KR102374732B1 - Flexible display device pressing and bonding system - Google Patents

Abstract

An object of the present invention is to provide a flexible display device pressure bonding system, the configuration of the present invention is to support the flexible film 2 passing along the transfer line under the laser head 812 installed in the main frame 110, a bonding base portion 820 for supporting; and a laser bonding pressing unit 850 that presses a device to be bonded on the flexible film 2 passing between the laser head 812 and the bonding base 820, and the bonding base unit 820 is vacuum It is characterized in that it includes a heating plate (822) and a vacuum chuck (824).

Description

Flexible display device pressing and bonding system

The present invention relates to a pressure bonding system for a flexible display device, and more particularly, when performing pressure bonding between a flexible film and a device such as a semiconductor device, the flexible film is stably fixed with vacuum pressure and precision pressure and bonding work in a state where heating is applied It relates to a flexible display device pressure bonding system of a new configuration that allows this to be made.

In general, flat panel displays such as LCDs and LEDs are gradually becoming lighter, thinner and smaller, and in response to this, elements such as semiconductor elements or circuit boards are directly bonded to the pattern part of glass and are often manufactured. and a device bonding device each having a bonding unit.

In order to bond glass and a semiconductor device to the device bonding apparatus, the glass and the semiconductor device are respectively loaded and set in the loading unit, and then the bonding is performed while pressing the bonding unit with a bonding head.

However, a problem with this type of flat panel display device is that, due to the glass substrate, the substrate is very hard and heavy, and has a very low tolerance for bending stress. When the display device receives a bending moment, a display image is lost due to a change in the cell gap between the substrates because a change in the thickness of the liquid crystal layer occurs.

In addition, in order to realize a ubiquitous display environment, the characteristics of a display device that can display various multimedia information while improving the portability of the display device, and being lightweight, have a large display area, have excellent resolution, and have a fast display speed, are required. do.

Therefore, in order to simultaneously satisfy the excellent characteristics of flexibility, weight reduction and portability, the need for a flexible display device in which wiring and elements of the display device are formed on a plastic substrate is emerging. Flexible display devices are often manufactured in a Roll-to-Roll method. In the manufacturing process of such a flexible display, a bonding operation between the flexible film 2 and a device such as a semiconductor device or a flexible printed circuit board is performed.

However, in order to produce a flexible display device, a precise and error-free bonding operation between the flexible film 2 (substrate) and the element is required. The flexible film 2 can be called a substrate of a flexible display, and for example, it can be a PI Film (Polyimid Film). Since defects occur, a bonding operation between the device and the flexible display substrate that is precise and error-free is required. In addition, the precision of the bonding operation to prevent a case in which the process yield and efficiency are lowered is more required.

Korean Patent Registration No. 10-1754511 (registered on June 29, 2017) Korean Patent Publication No. 10-1996-0035935 (published on October 28, 1996) Korean Patent Publication No. 10-2000-0074174 (published on December 05, 2000) Korea Registered Utility Model No. 20-0311427 (registered on April 11, 2003)

The present invention has been developed to solve the problems described above, and an object of the present invention is to stably fix the flexible film with vacuum pressure during pressure bonding between the flexible film and the device such as a semiconductor device, An object of the present invention is to provide a vacuum heating pressure bonding system of a process system for a flexible display device of a new configuration that enables pressurization and bonding work, and ensures high quality of flexible display due to improved bonding precision.

According to the present invention for solving the above problems, a bonding base portion supporting and supporting a flexible film passing along a transfer line under a laser head installed on a main frame; There is provided a flexible display device pressure bonding system comprising a; a laser bonding press unit for pressing the device to be bonded on the flexible film passing between the laser head and the bonding base unit.

The bonding base part is characterized in that it is configured to include a vacuum heating plate and a vacuum chuck.

The vacuum chuck may include a vacuum forming hole secured inside the vacuum heating plate; and a plurality of suction holes connected to the vacuum forming hole and communicating with the upper surface of the vacuum heating plate, wherein the vacuum heating plate is configured to have a heater built therein.

The laser bonding pressing unit may include a slider body disposed under the laser head; a hollow elevating slider mounted on the slider body so as to be elevating; a quartz mounted on the elevating slider; a pressurized servomotor mounted on the base of the main frame; a pressurized cam flange connected to the motor shaft of the pressurized servomotor; a pressure hinge bracket mounted on the base of the main frame; and a pressing lever coupled to the pressing hinge bracket via a hinge part and connected to the pressing cam flange and disposed on the slider body.

A long hole is formed in the pressing lever in the longitudinal direction, and a pressing operation connecting pin provided in the pressing cam flange is coupled to the long hole.

The pressure operation connecting pin is provided with a rolling member, characterized in that the outer peripheral surface of the rolling member is configured to be rolled while in contact with the long hole of the pressure lever.

It is characterized in that the quartz is coupled to a quartz holder provided in the elevating slider.

The bottom surface of the quartz faces the flexible film, and the bottom surface of the quartz is characterized in that it is composed of a horizontal surface.

A silicon block is provided on the bottom of the quartz.

A bonding pressure plate is provided in the lifting slider, and a pressure cam follower bearing in contact with an upper surface of the bonding pressure plate is further provided in the pressure lever.

The lifting slider is provided with a bonding pressure plate, the bonding pressure plate is disposed at a position facing the upper end of the slider body, and a plunger for lifting and returning is disposed between the upper end of the slider body and the bottom surface of the bonding pressure plate. characterized in that

and a gap adjusting plate interposed between the lifting slider and the slider body.

The slider body is characterized in that it is further provided with a load cell for checking the amount of pressurization.

It is characterized in that the main frame is further equipped with a camera for photographing the position of the flexible film on which the material is mounted.

In the flexible display device pressure bonding system of the present invention, by repeating the process of raising the vacuum heating table toward the PI Film (Polyimid Film), irradiating the laser from the laser head, and press bonding the device to the PI Flim in the laser bonding unit, the device on the PI Film (Mainly a semiconductor device) is bonded, and the flexible display device pressure bonding system of the present invention performs a precise and error-free bonding operation between a PI Film (flexible display film) and a device (mainly a semiconductor device) in order to produce a flexible display device. There is a possible effect.

On the other hand, the above-described effect corresponds to the main effect of the present invention, the present invention has several other useful effects in addition to the above-mentioned effects, and it should be understood that the present invention is not limited in its features only by the above-described effects.

1 is a front view showing the structure of a flexible display device pressure bonding system according to the present invention;
2 is a perspective view showing the structure of a flexible display device pressure bonding system according to the present invention;
3 is a perspective view showing a part of a laser head, a laser bonding pressing unit, and a flexible film, which are main parts of the present invention;
Figure 4 is a right side perspective view of Figure 3;
5 is a bottom perspective view of FIG.
6 is a perspective view of a bonding base part, which is a main part of the present invention;
Figure 7 is a side cross-sectional view of the bonding base of Figure 6;
Fig. 8 is a side cross-sectional view of the bonding table which is the main part of Fig. 7;
9 is a perspective view showing a part of a laser head, a laser bonding pressing unit, a bonding base unit, and a flexible film, which are main parts of the present invention;
Figure 10 is a side view of Figure 9
11 is a right side view of the bonding base unit and the laser bonding pressing unit shown in FIG. 9;
12 is a perspective view showing a part of a flexible film on which device bonding is performed by the thermal process system for a flexible display device of the present invention;
13 is a front view showing a part of the laser head, the laser bonding pressing part, and the flexible film, which are the main parts of the present invention;
14 is a perspective view showing an exploded state of the laser head and the laser bonding pressing part, which are the main parts of the present invention;
15 is a perspective view illustrating a part of the laser bonding press unit, the laser head, and the flexible film of FIG. 14;

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. The objects, features and advantages of the present invention will be more readily understood by referring to the accompanying drawings and the following detailed description. In the drawings, the same reference numbers are used for the same parts. In addition, in describing the present invention, if it is determined that a detailed description of a related known configuration or function may obscure the gist of the present invention, the detailed description thereof will be omitted.

In addition, in describing the components of the present invention, terms such as first, second, A, B, (a), (b), etc. may be used. These terms are only for distinguishing the elements from other elements, and the essence, order, or order of the elements are not limited by the terms. When it is described that a component is "connected", "coupled" or "connected" to another component, the component may be directly connected or connected to the other component, but another component is between each component. It will be understood that may also be "connected", "coupled" or "connected".

Referring to the drawings, the flexible display device pressure bonding system according to the present invention supports and supports the flexible film 2 passing along the transfer line under the laser head 812 installed in the main frame 110, the bonding base portion 820 ), and a laser bonding press unit 850 for pressing the device to be bonded on the flexible film 2 passing between the laser head 812 and the bonding base unit 820 . The PI Film (2) is a kind of flexible substrate, and it will be understood that the PI Film (2) described in the present invention, the flexible substrate, and the flexible display film are the same.

The main frame 110 is configured in a hexahedral frame shape. The main frame 110 is provided with a main base 112 . An unwinder unit 210 and a rewinder unit 310 are disposed at both left and right positions of the main frame 110, respectively, and the PI Film 2 is formed by the unwinder unit 210 and the rewinder unit 310. It is fed along a transport path on the main base 112 of this main frame 110 . In addition to the unwinder unit 210 and the rewinder unit 310 , the PI Film 2 may be configured to be supplied along the transport path of the main frame 110 by other known feeding means.

A laser head 812 is mounted on the main frame 110 to be disposed above the main base 112 . A lens is provided on the bottom surface of the laser head 812 so that the laser generated from the laser device provided inside the laser head 812 is irradiated toward the PI Film 2 through the lens.

The present invention is a flexible film 2 disposed under the laser head 812 and passing on the transport path of the main frame 110 (in the present invention, as PI Film 2, hereinafter for convenience, the flexible film 2 is used as a PI Film (referred to as (2)) includes a bonding base portion 820 for supporting and supporting.

The present invention includes a laser bonding press unit 850 that presses the device to be bonded on the PI Film 2 passing between the laser head 812 and the bonding base unit 820 . The laser bonding pressing unit 850 includes a slider body 852, a lifting slider 854, a quartz 855, a pressing servo motor 856, a pressing cam flange 857, a pressing hinge bracket 858, and a pressing lever ( 859).

The base 724 coupled to the main base 112 of the main frame 110 is provided with a Z-axis LM guide 732 in the vertical direction, and a Z-axis elevating panel ( A laser head 812 is mounted on the Z-axis elevation panel 734 , and the slider body 852 is disposed below the laser head 812 . It is mounted on the Z-axis lifting panel 734 as possible. Since the Z-axis elevating panel 734 is coupled to the base 724 coupled to the main base 112 so as to be elevating, and the slider body 852 is mounted on the Z-axis elevating panel 734, the main frame ( It is disposed below the laser head 812 in a state where the slider body 852 is mounted on the base 724 of the 110 . The slider body 852 has an elevating guide space for the elevating slider 854 to be elevated therein, and the elevating guide space is configured to communicate with an upper end and a lower end of the slider body 852 . The slider body 852 has a rectangular lifting guide space therein, and the upper and lower ends have an open rectangular box shape.

A lifting slider 854 is vertically coupled to the slider body 852 . The lifting slider 854 has a laser irradiation space therein. The elevating slider 854 has a hollow body shape that communicates with upper and lower ends, and the laser irradiation space is formed inside the elevating slider 854 . The upper end and lower end of the lifting slider 854 are open. It has a hollow body shape that is opened so that the laser irradiated through the lens provided at the lower part of the laser head 812 reaches the PI Film 2 from the upper end of the elevating slider 854 through the lower end. That is, the laser irradiation space inside the lifting slider 854 is configured to communicate with the upper end and the lower end of the lifting slider 854 . The elevating slider 854 has a rectangular laser irradiation space therein, and the upper and lower ends have an open rectangular box shape. The slider body 852 and the lifting slider 854 are disposed between the lower portion of the laser head 812 and the upper portion of the PI Film 2 passing through the bonding base portion 820 . The elevating slider 854 may have a rectangular cross-section hollow body or a circular cross-section hollow body shape. The lifting slider 854 may be configured in various hollow body shapes in addition to the rectangular or circular cross-sectional hollow body shape.

The lifting slider 854 is provided with a bonding pressure plate 854BP. A bonding pressure plate 854BP is provided at the upper end of the lifting slider 854 . In this case, the bonding pressure plate 854BP is provided with a laser passage hole connected to the laser irradiation space inside the lifting slider 854. The laser irradiation space portion of the elevating slider 854 is an open hole penetrating through the upper end and the lower end of the lifting slider 854, and the laser passage hole is an open hole penetrating from the upper surface of the bonding pressure plate 854BP to the laser irradiation space portion.

The bonding pressure plate 854BP is disposed at a position facing the upper end of the slider body 852 . A plunger 852SP for lifting and returning is disposed between the upper end of the slider body 852 and the bottom surface of the bonding pressure plate 854BP. The plunger 852SP for upward return has a structure in which a plunger pin is slidably coupled to the inside of the plunger housing, the plunger pin is supported by a spring built into the plunger housing, and a part of the plunger pin protrudes from the upper end of the plunger housing. . When the plunger pin is pressed, the spring inside the plunger housing is compressed to retain elastic restoring force, and when the force pressing the plunger pin is released, the compressed spring expands to its original state and elastically pushes the plunger pin to push the plunger pin. In this pressed state, it elastically protrudes from the upper end of the plunger housing.

The plunger 852SP for lifting and returning is disposed at positions symmetrical to both sides with respect to the center of the slider body 852 . A plunger 852SP for rising and returning is built in the slider body 852 , and a part of the plunge pin protruding from the upper end of the plunger body protrudes from the upper end of the slider body 852 . In the present invention, the slider body 852 is configured in a rectangular box shape, and the two upward and return plungers 852SP are disposed at positions symmetrical to both sides with respect to the center of the slider body 852 . When viewed from the front of the slider body 852 mounted on the main frame 110, one on each of the left and right, respectively, the plungers 852SP for lifting and returning are disposed. The lift and return plunger 852SP is disposed below the bonding pressure plate 854BP provided in the lift slider 854 . In the plunger for lifting and returning (852SP), the plunger pin partially protruding from the upper end of the plunger body is in contact with the bottom surface of the bonding pressure plate (854BP).

A gap adjustment plate 853 is interposed between the elevating slider 854 and the slider body 852 . The clearance adjustment plate 853 minimizes the clearance during the ascending and descending operation of the lifting slider 854 , so that the lifting slider 854 in the slider body 852 can be precisely raised without shifting the position.

A quartz hold 854HD is fixed to a lower portion of the elevating slider 854 , a quartz 855 is coupled to the quartz hold 854HD, and a quartz 855 is disposed under the elevating slider 854 . At this time, the quartz 855 is configured in a block shape, and is disposed at a position where it meets the laser irradiation space inside the elevating slider 854 at the top and bottom. The quartz 855 is disposed at a position where it also meets the lens (laser optical system lens) of the laser head 812 mounted on the base 724 of the main frame 110 from above and below. When the laser generated in the laser head 812 passes through the lens and is irradiated downward, the laser passing through the quartz 855 is irradiated to the PI Film 2 passing along the transport path of the main frame 110 . At this time, the quartz 855 is configured in a hexahedral block shape, the bottom surface of the quartz 855 faces the PI Film 2 (flexible film), and the bottom surface of the quartz 855 is configured as a horizontal plane. The bottom surface of the quartz 855 is a horizontal plane, and the entire bottom surface of the quartz 855 is configured to press the PI Film 2 with a uniform force. Since the entire bottom surface of the quartz 855 is a uniform horizontal surface, the entire bottom surface of the quartz 855 can press the PI Film 2 from above with a uniform force.

On the other hand, the lifting and returning plunger (852SP) is disposed below the bonding pressure plate (854BP) provided in the lifting slider (854). The bonding pressure plate 854BP, the lifting slider 854, and the quartz 855 are raised by the plunger pin of the . When the force pressing the bonding pressure plate (854BP) from above does not act, the bonding pressure plate (854BP) and the elevating slider (854) and The quartz 855 will rise upward. In the present invention, since the plungers 852SP for lifting and return are arranged at positions symmetrical on both sides with respect to the center of the lifting slider 854, the plunger pins of the plungers for lifting and return 852SP are bonded by the elastically pushing force. The pressure plate 854BP, the lifting slider 854, and the quartz 855 are configured to rise precisely in the vertical direction without being biased to either side. On the other hand, when the force pressing the bonding pressure plate (854BP) from above acts, the bonding pressure plate (854BP) presses down while the bonding pressure plate (854BP), the elevating slider (854), and the quartz (855) descend. As a result, the plunger pin of the plunger 852SP for upward return is pressed down, and at the same time, the spring built into the plunger housing is compressed to retain the elastic restoring force. The plunger pin of the plunger 852SP for lifting and returning is pressed into the inner side of the plunger housing by the pressing force of the bonding pressure plate 854BP provided in the lifting slider 854 . In the present invention, the plungers 852SP for lifting and return are arranged at positions symmetrical on both sides with respect to the center of the lifting slider 854, so that even when the plunger pins of the plungers 852SP for lifting and returning are pressed, the bonding pressure plate (854BP) And the lifting slider 854 and the quartz 855 are configured to be precisely descended in the vertical direction without being biased to either side.

A plurality of bracket supporters 856BS are provided on the front side of the Z-axis lifting panel 734 at a position deviated to one side of the laser head 812 . The bracket supporter (856BS) has a bar shape. A plurality of bracket supporters (856BS) protrude from the front of the Z-axis lifting panel (734). When the Z-axis lifting panel 734 is viewed from the front, a plurality of bracket supporters 856BS are disposed at positions deviated from the right side of the laser head 812 and the lifting slider 854 .

A pressure servomotor bracket 856BRK is coupled to the bracket supporter 856BS. The pressure servomotor bracket 856BRK may be coupled to the bracket supporter 856BS by a fastener such as a bolt.

A pressurized servomotor 856 is mounted on the pressurized servomotor bracket 856BRK. In the present invention, the pressurized servomotor 856 may be referred to as an element pressurized servomotor, and the element 3 mainly refers to a semiconductor element. The motor shaft of the pressurized servomotor 856 is disposed in a direction perpendicular to the PI Film 2 passing through the transport path of the main frame 110 . A Z-axis elevating panel 734 is coupled to the base 724 provided in the main frame 110 to be elevating, and a pressurized servomotor bracket 856BRK supported by a bracket support to the Z-axis elevating panel 734 is provided. is mounted, and the pressure servomotor 856 is mounted on the pressure servomotor bracket 856BRK. Since the Z-axis lifting panel 734 constitutes the base 724 of the main frame 110, the main frame ( It becomes the structure in which the pressurization servomotor 856 was attached to the base 724 of 110. As shown in FIG.

A pressure cam flange 857 is coupled to the motor shaft of the pressure servomotor 856 . The cam flange is formed in a plate shape. The central portion of the cam flange is coaxially coupled to the motor shaft of the pressurized servomotor 856 . As the motor shaft of the pressure servomotor 856 rotates, the pressure cam flange 857 rotates.

A base 724 is provided on the main frame 110, and a Z-axis elevating panel 734 is coupled to the base 724 so as to be elevating in the vertical direction (Z-axis direction), and the Z-axis elevating panel 734 is coupled to the base 724. ), a pressure hinge bracket 858 is mounted on the front side. The pressure hinge bracket 858 is disposed at a position adjacent to the bonding pressure plate 854BP provided in the elevating slider 854 and above the bonding pressure plate 854BP. A Z-axis elevating panel 734 is coupled to the base 724 provided in the main frame 110 to be elevating, and a pressing hinge bracket 858 is mounted on the Z-axis elevating panel 734, the Z-axis Since the lifting panel 734 constitutes the base 724 of the main frame 110 , the pressure hinge bracket 858 is mounted on the base 724 of the main frame 110 .

A pressing lever 859 is coupled to the pressing hinge bracket 858 through a hinge portion. A region between the front and rear of the pressing lever 859 is coupled to the pressing hinge bracket 858 via the hinge portion. The pressing lever 859 may be rotated up and down like a seesaw based on the hinge in the pressing hinge bracket 858 . A Z-axis elevating panel 734 is coupled to the base 724 provided in the main frame 110 to be elevating, and a pressurizing hinge bracket 858 is mounted on the Z-axis elevating panel 734, and the pressurizing hinge A pressing lever 859 is mounted on the bracket 858 via a hinge part. Since the Z-axis lifting panel 734 is a component of the base 724 , the pressing lever 859 is provided on the main frame 110 . It becomes a structure mounted on the base 724 through the hinge part.

A long hole 859LH is formed in the pressing lever 859 in the longitudinal direction. A long hole 859LH is formed at a position adjacent to the base end of the pressing lever 859 . The long hole 859LH is configured in the shape of a hole extending long along the path between the proximal end and the front end of the pressing lever 859 .

The pressure lever 859 is further provided with pressure cam follower bearings 859CAB and 859CAB in contact with the upper surface of the bonding pressure plate 854BP. In the present invention, a pair of side-by-side cam follower mounting lever pieces are provided on the tip side of the pressing lever 859 . The cam follower mounting lever pieces are respectively disposed one at the front and one rearward from the longitudinal centerline of the pressure lever 859 when viewed from above of the pressure lever 859 . Pressurized cam follower bearings 859CAB and 859CAB are provided on the pair of cam follower mounting lever pieces.

Accordingly, the pressure lever 859 has a structure in which the pressure cam follower bearing 859CAB in contact with the upper surface of the bonding pressure plate 854BP is provided. A pair of pressure cam follower bearings 859CAB are in contact with the upper surface of the bonding pressure plate 854BP at front and rear positions. The outer peripheral surface of the pressure cam follower bearing (859CAB) is in contact with the upper surface of the bonding pressure plate (854BP).

Between the pair of cam follower mounting lever pieces of the pressure lever 859, a laser passage hole on the side of the pressure lever 859 that meets directly below the laser passage hole formed in the bonding pressure plate 854BP is secured. The pair of cam follower mounting lever pieces is disposed at a position out of the laser passage hole of the bonding pressure plate 854BP, and a laser passage hole on the side of the pressing lever 859 is secured between the pair of cam follower mounting lever pieces.

The laser generated from the laser head 812 passes through the lens and passes through the laser passage hole on the side of the pressure lever 859, the laser passage hole of the bonding pressure plate 854BP, and the laser passage hole of the lifting slider 854 to pass through the PI Film ( 2) is investigated.

The pressing cam flange 857 is provided with a pressing operation connecting pin 857PCP. A pressure operation connecting pin 857PCP is provided at an eccentric position from the center of the pressure cam flange 857 to one side.

A pressing operation connecting pin 857PCP provided in the pressing cam flange 857 is coupled to the long hole formed in the pressing lever 859 . At this time, the pressing operation connecting pin 857PCP is provided with a rolling member 857ROL, and in a state in which the rolling member 857ROL is inserted into the long hole 859LH of the pressing lever 859, the outer peripheral surface of the rolling member 857ROL is pressed It is configured to be rolled while in contact with the long hole (859LH) of the lever (859).

In summary, in the present invention, the laser bonding pressurizing unit 850 includes a pressurized servomotor 856 mounted on the base 724 of the main frame 110 and a pressurized cam connected to the motor shaft of the pressurized servomotor 856 . A flange 857, a pressing hinge bracket 858 mounted on the base 724 of the main frame 110 and having a long hole in the longitudinal direction, and a pressing lever coupled to the pressing hinge bracket 858 through a hinge part 859 , a slider body 852 mounted on the base 724 of the main frame 110 and disposed under the pressing lever 859 , and a lifting slider mounted on the slider body 852 to be able to move up and down. 854 , and a quartz 855 mounted on the elevating slider 854 .

On the other hand, the slider body 852 is further provided with a load cell 852LOC for checking the amount of pressurization. The load cell 852LOC for checking the amount of pressure is provided at the upper end of the slider body 852 . A load cell 852LOC for checking the amount of pressure is disposed between the upper end of the slider body 852 and the bottom surface of the main steel pressure plate.

The elevating slider 854 and the quartz 855 are not down, and the outer peripheral surfaces of the pressurizing cam follower bearings 859CAB and 859CAB provided in the pressurizing lever 859 are on the upper surface of the main steel pressurizing plate provided in the elevating slider 854. In the contact state, the pressure operation connecting pin 857PCP and the rolling member 857ROL provided in the pressure cam flange 857 are disposed in the region between the inner front end and the base end of the long hole provided in the pressure lever 859 .

When the pressing cam flange 857 is rotated in one direction by rotating the motor shaft of the pressing servomotor 856 in one direction, the rolling member 857ROL provided in the pressing operation connecting pin 857PCP moves the pressing lever 859. While moving toward the proximal end of the pressure lever 859 along the long hole 859LH of the pressurizing lever 859 and at the same time as the pressure operation connecting piece and the rolling member 857ROL rise, the proximal end of the pressure lever 859 is the hinge portion of the pressure lever 859 bracket. is lifted upward and the tip side of the pressure lever 859 is rotated to go down.

Then, the pressure cam follower bearings 859CAB and 859CAB provided at the tip of the pressure lever 859 are rolled on the upper surface of the bonding pressure plate 854BP below and at the same time the bonding pressure plate 854BP and the lifting slider 854) And by pressing down the quartz 855 to press the element (mainly semiconductor element) mounted on the PI Film (2) with the quartz 855 at a constant pressure, from the laser head 812 to the bottom of the quartz 855 The device is bonded to the PI Film (2) by the bonding paste by the irradiated laser.

The semiconductor element pressing cam flange 857 is rotated by the semiconductor element pressing servomotor 856 , and the pressing lever 859 is rotated by the pressing hinge bracket 858 in a vertical straight motion through the pressing lever 859 . , and the quartz 855 descends to come into contact with the vacuum heating table and pressurize it. The quartz 855, which descends the element (semiconductor element) on the PI Film 2 supported on the vacuum heating table, presses it and bonds it onto the PI Film 2 by the bonding paste.

At this time, a silicon block may be provided on the bottom surface of the quartz 855 , and in this case, the silicon block contacts the device 3 to bond the device 3 on the PI Film 2 .

In addition, the load cell 852LOC for checking the pressurization amount provided in the slider body 852 is pressed by the quartz 855 that descends the element (semiconductor element) on the PI Film 2, and the PI Film 2 is formed by bonding paste. ) Check the appropriate amount of pressure on the element during bonding to prevent the element from being pressed with excessive force. As a result, the quartz 855 part presses the element by the rotation of the motor shaft of the bonding pressurization servomotor so that it is bonded on the PI Fim. The amount of rotation of the motor shaft of the bonding pressure servomotor 856 is controlled by confirming the amount of pressure to be applied, and the amount of rotation of the motor shaft of the bonding pressure servomotor 856 is controlled. The force applied to the Film (2) can be adjusted appropriately.

The bonding base part 820 includes a vacuum heating plate 822 and a vacuum chuck 824 , and the vacuum heating plate 822 and the vacuum chuck 824 are configured to be raised and lowered by an up-down operation means. In addition, the bonding base part 820 is configured to be movable in the X-axis direction of the main frame 110 by the X-axis movement operation unit.

A bonding base support block 826 is provided on the main base 112 of the main frame 110 . The bonding base support block 826 is configured in a box shape having a space therein. A lower slider 827 is provided in the inner space of the bonding base support block 826 . The upper surface of the lower slider 827 is composed of a lower up-down inclined surface 827SF. The lower slider 827 is movably embedded in the inner space of the bonding base support block 826 . The lower slider 827 is located in the inner space of the bonding base support block 826 so as to move forward and backward in the Y-axis direction, which is a direction orthogonal to the X-axis direction, which is the transport path of the main frame 110 through which the PI Film 2 passes. is built-in One of the lower up-down inclined surfaces 827SF constituting the upper surface of the lower slider 827 is a relatively higher inclined surface than the other. When viewed from one side of the bonding base support block 826, the higher side of the lower up-down inclined surface 827SF is disposed on the rear side of the bonding base support block 826, and the lower side of the lower up-down inclined surface 827SF is the bonding base support It is disposed on the front side of block 826 .

The lower slider 827 is movably coupled to the inner lower surface of the bonding base support block 826 by an up-down LM guide. The up-down LM guide is composed of an up-down guide rail and an up-down guide rail block, and the up-down guide rail is disposed in the front-rear direction of the bonding base support block 826 . In the main frame 110 , an up-down guide rail is arranged in a direction parallel to the Y-axis direction orthogonal to the X-axis direction, which is the transport direction of the PI Film (2). An up-down guide rail block is slidably coupled to the up-down guide rail, the up-down guide rail block is connected to a lower slider 827, and the lower slider 827 is PI of the main frame 110 by an up-down LM guide. Film (2) is configured to be movable in a direction orthogonal to the transport direction. At this time, an up-down guide rail groove is provided on the bottom surface of the lower slider 827, and the up-down guide rail is parallel to the Y-axis direction orthogonal to the X-axis direction, which is the transport direction of the PI Film (2) in the main frame 110. It may be arranged so that the up-down guide rail groove of the lower slider 827 is slidably coupled to the up-down guide rail. In this case, the up-down LM guide includes the up-down guide rail groove and the up-down guide rail.

A lifting operation servo motor 832 is mounted on the bonding base support block 826 . The motor shaft of the elevating operation servomotor 832 is disposed in a direction parallel to the direction (Y-axis direction) orthogonal to the transport direction of the PI Film (2) of the main frame 110 . A lifting operation ball screw 833 is provided on the motor shaft of the lifting operation servo motor 832 . The lifting operation ball screw 833 is also disposed in the Y-axis direction.

The lifting operation ball nut 834 is coupled to the lifting operation ball screw 833 . The lifting operation ball screw 833 is provided on the rear surface of the lower slider 827 , and the lifting operation ball nut 834 is coupled to the lifting operation ball screw 833 provided on the motor shaft of the lifting operation servo motor 832 . do.

A motor shaft of the lifting operation servo motor 832 is connected to the lower slider 827 . The lifting operation servomotor 832 is fixed to the bonding base support block 826 by fixing means such as bolts and brackets, and a lifting operation ball screw 833 is provided on the motor shaft of the lifting operation servomotor 832 . A lifting operation ball nut 834 is provided on the bonding base support block 826 , and the lifting operation ball nut 834 is coupled to the slider ball screw. The motor shaft of the lifting operation servomotor 832 is connected to the lower slider 827 in a state in which it is disposed in a direction orthogonal to the transport path of the PI Film (2). When viewed from one side of the lower slider 827 , the motor shaft of the lifting operation servo motor 832 is connected to the rear surface of the lower slider 827 .

The lower slider 827 is configured to move forward and backward by an up-down operation means. In the present invention, the up-down operation means is a lifting operation servo motor 832 , a lifting operation ball screw 833 , and a lifting operation ball nut 834 .

Therefore, when the motor shaft of the lifting operation servomotor 832 rotates forward and reverse, the lifting operation ball screw 833 rotates forward and reverse, and the lower slider 827 connected to the lifting operation ball nut 834 moves up and down by the LM guide. It becomes possible to move forward or backward along the Y-axis direction orthogonal to the transfer direction of (2). When the motor shaft of the lifting operation servo motor 832 and the lifting operation ball screw 833 rotate forward and reverse, the lower up-down movement ball nut to which the lower slider 827 is connected moves forward and backward along the up-down guide rail of the lower up-down LM guide. , the lower slider 827 connected to the lower up-down movement ball nut can move forward or backward along the Y-axis direction orthogonal to the transport direction of the PI Film (2). The rotational force of the motor shaft of the lifting operation servomotor 832 is converted into a linear motion by the lifting operation ball screw 833 and the lifting operation ball nut 834, and the lower slider 827 is moved by the PI Film ( It becomes possible to move forward and backward in the Y-axis direction orthogonal to the feed direction of 2). When the lower slider 827 moves in a direction perpendicular to the transport direction of the PI Film 2 , the lower up-down inclined surface 827SF can also move in a direction perpendicular to the transport direction of the PI Film 2 .

An upper slider 828 is disposed on the lower slider 827 . The upper slider 828 may be referred to as a table up-down slider. An upper slider 828 is provided in the inner space of the bonding base support block 826 . A bottom surface of the upper slider 828 is configured as an upper up-down inclined surface 828SF. The upper slider 828 is embedded in the inner space of the bonding base support block 826 to be liftable. That is, the upper slider 828 is coupled to the bonding base support block 826 to be elevating by the slider elevating LM guide. The upper slider 828 is embedded in the internal space of the bonding base support block 826 so as to be raised and lowered under the PI Film 2 passing along the transport path of the main frame 110 . One of the upper up-down inclined surfaces 828SF constituting the bottom surface of the upper slider 828 is a relatively higher inclined surface than the other. When viewed from one side of the bonding base support block 826, the higher side of the upper up-down inclined surface 828SF is disposed on the rear side of the bonding base support block 826, and the lower side of the upper up-down inclined surface 828SF is the bonding base support It is disposed on the front side of block 826 . The upper up-down inclined surface 828SF of the lower surface of the upper slider 828 is in contact with the lower up-down inclined surface 827SF of the upper surface of the lower slide. When viewed from one side of the bonding base support block 826, the upper up-down inclined surface 828SF of the upper slider 828 and the lower up-down inclined surface of the lower slider 827 are in contact with each other. Bonding base support block 826 It is formed as a slope inclined from the rear to the front of the

As the motor shaft of the lifting operation servomotor 832 and the lifting operation ball screw 833 constituting the up-down operation means rotate in one direction, the lower slider 827 advances. When viewed from one side of the bonding base support block 826 , the lower slider 827 advances from the rear to the front of the bonding base support block 826 . Then, the upper slider 828 rises by the lower up-down inclined surface 827SF of the lower slider 827 and the upper up-down inclined surface 828SF of the upper slider 828 .

As the motor shaft of the lifting operation servo motor 832 and the lifting operation ball screw 833 rotate in the other direction, the lower slider 827 moves backward. When viewed from one side of the bonding base support block 826 , the lower slider 827 advances from the front to the rear of the bonding base support block 826 . Then, the upper slider 828 descends by the lower up-down inclined surface 827SF of the lower slider 827 and the upper up-down inclined surface 828SF of the upper slider 828 .

A heat insulating material is provided on the upper surface of the upper slider 828 . A vacuum heating plate 822 is provided on the insulating material. An insulating material is interposed between the lower portion of the vacuum heating plate 822 and the upper surface of the upper slider 828 . That is, an upper slider 828 is provided under the vacuum heating plate 822 , a bottom surface of the upper slider 828 is composed of an upper up-down inclined surface 828SF, and a lower portion below the upper slider 828 . A slider 827 is provided, and the upper surface of the lower slider 827 includes a lower up-down inclined surface 827SF that is in surface contact with the upper up-down inclined surface 828SF, and the lower slider 827 is operated by an up-down operation means. The upper slider 828 and the vacuum heating plate 822 are raised and lowered as the lower slider 827 moves forward and backward. Of course, it is raised and lowered together with the insulation stock upper slider 828 and the vacuum heating plate 822 .

The bonding base support block 826, the upper slider 828, the lower slider 827, the insulating material, and the vacuum heating plate 822 provided on the main base 112 of the main frame 110 constitute a vacuum heating table. . In the present invention, the vacuum heating table is referred to as a bonding base unit 820 .

The bonding base part 820 includes a vacuum heating plate 822 and a vacuum chuck 824 .

The vacuum heating plate 822 is coupled to the upper surface of the insulating material on the upper slider 828, so that the vacuum heating plate 822 is under the PI Film 2 passing along the transport path of the main frame 110. can be elevated. As described above, when the lower slider 827 advances and pushes the upper slider 828 upward, the vacuum heating plate 822 rises, and when the lower slider 827 moves backward and the upper slider 828 descends, vacuum heating The plate 822 is lowered.

The vacuum chuck 824 is connected to the vacuum forming hole 824VH secured inside the vacuum heating plate 822, and the vacuum forming hole 824VH, and is connected to the upper surface of the vacuum heating plate 822 by a plurality of adsorption. and a hole 824SH.

The vacuum forming hole 824VH forms a passage for forming a vacuum in the vacuum heating plate 822 . A vacuum device (not shown) is connected to the vacuum forming hole 824VH.

The plurality of adsorption holes 824SH communicate with the vacuum forming hole 824VH. A plurality of adsorption holes 824SH are distributed on the vacuum heating plate 822 in a grid arrangement. A plurality of adsorption holes 824SH are arranged in a lattice form at uniform intervals on the upper surface of the vacuum heating plate 822 . When a vacuum is formed in the vacuum forming hole 824VH by the operation of a vacuum device, the PI Film 2 (substrate) placed on the upper surface of the vacuum heating plate 822 is applied to the plurality of adsorption holes 824SH by vacuum pressure. It is adsorbed and fixed to the upper surface of the vacuum heating plate 822 . The PI Film (2) is adsorbed with a uniform vacuum pressure by a plurality of adsorption holes (824SH) arranged in a uniform grid on the upper surface of the vacuum heating plate (822) and fixed to be stably adhered to the upper surface of the vacuum adsorption plate (822) will do

At this time, the main frame 110 is further provided with a camera 851 for photographing the position of the flexible film 2 on which the material is mounted. The camera 851 may be supported and mounted on the main frame 110 so as to be disposed above the PI Film 2 by a fixing means such as a bracket. By photographing the position of the PI Film (2) and the position of the element by the camera 851, the X-axis position, Y-axis position, and Z-axis position of the laser head 812, the lifting slider 854, and the quartz 855 are It can be adjusted according to the position of the PI Film (2).

On the other hand, in a state in which the bonding pressure plate 854BP, the lifting slider 854 and the quartz 855 descend and the quartz 855 part is pressing the element on the PI Flim, the plunger pins of the plungers 852SP for lifting and returning are raised and lowered. It is pressed by the bonding pressure plate 854BP provided in the slider 854 and the springs inside the plungers 852SP for lifting and returning are in a compressed state.

In the state in which the bonding pressure plate 854BP, the lifting slider 854, and the quartz 855 are down, the motor shaft of the pressure servo motor 856 is rotated in the other direction to rotate the pressure cam flange 857 in the other direction. When rotated, the rolling member 857ROL provided in the pressure operation connecting pin 857PCP moves from the proximal end to the front end of the pressure lever 859 along the long hole 859LH of the pressure lever 859 and simultaneously rolls with the pressure operation connection piece As the member 857ROL descends, the proximal end side of the pressure lever 859 is rotated downward based on the hinge part of the pressure lever 859 bracket and the front end side of the pressure lever 859 is lifted.

Then, the pressure cam follower bearings 859CAB and 859CAB provided at the tip of the pressure lever 859 are rolled on the upper surface of the bonding pressure plate 854BP below and at the same time the bonding pressure plate 854BP and the lifting slider 854) And the force pressing down the quartz 855 is released, and at this time, the pressed plunger pins of the lift and return plungers 852SP are elastically raised by the elastic force of the spring unfolding, and the bonding pressure plate 854BP and the elevating slider (854) and quartz (855) are raised above the PI Film (2). As the quartz 855 moves upward, the state in which the quartz 855 presses the element mounted on the PI Film 2 to a predetermined pressure is released.

The flexible display element pressure bonding system according to the present invention can be called a laser bonder device pressure system, and the flexible film 2 supply (PI Film 2 supply) from the unwinder unit 210, the PI Film 2 The PI Film (2) rewinding operation is performed in the device laser bonding and rewinder unit (310).

In the present invention, PI Film (2) (substrate) feeding, laser head 812 irradiation move to the correct position (X, Y, Z axes), vacuum heating table rise, laser head 812 irradiation, laser bonding system downward compression By this, a device (mainly a semiconductor device) is laser-bonded to the PI Film (2).

The vacuum heating plate 822 rises by the elevating servomotor 832 in a state in which the PI Film 2 on which the element is mounted is moved and stopped by one pitch. When the lifting operation ball screw 833 (table lifting slider 854 ball screw) is rotated by the lifting operation servomotor 832, the table lifting slider 854 is raised or lowered. As described above, as the motor shaft of the lifting operation servomotor 832 and the lifting operation ball screw 833 rotate in one direction, the lower slider 827 advances to raise the upper slider 828, and the lifting operation is performed. As the motor shaft of the servo motor 832 and the lifting operation ball screw 833 rotate in the other direction, the lower slider 827 moves backward to lower the upper slider 828 . When the lower slider 827 advances to raise the upper slider 828 , the vacuum heating plate 822 connected to the bottom surface of the upper slider 828 rises. When the vacuum heating plate 822 rises, the top surface of the vacuum heating plate 822 is in contact with the bottom surface of the PI Film 2 .

The element 3 pressurizing cam flange 857 is rotated by the element pressurizing servomotor 856, and the pressurizing lever 859 rotates by the pressurizing hinge bracket 858 and moves vertically through the pressurizing lever 859. , and the quartz 855 is lowered together with the elevating slider 854 to be in contact with the vacuum heating plate 822 and pressurized. Since the PI Film 2 on which the element 3 (semiconductor element 3) is mounted is located under the quartz 855, the quartz 855 applies the element 3 and the PI Film 2 to the vacuum heating plate. (822) to be pressurized on the upper surface. As described above, when the pressure cam follower is rotated in one direction by rotating the motor shaft of the pressure servomotor 856 in one direction, the rolling member 857ROL provided in the pressure operation connecting pin 857PCP moves the pressure lever 859 ) moves toward the proximal end of the pressure lever 859 along the long hole 612XLH, and at the same time, the pressure operation connecting piece and the rolling member 857ROL rise, while the pressure lever 859 moves toward the proximal end of the pressure lever 859. The quartz 855 is PI Film by pushing down the bonding pressure plate 854BP, the lifting slider 854 and the quartz 855 by lifting it up as a reference and rotating the tip of the pressure lever 859 to go down. The element 3 mounted in (2) is pressed to the upper surface of the vacuum heating plate 822 at a constant pressure.

As described above, as the lifting operation ball screw 833 (table up-down slider ball screw) rotates by the lifting operation servo motor 832, the lower slider 827 moves forward and backward by the lifting operation ball nut 834 The upper slider 828 (table up-down slider) rises or descends. As the upper slider 828 rises, the upper surface of the vacuum heating plate 822 is placed on the lower surface of the PI Film 2 on which the element 3 is mounted. In a contact state, a vacuum is formed through the vacuum nipple and the vacuum forming hole 824VH, and the PI Film 2 (substrate) is adsorbed by vacuum pressure through the adsorption hole 824SH. The vacuum nipple is not shown The vacuum generator is connected to the vacuum generator through a connecting tube such as a hose, and the vacuum nipple is connected to the vacuum forming hole (824VH) provided in the vacuum heating plate 822, and the vacuum generated by the vacuum generator is vacuumed. A vacuum pressure is formed in the internal vacuum forming hole 824VH of the heating plate 822, and the vacuum pressure acts through the suction hole 824SH communicating with the upper surface of the vacuum heating plate 822 from the vacuum forming hole 824VH. The PI Film 2 (substrate) is stably adsorbed and fixed to the upper surface of the vacuum heating plate 822 by vacuum pressure.

The element pressurizing cam flange 857 is rotated by the element pressurizing servomotor 856 and the element pressurizing reducer, and the pressurizing lever 859 connected to the element pressurizing cam flange 857 is the pressurizing lever 859 from the bracket. Based on the hinge part, the lifting slider 854 is pressed downward by the lever motion principle to descend.

A quartz holder 854HD and a quartz 855 are connected to the elevating slider 854, so that when the elevating slider 854 is lowered, the PI Film 2 (substrate) and the element 3 (mainly a semiconductor element) will pressurize

Meanwhile, the PI Film 2 is maintained in a fixed state by vacuum pressure while the vacuum heating plate 822 below is supported.

The laser head 812 irradiates a laser through a lens (laser optical lens) to bond the device (semiconductor device) onto the PI Film 2 by a bonding material such as a bonding paste. At this time, the vacuum heating plate 822 is maintained at an appropriate temperature (about 100° C.) by the heating heater and the temperature measuring sensor. A heater for heating and a sensor for temperature measurement are provided on the vacuum heating plate 822, and the temperature at which the heater for heating in the control unit etc. heats the vacuum heating plate 822 according to the temperature sensed by the sensor for temperature measurement is the appropriate temperature ( about 100°C), so that the device is stably bonded to the PI Film (2) without defects or the like.

In the present invention, the quartz 855 is in contact with the device to press the device and the PI Film 2 (substrate). When the quartz 855 descends, the device and the PI Film 2 may be pressed while the Teflon tape 7 is in contact with the device. In a state where the bottom of the quartz 855 is in contact with the device (semiconductor device) mounted on the PI Film (2), the device can be bonded to the PI Film (2).

Meanwhile, a silicon block may be provided on the lower surface of the quartz 855 . The silicon block may be attached to the bottom of the quartz 855 by a bonding means such as an adhesive as a plate shape. The silicon block is made of a laser-transmissive material so that the laser that is irradiated from the laser head 812 and has passed through the quartz 855 can be irradiated toward the PI Film (2). For example, the silicon block may be configured in the shape of a transparent or translucent plate through which a laser can pass. The silicon block is made of a material that the laser can pass through, so that the laser passing through the silicon block can be irradiated toward the PI Film (2).

When the silicon block is provided, when the quartz 855 descends, the silicon block comes into contact with the device to perform the device pressure bonding operation on the PI Film (2).

The pressure bonding system of the thermal process system for a flexible display device according to the present invention of the above configuration is a precise and error-free bonding between the PI Film (2) (flexible display film) and the device (mainly a semiconductor device) in order to produce a flexible display device. work is possible, and the precision of the bonding operation to prevent the case where the process yield and efficiency is lowered, etc. can be achieved more reliably.

In addition, in the present invention, the element pressing cam flange 857 is rotated by the element pressing servo motor 856, and the pressing lever 859 connected to the element pressing cam flange 857 is a lifting slider by the lever motion principle. (854) is pressed down to descend, and a quartz 855 is connected to the lifting slider 854, so that when the lifting slider 854 descends, the PI Film (2) (substrate) and the device (semiconductor device) is pressed with an appropriate and uniform force so that the device is laser-bonded to the PI Film (2), so that the quartz 855 is precisely bonded to the plurality of devices on the PI Film (2) to the PI Film (2). can For example, if four elements are placed in a region that can be pressed by the quartz 855, the quartz 855 presses the four elements to be bonded to the PI Film 2, and the quartz 855 presses the four elements. Since the devices are bonded to the PI Film (2) by pressing them with a uniform force, it is possible to precisely bond the devices to the PI Film (2).

In addition, while the pressing lever 859 presses the lifting slider 854 downward by the lever motion principle like a seesaw to descend, the pressure cam follower bearing 859CAB on the upper surface of the bonding pressure plate 854BP on the lifting slider 854 ) is rolled, so that a pressing bonding operation in which the pressing lever 859 pushes the lifting slider 854 downward can be performed more smoothly.

In addition, a vacuum forming hole (824VH) and a plurality of adsorption holes (824SH) are provided in the vacuum heating plate ( 822 ) in the bonding base part ( 820 ), and the PI Film ( 2 ) mounted on the vacuum heating plate ( 822 ) Since the device can be laser-bonded on the PI Film (2) while the (substrate) is stably fixed with vacuum pressure through the vacuum forming hole (824VH) and the adsorption hole (824SH), the PI Film ( It is possible to prevent a case in which the bonding precision of the device is deteriorated due to the flow of 2) and the device, and it is possible to reliably prevent the occurrence of a bonding (bonding) defect of the device.

In the above, specific embodiments of the present invention have been described above. However, the spirit and scope of the present invention is not limited to these specific embodiments, and various modifications and variations are possible within the scope that does not change the gist of the present invention. Anyone who has it will understand.

Therefore, since the embodiments described above are provided to fully inform those of ordinary skill in the art to which the present invention belongs the scope of the invention, it should be understood that they are exemplary in all respects and not limiting, The invention is only defined by the scope of the claims.

2. Flexible Film (PI Film) 3. Device
110. Main Frame 112. Main Base
812. Laser head 820. Bonding base part
822. Vacuum heating plate 824. Vacuum chuck
824VH. Vacuum forming hole 824SH. suction hole
826. Bonding base support block 827. Lower slider
827SF. Lower up-down slope 828. Upper slider
828SF. Upper up-down slope 832. Elevating operation servomotor
833. Lifting action ball screw 834. Lifting action ball nut
835. Insulation material 837. Bonding base support panel
839. Bonding base moving ball screw 841. Bonding base moving ball nut
843. Bonding base movement servomotor 850. Laser bonding pressurization part
851. Camera 852. Slider Body
852LOC. Load cell 852SP. Plunger for lift return
853. Gap adjustment plate 854. Elevating slider
854 BP. Bonding pressure plate 854HD. Quitz Holder
855. Quartz 856. Pressurized servomotor
856BS. Bracket supporter 856BRK. Pressurized Servo Motor Bracket
857. Pressurized cam flange 858. Pressurized hinge bracket
859. Pressure lever 859CAB. Pressurized Cam Follower Bearing
859LH. Long hole 872. Unwinding spool
874. Rewinding roller 876. Feeding guide roller

Claims (8)

Bonding base portion 820 for supporting and supporting the flexible film 2 passing along the transfer line under the laser head 812 installed on the main frame 110;
and a laser bonding pressing unit 850 for pressing the device to be bonded on the flexible film 2 passing between the laser head 812 and the bonding base unit 820;
The laser bonding pressing unit 850,
a slider body 852 disposed under the laser head 812;
a hollow elevating slider 854 mounted to the slider body 852 so as to be elevating;
a quartz 855 mounted on the elevating slider 854;
a pressurized servomotor (856) mounted on the base (724) of the main frame (110);
a pressure cam flange 857 connected to the motor shaft of the pressure servo motor 856;
a pressure hinge bracket (858) mounted to the base (724) of the main frame (110);
A flexible display device comprising a; a pressing lever 859 coupled to the pressing hinge bracket 858 via a hinge part and connected to the pressing cam flange 857 and disposed on the slider body 852; pressure bonding system.
delete delete delete According to claim 1,
A flexible display device pressure bonding system, characterized in that the quartz (855) is coupled to the quartz holder (854HD) provided in the elevating slider (854).
6. The method of claim 5,
A flexible display device pressure bonding system, characterized in that the lower surface of the quartz (855) faces the flexible film (2), and the lower surface of the quartz (855) is composed of a horizontal surface.
7. The method of claim 6,
A flexible display device pressure bonding system, characterized in that a silicon block is provided on the bottom of the quartz (855).
According to claim 1,
The main frame 110 has a flexible display device pressure bonding system, characterized in that further provided with a camera for photographing the position of the flexible film (2) is mounted material.

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