KR102461278B1 - Rf 전력 증폭기 모듈의 제조 방법과 rf 전력 증폭기 모듈, rf 모듈 및 기지국 - Google Patents

Rf 전력 증폭기 모듈의 제조 방법과 rf 전력 증폭기 모듈, rf 모듈 및 기지국 Download PDF

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Publication number
KR102461278B1
KR102461278B1 KR1020150097161A KR20150097161A KR102461278B1 KR 102461278 B1 KR102461278 B1 KR 102461278B1 KR 1020150097161 A KR1020150097161 A KR 1020150097161A KR 20150097161 A KR20150097161 A KR 20150097161A KR 102461278 B1 KR102461278 B1 KR 102461278B1
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KR
South Korea
Prior art keywords
circuit board
power
protective cover
heat dissipation
amplifier module
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KR1020150097161A
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English (en)
Korean (ko)
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KR20160024744A (ko
Inventor
유 장
이웨이 마
진페이 주
홍메이 후
친 공
Original Assignee
삼성전자주식회사
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Publication date
Application filed by 삼성전자주식회사 filed Critical 삼성전자주식회사
Priority to US14/836,301 priority Critical patent/US9721902B2/en
Publication of KR20160024744A publication Critical patent/KR20160024744A/ko
Application granted granted Critical
Publication of KR102461278B1 publication Critical patent/KR102461278B1/ko

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    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03F—AMPLIFIERS
    • H03F3/00—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
    • H03F3/189—High frequency amplifiers, e.g. radio frequency amplifiers
    • H03F3/19—High frequency amplifiers, e.g. radio frequency amplifiers with semiconductor devices only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03F—AMPLIFIERS
    • H03F1/00—Details of amplifiers with only discharge tubes, only semiconductor devices or only unspecified devices as amplifying elements
    • H03F1/02—Modifications of amplifiers to raise the efficiency, e.g. gliding Class A stages, use of an auxiliary oscillation
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04W—WIRELESS COMMUNICATION NETWORKS
    • H04W88/00—Devices specially adapted for wireless communication networks, e.g. terminals, base stations or access point devices
    • H04W88/08—Access point devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
KR1020150097161A 2014-08-26 2015-07-08 Rf 전력 증폭기 모듈의 제조 방법과 rf 전력 증폭기 모듈, rf 모듈 및 기지국 KR102461278B1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US14/836,301 US9721902B2 (en) 2014-08-26 2015-08-26 Method of manufacturing RF power amplifier module, RF power amplifier module, RF module, and base station

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201410423542.XA CN104218018B (zh) 2014-08-26 2014-08-26 一种射频功放模块及其组装方法、射频模块、基站
CN201410423542.X 2014-08-26

Publications (2)

Publication Number Publication Date
KR20160024744A KR20160024744A (ko) 2016-03-07
KR102461278B1 true KR102461278B1 (ko) 2022-11-01

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KR1020150097161A KR102461278B1 (ko) 2014-08-26 2015-07-08 Rf 전력 증폭기 모듈의 제조 방법과 rf 전력 증폭기 모듈, rf 모듈 및 기지국

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KR (1) KR102461278B1 (zh)
CN (1) CN104218018B (zh)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107919351A (zh) * 2016-10-11 2018-04-17 苏州远创达科技有限公司 一种射频功放模块及其组装方法
US10037951B2 (en) * 2016-11-29 2018-07-31 Cyntec Co., Ltd. Semiconductor package with antenna
CN106449616B (zh) * 2016-12-02 2019-02-26 北京北广科技股份有限公司 一种大功率射频模块及其制作方法
CN107801355A (zh) * 2017-10-25 2018-03-13 成都西井科技有限公司 一种功率放大器的散热外壳及安装方法
US11264251B2 (en) * 2018-11-29 2022-03-01 Wavepia Co., Ltd. Method of manufacturing power amplifier package embedded with input-output circuit
CN111931459B (zh) * 2020-10-09 2021-05-11 三维通信股份有限公司 一种功放模块制作方法、装置、存储介质及电子设备
CN113193877B (zh) * 2021-04-20 2022-12-20 深圳市广和通无线股份有限公司 散热模块及射频模组
CN115378379B (zh) * 2022-10-20 2023-03-28 南京正銮电子科技有限公司 一种基于siw的功率放大器

Citations (2)

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Publication number Priority date Publication date Assignee Title
JP2004179484A (ja) * 2002-11-28 2004-06-24 Toyota Motor Corp ワイヤが接合されている半導体装置の製造方法
US20040238934A1 (en) * 2001-08-28 2004-12-02 Tessera, Inc. High-frequency chip packages

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Publication number Priority date Publication date Assignee Title
US6362964B1 (en) * 1999-11-17 2002-03-26 International Rectifier Corp. Flexible power assembly
US7446411B2 (en) * 2005-10-24 2008-11-04 Freescale Semiconductor, Inc. Semiconductor structure and method of assembly
KR20080092170A (ko) * 2007-04-11 2008-10-15 한국산업기술대학교산학협력단 향상된 방열 특성을 갖는 ｒｆ 모듈
CN101460018B (zh) * 2007-12-14 2011-02-16 华为技术有限公司 一种印制电路板及其制造方法、射频装置
CN102623416B (zh) * 2012-04-24 2015-09-02 苏州远创达科技有限公司 一种射频功放模块的功率器件无封装结构及其组装方法
CN204144246U (zh) * 2014-08-26 2015-02-04 深圳三星通信技术研究有限公司 一种射频功放模块、射频模块及基站

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040238934A1 (en) * 2001-08-28 2004-12-02 Tessera, Inc. High-frequency chip packages
JP2004179484A (ja) * 2002-11-28 2004-06-24 Toyota Motor Corp ワイヤが接合されている半導体装置の製造方法

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Publication number Publication date
CN104218018A (zh) 2014-12-17
CN104218018B (zh) 2017-08-29
KR20160024744A (ko) 2016-03-07

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