KR102454243B1 - 기판 에지들에서 이면 증착을 감소시키고 두께 변화들을 완화하기 위한 시스템들 및 방법들 - Google Patents
기판 에지들에서 이면 증착을 감소시키고 두께 변화들을 완화하기 위한 시스템들 및 방법들 Download PDFInfo
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- KR102454243B1 KR102454243B1 KR1020150126922A KR20150126922A KR102454243B1 KR 102454243 B1 KR102454243 B1 KR 102454243B1 KR 1020150126922 A KR1020150126922 A KR 1020150126922A KR 20150126922 A KR20150126922 A KR 20150126922A KR 102454243 B1 KR102454243 B1 KR 102454243B1
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- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
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- C23C16/45597—Reactive back side gas
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- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
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| US14/485,142 US9460915B2 (en) | 2014-09-12 | 2014-09-12 | Systems and methods for reducing backside deposition and mitigating thickness changes at substrate edges |
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| KR1020220128496A Division KR102598660B1 (ko) | 2014-09-12 | 2022-10-07 | 기판 에지들에서 이면 증착을 감소시키고 두께 변화들을 완화하기 위한 시스템들 및 방법들 |
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| KR1020220128496A Active KR102598660B1 (ko) | 2014-09-12 | 2022-10-07 | 기판 에지들에서 이면 증착을 감소시키고 두께 변화들을 완화하기 위한 시스템들 및 방법들 |
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| US10094018B2 (en) * | 2014-10-16 | 2018-10-09 | Lam Research Corporation | Dynamic precursor dosing for atomic layer deposition |
| US11072860B2 (en) | 2014-08-22 | 2021-07-27 | Lam Research Corporation | Fill on demand ampoule refill |
| US11970772B2 (en) * | 2014-08-22 | 2024-04-30 | Lam Research Corporation | Dynamic precursor dosing for atomic layer deposition |
| TWI734770B (zh) * | 2016-04-24 | 2021-08-01 | 美商應用材料股份有限公司 | 用於防止空間ald處理腔室中之背側沉積的設備 |
| US10777386B2 (en) * | 2017-10-17 | 2020-09-15 | Lam Research Corporation | Methods for controlling plasma glow discharge in a plasma chamber |
| KR102718679B1 (ko) * | 2017-11-29 | 2024-10-16 | 도쿄엘렉트론가부시키가이샤 | 기판의 후면 마찰 감소 |
| JP7178177B2 (ja) * | 2018-03-22 | 2022-11-25 | 東京エレクトロン株式会社 | 基板処理装置 |
| US12112930B2 (en) | 2018-08-31 | 2024-10-08 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method for improving deposition process |
| US12412736B2 (en) * | 2018-09-28 | 2025-09-09 | Lam Research Corporation | Methods and systems for managing byproduct material accumulation during plasma-based semiconductor wafer fabrication process |
| US20220136107A1 (en) * | 2019-01-31 | 2022-05-05 | Lam Research Corporation | Showerhead with configurable gas outlets |
| WO2021034508A1 (en) | 2019-08-16 | 2021-02-25 | Lam Research Corporation | Spatially tunable deposition to compensate within wafer differential bow |
| US11031236B2 (en) | 2019-10-01 | 2021-06-08 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method for improving surface of semiconductor device |
| CN112981372B (zh) * | 2019-12-12 | 2024-02-13 | Asm Ip私人控股有限公司 | 衬底支撑板、包括它的衬底处理设备以及衬底处理方法 |
| CN114846596A (zh) * | 2019-12-20 | 2022-08-02 | 朗姆研究公司 | 在晶片外周附近具有凹入区域以减轻边缘/中心不均匀性的半导体处理卡盘 |
| US11923295B2 (en) | 2020-02-19 | 2024-03-05 | Taiwan Semiconductor Manufacturing Co., Ltd. | Interconnect level with high resistance layer and method of forming the same |
| US11495483B2 (en) * | 2020-10-15 | 2022-11-08 | Applied Materials, Inc. | Backside gas leakby for bevel deposition reduction |
| US12009246B2 (en) * | 2021-03-26 | 2024-06-11 | Taiwan Semiconductor Manufacturing Co., Ltd. | Substrate holder and methods of use |
| CN116334583B (zh) * | 2021-12-22 | 2026-01-09 | 中微半导体设备(上海)股份有限公司 | 加热装置、化学气相沉积设备及吹扫方法 |
| JP2023162983A (ja) * | 2022-04-27 | 2023-11-09 | 東京エレクトロン株式会社 | 基板処理方法及び基板処理装置 |
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| KR100696029B1 (ko) * | 1999-02-09 | 2007-03-15 | 어플라이드 머티어리얼스, 인코포레이티드 | 퍼지 링을 가지는 웨이퍼 받침대 |
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| TW201938839A (zh) | 2019-10-01 |
| US20160372318A1 (en) | 2016-12-22 |
| US20160079057A1 (en) | 2016-03-17 |
| JP6578163B2 (ja) | 2019-09-18 |
| KR20160031419A (ko) | 2016-03-22 |
| US9460915B2 (en) | 2016-10-04 |
| JP2016063223A (ja) | 2016-04-25 |
| TWI682062B (zh) | 2020-01-11 |
| TWI675124B (zh) | 2019-10-21 |
| CN105420685A (zh) | 2016-03-23 |
| CN108642474A (zh) | 2018-10-12 |
| US9852901B2 (en) | 2017-12-26 |
| CN108642474B (zh) | 2020-09-15 |
| KR20220142411A (ko) | 2022-10-21 |
| TW201623684A (zh) | 2016-07-01 |
| KR102598660B1 (ko) | 2023-11-06 |
| CN105420685B (zh) | 2018-06-15 |
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