KR102394613B1 - A high speed monitoring burn-in tester and a burn-in board therefor - Google Patents

Abstract

The present invention is an equipment for performing a burn-in test on a packaged semiconductor chip, which is capable of high-speed testing of 100 MHz or higher, and is capable of uniformly controlling the test temperature condition applied to a plurality of test target devices and a burn-in board used therein. It's about structure. The burn-in board according to the present invention is configured to input and output test signals through connectors configured on both sides facing each other, and a plurality of heating wires having a heating action are built-in.

Description

A high speed monitoring burn-in tester and a burn-in board therefor

The present invention relates to a high-speed burn-in test equipment and a burn-in board for a high-speed burn-in test equipment. More specifically, it is an equipment for performing a burn-in test on a semiconductor chip. The present invention relates to a structure of an equipment capable of uniformly controlling the test temperature condition and a structure of a burn-in board used therefor.

Among the various test processes in the semiconductor field, the burn-in test is a process for pre-detecting initial defects that may occur in a packaged semiconductor chip prior to product sales. The burn-in test is a process of selecting defective products that do not meet design specifications by accelerating the defect generation mechanism by applying high-temperature or low-temperature thermal stress to a semiconductor chip under test. The burn-in test equipment is also called “MBT” Monitoring Burn-in Tester) equipment.

Korean Patent Publication No. 10-2009-0042033 (published on April 29, 2009) discloses an example of a conventional burn-in test equipment configuration. 1 and 2 show the burn-in test equipment shown in FIGS. 2 and 3 of Korean Patent Laid-Open No. 10-2009-0042033. According to this, the conventional burn-in test equipment includes a burn-in chamber 10 that forms a burn-in space 12 in which a burn-in board to which a semiconductor chip to be tested is incorporated, a heater 40 that radiates heat to be supplied to the burn-in chamber 10, and It is configured to include an evaporator 60 that emits cold air, a circulation blower 50 and a blower 70 that cause air flow in and out of the burn-in chamber 10 . The circulation blower 50 and the blower 70 generate an air flow so that hot or cold air generated in the upper portion of the burn-in chamber 10 is supplied into the burn-in chamber 10 . 1 and 2, such a flow of air is indicated by arrows. The air flow induced by the circulation blower 50 moves downward through the communication hole 22 and is introduced through one sidewall of the burn-in chamber 10 .

The burn-in chamber 10 has a rectangular parallelepiped shape having a predetermined height. The air supplied to the burn-in chamber 10 is supplied through one sidewall while flowing from top to bottom, but due to the nature of the fluid flow, the inflow is concentrated on the upper side of the sidewall, making it difficult to form a uniform flow rate over the entire height of the sidewall. This causes the temperature distribution inside the burn-in chamber 10 to become non-uniform, and the test temperature conditions are different depending on the location where the test target device is placed, thereby reducing test reliability.

In addition, the conventional burn-in test equipment uses a method of transferring heat emitted from the heater 40 into the burn-in chamber 10 through the air flow circulating around the heater 40, so the heat transfer efficiency is low, and the burn-in chamber (10) There is a problem that it takes a long time for the interior to reach a predetermined test temperature condition for several tens of minutes (eg, 40 minutes) or more.

Korean Patent Publication No. 10-2016-0007139 (published on January 20, 2016) discloses another example of a conventional burn-in test equipment. 3 shows the burn-in test equipment shown in FIG. 1b of Korean Patent Laid-Open No. 10-2016-0007139. Referring to this, the burn-in test equipment is prepared by stacking a plurality of burn-in boards 19 on which a semiconductor chip to be tested is mounted, and a drive board 16 for inputting and outputting test signals to each burn-in board 19 is installed on each burn-in board ( 19) is composed of the same number to correspond to each. The burn-in boards 19 are placed inside a high-temperature (or low-temperature) burn-in chamber that satisfies a predetermined test temperature condition (eg, -60°C to 140°C), and the drive boards 16 are installed outside the burn-in chamber. The inside and outside of the burn-in chamber are spatially separated by the partition wall 13 so that hot air (or cold air) inside the burn-in chamber is not transmitted to the drive board 16 . In addition, a feedthrough board 18 for transmitting an electrical signal between the burn-in board 19 and the drive board 16 is configured in the partition 13 . However, in the test environment using the feed-through board 18, only a low speed test of tens of MHz or less can be implemented, and there is a problem in that it is difficult to implement a high speed test of 100 MHz or more.

Republic of Korea Patent Registration No. 10-1161811 (registration date June 26, 2012) discloses another example of a conventional burn-in test equipment. 4 shows the burn-in test equipment shown in FIG. 1 of Korean Patent Registration No. 10-1161811. As shown, the burn-in board 140 is connected to the driver 120 (the same element as the aforementioned “drive board”) through the connector 130 (the same element as the aforementioned “feed-through board”) and tested. It is configured to input and output signals. Such conventional burn-in test equipment can only test at a speed of several tens of MHz, but it is difficult to test high-speed operation of hundreds of MHz or more. Therefore, high-frequency noise generation and impedance increase were the main factors.

Korean Patent Publication No. 10-2009-0042033 Korean Patent Publication No. 10-2016-0007139 Korean Patent Registration No. 10-1161811

In order to solve this problem, the present invention provides burn-in test equipment capable of improving the uniformity of temperature distribution so that a plurality of test target chips placed in a test chamber can be tested under the same temperature condition, and a burn-in board for the same aim to do

Another object of the present invention is to provide a burn-in test equipment capable of rapidly reaching a predetermined test temperature condition for performing a burn-in test, thereby reducing the time required for a test process, and a burn-in board for the same.

Another object of the present invention is to provide a burn-in test equipment that provides an environment capable of high-speed tests of hundreds of MHz or more, and a burn-in board for the same.

In order to achieve this object, the burn-in test equipment according to the present invention is a burn-in test equipment for performing a test by applying thermal stress to a packaged semiconductor chip, wherein the burn-in test equipment includes a burn-in board for mounting DUTs under test; A chamber for stacking and accommodating a plurality of burn-in boards, and a drive board accommodated outside the chamber and providing a test signal to be applied to the DUT, wherein the burn-in board has a rectangular flat plate shape and the DUTs are electrically connected on one surface A plurality of DUT regions to be connected are formed, the DUT regions are arranged in a plurality of rows and a plurality of columns, and a test signal from the drive board is provided on first and second side edges of the burn-in board facing each other. A first connector and a second connector are formed for input/output of a first signal line and a second signal line for transmitting a test signal from the second connector to a second group of DUT areas adjacent to the second connector; has a built-in heating wire that heats the mounted DUTs to a predetermined test temperature, and the chamber includes a door for taking out the burn-in board, and a first sidewall and a second sidewall facing each other from both sides of the door a third connector extending from the drive board and connected to the first connector is installed on the first sidewall, and a fourth connector extending from the drive board and connected to the second connector is installed on the second sidewall characterized in that it is installed.

In addition, the distance from the first connector to the farthest DUT area among the DUT areas of the first group is less than 1/2 of the distance L1 between the first connector and the second connector, and the second Among the DUT regions of the group, the distance from the second connector to the farthest DUT region is less than 1/2 of the distance L1 between the first connector and the second connector.

In addition, the burn-in board further includes one or more temperature sensors, and in the plurality of burn-in boards accommodated in the chamber, the amount of current provided to the heating wire is configured to be individually controlled for each burn-in board.

In addition, the burn-in board includes two or more temperature sensors, and the heating wire built into the burn-in board is divided into two or more so that each can be individually controlled.

In addition, the third connector is installed to be movable forward and backward toward the first connector, and the fourth connector is also installed to be movable forward and backward toward the second connector.

In addition, the burn-in test equipment includes a refrigerator for a predetermined low temperature test, and a blower for circulating cold air generated in the refrigerator into the chamber, and cold air is introduced into the chamber through a rear wall facing the door It is characterized in that a through hole is formed for this.

And in the burn-in board for burn-in test equipment according to the present invention for achieving the above object is a burn-in board on which a plurality of DUTs for a burn-in test process are mounted, the burn-in board has a rectangular flat plate shape and DUTs are electrically connected on one surface A plurality of DUT regions are formed, the DUT regions are arranged in a plurality of rows and a plurality of columns, and the first and second side edges facing each other of the burn-in board are separated from the drive board of the burn-in test equipment. A first connector and a second connector for receiving and inputting a test signal are formed, and the burn-in board transmits the test signal from the first connector to the DUT regions of the first group including the DUT regions adjacent to the first connector. and a first signal wiring for transmitting a test signal from the second connector to a second group of DUT regions including DUT regions adjacent to the second connector, wherein the burn-in board includes: is characterized in that it has a built-in heating wire that generates heat so that the mounted DUTs are heated to a predetermined test temperature.

In addition, the distance from the first connector to the farthest DUT area among the DUT areas of the first group is less than 1/2 of the distance L1 between the first connector and the second connector, and the second Among the DUT regions of the group, the distance from the second connector to the farthest DUT region is less than 1/2 of the distance L1 between the first connector and the second connector.

In addition, the burn-in board further includes one or more temperature sensors, and the heating wire is divided into two or more so that each can be individually controlled.

The burn-in test equipment and the burn-in board for the same according to the present invention provide the effect of reducing noise and impedance of the signal because the length of the conductive line is shorter and the interval is wider than that of the conventional signal wiring configuration. This has the effect of enabling high-speed testing of 100 MHz or higher.

In addition, the burn-in test equipment according to the present invention uses the heating function of a hot wire to heat the DUT when performing a high-temperature test process. can This provides the effect of reducing the process time required for the burn-in test.

In addition, the amount of current supplied to the hot wire of the burn-in test equipment according to the present invention can be individually controlled for each burn-in board, and can be controlled for each position within each burn-in board, so that it is easy to maintain the same temperature throughout the chamber. That is, it is possible to improve the uniformity of the temperature distribution.

1 to 4 are views showing examples of burn-in test equipment according to the prior art.
5 is a diagram schematically showing a partial configuration of a burn-in test equipment according to a preferred embodiment of the present invention.
6 is a partial cross-sectional view illustrating the burn-in test equipment shown in FIG. 5 as viewed from the side (direction A in FIG. 5);
7 is a partial cross-sectional view illustrating the burn-in test equipment shown in FIG. 5 as viewed from the front (direction B in FIG. 5);
8 is a plan view showing a burn-in board of the burn-in test equipment according to the present invention.
9 is a view schematically showing various arrangements of the heating wire embedded in the burn-in pod according to the present invention.

Hereinafter, various embodiments of the present invention will be described in detail with reference to the drawings. Various modifications may be made to the embodiments described below by those of ordinary skill in the art to which the present invention pertains. The embodiments described below are not described to limit the present invention to the embodiments. It should be understood that the present invention includes various modifications, substitutions, and equivalents within the scope of the technical spirit understood from the entire specification as well as the following examples.

It should be understood that expressions such as “including”, “consisting of” and “having” that may be used below do not exclude additional components or functions.

The “first…” which may be used hereinafter ”, “Second… Expressions such as ”, “first”, and “second” should not be construed as limiting the order or importance between elements unless explicitly stated.

Expressions such as “coupled” and “connected” that may be used hereinafter should be understood as not only directly coupled or connected, but also other components present or intervening, unless explicitly stated otherwise. do.

In the use of terms hereinafter, it should be understood that a singular expression does not exclude a plural expression unless explicitly stated otherwise.

Hereinafter, a high-speed burn-in test equipment and a burn-in board for the same according to a preferred embodiment of the present invention will be described in detail with reference to the drawings. The burn-in test equipment according to the present invention improves the electrical connection between the drive board and the burn-in board to enable high-speed testing of 100 MHz or more to hundreds of MHz.

5 to 7 , the burn-in test equipment 10 includes a chamber 11 accommodating a plurality of burn-in boards 200 . A plurality of burn-in boards 200 may be accommodated in the chamber 11 in a form in which a plurality of burn-in boards 200 are stacked at a predetermined distance in the vertical direction. In front of the chamber 11, a door 11A for taking out the burn-in board 200 is configured.

A plurality of devices under test (hereinafter referred to as “DUT”) are mounted on one surface of the burn-in board 200 . Although not shown, the burn-in board 200 may include a socket for mounting the DUT. A first connector 211 and a second connector 212 for receiving a test signal input/output from a drive board (not shown) are configured on both sides of the burn-in board 200 . The configuration of the burn-in board 200 will be described in more detail below.

A plurality of third connectors 111 extending from the drive board are configured on the first sidewall 11B constituting one sidewall of the chamber 11 . The plurality of third connectors 111 are installed to be spaced apart from each other by a predetermined interval in the vertical direction. The third connector 111 is connected to the first connector 211 of the burn-in board 200 . A test signal may be input/output between the drive board and the burn-in board 200 by connecting the third connector 111 and the first connector 211 .

A plurality of fourth connectors 112 extending from the drive board are also formed on the second sidewall 11C facing the first sidewall 11B. The plurality of fourth connectors 112 are installed to be spaced apart from each other by a predetermined interval in the vertical direction. The fourth connector 112 is connected to the second connector 212 of the burn-in board 200 . A test signal may be input/output between the drive board and the burn-in board 200 by connecting the fourth connector 112 and the second connector 212 .

The third connector 111 may be formed in the same number as the number of burn-in boards 220 that can be accommodated in the chamber 11 at the same time. The third connectors 111 may be installed to move forward and backward toward the corresponding first connectors 211 , respectively. The third connector 111 is configured to be movable forward and backward with respect to the first sidewall 11A, or the first sidewall 11A burns in in a state in which the third connector 111 is integrated with the first sidewall 11A. It may be configured to be movable inward toward the board 220 .

Similarly, the fourth connector 112 may be configured in the same number as the third connector 111 . The fourth connector 112 may also be installed to move forward and backward toward the second connector 212 corresponding to each. That is, the fourth connector 112 is configured to be movable forward and backward with respect to the second side wall 11C, or the fourth connector 112 is formed integrally with the second side wall 11C. It may be configured to be movable inward toward the burn-in board 220 .

Although not shown, the burn-in test equipment 10 according to the present invention may include a separate space for accommodating the drive boards outside the chamber 11 . The third connector 111 and the fourth connector 112 are configured to extend directly from the drive board. The burn-in test equipment 10 according to the present invention is configured such that the drive board and the burn-in board 220 are directly connected through connectors 111 , 112 , 221 , 222 in a state where a separate feed-through board is not interposed therebetween.

The burn-in board 200 of the burn-in test equipment 10 according to the present invention is configured to have a self-heating function. Accordingly, the DUT can be heated up to a predetermined test temperature (eg, 125° C.) without circulating high-temperature air into the chamber 11 . Since the burn-in test equipment 10 according to the present invention is configured to directly heat the DUT through the heat-generating burn-in board 200, the conventional feed used to prevent the high temperature inside the chamber from being transferred to the drive board. No thru board required.

On the other hand, the burn-in test equipment 10 according to the present invention may include a configuration for transferring cold air to the inside of the chamber 11 for a low temperature (eg, -20 ℃) test. Referring to FIG. 6 , a plurality of through holes h for introducing cold air emitted through a separate refrigerator (not shown) are formed in the rear wall 11D of the chamber 11 . The burn-in test rig 10 may also include a blower 13 for generating an air flow. The blower 13 generates an air flow (refer to the arrow in FIG. 6 ) circulating inside and outside the chamber 11 , and through this, the cold air generated from the refrigerator outside the chamber 11 is delivered to the inside of the chamber 11 . The height of the plurality of through-holes (h) is preferably configured to face the space between the burn-in boards 200 built in the chamber (11).

Hereinafter, the burn-in board 200 will be described in detail with reference to FIG. 8 .

The burn-in board 200 has a rectangular plate shape. A plurality of DUTs are mounted on one surface of the burn-in board 200 on the plate and a test is performed. Hereinafter, for convenience of description, a direction parallel to any one of the four sides of the rectangular burn-in board 200 is referred to as a first direction, and a direction orthogonal thereto is referred to as a second direction. A plurality of DUT areas in which DUTs can be mounted are configured on the burn-in board 200 . The plurality of DUT regions are arranged in rows along the first direction, and arranged in columns along the second direction. For convenience, the first direction is referred to as a row direction and the second direction is referred to as a column direction. As shown, each DUT area can be divided by the positioning method of (row, column). That is, the positions of row a and column b may be expressed as (a, b). For example, in the case of the burn-in board 200 capable of mounting 480 DUTs, the number of rows may be 24 and the number of columns may be 20.

The burn-in board 200 includes four side portions 201 , 202 , 203 , 204 . For convenience, two side edges facing each other in the first direction are referred to as a first side edge part 201 and a second side edge part 202 , and the two side edges facing each other in the second direction are called the third side edge part 203 and the third side edge part 203 . It is referred to as the fourth side part 204 . A first connector 211 and a second connector 212 are formed on the first side portion 201 and the second side portion 202 , respectively. The first connector 211 and the second connector 212 provide a terminal function for inputting and outputting a test signal from the drive board.

The plurality of DUT regions described above may be divided into regions close to the first side edge 201 and regions close to the second side edge 202 . That is, half of the N columns of the DUT regions are divided into regions adjacent to the first side part 201 up to the N/2 column, and from the remaining half N/2 columns to the N columns are divided into the second side edge. It may be divided into regions adjacent to the portion 202 . For convenience, DUT regions adjacent to the first side edge 201 are divided into a first group G1 , and DUT regions adjacent to the second side edge 202 are divided into a second group G2 .

The DUT regions located in the first group G1 receive input and output test signals through the adjacent first connector 211 . A first signal wiring 221 for electrically connecting the first connector 211 and the DUT regions of the first group G1 is configured on the burn-in board 200 . The DUT regions located in the second group G2 receive input and output test signals through the adjacent second connector 212 . A second signal wiring 222 for electrically connecting the second connector 212 and the DUT regions of the second group G2 is configured on the burn-in board 200 .

The burn-in board 200 receives a test signal input/output from the drive board by dividing it through two connectors 211 and 212 . Each of the connectors 211 and 212 is configured to input and output a test signal to the DUT areas of the groups G1 and G2 adjacent to the corresponding connectors 211 and 212 .

The burn-in board used in the conventional burn-in test equipment has a problem in that the length of the signal wiring connecting the connector and the DUT area becomes longer because the connector is configured only on one side of the burn-in board. In particular, in order to connect the signal wiring to the DUT area adjacent to the opposite side of the connector among the DUT areas, a conductive line had to be formed over the entire length in a direction perpendicular to the connector.

On the other hand, in the burn-in board 200 according to the present invention, connectors 211 and 212 are configured on two side portions 201 and 202, respectively, and groups G1 and G2 adjacent to each of the side portions 201 and 202 are adjacent to each other. ), since the signal wiring can be configured to input and output signals only in the DUT area, the length of the conductive line for signal wiring can be reduced to less than half of the conventional one.

When the length of the burn-in board 200 in the first direction, that is, the distance between the first connector 211 and the second connector 212 is L1, the DUT region located farthest from the first connector 211 in the first direction. The distance to L1 is less than 1/2 (half) of L1, and similarly, the distance from the second connector 212 to the DUT area located farthest in the first direction is also less than 1/2 (half) of L1.

Therefore, in the burn-in board 200 according to the present invention, the distance from the connectors 211 and 212 to the DUT region located the farthest is shortened to less than 1/2 of the conventional one, so that the length of the conductive line for forming the signal wiring is also that much. It can be made short.

In addition, in the conventional burn-in board, since it is necessary to connect signal wires from one connector to all DUT areas, the distance between the conductive wires in the board is short and dense, whereas the burn-in board according to the present invention has two connectors (211, 212) divides the DUT regions in half and is connected to each other, so that the distance between the conductive lines forming the signal wiring may be distributed wider than in the prior art.

The signal wiring configuration of the burn-in board 200 according to the present invention provides the effect of reducing noise and impedance of the signal due to the shorter length of the conductive line and the wider spacing compared to the prior art, thereby providing 100 MHz This has the effect of enabling high-speed testing as described above.

On the other hand, it is preferable that the number of DUT regions constituting the first group G1 and the number of DUT regions constituting the second group G2 are the same. For this purpose, it is preferable that the number (N) of the columns of the DUT regions is an even number.

In addition, the burn-in board 200 according to the present invention includes a heating wire 250 having a heating function. Whereas the conventional burn-in test equipment used a method of heating the DUT by circulating air heated by a heater into the chamber, the present invention uses the burn-in board 200 through the heating wire 250 built into the burn-in board 200. The DUT is heated by self-heating. By controlling the amount of current supplied to the heating wire 250, the amount of heat may be precisely controlled.

The burn-in board 200 may include one or more temperature sensors 260 for temperature monitoring. In order to accurately detect a temperature difference between the central portion and each edge of the burn-in board 200, the burn-in board 200 preferably includes at least five temperature sensors 260 spaced apart from each other and distributed.

In the embodiment of FIG. 8 , the heating wire 250 is configured such that a plurality of strands are placed side by side in the second direction, but the number and direction thereof may be different. The amount of current applied to the heating wire 250 may be controlled to be the same as a whole, or may be controlled differently depending on the location. For example, when heat is concentrated in the center of the burn-in board 200 and the temperature is high and the temperature is low at the edge (or when the heat loss is large), by increasing the amount of current in the heating wire 250 located at the edge to increase the temperature The entire burn-in board 200 may be configured such that the test is performed under the same temperature. On the other hand, a plurality of burn-in boards stacked as shown in FIG. The amount of current supplied to the heating wire 250 present in each may be controlled differently for each burn-in board. That is, if the burn-in board located at the upper or lower side has a greater heat loss than the burn-in board located in the center, the amount of current supplied to the heating wire of the burn-in board is increased by increasing the amount of current supplied to the burn-in board under the same temperature condition throughout the burn-in board placed inside the chamber. It may be configured to be tested.

The heating wire 250 may be made of various materials having electrical heating properties, for example, made of a metal alloy such as nichrome or cupronickel, or made of a non-metal material such as ceramic or PCT rubber, or It may be made of other composite materials.

9 is a diagram schematically illustrating various arrangements of the heating wire 250 embedded in the burn-in board 200 according to the present invention. Referring to this, as shown in (a), as shown in (a), a plurality of hot wires formed in parallel in the second direction may be arranged to be spaced apart from each other by a predetermined distance in the first direction. Some of them may be connected to each other as shown in (b), or all of them may be connected as shown in (c).

In addition, as shown in (d), as shown in (d), a plurality of hot wires formed in parallel in the first direction may be arranged to be spaced apart from each other by a predetermined distance in the second direction. Some of them may be connected to each other as shown in (e), or all of them may be connected to each other as shown in (f).

In addition, as shown in (g), the hot wire 250 may include both a plurality of hot wires 250a formed in parallel in the second direction and a plurality of hot wires 250b formed in parallel in the first direction. there is. The heating wire 250a in the second direction and the heating wire 250b in the first direction may be formed at different depths so as not to cross in the burn-in board 200 . Also, as shown in (h), a portion of the plurality of first-direction hot wires 250b may be connected to each other, and some of the plurality of second-direction hot wires 250a may also be partially connected to each other. Also, as shown in (i), all of the plurality of first-direction hot wires 250b may be connected to each other, and all of the plurality of second-direction hot wires 250a may be all connected to each other.

In the above, various arrangements of the heating wire 250 have been described as examples, but it is obvious that the present invention is not limited to this embodiment and can be modified in various forms. For example, although not shown, in the burn-in board 200 according to the present invention, when a socket for DUT mounting and a separate DUT board configured in the socket are configured, the above-mentioned heating wire 250 is on the DUT board. may be configured in

As described above, a plurality of burn-in boards may be loaded in the chamber of the burn-in test equipment, and the amount of current supplied to the heating wire 250 of each burn-in board may be differently controlled for each burn-in board. In addition, even within one burn-in board, the amount of current supplied to the heating wire 250 for each position in the board may be controlled differently.

The burn-in test equipment 10 according to the present invention uses the heating function of the heating wire 250 to heat the DUT when performing a high-temperature test process. can be reached quickly. This provides the effect of reducing the process time required for the burn-in test. In addition, the amount of current supplied to the heating wire 250 of the burn-in test equipment 10 according to the present invention can be individually controlled for each burn-in board, and can be controlled for each position within each burn-in board, so that the same temperature throughout the chamber easy to maintain That is, it is possible to improve the uniformity of the temperature distribution.

10: burn-in test equipment 11: chamber
11A: Door 13: Blower
111: third connector 112: fourth connector
200: burn-in board 201: first side edge
202: second side part 203: third side part
204: fourth side part 211: first connector
212: second connector 221: first signal wiring
222: second signal wiring 250: hot wire
260: temperature sensor

Claims (10)

In the burn-in test equipment for performing a test by applying thermal stress to a packaged semiconductor chip,
The burn-in test equipment includes a burn-in board for mounting DUTs under test;
a chamber for stacking and accommodating a plurality of the burn-in boards;
and a drive board accommodated outside the chamber and providing a test signal to be applied to the DUT;
The burn-in board has a rectangular flat plate shape, and a plurality of DUT regions to which DUTs are electrically connected are formed on one surface, and the DUT regions are arranged in a plurality of rows and a plurality of columns,
A first connector and a second connector for receiving input/output of a test signal from the drive board are formed on first and second side portions facing each other of the burn-in board,
The burn-in board includes a first signal wiring for transmitting a test signal from the first connector to a first group of DUT regions including the DUT regions adjacent to the first connector, and a second connector from the second connector. a second signal wiring for transmitting a test signal to the DUT regions of a second group consisting of DUT regions adjacent to
In addition, the burn-in board has a built-in heating wire that heats the mounted DUTs to a predetermined test temperature,
The chamber includes a door for taking out the burn-in board, and first and second sidewalls facing each other on both sides of the door,
A third connector extending from the drive board and connected to the first connector is installed on the first sidewall,
The burn-in test equipment according to claim 1, wherein a fourth connector extending from the drive board and connected to the second connector is installed on the second sidewall. According to claim 1,
Among the DUT regions of the first group, the distance from the first connector to the farthest DUT region is less than 1/2 of the distance L1 between the first connector and the second connector,
Among the DUT regions of the second group, the distance from the second connector to the farthest DUT region is less than 1/2 of the distance L1 between the first connector and the second connector. . According to claim 1,
The burn-in board further comprises one or more temperature sensors,
Burn-in test equipment, characterized in that in the plurality of burn-in boards accommodated in the chamber, the amount of current provided to the heating wire is configured to be individually controlled for each burn-in board. According to claim 1,
wherein the burn-in board includes two or more temperature sensors;
The burn-in test equipment, characterized in that the heating wire embedded in the burn-in board is divided into two or more so that each can be individually controlled. The method of claim 1,
The third connector is installed to move forward and backward toward the first connector,
Burn-in test equipment, characterized in that the fourth connector is also installed to be movable forward and backward toward the second connector. According to claim 1,
The burn-in test equipment includes a refrigerator for a predetermined low temperature test,
A blower for circulating cold air generated in the refrigerator into the chamber,
Burn-in test equipment, which faces the door and has a through hole formed in a rear wall for introducing cold air into the chamber. In a burn-in board on which a plurality of DUTs for a burn-in test process are mounted,
The burn-in board has a rectangular flat plate shape, and a plurality of DUT regions to which DUTs are electrically connected are formed on one surface, and the DUT regions are arranged in a plurality of rows and a plurality of columns,
A first connector and a second connector for receiving input/output of a test signal from a drive board of the burn-in test equipment are formed on first and second side portions facing each other of the burn-in board;
The burn-in board includes a first signal wiring for transmitting a test signal from the first connector to a first group of DUT regions including the DUT regions adjacent to the first connector, and a second connector from the second connector. a second signal wiring for transmitting a test signal to the DUT regions of a second group consisting of DUT regions adjacent to
The burn-in board is a burn-in board, characterized in that it has a built-in heating wire that heats the mounted DUTs to a predetermined test temperature. 8. The method of claim 7,
Among the DUT regions of the first group, the distance from the first connector to the farthest DUT region is less than 1/2 of the distance L1 between the first connector and the second connector,
Among the DUT regions of the second group, the distance from the second connector to the farthest DUT region is less than 1/2 of the distance (L1) between the first connector and the second connector. 9. The method of claim 8,
The burn-in board further comprises one or more temperature sensors,
The burn-in board, characterized in that the heating wire is divided into two or more so that each can be individually controlled. 10. Burn-in test equipment comprising the burn-in board of any one of claims 7 to 9.

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