KR102401037B1 - 레이저 가공 장치에서 광학계의 수명을 연장하는 방법 및 시스템 - Google Patents

레이저 가공 장치에서 광학계의 수명을 연장하는 방법 및 시스템 Download PDF

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Publication number
KR102401037B1
KR102401037B1 KR1020197021585A KR20197021585A KR102401037B1 KR 102401037 B1 KR102401037 B1 KR 102401037B1 KR 1020197021585 A KR1020197021585 A KR 1020197021585A KR 20197021585 A KR20197021585 A KR 20197021585A KR 102401037 B1 KR102401037 B1 KR 102401037B1
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South Korea
Prior art keywords
beam path
scan
deflecting
laser
lens
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Expired - Fee Related
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KR1020197021585A
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English (en)
Korean (ko)
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KR20190093222A (ko
Inventor
패트릭 리첼
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일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/0006Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B23K26/0624Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1 ns or less
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • B23K26/082Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • B23K26/083Devices involving movement of the workpiece in at least one axial direction
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • B23K26/0869Devices involving movement of the laser head in at least one axial direction
    • B23K26/0876Devices involving movement of the laser head in at least one axial direction in at least two axial directions
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20Bonding
    • B23K26/21Bonding by welding
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/362Laser etching
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/38Removing material by boring or cutting
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/38Removing material by boring or cutting
    • B23K26/382Removing material by boring or cutting by boring
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00Articles made by soldering, welding or cutting
    • B23K2101/36Electric or electronic devices

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Lasers (AREA)
KR1020197021585A 2016-12-30 2017-12-28 레이저 가공 장치에서 광학계의 수명을 연장하는 방법 및 시스템 Expired - Fee Related KR102401037B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201662440925P 2016-12-30 2016-12-30
US62/440,925 2016-12-30
PCT/US2017/068833 WO2018126078A1 (en) 2016-12-30 2017-12-28 Method and system for extending optics lifetime in laser processing apparatus

Publications (2)

Publication Number Publication Date
KR20190093222A KR20190093222A (ko) 2019-08-08
KR102401037B1 true KR102401037B1 (ko) 2022-05-24

Family

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KR1020197021585A Expired - Fee Related KR102401037B1 (ko) 2016-12-30 2017-12-28 레이저 가공 장치에서 광학계의 수명을 연장하는 방법 및 시스템

Country Status (6)

Country Link
US (1) US11260472B2 (https=)
JP (1) JP7146770B2 (https=)
KR (1) KR102401037B1 (https=)
CN (2) CN110139727B (https=)
TW (1) TWI774721B (https=)
WO (1) WO2018126078A1 (https=)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019197341A1 (en) * 2018-04-10 2019-10-17 Talens Systems, S.L.U. Apparatus and method for processing cardboard
TWI843784B (zh) * 2019-01-31 2024-06-01 美商伊雷克托科學工業股份有限公司 雷射加工設備、與設備一起使用的控制器及非暫時性電腦可讀取媒體
EP3918384B1 (en) * 2019-01-31 2026-04-08 King Abdullah University of Science and Technology Light processing device based on multilayer nano-elements
US12103110B2 (en) 2019-03-22 2024-10-01 Via Mechanics, Ltd. Laser processing apparatus and laser processing method
JP7404043B2 (ja) * 2019-03-22 2023-12-25 ビアメカニクス株式会社 レーザ加工装置及びレーザ加工方法
CN110814546B (zh) * 2019-11-20 2021-10-15 东莞市盛雄激光先进装备股份有限公司 一种翻转机构
WO2021161367A1 (ja) * 2020-02-10 2021-08-19 三菱電機株式会社 レーザ加工方法およびレーザ加工装置
KR102331321B1 (ko) * 2020-02-12 2021-11-26 주식회사 이오테크닉스 가변 펄스폭 플랫 탑 레이저 장치 및 이의 동작 방법
US12064830B2 (en) * 2020-03-12 2024-08-20 Rohr, Inc. Substrate perforation system and method using beamlets
KR102875674B1 (ko) * 2020-07-21 2025-10-23 삼성디스플레이 주식회사 레이저 장치 및 표시 장치의 제조 방법
WO2022205082A1 (en) * 2021-03-31 2022-10-06 Yangtze Memory Technologies Co., Ltd. Laser system for dicing semiconductor structure and operation method thereof
JP7331056B2 (ja) * 2021-09-21 2023-08-22 三菱重工業株式会社 複合材の加工装置及び複合材の加工方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004361862A (ja) * 2003-06-09 2004-12-24 Mitsubishi Electric Corp 集光レンズ装置、レーザ加工装置、集光レンズの調整方法
JP2012503556A (ja) * 2008-09-26 2012-02-09 エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド 微細加工用途のためのレーザビームの後置レンズステアリング

Family Cites Families (55)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4912487A (en) 1988-03-25 1990-03-27 Texas Instruments Incorporated Laser scanner using focusing acousto-optic device
JPH07211623A (ja) * 1994-01-27 1995-08-11 Nikon Corp 短波長対応光学系
US5638267A (en) 1994-06-15 1997-06-10 Convolve, Inc. Method and apparatus for minimizing unwanted dynamics in a physical system
US5633747A (en) 1994-12-21 1997-05-27 Tencor Instruments Variable spot-size scanning apparatus
US5751585A (en) 1995-03-20 1998-05-12 Electro Scientific Industries, Inc. High speed, high accuracy multi-stage tool positioning system
US5847960A (en) 1995-03-20 1998-12-08 Electro Scientific Industries, Inc. Multi-tool positioning system
US5917300A (en) 1997-03-10 1999-06-29 Convolve, Inc. Method and apparatus for the control of gantry machines
US6314473B1 (en) 1998-03-05 2001-11-06 Convolve, Inc. System for removing selected unwanted frequenices in accordance with altered settings in a user interface of a data storage device
SE516347C2 (sv) 1999-11-17 2001-12-17 Micronic Laser Systems Ab Laserskanningssystem och metod för mikrolitografisk skrivning
EP1275036B1 (en) 2000-01-11 2005-10-26 Electro Scientific Industries, Inc. Abbe error correction system and method
JP3491591B2 (ja) 2000-01-25 2004-01-26 松下電器産業株式会社 レーザ加工機および加工方法
US20030024913A1 (en) * 2002-04-15 2003-02-06 Downes Joseph P. Laser scanning method and system for marking articles such as printed circuit boards, integrated circuits and the like
KR100684710B1 (ko) 2000-01-28 2007-02-20 지에스아이 루모닉스 인코퍼레이티드 인쇄회로판, 집적회로 따위 품목들을 마킹하는 레이저스캐닝 방법 및 체계
DE10193737B4 (de) 2000-08-29 2009-07-30 Mitsubishi Denki K.K. Laserbearbeitungsvorrichtung
US6816294B2 (en) 2001-02-16 2004-11-09 Electro Scientific Industries, Inc. On-the-fly beam path error correction for memory link processing
US7245412B2 (en) 2001-02-16 2007-07-17 Electro Scientific Industries, Inc. On-the-fly laser beam path error correction for specimen target location processing
US8497450B2 (en) 2001-02-16 2013-07-30 Electro Scientific Industries, Inc. On-the fly laser beam path dithering for enhancing throughput
US6706998B2 (en) 2002-01-11 2004-03-16 Electro Scientific Industries, Inc. Simulated laser spot enlargement
JP4270891B2 (ja) 2003-01-21 2009-06-03 三洋電機株式会社 El表示装置のレーザーリペア方法
US6706999B1 (en) 2003-02-24 2004-03-16 Electro Scientific Industries, Inc. Laser beam tertiary positioner apparatus and method
US6947454B2 (en) 2003-06-30 2005-09-20 Electro Scientific Industries, Inc. Laser pulse picking employing controlled AOM loading
CN1826207B (zh) 2003-07-18 2010-06-16 浜松光子学株式会社 激光加工方法、激光加工装置以及加工产品
EP1680255A4 (en) * 2003-10-17 2008-10-08 Gsi Lumonics Corp Flexible scan field
JP4601965B2 (ja) 2004-01-09 2010-12-22 浜松ホトニクス株式会社 レーザ加工方法及びレーザ加工装置
US7133188B2 (en) 2004-06-07 2006-11-07 Electro Scientific Industries, Inc. AOM modulation techniques employing an upstream Bragg adjustment device
US8383982B2 (en) * 2004-06-18 2013-02-26 Electro Scientific Industries, Inc. Methods and systems for semiconductor structure processing using multiple laser beam spots
US7259354B2 (en) 2004-08-04 2007-08-21 Electro Scientific Industries, Inc. Methods for processing holes by moving precisely timed laser pulses in circular and spiral trajectories
KR100462359B1 (ko) 2004-08-18 2004-12-17 주식회사 이오테크닉스 폴리곤 미러를 이용한 레이저 가공장치 및 방법
JP2006136923A (ja) * 2004-11-12 2006-06-01 Hitachi Via Mechanics Ltd レーザ加工機及びレーザ加工方法
JP4527567B2 (ja) * 2005-03-01 2010-08-18 フェトン株式会社 レーザ加工装置及びレーザ加工方法
ES2306361T3 (es) * 2005-09-09 2008-11-01 Highyag Lasertechnologie Gmbh Optica de mecanizado laser guiada de forma tactil.
DE102006010337B4 (de) 2006-03-07 2010-06-02 Carl Zeiss Smt Ag Off-axis-Objektive mit drehbarem optischen Element
US7834293B2 (en) 2006-05-02 2010-11-16 Electro Scientific Industries, Inc. Method and apparatus for laser processing
US8026158B2 (en) 2007-06-01 2011-09-27 Electro Scientific Industries, Inc. Systems and methods for processing semiconductor structures using laser pulses laterally distributed in a scanning window
US8076605B2 (en) 2007-06-25 2011-12-13 Electro Scientific Industries, Inc. Systems and methods for adapting parameters to increase throughput during laser-based wafer processing
WO2009039184A2 (en) 2007-09-19 2009-03-26 Gsi Group Corporation Link processing with high speed beam deflection
GB0800333D0 (en) 2008-01-09 2008-02-20 Ucl Business Plc Beam deflection apparatus and methods
EP2252426A4 (en) 2008-03-21 2014-08-06 Imra America Inc METHOD AND SYSTEMS FOR PROCESSING A LASER BASED MATERIAL
US8680430B2 (en) 2008-12-08 2014-03-25 Electro Scientific Industries, Inc. Controlling dynamic and thermal loads on laser beam positioning system to achieve high-throughput laser processing of workpiece features
US8350187B2 (en) * 2009-03-28 2013-01-08 Electro Scientific Industries, Inc. Method and apparatus for laser machining
TWI594828B (zh) 2009-05-28 2017-08-11 伊雷克托科學工業股份有限公司 應用於雷射處理工件中的特徵的聲光偏轉器及相關雷射處理方法
TWI395630B (zh) * 2009-06-30 2013-05-11 Mitsuboshi Diamond Ind Co Ltd 使用雷射光之玻璃基板加工裝置
WO2011152854A1 (en) 2010-06-03 2011-12-08 The Trustees Of Columbia University In The City Of New York Single-scan line-scan crystallization using superimposed scanning elements
TWI430000B (zh) 2010-07-02 2014-03-11 Ind Tech Res Inst 平面顯示器之修補方法與系統
JP6055414B2 (ja) 2010-10-22 2016-12-27 エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド ビームディザリング及びスカイビングのためのレーザ加工システム並びに方法
US8958052B2 (en) 2010-11-04 2015-02-17 Micronic Ab Multi-method and device with an advanced acousto-optic deflector (AOD) and a dense brush of flying spots
US8648277B2 (en) 2011-03-31 2014-02-11 Electro Scientific Industries, Inc. Laser direct ablation with picosecond laser pulses at high pulse repetition frequencies
US9266192B2 (en) * 2012-05-29 2016-02-23 Electro Scientific Industries, Inc. Method and apparatus for processing workpieces
US9259802B2 (en) 2012-07-26 2016-02-16 Electro Scientific Industries, Inc. Method and apparatus for collecting material produced by processing workpieces
US9610653B2 (en) 2012-09-21 2017-04-04 Electro Scientific Industries, Inc. Method and apparatus for separation of workpieces and articles produced thereby
WO2014110276A1 (en) 2013-01-11 2014-07-17 Electro Scientific Industries, Inc. Laser pulse energy control systems and methods
JP6516722B2 (ja) 2013-03-15 2019-05-22 エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド ビームポジショナのレーザ出射に基づく制御
KR102245810B1 (ko) 2013-03-15 2021-04-30 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 Aod 라우트 프로세싱을 위한 레이저 시스템들 및 방법들
EP2969372A4 (en) 2013-03-15 2016-11-16 Electro Scient Ind Inc COORDINATION OF THE BEAM ANGLE AND THE MOVEMENT OF A MANUFACTURING PART TO CONTROL THE INCLINATION
WO2014152526A1 (en) 2013-03-15 2014-09-25 Electro Scientific Industries, Inc. Laser systems and methods for aod tool settling for aod travel reduction

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004361862A (ja) * 2003-06-09 2004-12-24 Mitsubishi Electric Corp 集光レンズ装置、レーザ加工装置、集光レンズの調整方法
JP2012503556A (ja) * 2008-09-26 2012-02-09 エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド 微細加工用途のためのレーザビームの後置レンズステアリング

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Publication number Publication date
US11260472B2 (en) 2022-03-01
CN110139727A (zh) 2019-08-16
WO2018126078A1 (en) 2018-07-05
TW201830810A (zh) 2018-08-16
US20210107091A1 (en) 2021-04-15
JP7146770B2 (ja) 2022-10-04
CN114654082A (zh) 2022-06-24
CN110139727B (zh) 2022-04-05
JP2020504675A (ja) 2020-02-13
TWI774721B (zh) 2022-08-21
KR20190093222A (ko) 2019-08-08

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