KR960035935A - Die bonding method of semiconductor device - Google Patents
Die bonding method of semiconductor device Download PDFInfo
- Publication number
- KR960035935A KR960035935A KR1019950006165A KR19950006165A KR960035935A KR 960035935 A KR960035935 A KR 960035935A KR 1019950006165 A KR1019950006165 A KR 1019950006165A KR 19950006165 A KR19950006165 A KR 19950006165A KR 960035935 A KR960035935 A KR 960035935A
- Authority
- KR
- South Korea
- Prior art keywords
- die
- adhesive
- semiconductor device
- die bonding
- bonding method
- Prior art date
Links
Abstract
본 발명은 소정의 단위 공정을 거쳐 제조된 IC 칩을 팩키지하기 위하여 리드 프레임이란 구조물의 다이 패드에 접착제를 이용하여 부착시키는 반도체 소자의 다이 본딩 방법에 관한 것으로, 보다 구체적으로는 다이 본딩시 응력을 방지하여 다이 크랙 및 소자의 신뢰성을 확보할 수 있는 반도체 소자의 다이 본딩 방법에 관한 것으로 반도체 소자의 다이 본딩시 접착제를 구비한 다이 부착용 패드 상부에 접착제와 동일한 재질의 볼 스페이서를 접착제 내부에 포함시킴으로써 다이 본딩시 균일한 본드 라인 두께를 얻을 수 있으며, 경화시 접착 용제의 휘발로 인하여 다이가 틸트되는 것을 방지하여, 응력을 최소화할 수 있고, 이후의 팩키지시 소자의 신뢰성을 확보할 수 있으며, 원가 절감 및 IC 제품의 기술을 향상시킬 수 있다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a die bonding method of a semiconductor device in which a lead frame is attached to a die pad of a structure by using an adhesive in order to package an IC chip manufactured through a predetermined unit process. The present invention relates to a die bonding method of a semiconductor device capable of preventing die cracks and device reliability by including a ball spacer of the same material as the adhesive in an upper portion of a die attaching pad having an adhesive during die bonding of the semiconductor device. It is possible to obtain a uniform bond line thickness during die bonding, to prevent the die from tilting due to volatilization of the adhesive solvent during curing, to minimize the stress, and to secure the reliability of the device during the subsequent packaging. Reduce and improve the technology of IC products.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.
제2도는 본 발명의 일 실시예의 다이 본딩 방법을 설명하기 위한 반도체 장치의 요부 단면도, 제4도는 본 발명에 따른 반도체의 수율 및 다이 크랙 발생율을 나타낸 그래프.2 is a sectional view showing main parts of a semiconductor device for explaining a die bonding method according to an embodiment of the present invention, and FIG.
Claims (4)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019950006165A KR960035935A (en) | 1995-03-23 | 1995-03-23 | Die bonding method of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019950006165A KR960035935A (en) | 1995-03-23 | 1995-03-23 | Die bonding method of semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
KR960035935A true KR960035935A (en) | 1996-10-28 |
Family
ID=66553632
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019950006165A KR960035935A (en) | 1995-03-23 | 1995-03-23 | Die bonding method of semiconductor device |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR960035935A (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102325662B1 (en) | 2020-05-07 | 2021-11-12 | (주)에스엔에프 | Laser bonder device pressing system of flexible display device heat process system |
KR102325660B1 (en) | 2020-05-07 | 2021-11-12 | (주)에스엔에프 | Flexible display device heat process system |
KR20210136441A (en) | 2020-05-07 | 2021-11-17 | (주) 에스엔에프 | Flexible display device pressing and bonding system |
KR20210136442A (en) | 2020-05-07 | 2021-11-17 | (주) 에스엔에프 | Flexible display divice bonding table structure |
KR20230068769A (en) | 2021-11-11 | 2023-05-18 | 조아라 | Flexible display detection mark measurement system |
KR20230068767A (en) | 2021-11-11 | 2023-05-18 | 조아라 | Flexible device bonding clean quartz system |
-
1995
- 1995-03-23 KR KR1019950006165A patent/KR960035935A/en not_active Application Discontinuation
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102325662B1 (en) | 2020-05-07 | 2021-11-12 | (주)에스엔에프 | Laser bonder device pressing system of flexible display device heat process system |
KR102325660B1 (en) | 2020-05-07 | 2021-11-12 | (주)에스엔에프 | Flexible display device heat process system |
KR20210136441A (en) | 2020-05-07 | 2021-11-17 | (주) 에스엔에프 | Flexible display device pressing and bonding system |
KR20210136442A (en) | 2020-05-07 | 2021-11-17 | (주) 에스엔에프 | Flexible display divice bonding table structure |
KR20230068769A (en) | 2021-11-11 | 2023-05-18 | 조아라 | Flexible display detection mark measurement system |
KR20230068767A (en) | 2021-11-11 | 2023-05-18 | 조아라 | Flexible device bonding clean quartz system |
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Legal Events
Date | Code | Title | Description |
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A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E601 | Decision to refuse application |