KR102397238B1 - 접착제 조성물 및 접속체 - Google Patents

접착제 조성물 및 접속체 Download PDF

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Publication number
KR102397238B1
KR102397238B1 KR1020177035152A KR20177035152A KR102397238B1 KR 102397238 B1 KR102397238 B1 KR 102397238B1 KR 1020177035152 A KR1020177035152 A KR 1020177035152A KR 20177035152 A KR20177035152 A KR 20177035152A KR 102397238 B1 KR102397238 B1 KR 102397238B1
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KR
South Korea
Prior art keywords
circuit
adhesive composition
meth
adhesive
radically polymerizable
Prior art date
Application number
KR1020177035152A
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English (en)
Korean (ko)
Other versions
KR20180017015A (ko
Inventor
스나오 구도우
도루 후지나와
도시유키 야나가와
아키히로 이토
도모키 모리지리
Original Assignee
쇼와덴코머티리얼즈가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 쇼와덴코머티리얼즈가부시끼가이샤 filed Critical 쇼와덴코머티리얼즈가부시끼가이샤
Publication of KR20180017015A publication Critical patent/KR20180017015A/ko
Application granted granted Critical
Publication of KR102397238B1 publication Critical patent/KR102397238B1/ko

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
KR1020177035152A 2015-06-10 2015-06-10 접착제 조성물 및 접속체 KR102397238B1 (ko)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2015/066776 WO2016199252A1 (ja) 2015-06-10 2015-06-10 接着剤組成物及び接続体

Publications (2)

Publication Number Publication Date
KR20180017015A KR20180017015A (ko) 2018-02-20
KR102397238B1 true KR102397238B1 (ko) 2022-05-11

Family

ID=57503366

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020177035152A KR102397238B1 (ko) 2015-06-10 2015-06-10 접착제 조성물 및 접속체

Country Status (4)

Country Link
JP (1) JP6645499B2 (ja)
KR (1) KR102397238B1 (ja)
CN (1) CN107636107B (ja)
WO (1) WO2016199252A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20220220348A1 (en) * 2019-09-27 2022-07-14 Lg Chem, Ltd. Adhesive Composition, and Polarizing Plate and Display Device Manufactured Using Same

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101100507B1 (ko) * 2007-05-09 2011-12-29 히다치 가세고교 가부시끼가이샤 필름상 회로 접속 재료 및 회로 부재의 접속 구조
JP2012229375A (ja) 2011-04-27 2012-11-22 Nitto Denko Corp 粘着シート
JP2013170267A (ja) 2012-02-23 2013-09-02 Hitachi Cable Ltd 接着剤、接着剤ワニス、接着フィルム及び配線フィルム

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2610900B2 (ja) 1987-10-27 1997-05-14 ソニーケミカル 株式会社 熱硬化型異方性導電接着シート及びその製造方法
JPH0597963A (ja) * 1991-10-04 1993-04-20 Three Bond Co Ltd 硬化性樹脂組成物
AU6520798A (en) 1997-03-31 1998-10-22 Hitachi Chemical Company, Ltd. Circuit connecting material, and structure and method of connecting circuit terminal
JP2008208229A (ja) * 2007-02-27 2008-09-11 Nippon Zeon Co Ltd 熱伝導性感圧接着剤組成物並びに熱伝導性感圧接着性シート及びその製造方法
JP5292838B2 (ja) * 2007-08-30 2013-09-18 日立化成株式会社 接着剤、及び回路部材の接続構造体
JP5251393B2 (ja) * 2008-03-28 2013-07-31 日立化成株式会社 接着剤組成物、回路接続用接着剤及びそれを用いた接続体
JP5298977B2 (ja) * 2008-03-28 2013-09-25 日立化成株式会社 接着剤組成物、回路接続用接着剤、接続体及び半導体装置
JP5516163B2 (ja) * 2009-07-14 2014-06-11 東亞合成株式会社 活性エネルギー線硬化型接着剤組成物
CN102791820B (zh) * 2010-03-25 2015-04-29 日立化成株式会社 粘接剂组合物及其用途、以及电路部件的连接结构体及其制造方法
JP5504225B2 (ja) * 2010-08-31 2014-05-28 積水化学工業株式会社 異方性導電材料及び接続構造体
WO2013161713A1 (ja) * 2012-04-25 2013-10-31 日立化成株式会社 回路接続材料、回路接続構造体、接着フィルム及び巻重体

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101100507B1 (ko) * 2007-05-09 2011-12-29 히다치 가세고교 가부시끼가이샤 필름상 회로 접속 재료 및 회로 부재의 접속 구조
JP2012229375A (ja) 2011-04-27 2012-11-22 Nitto Denko Corp 粘着シート
JP2013170267A (ja) 2012-02-23 2013-09-02 Hitachi Cable Ltd 接着剤、接着剤ワニス、接着フィルム及び配線フィルム

Also Published As

Publication number Publication date
CN107636107B (zh) 2021-01-05
JPWO2016199252A1 (ja) 2018-03-29
JP6645499B2 (ja) 2020-02-14
CN107636107A (zh) 2018-01-26
KR20180017015A (ko) 2018-02-20
WO2016199252A1 (ja) 2016-12-15

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