KR960035935A - Die bonding method of semiconductor device - Google Patents

Die bonding method of semiconductor device Download PDF

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Publication number
KR960035935A
KR960035935A KR1019950006165A KR19950006165A KR960035935A KR 960035935 A KR960035935 A KR 960035935A KR 1019950006165 A KR1019950006165 A KR 1019950006165A KR 19950006165 A KR19950006165 A KR 19950006165A KR 960035935 A KR960035935 A KR 960035935A
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KR
South Korea
Prior art keywords
die
adhesive
semiconductor device
die bonding
bonding method
Prior art date
Application number
KR1019950006165A
Other languages
Korean (ko)
Inventor
김태마
김용환
Original Assignee
릭. 헬싱
한국시그네틱스 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 릭. 헬싱, 한국시그네틱스 주식회사 filed Critical 릭. 헬싱
Priority to KR1019950006165A priority Critical patent/KR960035935A/en
Publication of KR960035935A publication Critical patent/KR960035935A/en

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Abstract

본 발명은 소정의 단위 공정을 거쳐 제조된 IC 칩을 팩키지하기 위하여 리드 프레임이란 구조물의 다이 패드에 접착제를 이용하여 부착시키는 반도체 소자의 다이 본딩 방법에 관한 것으로, 보다 구체적으로는 다이 본딩시 응력을 방지하여 다이 크랙 및 소자의 신뢰성을 확보할 수 있는 반도체 소자의 다이 본딩 방법에 관한 것으로 반도체 소자의 다이 본딩시 접착제를 구비한 다이 부착용 패드 상부에 접착제와 동일한 재질의 볼 스페이서를 접착제 내부에 포함시킴으로써 다이 본딩시 균일한 본드 라인 두께를 얻을 수 있으며, 경화시 접착 용제의 휘발로 인하여 다이가 틸트되는 것을 방지하여, 응력을 최소화할 수 있고, 이후의 팩키지시 소자의 신뢰성을 확보할 수 있으며, 원가 절감 및 IC 제품의 기술을 향상시킬 수 있다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a die bonding method of a semiconductor device in which a lead frame is attached to a die pad of a structure by using an adhesive in order to package an IC chip manufactured through a predetermined unit process. The present invention relates to a die bonding method of a semiconductor device capable of preventing die cracks and device reliability by including a ball spacer of the same material as the adhesive in an upper portion of a die attaching pad having an adhesive during die bonding of the semiconductor device. It is possible to obtain a uniform bond line thickness during die bonding, to prevent the die from tilting due to volatilization of the adhesive solvent during curing, to minimize the stress, and to secure the reliability of the device during the subsequent packaging. Reduce and improve the technology of IC products.

Description

반도체 소자의 다이 본딩 방법Die bonding method of semiconductor device

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.

제2도는 본 발명의 일 실시예의 다이 본딩 방법을 설명하기 위한 반도체 장치의 요부 단면도, 제4도는 본 발명에 따른 반도체의 수율 및 다이 크랙 발생율을 나타낸 그래프.2 is a sectional view showing main parts of a semiconductor device for explaining a die bonding method according to an embodiment of the present invention, and FIG.

Claims (4)

리드 프레임의 다이 부착용 패드 상부에 접착제를 도포한 후, 이에 다이를 부착시키는 반도체 소자의 다이 본딩 방법에 있어서, 상기 다이 부착용 패드 상부에 볼 스페이서를 포함한 에폭시 수지를 접착제로하여 도포한 다음, 상기 다이를 에폭시 수지 상부에 얹고, 경화하여 다이와 다이 부착용 패드간의 일정한 본드 라인 두께를 유지하는 것을 특징으로 하는 반도체 소자의 다이 본딩 방법.In a die bonding method of a semiconductor device in which an adhesive is applied to an upper portion of a die attach pad of a lead frame, and then a die is attached thereto, an epoxy resin including a ball spacer is coated on the die attaching pad as an adhesive, and then the die is applied. Is placed on top of an epoxy resin and cured to maintain a constant bond line thickness between the die and the pad for attaching the die. 제1항에 있어서, 상기 볼 스페이서는 상기 접착제의 주요 구성 물질과 동일하게 이루어진 것을 특징으로 하는 반도체 소자의 다이 본딩 방법.The method of claim 1, wherein the ball spacer is made of the same material as the main constituent of the adhesive. 제2항에 있어서, 상기 볼 스페이서 및 접착제는 실버 볼을 포함한 에폭시 물질인 것을 특징으로 하는 반도체 소자의 다이 본딩 방법.The method of claim 2, wherein the ball spacer and the adhesive are epoxy materials including silver balls. 제1항 내지 제3항 중 어느 한 항에 있어서, 상기 볼 스페이서의 직경은 원하는 본드 라인 두께에 따라 임의로 조정할 수 있는 것을 특징으로 하는 반도체 소자의 다이 본딩 방법.The die bonding method of any one of claims 1 to 3, wherein a diameter of the ball spacer can be arbitrarily adjusted according to a desired bond line thickness. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019950006165A 1995-03-23 1995-03-23 Die bonding method of semiconductor device KR960035935A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019950006165A KR960035935A (en) 1995-03-23 1995-03-23 Die bonding method of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019950006165A KR960035935A (en) 1995-03-23 1995-03-23 Die bonding method of semiconductor device

Publications (1)

Publication Number Publication Date
KR960035935A true KR960035935A (en) 1996-10-28

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KR1019950006165A KR960035935A (en) 1995-03-23 1995-03-23 Die bonding method of semiconductor device

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KR (1) KR960035935A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102325662B1 (en) 2020-05-07 2021-11-12 (주)에스엔에프 Laser bonder device pressing system of flexible display device heat process system
KR102325660B1 (en) 2020-05-07 2021-11-12 (주)에스엔에프 Flexible display device heat process system
KR20210136441A (en) 2020-05-07 2021-11-17 (주) 에스엔에프 Flexible display device pressing and bonding system
KR20210136442A (en) 2020-05-07 2021-11-17 (주) 에스엔에프 Flexible display divice bonding table structure
KR20230068769A (en) 2021-11-11 2023-05-18 조아라 Flexible display detection mark measurement system
KR20230068767A (en) 2021-11-11 2023-05-18 조아라 Flexible device bonding clean quartz system

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102325662B1 (en) 2020-05-07 2021-11-12 (주)에스엔에프 Laser bonder device pressing system of flexible display device heat process system
KR102325660B1 (en) 2020-05-07 2021-11-12 (주)에스엔에프 Flexible display device heat process system
KR20210136441A (en) 2020-05-07 2021-11-17 (주) 에스엔에프 Flexible display device pressing and bonding system
KR20210136442A (en) 2020-05-07 2021-11-17 (주) 에스엔에프 Flexible display divice bonding table structure
KR20230068769A (en) 2021-11-11 2023-05-18 조아라 Flexible display detection mark measurement system
KR20230068767A (en) 2021-11-11 2023-05-18 조아라 Flexible device bonding clean quartz system

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