KR102376223B1 - 접착제 조성물, 이방 도전성 접착제 조성물, 회로 접속 재료 및 접속체 - Google Patents

접착제 조성물, 이방 도전성 접착제 조성물, 회로 접속 재료 및 접속체 Download PDF

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Publication number
KR102376223B1
KR102376223B1 KR1020187008753A KR20187008753A KR102376223B1 KR 102376223 B1 KR102376223 B1 KR 102376223B1 KR 1020187008753 A KR1020187008753 A KR 1020187008753A KR 20187008753 A KR20187008753 A KR 20187008753A KR 102376223 B1 KR102376223 B1 KR 102376223B1
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KR
South Korea
Prior art keywords
circuit
adhesive composition
epoxy resin
meth
adhesive
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Application number
KR1020187008753A
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English (en)
Korean (ko)
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KR20180050336A (ko
Inventor
스나오 구도
도루 후지나와
사토루 모리
아키히로 이토
도모키 모리지리
Original Assignee
쇼와덴코머티리얼즈가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 쇼와덴코머티리얼즈가부시끼가이샤 filed Critical 쇼와덴코머티리얼즈가부시끼가이샤
Publication of KR20180050336A publication Critical patent/KR20180050336A/ko
Application granted granted Critical
Publication of KR102376223B1 publication Critical patent/KR102376223B1/ko

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
KR1020187008753A 2015-09-04 2015-09-04 접착제 조성물, 이방 도전성 접착제 조성물, 회로 접속 재료 및 접속체 KR102376223B1 (ko)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2015/075253 WO2017037951A1 (ja) 2015-09-04 2015-09-04 接着剤組成物、異方導電性接着剤組成物、回路接続材料及び接続体

Publications (2)

Publication Number Publication Date
KR20180050336A KR20180050336A (ko) 2018-05-14
KR102376223B1 true KR102376223B1 (ko) 2022-03-17

Family

ID=58186871

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020187008753A KR102376223B1 (ko) 2015-09-04 2015-09-04 접착제 조성물, 이방 도전성 접착제 조성물, 회로 접속 재료 및 접속체

Country Status (4)

Country Link
JP (1) JP6631631B2 (ja)
KR (1) KR102376223B1 (ja)
CN (1) CN107922817B (ja)
WO (1) WO2017037951A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7446095B2 (ja) * 2019-12-03 2024-03-08 デクセリアルズ株式会社 フィルム巻装体及び接続体の製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2610900B2 (ja) 1987-10-27 1997-05-14 ソニーケミカル 株式会社 熱硬化型異方性導電接着シート及びその製造方法
JPH10168412A (ja) * 1996-12-10 1998-06-23 Sumitomo Bakelite Co Ltd 異方導電性接着剤
AU6520798A (en) 1997-03-31 1998-10-22 Hitachi Chemical Company, Ltd. Circuit connecting material, and structure and method of connecting circuit terminal
US6225408B1 (en) * 1998-06-12 2001-05-01 Lord Corporation Adhesive formulations
KR101342255B1 (ko) * 2009-11-16 2013-12-16 히타치가세이가부시끼가이샤 회로 접속 재료 및 이를 이용한 회로 부재의 접속 구조
JP5867508B2 (ja) 2011-09-06 2016-02-24 日立化成株式会社 回路接続材料及び接続体
JP6307966B2 (ja) * 2014-03-25 2018-04-11 日立化成株式会社 接着剤組成物、異方導電性接着剤組成物、回路接続材料及び接続体

Also Published As

Publication number Publication date
JPWO2017037951A1 (ja) 2018-07-26
KR20180050336A (ko) 2018-05-14
CN107922817B (zh) 2021-05-28
JP6631631B2 (ja) 2020-01-15
WO2017037951A1 (ja) 2017-03-09
CN107922817A (zh) 2018-04-17

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