KR102376223B1 - Adhesive composition, anisotropically conductive adhesive composition, circuit connection material and connection body - Google Patents

Abstract

The present invention contains (a) a thermoplastic resin, (b) a radically polymerizable compound, (c) a radical polymerization initiator, and (d) an epoxy resin having no (meth)acryloyloxy group, and a cationic polymerization curing agent for the epoxy resin. It relates to an adhesive composition substantially free of it.

Description

Adhesive composition, anisotropically conductive adhesive composition, circuit connection material and connection body

The present invention relates to an adhesive composition, an anisotropically conductive adhesive composition, a circuit connection material, and a connector.

In a semiconductor element or a liquid crystal display element, various adhesive compositions are conventionally used as a circuit connection material for the purpose of bonding various members in an element. Various characteristics, such as adhesiveness, heat resistance, and reliability in a high-temperature, high-humidity state, are calculated|required of this adhesive composition.

The adherend to be adhered has various surfaces formed of various materials, such as printed wiring boards, organic materials such as polyimide films, metals such as copper and aluminum, and metal compounds such as ITO, SiN, and SiO ₂ . Therefore, the adhesive composition is designed according to each to-be-adhered body.

As an adhesive composition for semiconductor elements or liquid crystal display elements, the thermosetting resin composition containing thermosetting resins, such as an epoxy resin which is highly adhesive and shows high reliability, is known (for example, refer patent document 1). Such adhesive compositions generally contain an epoxy resin, a curing agent such as a phenol resin that reacts with the epoxy resin, and a thermal latent catalyst that promotes the reaction between the epoxy resin and the curing agent. Among them, the thermal latent catalyst is an important factor determining the curing temperature and curing rate. Therefore, as a thermal latent catalyst, various compounds are used from a viewpoint of the storage stability at room temperature, and the curing rate at the time of heating. This adhesive composition is hardened|cured by heating generally at the temperature of 170-250 degreeC for 1 to 3 hours, and exhibits desired adhesiveness.

Moreover, the radical curing adhesive agent containing a (meth)acrylate derivative and a peroxide attracts attention (for example, refer patent document 2). A radical-curable adhesive is advantageous in terms of curing for a short period of time because the radical, which is a reactively active species, has high reactivity.

Moreover, in patent document 3, the radical curing adhesive agent containing the (meth)acrylate compound which has an epoxy group in a molecule|numerator is disclosed.

Japanese Patent Laid-Open No. Hei1-113480 International Publication No. 98/44067 International Publication No. 2013/035164

In recent years, with the high integration of semiconductor devices and high precision of liquid crystal devices, the pitch between devices and between wirings has become narrower, and the possibility that heating during curing for circuit connection adversely affects peripheral members is increasing.

Moreover, in order to reduce cost, it is necessary to improve a throughput, and development of the adhesive composition which hardens|cures in a shorter time while being low temperature, in other words, the adhesive composition of "low temperature fast curing" is calculated|required.

In order to achieve low-temperature rapid curing of the adhesive composition, for example, in the thermosetting resin composition, a thermal latent catalyst having a low activation energy is sometimes used, but in this case, it is very difficult to maintain storage stability around room temperature.

On the other hand, the radical curing adhesive can achieve low-temperature fast curing relatively easily. However, when the connection body obtained using the radical curing adhesive is exposed to a high-temperature, high-humidity environment, the interface of a circuit member and an adhesive agent peels, and a bubble will generate|occur|produce in many cases. As one of the causes, it is considered that a radical curing adhesive tends to generate|occur|produce large cure shrinkage compared with the adhesive agent containing an epoxy resin.

Said radical curing adhesive WHEREIN: When the compounding quantity of a (meth)acrylate derivative is decreased, peeling of the interface of a circuit member and an adhesive agent can be suppressed to some extent. However, in this case, there exists a tendency for adhesive strength and connection reliability to fall. In addition, circuit connection under low pressure conditions is necessary to prevent damage to circuit members, especially when connecting thin circuit members. For example, when circuit connection is performed under low pressure conditions such as 1 MPa, the resin between the opposing electrodes is Since it is difficult to fully exclude, satisfactory electrical connection may not be obtained with the conventional radical-curable adhesive agent.

On the other hand, when an epoxy resin and a radically polymerizable compound are used together, since radical polymerization is inhibited, hardening for a short time becomes difficult.

Patent Document 3 discloses a radical-curable adhesive containing a (meth)acrylate compound having an epoxy group in its molecule. Adhesiveness to it became inadequate, and it was not able to suppress completely generation|occurrence|production of the bubble by peeling of the interface of a circuit member and an adhesive agent after a high-temperature, high-humidity test.

The present invention has been made in view of the problems of the prior art, and although it is a radical curing adhesive, it is a low temperature (for example, 140° C. or less) and sufficient adhesive strength and connection even under connection conditions for a short time (for example, 5 seconds or less) It aims at providing the adhesive composition which can maintain reliability and can suppress peeling with a to-be-adhered body under high-temperature, high-humidity conditions.

The present invention contains (a) a thermoplastic resin, (b) a radically polymerizable compound, (c) a radical polymerization initiator, and (d) an epoxy resin having no (meth)acryloyloxy group, and a cationic polymerization curing agent for the epoxy resin. An adhesive composition substantially free of the composition is provided. According to such an adhesive composition, sufficient adhesive strength and connection reliability are maintained even under connection conditions of a low temperature (for example, 140 degrees C or less) and a short time (for example, 5 seconds or less), and furthermore, it maintains sufficient bonding strength and connection reliability with the to-be-adhered body under high temperature and high humidity conditions. It becomes possible to suppress peeling.

It is preferable that an epoxy resin has a biphenyl skeleton. By containing the epoxy resin which has such frame|skeleton, the effect mentioned above becomes larger.

The adhesive composition of this invention may contain (e) electroconductive particle further. By further containing electroconductive particle, since electroconductivity or anisotropic electroconductivity can be provided to an adhesive composition, an adhesive composition can be used more suitably as a circuit connection material. Moreover, the connection resistance between the circuit electrodes electrically connected through the said adhesive composition can be reduced more easily.

The present invention also contains (a) a thermoplastic resin, (b) a radically polymerizable compound, (c) a radical polymerization initiator, (d) an epoxy resin having no (meth)acryloyloxy group, and (e) conductive particles, Provided is an anisotropically conductive adhesive composition substantially free of a cationic polymerization curing agent for an epoxy resin. Here, it is preferable that the said epoxy resin has a biphenyl skeleton.

The present invention also provides a circuit connection material containing the above-described adhesive composition or anisotropic conductive adhesive composition and used for bonding circuit members having circuit electrodes to each other so that the circuit electrodes of each circuit member are electrically connected to each other. do.

The present invention also provides a first circuit member in which a first circuit electrode is formed on a main surface of a first circuit board, a second circuit electrode is formed on a main surface of a second circuit board, and the second circuit electrode and the first circuit electrode are A second circuit member disposed to face each other, and a connection member provided between the first circuit member and the second circuit member to electrically connect the first circuit member and the second circuit member, the connection member comprising the present invention It provides a connection body that is a cured product of the adhesive composition or anisotropically conductive adhesive composition. Moreover, it is preferable here that one of a said 1st circuit board and a 2nd circuit board is a glass substrate.

In the connector according to the present invention, since the connecting member for electrically connecting the first circuit member and the second circuit member is made of the adhesive composition of the present invention or a cured product of the anisotropically conductive adhesive composition, sufficient adhesive strength And connection reliability is maintained, and peeling of an adhesive agent is fully suppressed in high-temperature, high-humidity conditions.

According to the present invention, while being a radical curing adhesive, it maintains sufficient adhesive strength and connection reliability even under connection conditions of low temperature (for example, 140° C. or less) and for a short time (for example, 5 seconds or less), and furthermore, in high temperature and high humidity conditions An adhesive composition capable of suppressing peeling from an adherend can be provided.

BRIEF DESCRIPTION OF THE DRAWINGS It is a schematic sectional drawing which shows one Embodiment of the film adhesive containing the adhesive composition which concerns on this embodiment.
Fig. 2 is a schematic cross-sectional view showing an embodiment of a connecting body provided with a connecting member including a cured product of the adhesive composition according to the present embodiment.
Fig. 3 is a process diagram showing an embodiment in which a connector is manufactured with the adhesive composition according to the present embodiment by a schematic cross-sectional view.

EMBODIMENT OF THE INVENTION Hereinafter, preferred embodiment of this invention is described in detail, referring drawings as needed. However, this invention is not limited to the following embodiment. In the drawings, the same or equivalent parts are denoted by the same reference numerals, and overlapping explanations are omitted as appropriate. In addition, in this specification, (meth)acrylic acid means acrylic acid or methacrylic acid corresponding thereto. The same is true for other similar expressions such as (meth)acrylate.

The adhesive composition according to the present embodiment contains (a) a thermoplastic resin, (b) a radically polymerizable compound, (c) a radical polymerization initiator, and (d) an epoxy resin having no (meth)acryloyloxy group.

It is preferable that the said adhesive composition does not contain the cationic polymerization hardening|curing agent of an epoxy resin substantially. Here, not substantially containing the cationic polymerization curing agent of the epoxy resin indicates that the content of the cationic polymerization curing agent of the epoxy resin is less than 1.5 parts by mass with respect to 100 parts by mass of the total amount of the component (a) and the component (b), It is preferable that it is less than 1.0 mass part, It is more preferable that it is less than 0.5 mass part, It is still more preferable not to contain the cationic polymerization hardening|curing agent of an epoxy resin.

The cationic polymerization curing agent of an epoxy resin is a Bronsted acid, a Lewis acid, and a compound which can generate|occur|produce these acids with energy, such as a heat|fever and light. As a cationic polymerization hardening|curing agent of an epoxy resin, an onium salt etc. are mentioned, for example.

The (a) thermoplastic resin is, for example, selected from polyimide resin, polyamide resin, phenoxy resin, poly(meth)acrylic resin, polyester resin, polyurethane resin, polyester urethane resin and polyvinyl butyral resin. 1 type or 2 or more types of resin used are mentioned.

5000 or more may be sufficient as the lower limit of the weight average molecular weight of a thermoplastic resin, and 10000 or more may be sufficient as it. It exists in the tendency for the adhesive strength of an adhesive composition to improve that the weight average molecular weight of a thermoplastic resin is 5000 or more. On the other hand, the upper limit of the weight average molecular weight of a thermoplastic resin may be 400000 or less, 200000 or less may be sufficient, and 150000 or less may be sufficient as it. When the weight average molecular weight of the thermoplastic resin is 400000 or less, good compatibility with other components tends to be easily obtained, and the fluidity of the adhesive tends to be easily obtained. 5000-40000 are preferable, as for the weight average molecular weight of a thermoplastic resin, 5000-20000 are more preferable, and 10000-150000 are especially preferable.

As the thermoplastic resin, a rubber component may be used for the purpose of stress relaxation and adhesion improvement.

It is preferable that content of a thermoplastic resin is 20-80 mass parts with respect to 100 mass parts of total amounts of (a) component and (b) component, It is more preferable that it is 30-70 mass parts, It is still more preferable that it is 35-65 mass parts. When the content of the thermoplastic resin is 20 parts by mass or more, the adhesive strength tends to improve or the film formability of the adhesive composition tends to improve, and when it is 80 parts by mass or less, the fluidity of the adhesive tends to be easily obtained.

The adhesive composition which concerns on this embodiment may contain arbitrary things as (b) radically polymerizable compound. Any of the monomer and oligomer of the compound mentioned later may be sufficient as the said radically polymerizable compound, for example, and what used both together may be sufficient as it.

As said compound, the 1 type(s) or 2 or more types of polyfunctional (meth)acrylate compound which has 2 or more (meth)acryloyloxy groups are preferable. As such (meth)acrylate compound, for example, epoxy (meth)acrylate, urethane (meth)acrylate, polyether (meth)acrylate, polyester (meth)acrylate, trimethylolpropane tri(meth)acryl Polyalkylene glycol di(meth)acrylate, dicyclopentenyl(meth)acrylate, dicyclopentenyloxyethyl(meth)acrylate, neopentylglycoldi(meth)acrylate, and meth)acrylate, dipentaerythritol hexa(meth)acrylate, isocyanuric acid-modified bifunctional (meth)acrylate, and isocyanuric acid-modified trifunctional (meth)acrylate. As said epoxy (meth)acrylate, the epoxy (meth)acrylate which added (meth)acrylic acid to two glycidyl groups of bisphenol fluorenediglycidyl ether, and bisphenol fluorenediglycidyl ether, for example, The compound which introduce|transduced the (meth)acryloyloxy group to the compound which added ethylene glycol and/or propylene glycol to two glycidyl groups is mentioned. These compounds can be used individually by 1 type or in combination of 2 or more type.

Moreover, the adhesive composition may contain the monofunctional (meth)acrylate compound as (b) radically polymerizable compound for the purpose of fluidity|liquidity adjustment etc. Examples of the monofunctional (meth)acrylate compound include pentaerythritol (meth)acrylate, 2-cyanoethyl (meth)acrylate, cyclohexyl (meth)acrylate, and dicyclopentenyl (meth)acrylate. , dicyclopentenyloxyethyl (meth) acrylate, 2-(2-ethoxyethoxy) ethyl (meth) acrylate, 2-ethoxyethyl (meth) acrylate, 2-ethylhexyl (meth) acrylate , n-hexyl (meth) acrylate, 2-hydroxyethyl (meth) acrylate, hydroxypropyl (meth) acrylate, isobornyl (meth) acrylate, isodecyl (meth) acrylate, isooctyl ( Meth) acrylate, n-lauryl (meth) acrylate, 2-methoxyethyl (meth) acrylate, 2-phenoxyethyl (meth) acrylate, tetrahydrofurfuryl (meth) acrylate, 2- ( One of meth)acryloyloxyethyl phosphate, N,N-dimethylaminoethyl (meth)acrylate, N,N-dimethylaminopropyl (meth)acrylate, glycidyl group of an epoxy resin having a plurality of glycidyl groups glycidyl group-containing (meth)acrylate and (meth)acryloylmorpholine obtained by reacting with (meth)acrylic acid are mentioned. These compounds can be used individually by 1 type or in combination of 2 or more type.

Moreover, the adhesive composition may contain the compound which has radically polymerizable functional groups, such as an allyl group, a maleimide group, and a vinyl group, as (b) radically polymerizable compound for the purpose of the improvement of a crosslinking rate, etc.

It is preferable that an adhesive composition contains the radically polymerizable compound which has a phosphoric acid group as (b) radically polymerizable compound for the purpose of the improvement of adhesive strength. As a radically polymerizable compound which has a phosphoric acid group, the compound represented by following formula (1), (2), or (3) is mentioned, for example.

In formula (1), R ⁵ represents a hydrogen atom or a methyl group, R ⁶ represents a (meth)acryloyloxy group, and w and x each independently represent an integer of 1 to 8. In addition, a plurality of R ⁵ , R ⁶ , w and x in the same molecule may be the same or different, respectively.

In Formula (2), R< ⁷ > represents a (meth)acryloyloxy group, and y and z represent the integer of 1-8 each independently. A plurality of R ⁷ , y and z in the same molecule may be the same or different, respectively.

In Formula (3), R< ⁸ > represents a hydrogen atom or a methyl group, R< ⁹ > represents a (meth)acryloyloxy group, b and c each independently represent the integer of 1-8. A plurality of R ⁸ and b in the same molecule may be the same or different.

As a radically polymerizable compound which has a phosphoric acid group, for example, acid phosphooxyethyl (meth) acrylate, acid phosphooxypropyl (meth) acrylate, acid phosphooxy polyoxyethylene glycol mono (meth) acrylate, acid Phosphooxy polyoxypropylene glycol mono (meth) acrylate, 2,2'-di (meth) acryloyloxy diethyl phosphate, EO (ethylene oxide) modified phosphoric acid di (meth) acrylate, phosphoric acid modified epoxy (meth) ) acrylate and vinyl phosphate. These compounds can be used individually by 1 type or in combination of 2 or more type.

It is preferable that content of the radically polymerizable compound which has a phosphoric acid group is 0.1-15 mass parts with respect to 100 mass parts of total amounts of (a) component and (b) component, It is more preferable that it is 0.5-10 mass parts, It is 1-5 mass It is more preferable to deny it. When the content of the radically polymerizable compound having a phosphoric acid group is 0.1 parts by mass or more, high adhesive strength tends to be easily obtained, and when it is 15 parts by mass or less, it is difficult to decrease the physical properties of the adhesive composition after curing, and the effect of improving reliability is get better

It is preferable that it is 20-80 mass parts with respect to 100 mass parts of total amounts of (a) component and (b) component, and, as for total content of (b) radically polymerizable compound contained in adhesive composition, it is more preferable that it is 30-70 mass parts And, it is more preferable that it is 35-65 mass parts. When this total content is 20 mass parts or more, there exists a tendency for heat resistance to improve, and if it is 80 mass parts or less, there exists a tendency for the effect of peeling suppression after leaving to stand in a high-temperature, high-humidity environment to become large.

(c) A radical polymerization initiator can be arbitrarily selected from compounds, such as a peroxide and an azo compound. From the viewpoints of stability, reactivity and compatibility, a peroxide having a half-life temperature of 90 to 175° C. for 1 minute and a molecular weight of 180 to 1000 is preferable. "One-minute half-life temperature" means the temperature at which the half-life of a peroxide is 1 minute. "Half-life" refers to the time until the concentration of the compound is reduced to half of the initial value at a predetermined temperature.

As the radical polymerization initiator, for example, 1,1,3,3-tetramethylbutylperoxyneodecanoate, di(4-t-butylcyclohexyl)peroxydicarbonate, di(2-ethylhexyl)per Oxydicarbonate, cumylperoxyneodecanoate, 1,1,3,3-tetramethylbutylperoxyneodecanoate, dilauroyl peroxide, 1-cyclohexyl-1-methylethylperoxyneo Decanoate, t-hexylperoxyneodecanoate, t-butylperoxyneodecanoate, t-butylperoxypivalate, 1,1,3,3-tetramethylbutylperoxy-2-ethylhexa Noate, 2,5-dimethyl-2,5-di(2-ethylhexanoylperoxy)hexane, t-hexylperoxy-2-ethylhexanoate, t-butylperoxy-2-ethylhexanoate , t-butylperoxyneoheptanoate, t-amylperoxy-2-ethylhexanoate, di-t-butylperoxyhexahydroterephthalate, t-amylperoxy-3,5,5-trimethylhexanoate Noate, 3-hydroxy-1,1-dimethylbutylperoxyneodecanoate, 1,1,3,3-tetramethylbutylperoxy-2-ethylhexanoate, t-amylperoxyneodecano ate, t-amylperoxy-2-ethylhexanoate, 3-methylbenzoylperoxide, 4-methylbenzoylperoxide, di(3-methylbenzoyl)peroxide, dibenzoylperoxide, di(4-methylbenzoyl) ) Peroxide, 2,2'-azobis-2,4-dimethylvaleronitrile, 1,1'-azobis (1-acetoxy-1-phenylethane), 2,2'-azobisisobutyro Nitrile, 2,2'-azobis (2-methylbutyronitrile), dimethyl-2,2'-azobisisobutyronitrile, 4,4'-azobis (4-cyanovaleric acid), 1, 1'-azobis(1-cyclohexanecarbonitrile), t-hexylperoxyisopropyl monocarbonate, t-butylperoxymaleic acid, t-butylperoxy-3,5,5-trimethylhexanoate , t-butylperoxylaurate, 2,5-dimethyl-2,5-di(3-methylbenzoylperoxy)hexane, t-butylperoxy-2-ethylhexyl monocarbonate, t-hexylperoxy Benzoate, 2,5-dimethyl-2,5-di(benzoylperoxy)hexane, t-butylperoxybenzoate, dibutylperoxytrimethyladipate, t-amylperoxynormaloctoate, t-amylper at least one selected from oxyisononanoate and t-amylperoxybenzoate is a compound.

It is preferable that content of a radical polymerization initiator is 1-15 mass parts with respect to 100 mass parts of total amounts of (a) component and (b) component, It is more preferable that it is 2.5-10 mass parts, It is still more preferable that it is 3-8 mass parts do.

(d) As an epoxy resin which does not have a (meth)acryloyloxy group, For example, bisphenol A epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, phenol novolak type epoxy resin, cresol novolak type epoxy Resin, bisphenol A novolak type epoxy resin, bisphenol F novolak type epoxy resin, alicyclic epoxy resin, glycidyl ester type epoxy resin, glycidylamine type epoxy resin, hydantoin type epoxy resin, isocyanurate type An epoxy resin, an aromatic polycyclic epoxy resin, an aliphatic chain epoxy resin, an aliphatic polycyclic epoxy resin, the epoxy resin etc. which have a biphenyl skeleton are mentioned. These epoxy resins may be halogenated and may be hydrogenated. Among these, from the viewpoint of further improving connection reliability, an aromatic polycyclic epoxy resin and an epoxy resin having a biphenyl skeleton are preferable, and an epoxy resin having a biphenyl skeleton is more preferable. These can be used individually by 1 type or in combination of 2 or more type.

250 or more may be sufficient as the lower limit of the molecular weight of the epoxy resin which does not have a (meth)acryloyloxy group, 300 or more may be sufficient, and 350 or more may be sufficient as it. When the molecular weight is 250 or more, when the adhesive composition is used as a film adhesive, there is little possibility that the epoxy resin will volatilize in the drying process. On the other hand, the upper limit of the molecular weight of the epoxy resin which does not have a (meth)acryloyloxy group may be 5000 or less, 3000 or less may be sufficient, and 1000 or less may be sufficient as it. When the molecular weight is 5000 or less, the fluidity of the adhesive tends to be sufficiently easily obtained. It is preferable that it is 250-5000, as for the molecular weight of the epoxy resin which does not have a (meth)acryloyloxy group from the said viewpoint, it is more preferable that it is 300-3000, It is still more preferable that it is 350-1000.

The lower limit of the epoxy equivalent of the epoxy resin which does not have a (meth)acryloyloxy group may be 100 or more, 150 or more may be sufficient, and 180 or more may be sufficient as it. It exists in the tendency for the connection reliability of an adhesive composition to improve that an epoxy equivalent is 100 or more. On the other hand, the upper limit of the epoxy equivalent of the epoxy resin which does not have a (meth)acryloyloxy group may be 300 or less, 275 or less may be sufficient, and 270 or less may be sufficient as it. It exists in the tendency for the adhesiveness to glass to increase that epoxy equivalent is 300 or less. It is preferable that it is 100-300, as for the epoxy equivalent of the epoxy resin which does not have a (meth)acryloyloxy group from the said viewpoint, it is more preferable that it is 150-275, It is still more preferable that it is 180-270.

1 mass part or more may be sufficient as the lower limit of content of the epoxy resin which does not have a (meth)acryloyloxy group with respect to 100 mass parts of total amounts of (a) component and (b) component, 2.5 mass part or more may be sufficient, and 3 mass parts It may be more than When content is 1 mass part or more, there exists a tendency for the effect of this invention to become easy to be acquired at a higher level. In addition, 15 mass parts or less may be sufficient as the upper limit of content of the epoxy resin which does not have a (meth)acryloyloxy group with respect to 100 mass parts of total amounts of (a) component and (b) component, and 10 mass parts or less may be sufficient as it. When content is 15 mass parts or less and it uses on low-temperature short-time conditions, there exists a tendency for radical polymerization to become difficult to be inhibited. From the said viewpoint, it is preferable that content of the epoxy resin which does not have a (meth)acryloyloxy group is 1-15 mass parts with respect to 100 mass parts of total amounts of (a) component and (b) component, It is 2.5-10 mass parts It is more preferable, and it is still more preferable that it is 3-10 mass parts.

The adhesive composition which concerns on this embodiment may contain the silane coupling agent. The silane coupling agent is preferably a compound represented by the following formula (4).

In formula (4), R ¹ , R ² and R ³ each independently represent a hydrogen atom, an alkyl group having 1 to 5 carbon atoms, an alkoxy group having 1 to 5 carbon atoms, an alkoxycarbonyl group having 1 to 5 carbon atoms, or an aryl group. At least one of R ¹ , R ² and R ³ is an alkoxy group. R ⁴ is a (meth)acryloyl group, (meth)acryloyloxy group, vinyl group, isocyanato group, imidazole group, mercapto group, amino group optionally substituted with an aminoalkyl group, methylamino group, dimethylamino group, benzylamino group , a phenylamino group, a cyclohexylamino group, a morpholino group, a piperazino group, a ureide group, a glycidyl group or a glycidoxy group. a represents the integer of 0-10.

As a silane coupling agent of Formula (4), for example, vinyltrimethoxysilane, vinyltriethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldiethoxysilane, 3-( Meth)acryloxypropylmethyldimethoxysilane, 3-(meth)acryloxypropyltrimethoxysilane, 3-(meth)acryloxypropylmethyldiethoxysilane, 3-(meth)acryloxypropyltriethoxysilane, N -2-(aminoethyl)-3-aminopropylmethyldimethoxysilane, N-phenyl-3-aminopropyltrimethoxysilane, 3-ureidopropyltriethoxysilane, 3-mercaptopropyltrimethoxysilane and 3-isocyanate propyltriethoxysilane is mentioned. These compounds can be used individually by 1 type or in combination of 2 or more type.

It is preferable that it is 0.1-10 mass parts with respect to 100 mass parts of total amounts of (a) component and (b) component, and, as for content of a silane coupling agent, it is more preferable that it is 0.25-5 mass parts. When the content of the silane coupling agent is 0.1 parts by mass or more, the effect of suppressing the interfacial peeling of the circuit member and the circuit connection material and the generation of bubbles tends to become larger, and when the content of the silane coupling agent is 10 parts by mass or less, the adhesive composition tend to have a longer uptime.

In addition, when a silane coupling agent has radically polymerizable functional groups, such as an acryloyl group (acryloyloxy group), it shall be contained in (b) component as a radically polymerizable compound.

The adhesive composition which concerns on this embodiment may contain (e) electroconductive particle further. The adhesive composition containing electroconductive particle can be used especially suitably as an anisotropically conductive adhesive composition.

As electroconductive particle, metal particles, such as Au, Ag, Pd, Ni, Cu, and solder, carbon particle, etc. are mentioned, for example. In addition, the electroconductive particle may be a composite particle which has a nuclide particle containing non-conductive material, such as glass, ceramic, plastic, and a conductive layer, such as a metal, metal particle, carbon, which coat|covers the said nuclide particle. The particle|grains which have a copper particle and the silver layer which coat|covers this copper particle may be sufficient as a metal particle. The nucleoid particles of the composite particles are preferably plastic particles.

Since the composite particle which uses the said plastic particle as a nuclide particle has the deformability which deform|transforms by heating and pressurization, when bonding circuit members together, the contact area of the circuit electrode and electroconductive particle which the said circuit member has can be increased. Therefore, according to the adhesive composition containing these composite grain|particles as electroconductive particle, the connection body further excellent in the point of connection reliability is obtained.

The adhesive composition may contain the said electroconductive particle and the insulation coating electroconductive particle which has the insulating layer or insulating particle which coat|covers at least one part of the surface. The insulating layer can be provided by methods, such as hybridization. The insulating layer or insulating particles are formed of an insulating material such as a polymer resin. By using such insulating coating electroconductive particle, it becomes difficult to generate|occur|produce the short circuit by adjacent electroconductive particle.

It is preferable that the average particle diameter of electroconductive particle is 1-18 micrometers from a viewpoint of obtaining favorable dispersibility and electroconductivity.

It is preferable that content of electroconductive particle is 0.1-30 volume% on the basis of the total volume of adhesive composition, It is more preferable that it is 0.1-10 volume%, It is more preferable that it is 0.5-7.5 volume%. There exists a tendency for electroconductivity to improve that content of electroconductive particle is 0.1 volume% or more. There exists a tendency for it to become difficult to generate|occur|produce the short circuit between circuit electrodes as content of electroconductive particle is 30 volume% or less. Content (vol%) of electroconductive particle is determined based on the volume in 23 degreeC of each component which comprises the adhesive composition before hardening. The volume of each component can be calculated|required by converting mass into volume using specific gravity. Without dissolving or swelling the component whose volume is to be measured, a suitable solvent (water, alcohol, etc.) that can wet the component is placed in a measuring cylinder, etc., and the component to be measured is introduced thereto to measure the increased volume It can also be calculated|required as the volume of a component.

The adhesive composition may contain insulating organic or inorganic microparticles|fine-particles other than electroconductive particle. As the inorganic fine particles, for example, in addition to metal oxide fine particles such as silica fine particles, alumina fine particles, silica-alumina fine particles, titania fine particles and zirconia fine particles, nitride fine particles and the like. As organic microparticles|fine-particles, silicone microparticles|fine-particles, methacrylate-butadiene-styrene microparticles|fine-particles, acryl- silicone microparticles|fine-particles, polyamide microparticles|fine-particles, polyimide microparticles|fine-particles, etc. are mentioned, for example. These microparticles|fine-particles may have a uniform structure, and may have a core-shell type structure.

It is preferable that it is 5-30 mass parts with respect to 100 mass parts of total amounts of (a) component and (b) component, and, as for content of organic microparticles|fine-particles and inorganic microparticles|fine-particles, it is more preferable that it is 7.5-20 mass parts. When the content of the organic fine particles and the inorganic fine particles is 5 parts by mass or more, it tends to be relatively easy to maintain the electrical connection between the correlated electrodes, and when it is 30 parts by mass or less, the fluidity of the adhesive composition tends to be improved.

The adhesive composition may contain various additives.

When the adhesive composition according to the present embodiment is liquid at room temperature (25°C), it can be used as a paste-like adhesive. When an adhesive composition is solid at normal temperature, you may heat and use it, and you may use it by adding a solvent, making it into a paste. The solvent used for pasting is not particularly limited as long as it has substantially no reactivity with the adhesive composition (including additives) and can sufficiently dissolve the adhesive composition.

The adhesive composition according to the present embodiment can also be molded into a film and used as a film adhesive. The film adhesive is, for example, a solution obtained by adding a solvent or the like to the adhesive composition as needed, on a releasable support such as a fluororesin film, a polyethylene terephthalate film, a release paper, and the solvent is removed. can be obtained by The film adhesive is more convenient in terms of handling and the like.

BRIEF DESCRIPTION OF THE DRAWINGS It is a schematic sectional drawing which shows one Embodiment of the film adhesive containing the adhesive composition which concerns on this embodiment. The laminated|multilayer film 100 shown in FIG. 1 is equipped with the support body 8 and the film adhesive 40 laminated|stacked on the support body 8 so that peeling was possible. The film adhesive 40 is composed of an insulating adhesive layer 5 and conductive particles 7 dispersed in the insulating adhesive layer 5 . The insulating adhesive layer 5 is comprised from components other than electroconductive particle in the adhesive composition mentioned above. According to this film-like adhesive agent, handling is easy, it can install to a to-be-adhered body easily, and a connection operation|work can be performed easily. The film adhesive may have a multilayer structure containing two or more types of layers. When the film adhesive contains conductive particles, the film adhesive can be suitably used as the anisotropic conductive film.

According to the adhesive composition and the film adhesive which concern on this embodiment, to-be-adhered body can be adhere|attached by using heating and pressurization together normally. The heating temperature is preferably 100 to 250°C. The pressure is not particularly limited as long as it does not damage the adherend, but is generally preferably 0.1 to 10 MPa. It is preferable to perform these heating and pressurization in the range for 0.5 to 120 second. According to the adhesive composition and film adhesive according to the present embodiment, for example, under conditions of 140°C and about 1 MPa, it is possible to sufficiently adhere the adherends to each other even by heating and pressing for a short time for 5 seconds.

The adhesive composition and the film adhesive according to the present embodiment can be used as adhesives of different types of adherends having different coefficients of thermal expansion. Specifically, the adhesive composition and film adhesive according to the present embodiment, in addition to the anisotropic conductive adhesive, include circuit connection materials such as silver paste and silver film, elastomer for CSP, underfill material for CSP, and semiconductor element adhesive material such as LOC tape can be used as

The circuit connection material according to the present embodiment contains the above-described adhesive composition or anisotropically conductive adhesive composition. Such a circuit connection material can be used in order to adhere|attach circuit members which have circuit electrodes so that the circuit electrodes which each circuit member has may be electrically connected.

Hereinafter, an example in which a circuit board and circuit members having circuit electrodes formed on the main surface of the circuit board are connected as an adherend to each other as an adherend, using the film adhesive according to the present embodiment as an anisotropic conductive film, and a connection body is manufactured Explain.

Fig. 2 is a schematic cross-sectional view showing one embodiment of a connecting body provided with a connecting member including a cured product of the adhesive composition according to the present embodiment. The connection body 1 shown in FIG. 2 is provided with the 1st circuit member 20 and the 2nd circuit member 30 opposingly arranged. Between the first circuit member 20 and the second circuit member 30 , a connection member 10 for bonding and connecting them is provided.

The first circuit member 20 includes a first circuit board 21 and a first circuit electrode 22 formed on a main surface 21a of the first circuit board 21 . An insulating layer may be formed on the main surface 21a of the first circuit board 21 .

The second circuit member 30 includes a second circuit board 31 and a second circuit electrode 32 formed on the main surface 31a of the second circuit board 31 . An insulating layer may be formed also on the main surface 31a of the second circuit board 31 .

The first circuit member 20 and the second circuit member 30 are not particularly limited as long as they have circuit electrodes that require electrical connection. As the first circuit board 21 and the second circuit board 31, for example, a substrate made of an inorganic material such as a semiconductor, glass, or ceramic, a substrate made of an organic material such as polyimide or polycarbonate, glass/epoxy, etc. and a substrate containing an inorganic material and an organic material. The first circuit board 21 may be a glass substrate, and the second circuit board 31 may be a flexible substrate (preferably, a resin film such as a polyimide film).

Specific examples of the circuit member to be connected include a glass or plastic substrate on which an electrode such as an indium tin oxide (ITO) film is formed, a printed wiring board, a ceramic wiring board, a flexible wiring board, a semiconductor silicon chip, etc. used in a liquid crystal display. . These are used in combination as needed. As described above, according to the adhesive composition according to the present embodiment, in addition to a member having a surface formed of an organic material such as a printed wiring board and a polyimide film, metals such as copper and aluminum, ITO, silicon nitride (SiNx), silicon dioxide (SiO ₂ ) ) can be used for bonding circuit members having a wide variety of surface states, such as a member having a surface formed of an inorganic material.

For example, when one circuit member is a solar cell having electrodes such as a finger electrode and a bus bar electrode, and the other circuit member is a tab wire, a connection body obtained by connecting them is a solar cell, a tab wire, and a method for bonding them. It is a solar cell module provided with the connection member (hardened|cured material of adhesive composition).

The connecting member 10 includes a cured product of the adhesive composition according to the present embodiment. The connecting member 10 contains an insulating layer 11 and conductive particles 7 dispersed in the insulating layer 11 . The electroconductive particle 7 is arrange|positioned not only between the 1st circuit electrode 22 and the 2nd circuit electrode 32 which oppose but also between the main surfaces 21a, 31a. Since the 1st circuit electrode 22 and the 2nd circuit electrode 32 are electrically connected via the electroconductive particle 7, the connection resistance between the 1st circuit electrode 22 and the 2nd circuit electrode 32 is sufficiently reduced. Therefore, the flow of the electric current between the 1st circuit electrode 22 and the 2nd circuit electrode 32 can be made smooth, and the function which a circuit has can be fully exhibited. When a connection member does not contain electroconductive particle, when the 1st circuit electrode 22 and the 2nd circuit electrode 32 contact, they are electrically connected.

Since the connecting member 10 is formed of the cured product of the adhesive composition according to the present embodiment, the adhesive strength of the connecting member 10 to the first circuit member 20 and the second circuit member 30 is high enough Therefore, also after a reliability test (high-temperature, high-humidity test), the fall of adhesive strength and the increase of connection resistance can fully be suppressed.

The connection body 1 includes, for example, a process of arranging a pair of circuit members facing each other having a circuit electrode, with a film adhesive containing an adhesive composition interposed therebetween; a pair of circuit members and a film adhesive can be produced by a method comprising a step (this connection step) of bonding a pair of circuit members through a cured product of an adhesive composition by heating and curing the film while pressing it in the thickness direction of the adhesive composition.

Fig. 3 is a process diagram showing an embodiment in which a connector is manufactured with the adhesive composition according to the present embodiment by a schematic cross-sectional view. As shown in FIG. 3A , a film adhesive 40 is mounted on the main surface of the first circuit member 20 on the side of the first circuit electrode 22 . When the film adhesive 40 is provided on the above-described support, the laminate of the film adhesive and the support is loaded onto the circuit member in the direction in which the film adhesive 40 is positioned on the first circuit member 20 side. do. Since the film adhesive 40 is in the form of a film, handling is easy. For this reason, the film adhesive 40 can be easily interposed between the 1st circuit member 20 and the 2nd circuit member 30, and the 1st circuit member 20 and the 2nd circuit member 30 Connection work can be performed easily.

The film adhesive 40 is the above-mentioned adhesive composition (circuit connection material) formed in the form of a film, and has the electroconductive particle 7 and the insulating adhesive bond layer 5. FIG. Even when an adhesive composition does not contain electroconductive particle, it can be used as a circuit connection material for electrically connecting by connecting circuit electrodes directly. The circuit connection material which does not contain electroconductive particle may be called NCF(Non-Conductive-FILM) or NCP(Non-Conductive-Paste). When an adhesive composition has electroconductive particle, the circuit connection material using this may be called ACF(Anisotropic Conductive FILM) or ACP(Anisotropic Conductive Paste) in some cases.

It is preferable that the thickness of the film adhesive 40 is 10-50 micrometers. If the thickness of the film adhesive 40 is 10 micrometers or more, there exists a tendency for it to become easy to fill between the 1st circuit electrode 22 and the 2nd circuit electrode 32 with an adhesive agent. When the thickness of the film adhesive is 50 µm or less, the adhesive composition between the first circuit electrode 22 and the second circuit electrode 32 can be sufficiently excluded, and the first circuit electrode 22 and the second circuit electrode ( 32) can be easily secured.

In the thickness direction of the film adhesive 40, by applying pressures A and B as shown in Fig. 3A, the film adhesive 40 is temporarily connected to the first circuit member 20 (Fig. See (b) of 3). At this time, you may pressurize, heating. However, the heating temperature is set to a temperature sufficiently lower than the temperature at which the adhesive composition in the film adhesive 40 is not cured, that is, the temperature at which the radical polymerization initiator rapidly generates radicals.

Subsequently, as shown in FIG. 3C , the second circuit member 30 is placed on the film adhesive 40 in the direction in which the second circuit electrode is positioned on the first circuit member 20 side. do. When the film adhesive 40 is provided on a support body, the 2nd circuit member 30 is mounted on the film adhesive 40 after peeling a support body.

Then, the film adhesive 40 is heated, applying pressures A and B in the thickness direction. The heating temperature at this time is set to the temperature at which a radical polymerization initiator fully generate|occur|produces a radical. Thereby, radicals generate|occur|produce from a radical polymerization initiator, and superposition|polymerization of a radically polymerizable compound is started. By this connection, the connection body shown in FIG. 2 is obtained. By heating the film adhesive 40 , the insulating adhesive is cured to form the insulating layer 11 in a state where the distance between the first circuit electrode 22 and the second circuit electrode 32 is sufficiently small. As a result, the first circuit member 20 and the second circuit member 30 are firmly connected via the connecting member 10 including the insulating layer 11 .

It is preferable that this connection is performed under the conditions of a heating temperature of 100 to 250 degreeC, a pressure of 0.1 to 10 MPa, and a pressurization time of 0.5 to 120 second. These conditions are suitably selected by the use to be used, adhesive composition, and a circuit member. According to the adhesive composition according to the present embodiment, it is possible to obtain a connector having sufficient reliability even under low-temperature conditions such as 140° C. or less. After this connection, you may post-cure as needed.

Example

Hereinafter, the present invention will be described in more detail by way of Examples and Comparative Examples. However, the present invention is not limited to the following examples.

<Synthesis of polyurethane resin>

To a separable flask equipped with a reflux condenser, a thermometer, and a stirrer, 1000 parts by mass of polypropylene glycol (number average molecular weight Mn=2000) which is a diol having an ether bond and 4000 parts by mass of methyl ethyl ketone as a solvent were added, and 30 at 40°C stirred for minutes. After the solution was heated to 70° C., 12.7 mg of dimethyl tin laurate as a catalyst was added. Then, the solution prepared by dissolving 125 mass parts of 4,4'- diphenylmethane diisocyanate in 125 mass parts of methyl ethyl ketone with respect to this solution was dripped over 1 hour. Then, stirring was continued at this temperature until the absorption peak of NCO was no longer confirmed with an infrared spectrophotometer, and the methyl ethyl ketone solution of a polyurethane resin was obtained. It adjusted so that the solid content concentration (concentration of a polyurethane resin) of this solution might be set to 30 mass %. The weight average molecular weight of the obtained polyurethane resin was 320000 (standard polystyrene conversion value) as a result of the measurement by GPC (gel permeation chromatography). Table 1 shows the analysis conditions for GPC below.

<Synthesis of urethane acrylate>

To a 2-liter four-neck flask equipped with a thermometer, a stirrer, an inert gas inlet and a reflux condenser, 4000 parts by mass of polycarbonate diol (manufactured by Aldrich, Mn=2000) and 238 parts by mass of 2-hydroxyethyl acrylate And 0.49 mass parts of hydroquinone monomethyl ether, and 4.9 mass parts of tin catalysts were thrown in, and the reaction liquid was prepared. With respect to the reaction liquid heated to 70 degreeC, 666 mass parts of isophorone diisocyanate (IPDI) was dripped uniformly over 3 hours, and it was made to react. After completion of the dropwise addition, the reaction was continued for 15 hours, and when it was confirmed that the NCO content was 0.2% by mass with a potentiometric automatic titration device (trade name AT-510, manufactured by Kyoto Denshi Kogyo Co., Ltd.), the reaction was terminated and the urethane acrylate got As a result of the analysis by GPC, the weight average molecular weight of urethane acrylate was 8500 (standard polystyrene conversion value). In addition, the analysis by GPC was performed under the same conditions as the analysis of the above-mentioned weight average molecular weight of a polyurethane resin.

<Synthesis of acrylate compound A having an epoxy group>

To a reactor equipped with a stirring device, a reflux condenser and a thermometer, 330 parts by mass of a bisphenol F-type epoxy resin (trade name JER806, manufactured by Mitsubishi Chemical Corporation: diglycidyl ether of bisphenol F, epoxy equivalent 165) and 72 acrylic acid Mass parts (ratio of 1 mol of acrylic acid with respect to 2 mol of epoxy groups in an epoxy resin), 1 mass part of benzyl triethylammonium chloride, and 0.1 mass part of t-butylcatechol were thrown in, and the reaction liquid was prepared. While the reaction solution was stirred at 100°C for 3 hours, the reaction between the epoxy group and acrylic acid was allowed to proceed. After returning the reaction liquid to room temperature after completion|finish of reaction, 300 mass parts of benzene was added and the product was dissolved. Then, an aqueous sodium carbonate solution and distilled water were added thereto in this order, and the solution was washed three times. Thereafter, benzene was sufficiently distilled off to obtain a crude product. As a result of analyzing the crude product by liquid chromatography, it was found that, in addition to the target compound, an acrylate compound having one epoxy group, a bifunctional acrylate compound having no epoxy group and a raw material bisphenol F-type epoxy resin were included in the crude product. . Then, the crude product was purified to obtain an acrylate compound A having an epoxy group and an acryloyloxy group, and having a bisphenol F-type basic skeleton.

<Production of conductive particles>

A nickel layer having a thickness of 0.2 µm was formed on the surface of the polystyrene particles, and then a gold layer having a thickness of 0.04 µm was formed on the outside of the nickel layer. In this way, the electroconductive particle with an average particle diameter of 4 micrometers was produced.

<Production of film adhesive>

The raw materials shown in Table 2 were mixed in the mass ratio shown in Table 2. The said electroconductive particle was disperse|distributed here in the ratio of 1.5 volume%, and the coating liquid for forming a film adhesive was obtained. This coating solution was applied to a polyethylene terephthalate (PET) film having a thickness of 50 µm using a coating device. The coating film was dried with hot air at 70°C for 10 minutes to form a film adhesive having a thickness of 18 µm.

Each numerical value shown in Table 2 represents the mass part of solid content. In addition, the specific substance of each raw material shown in Table 2 is as showing below.

- Polyurethane resin, urethane acrylate, and acrylate compound A having an epoxy group: synthesized as described above;

-Phenoxy resin: a 40 mass % solution prepared by dissolving 40 g of PKHC (made by Union Carbide, trade name: average molecular weight 45000) in 60 g of methyl ethyl ketone;

・Epoxy resin A: YX4000 (manufactured by Mitsubishi Chemical Corporation, trade name: molecular weight 384, epoxy equivalent 192, biphenyl type epoxy resin);

・Epoxy resin B: YX7399 (manufactured by Mitsubishi Chemical Co., Ltd., trade name: molecular weight 528, epoxy equivalent 264, biphenyl type epoxy resin);

Epoxy resin C: JER806 (manufactured by Mitsubishi Chemical Corporation, trade name: molecular weight 330, epoxy equivalent 165, bisphenol F-type epoxy resin);

-Phosphate ester: 2-methacryloyloxyethyl acid phosphate (trade name Light Ester P-2M, manufactured by Kyoesha Chemical Co., Ltd.);

· Silane coupling agent: 3-methacryloxypropyltrimethoxysilane (trade name KBM-503, manufactured by Shin-Etsu Chemical Co., Ltd.);

Peroxide: lauroyl peroxide (trade name peroyl L, manufactured by Nichiyu Corporation: molecular weight 398.6);

Cationic polymerization curing agent for epoxy resin: aliphatic sulfonium salt-based latent cationic polymerization curing agent (trade name: Adeka Optomer CP-66, manufactured by ADEKA Corporation)

- Inorganic fine particles: A 10 mass % dispersion liquid prepared by dispersing 10 g of silica particles (trade name R104, manufactured by Nippon Aerosil Co., Ltd.) in a mixed solvent of 45 g of toluene and 45 g of ethyl acetate.

<Production of connector>

A flexible circuit board (FPC) having 2200 copper circuits with a line width of 75 µm, a pitch of 150 µm and a thickness of 18 µm using the above film adhesive as a circuit connection material, a glass substrate and 0.2 µm thick formed on the glass substrate An ITO substrate having a thin layer of indium oxide (ITO) (thickness of 1.1 mm, surface resistance of 20 Ω/□) was connected. Connection was performed by heating and pressurization for 5 seconds at 140 degreeC and 1 MPa using the thermocompression-bonding apparatus (heating method: constant heat type, Toray Engineering Co., Ltd. make). Thereby, the connection body in which the FPC and the ITO board|substrate were connected by the hardened|cured material of the film adhesive over a width of 1.5 mm was produced.

Further, instead of the ITO substrate, using a glass substrate and a SiN substrate (thickness 0.7 mm) having a thin layer of 0.2 μm silicon nitride (SiN) formed on the glass substrate, by heating and pressing at 140° C. and 3 MPa for 5 seconds , a connection body between FPC and SiN substrate was fabricated.

<Measurement of connection resistance and adhesive strength>

The resistance value (connection resistance) between the adjacent circuits of the obtained FPC and the connection body of an ITO board|substrate was measured with a multimeter. The resistance value was expressed as the average of 37 resistance points between adjacent circuits. In addition, the adhesive strength of this connection body was measured by the 90 degree peeling method according to JIS-Z0237. As a measuring device of adhesive strength, Tensilon UTM-4 (manufactured by Toyo Baldwin Co., Ltd., trade name, peel strength (50 mm/min, 25° C.) was used. Connection resistance and adhesive strength were measured immediately after connection and at 85° C., 85° C.) It measured about the connection body after holding|maintained for 250 hours in the constant temperature and humidity chamber of %RH.Table 3 shows the evaluation result.

<Observation of connector appearance>

Using a microscope (trade name: ECLIPSE L200, manufactured by Nikon Corporation), the interface between the cured product of the circuit connection material and the FPC and the interface between the cured product and the glass after the high temperature and high humidity test for the connection body of the ITO substrate and the SiN substrate was investigated. The case where there was no peeling was judged as "A", the case where peeling was confirmed slightly enough to have practically no problem was judged as "B", and the case where peeling was confirmed to some extent of a problem practically was judged as "C". Table 3 shows the evaluation results. If evaluation is "A" or "B", it can be said that peeling is a thing of the range which does not have a problem practically.

According to the film adhesive of each example, it was confirmed that good connection resistance (5Ω or less) and adhesive strength (8N/cm or more) were exhibited immediately after connection and after high-temperature, high-humidity test by low-temperature and short-time curing conditions, and , the connection appearance was also good enough that there was no problem in practical use.

On the other hand, in Comparative Example 1 which does not contain an epoxy resin and Comparative Example 2 containing 1 part by mass or more of a cationic polymerization curing agent for an epoxy resin, the adhesive strength after the high temperature and high humidity test is not sufficient as compared with each Example, Moreover, when a SiN substrate was used, generation|occurrence|production of peeling was confirmed after a high temperature, high humidity test, and also in the external appearance of a connection, a practical problem was confirmed.

One… connector, 5... Insulating adhesive layer, 7... Electroconductive particles, 8... support, 10... connection member, 11 ... insulating layer, 20... A first circuit member, 21 ... A first circuit board, 21a... If you give, 22... 1st circuit electrode, 30... A second circuit member, 31 ... a second circuit board, 31a... If you give, 32... 2nd circuit electrode, 40... Film adhesive, 100... laminated film.

Claims (8)

(a) a thermoplastic resin;
(b) a radically polymerizable compound;
(c) a radical polymerization initiator, and
(d) an epoxy resin having no (meth)acryloyloxy group
An adhesive composition comprising, wherein the radically polymerizable compound contains a radically polymerizable compound having a phosphoric acid group, the epoxy resin has a biphenyl skeleton, and is substantially free of a cationic polymerization curing agent for an epoxy resin. The adhesive composition of Claim 1 which further contains (e) electroconductive particle. (a) a thermoplastic resin;
(b) a radically polymerizable compound;
(c) a radical polymerization initiator;
(d) an epoxy resin having no (meth)acryloyloxy group, and
(e) conductive particles
An anisotropic conductive adhesive composition containing, wherein the radically polymerizable compound contains a radically polymerizable compound having a phosphoric acid group, the epoxy resin has a biphenyl skeleton, and does not substantially contain a cationic polymerization curing agent of the epoxy resin. It contains the adhesive composition according to claim 1 or 2, or the anisotropic conductive adhesive composition according to claim 3,
A circuit connection material used for bonding circuit members having circuit electrodes so that circuit electrodes of each circuit member are electrically connected to each other. a first circuit member having a first circuit electrode formed on a main surface of the first circuit board;
a second circuit member having a second circuit electrode formed on a main surface of a second circuit board and disposed so that the second circuit electrode and the first circuit electrode face each other;
a connection member provided between the first circuit member and the second circuit member and electrically connecting the first circuit member and the second circuit member;
A connection body, wherein the connection member is a cured product of the adhesive composition according to claim 1 or 2 or the anisotropically conductive adhesive composition according to claim 3 . The connector according to claim 5, wherein one of the first circuit board and the second circuit board is a glass substrate. delete delete

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