403A KR 20170102403 A KR20170102403 A KR 20170102403A KR 102462049 B1 KR102462049 B1 KR 102462049B1
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South Korea
Prior art keywords
process fluid
dispensing
bladder
nozzle
fluid
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KR1020170102403A
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English (en)
Korean (ko)
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KR20180018445A (ko
Inventor
안톤 제이. 데빌리어스
로드니 엘 로비슨
데이비드 트라비스
로날드 나스만
제임즈 그루테고드
노만 에이 주니어 재콥슨
데이비드 헤처
리오 훌리
조슈아 에스 후게
Original Assignee
도쿄엘렉트론가부시키가이샤
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Publication of KR20180018445A publication Critical patent/KR20180018445A/ko
Priority to KR1020220009262A priority Critical patent/KR102485546B1/ko
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Publication of KR102462049B1 publication Critical patent/KR102462049B1/ko
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H10P76/20—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials
    • H10P76/204—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials of organic photoresist masks
    • H10P76/2041—Photolithographic processes
    • H10P76/2042—Photolithographic processes using lasers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • H01L21/67017—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B12/00—Arrangements for controlling delivery; Arrangements for controlling the spray area
    • B05B12/08—Arrangements for controlling delivery; Arrangements for controlling the spray area responsive to condition of liquid or other fluent material to be discharged, of ambient medium or of target ; responsive to condition of spray devices or of supply means, e.g. pipes, pumps or their drive means
    • B05B12/081—Arrangements for controlling delivery; Arrangements for controlling the spray area responsive to condition of liquid or other fluent material to be discharged, of ambient medium or of target ; responsive to condition of spray devices or of supply means, e.g. pipes, pumps or their drive means responsive to the weight of a reservoir or container for liquid or other fluent material; responsive to level or volume of liquid or other fluent material in a reservoir or container
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B12/00—Arrangements for controlling delivery; Arrangements for controlling the spray area
    • B05B12/08—Arrangements for controlling delivery; Arrangements for controlling the spray area responsive to condition of liquid or other fluent material to be discharged, of ambient medium or of target ; responsive to condition of spray devices or of supply means, e.g. pipes, pumps or their drive means
    • B05B12/085—Arrangements for controlling delivery; Arrangements for controlling the spray area responsive to condition of liquid or other fluent material to be discharged, of ambient medium or of target ; responsive to condition of spray devices or of supply means, e.g. pipes, pumps or their drive means responsive to flow or pressure of liquid or other fluent material to be discharged
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B15/00—Details of spraying plant or spraying apparatus not otherwise provided for; Accessories
    • B05B15/50—Arrangements for cleaning; Arrangements for preventing deposits, drying-out or blockage; Arrangements for detecting improper discharge caused by the presence of foreign matter
    • B05B15/55—Arrangements for cleaning; Arrangements for preventing deposits, drying-out or blockage; Arrangements for detecting improper discharge caused by the presence of foreign matter using cleaning fluids
    • B05B15/557—Arrangements for cleaning; Arrangements for preventing deposits, drying-out or blockage; Arrangements for detecting improper discharge caused by the presence of foreign matter using cleaning fluids the cleaning fluid being a mixture of gas and liquid
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B9/00—Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour
    • B05B9/03—Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour characterised by means for supplying liquid or other fluent material
    • B05B9/04—Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour characterised by means for supplying liquid or other fluent material with pressurised or compressible container; with pump
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
    • B05C11/1007—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to condition of liquid or other fluent material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1047—Apparatus or installations for supplying liquid or other fluent material comprising a buffer container or an accumulator between the supply source and the applicator
    • H01L21/6715—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/68—Organic materials, e.g. photoresists
    • H10P14/683—Organic materials, e.g. photoresists carbon-based polymeric organic materials, e.g. polyimides, poly cyclobutene or PVC
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0404—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0448—Apparatus for applying a liquid, a resin, an ink or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Coating Apparatus (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Reciprocating Pumps (AREA)
  • Optics & Photonics (AREA)
KR1020170102403A 2016-08-11 2017-08-11 고순도 분배 시스템 Active KR102462049B1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020220009262A KR102485546B1 (ko) 2016-08-11 2022-01-21 고순도 분배 시스템

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201662373729P 2016-08-11 2016-08-11
US62/373,729 2016-08-11

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020220009262A Division KR102485546B1 (ko) 2016-08-11 2022-01-21 고순도 분배 시스템

Publications (2)

Publication Number Publication Date
KR20180018445A KR20180018445A (ko) 2018-02-21
KR102462049B1 true KR102462049B1 (ko) 2022-11-02

Family

ID=61159327

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020170102403A Active KR102462049B1 (ko) 2016-08-11 2017-08-11 고순도 분배 시스템
KR1020220009262A Active KR102485546B1 (ko) 2016-08-11 2022-01-21 고순도 분배 시스템

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020220009262A Active KR102485546B1 (ko) 2016-08-11 2022-01-21 고순도 분배 시스템

Country Status (5)

Country Link
US (1) US10403501B2 (https=)
JP (1) JP7038505B2 (https=)
KR (2) KR102462049B1 (https=)
CN (1) CN107728432A (https=)
TW (1) TWI723204B (https=)

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US9987655B2 (en) * 2015-06-26 2018-06-05 Tokyo Electron Limited Inline dispense capacitor system
KR102791311B1 (ko) * 2016-08-12 2025-04-04 인프리아 코포레이션 금속 함유 레지스트로부터의 에지 비드 영역의 금속 잔류물 저감방법
US10682663B2 (en) * 2018-10-31 2020-06-16 The Boeing Company Methods for dispensing flowable materials
US11383211B2 (en) * 2019-04-29 2022-07-12 Tokyo Electron Limited Point-of-use dynamic concentration delivery system with high flow and high uniformity
DE112020003653T5 (de) * 2019-07-29 2022-04-21 Xtpl S.A. Verfahren zum Abgeben einer metallischen Nanopartikelzusammensetzung aus einer Düse auf ein Substrat
US20210178031A1 (en) * 2019-12-17 2021-06-17 Johnson & Johnson Surgical Vision, Inc. Rotary valve configuration for a surgical cassette
US11666932B2 (en) 2020-03-27 2023-06-06 Wagner Spray Tech Corporation Fluid applicator
JP7603311B2 (ja) * 2020-05-08 2024-12-20 兵神装備株式会社 流動物吐出システム
CN114054287A (zh) * 2020-07-30 2022-02-18 中国科学院微电子研究所 光刻胶回吸装置、光刻胶涂布设备及光刻胶涂布方法
US12216400B2 (en) 2021-01-22 2025-02-04 Tokyo Electron Limited Directed self-assembly
US12533771B2 (en) * 2021-10-21 2026-01-27 Applied Materials, Inc. Polishing slurry dispense nozzle
CN114311949B (zh) * 2022-01-17 2022-08-16 浙江华基环保科技有限公司 一种钢铁厂抗氧化防静电针刺毡的生产方法
TWI792883B (zh) * 2022-01-24 2023-02-11 高科晶捷自動化股份有限公司 塗佈裝置的流體控制結構
KR20240102710A (ko) 2022-12-26 2024-07-03 삼성전자주식회사 포토레지스트 코팅 장치

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JP2016063205A (ja) * 2014-09-22 2016-04-25 株式会社Ｓｃｒｅｅｎホールディングス 塗布装置

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JP2016063205A (ja) * 2014-09-22 2016-04-25 株式会社Ｓｃｒｅｅｎホールディングス 塗布装置

Also Published As

Publication number Publication date
KR20220016252A (ko) 2022-02-08
US20180047562A1 (en) 2018-02-15
TWI723204B (zh) 2021-04-01
JP7038505B2 (ja) 2022-03-18
KR20180018445A (ko) 2018-02-21
CN107728432A (zh) 2018-02-23
TW201816958A (zh) 2018-05-01
US10403501B2 (en) 2019-09-03
KR102485546B1 (ko) 2023-01-05
JP2018040349A (ja) 2018-03-15

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