KR102436526B1 - 다이싱 시트, 다이싱·다이 본드 필름 및 반도체 장치의 제조 방법 - Google Patents

다이싱 시트, 다이싱·다이 본드 필름 및 반도체 장치의 제조 방법 Download PDF

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Publication number
KR102436526B1
KR102436526B1 KR1020177019215A KR20177019215A KR102436526B1 KR 102436526 B1 KR102436526 B1 KR 102436526B1 KR 1020177019215 A KR1020177019215 A KR 1020177019215A KR 20177019215 A KR20177019215 A KR 20177019215A KR 102436526 B1 KR102436526 B1 KR 102436526B1
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KR
South Korea
Prior art keywords
adhesive layer
film
dicing
meth
adhesive
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KR1020177019215A
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English (en)
Korean (ko)
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KR20170095947A (ko
Inventor
유이치로 시시도
사다히토 미스미
겐지 오니시
유이치로 야나기
Original Assignee
닛토덴코 가부시키가이샤
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Publication of KR20170095947A publication Critical patent/KR20170095947A/ko
Application granted granted Critical
Publication of KR102436526B1 publication Critical patent/KR102436526B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/27—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/27—Manufacturing methods
    • H01L2224/274—Manufacturing methods by blanket deposition of the material of the layer connector
    • H01L2224/2743—Manufacturing methods by blanket deposition of the material of the layer connector in solid form
    • H01L2224/27436—Lamination of a preform, e.g. foil, sheet or layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83191—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on the semiconductor or solid-state body

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Dicing (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Die Bonding (AREA)
KR1020177019215A 2014-12-12 2015-12-10 다이싱 시트, 다이싱·다이 본드 필름 및 반도체 장치의 제조 방법 KR102436526B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2014252206A JP6445315B2 (ja) 2014-12-12 2014-12-12 ダイシングシート、ダイシング・ダイボンドフィルム及び半導体装置の製造方法
JPJP-P-2014-252206 2014-12-12
PCT/JP2015/084644 WO2016093308A1 (ja) 2014-12-12 2015-12-10 ダイシングシート、ダイシング・ダイボンドフィルム及び半導体装置の製造方法

Publications (2)

Publication Number Publication Date
KR20170095947A KR20170095947A (ko) 2017-08-23
KR102436526B1 true KR102436526B1 (ko) 2022-08-25

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020177019215A KR102436526B1 (ko) 2014-12-12 2015-12-10 다이싱 시트, 다이싱·다이 본드 필름 및 반도체 장치의 제조 방법

Country Status (5)

Country Link
JP (1) JP6445315B2 (zh)
KR (1) KR102436526B1 (zh)
CN (1) CN107004589B (zh)
TW (1) TWI667703B (zh)
WO (1) WO2016093308A1 (zh)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018083986A1 (ja) * 2016-11-02 2018-05-11 リンテック株式会社 ステルスダイシング用粘着シート
JP6773535B2 (ja) * 2016-11-25 2020-10-21 積水化学工業株式会社 半導体装置の製造方法
JP2018178002A (ja) * 2017-04-17 2018-11-15 日東電工株式会社 ダイシングダイボンドフィルム
JP7041475B2 (ja) * 2017-07-04 2022-03-24 日東電工株式会社 ダイシングテープ、ダイシングダイボンドフィルム、及び半導体装置の製造方法
JP7105120B2 (ja) 2017-07-04 2022-07-22 日東電工株式会社 ダイシングテープ、ダイシングダイボンドフィルム、および半導体装置製造方法
JP7041476B2 (ja) * 2017-07-04 2022-03-24 日東電工株式会社 ダイシングテープおよびダイシングダイボンドフィルム
JP7269095B2 (ja) * 2019-05-29 2023-05-08 古河電気工業株式会社 ガラス加工用テープ
KR20220088866A (ko) 2019-10-28 2022-06-28 쇼와덴코머티리얼즈가부시끼가이샤 필름상 접착제 및 그 분단성 평가 방법, 다이싱·다이본딩 일체형 필름 및 그 제조 방법, 및 반도체 장치
KR20230157294A (ko) 2021-03-05 2023-11-16 가부시끼가이샤 레조낙 필름상 접착제, 다이싱·다이본딩 일체형 필름, 및 반도체장치 및 그 제조 방법
JP7276555B1 (ja) 2021-11-08 2023-05-18 大日本印刷株式会社 半導体加工用粘着テープ
JP2024000458A (ja) 2022-06-20 2024-01-05 マクセル株式会社 ダイシングテープおよびダイシングテープを使用する、半導体チップおよび半導体装置の製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007005530A (ja) * 2005-06-23 2007-01-11 Lintec Corp チップ体の製造方法
JP2009242586A (ja) * 2008-03-31 2009-10-22 Sekisui Film Kk 粘着テープ基材及び粘着シート

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3408805B2 (ja) 2000-09-13 2003-05-19 浜松ホトニクス株式会社 切断起点領域形成方法及び加工対象物切断方法
JP4358502B2 (ja) 2002-03-12 2009-11-04 浜松ホトニクス株式会社 半導体基板の切断方法
JP2010129607A (ja) * 2008-11-25 2010-06-10 Nitto Denko Corp ダイシング用表面保護テープ及びダイシング用表面保護テープの剥離除去方法
JPWO2011004825A1 (ja) * 2009-07-08 2012-12-20 古河電気工業株式会社 ウエハ貼着用粘着シートおよびそれを用いたウエハの加工方法
JP5554118B2 (ja) * 2010-03-31 2014-07-23 古河電気工業株式会社 ウエハ加工用テープ
JP4976532B2 (ja) * 2010-09-06 2012-07-18 日東電工株式会社 半導体装置用フィルム
JP2012069586A (ja) * 2010-09-21 2012-04-05 Nitto Denko Corp ダイシング・ダイボンドフィルム、ダイシング・ダイボンドフィルムの製造方法、及び、半導体装置の製造方法
KR101649020B1 (ko) * 2011-07-01 2016-08-17 후루카와 덴키 고교 가부시키가이샤 접착 필름 및 다이싱 다이 본딩 필름 및 그것을 이용한 반도체 가공방법
JP5294358B2 (ja) * 2012-01-06 2013-09-18 古河電気工業株式会社 ウエハ加工用テープ及びこれを使用した半導体装置の製造方法
JP5554351B2 (ja) * 2012-01-25 2014-07-23 古河電気工業株式会社 ウエハ加工用テープ
JP5855034B2 (ja) * 2013-02-18 2016-02-09 古河電気工業株式会社 半導体ウェハ加工用粘着テープ及び半導体ウェハの分割方法
CN105143380B (zh) * 2013-03-28 2019-05-17 古河电气工业株式会社 粘合带及晶片加工用胶带

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007005530A (ja) * 2005-06-23 2007-01-11 Lintec Corp チップ体の製造方法
JP2009242586A (ja) * 2008-03-31 2009-10-22 Sekisui Film Kk 粘着テープ基材及び粘着シート

Also Published As

Publication number Publication date
JP2016115775A (ja) 2016-06-23
JP6445315B2 (ja) 2018-12-26
CN107004589A (zh) 2017-08-01
CN107004589B (zh) 2021-07-16
KR20170095947A (ko) 2017-08-23
TW201633389A (zh) 2016-09-16
TWI667703B (zh) 2019-08-01
WO2016093308A1 (ja) 2016-06-16

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