KR102374529B1 - Light emitting diode package and method for manufacturing the same, backlight unit and liquid crystal display device using the same - Google Patents

Abstract

The present invention provides a light emitting diode package having a wide light directivity angle, wherein the light emitting diode package according to the present invention includes an encapsulation layer for encapsulating a light emitting diode chip connected to first and second lead electrodes, the long side of the encapsulation layer And at least one side of the short side may be exposed to the outside.

Description

Light emitting diode package, manufacturing method thereof, and backlight unit and liquid crystal display using same

The present invention relates to a liquid crystal display device, and more particularly, to a light emitting diode package, a manufacturing method thereof, and a backlight unit and liquid crystal display device using the same.

A general liquid crystal display displays an image by using a thin film transistor as a switching element. Such a liquid crystal display device is widely used as a display device for a notebook computer, a tablet computer, a smart phone, a portable display device, a portable information device, etc. in addition to a display device for a television or a monitor. Since such a liquid crystal display is not a self-emission method, an image is displayed using light irradiated from a backlight unit disposed below the liquid crystal display panel.

Recently, a backlight unit using a light emitting diode (LED), which has a long lifespan, low power consumption, and can be miniaturized, has been developed as a light source, and such a backlight unit is being applied from a small liquid crystal display to a large liquid crystal display.

The backlight unit is divided into a direct type and an edge type according to the arrangement position of the light source. Recently, the edge type backlight unit has been widely applied to slim the liquid crystal display device.

1 is a cross-sectional view schematically illustrating a general edge-type backlight unit.

Referring to FIG. 1 , a typical edge type backlight unit includes a light guide plate 10 having a light incident part 12 , and a light emitting diode array 20 .

The light guide plate 10 internally refracts and reflects the light incident from the light emitting diode array 20 through the planar light incident part 12 provided on one side to emit it in the upper surface direction.

The light emitting diode array 20 is disposed on one side of the light guide plate 10 to face the light incident part 12 of the light guide plate 10 . The light emitting diode array 20 includes a plurality of light emitting diode packages 22 arranged at regular intervals.

Each of the plurality of light emitting diode packages 22 irradiates light to the light incident portion 12 of the light guide plate 10 by emitting light through a light emitting surface facing the light incident portion 12 of the light guide plate 10 .

In such a general edge-type backlight unit, a dark portion is generated in the light incident portion 12 of the light guide plate 10 corresponding to the space between the plurality of light emitting diode packages 22 according to the pitch between the plurality of light emitting diode packages 22 . This causes a hot spot phenomenon. Here, in the hot spot phenomenon, as the light directing angle of each of the plurality of light emitting diode packages 22 is limited to a specific angle, as shown in FIG. 2 , the light incident part 12 of the light guide plate 10 . This is a phenomenon in which a relatively bright area LA and a relatively dark area DA are generated.

Such a hot spot phenomenon can be improved by separating the distance between the light incident part 12 of the light guide plate 10 and the light emitting diode package 22 by the optical distance OL corresponding to the area where the hot spot is generated. . However, if the hot spot phenomenon is improved by increasing the optical distance OL, there is a problem in that the bezel width of the light incident part of the backlight unit increases.

The present invention has been devised to solve the above-described problems, and an object of the present invention is to provide a light emitting diode package having a wide light directivity angle and a method for manufacturing the same.

Another technical object of the present invention is to provide a light emitting diode package capable of minimizing a hot spot phenomenon, a manufacturing method thereof, and a backlight unit and liquid crystal display using the same.

The light emitting diode package according to the present invention for achieving the above technical problem includes an encapsulation layer for encapsulating the light emitting diode chip connected to the first and second lead electrodes, and at least one side of the long side and the short side of the encapsulation layer is exposed to the outside. may be exposed.

In a method for manufacturing a light emitting diode package according to the present invention for achieving the above-described technical problem, a mold frame surrounding each side of the first and second lead electrodes is formed, and at least one light emitting diode chip is connected to the first and second leads After being electrically connected to the electrode, the mold frame may be cut so that at least one of a long side and a short side of the next encapsulation layer forming an encapsulation layer encapsulating the light emitting diode chip is exposed to the outside.

A backlight unit and a liquid crystal display including the same according to the present invention for achieving the above technical problem include a light emitting diode package, wherein the light emitting diode package includes an encapsulation layer for encapsulating the light emitting diode chips connected to first and second lead electrodes Including, at least one side of the long side and the short side of the encapsulation layer may be exposed to the outside.

According to the means for solving the above problems, the present invention has the following effects.

First, the light beam angle of the light emitting diode package may be widened through the three- or five-surface light emitting structure.

Second, it is possible to minimize the hot spot phenomenon occurring in the light incident portion of the light guide plate due to the wide light directivity angle of each of the plurality of light emitting diode packages.

In addition to the effects of the present invention mentioned above, other features and advantages of the present invention will be described below or will be clearly understood by those of ordinary skill in the art from such description and description.

1 is a cross-sectional view schematically illustrating a general edge-type backlight unit.
2 is a diagram for explaining a hot spot phenomenon occurring in a general edge-type backlight unit.
3 is a perspective view illustrating a light emitting diode package according to a first example of the present invention.
FIG. 4 is a cross-sectional view taken along line I-I' shown in FIG. 3 .
FIG. 5 is a cross-sectional view taken along the line II-II' shown in FIG. 3 .
6 is a view showing a light emitting direction from three surfaces of the light emitting diode package according to the first example of the present invention.
7A to 7F are process diagrams for explaining step by step a method of manufacturing a light emitting diode package according to a first example of the present invention.
8 is a perspective view illustrating a light emitting diode package according to a second example of the present invention.
9 is a cross-sectional view taken along line III-III' shown in FIG. 8 .
Fig. 10 is another cross-sectional view taken along the line II' shown in Fig. 3;
11 is another cross-sectional view taken along the line II-II' shown in FIG. 3 .
12 is a perspective view illustrating a light emitting diode package according to a third example of the present invention.
Fig. 13 is a cross-sectional view taken along line IV-IV' shown in Fig. 12;
14 is a perspective view illustrating a light emitting diode package according to a fourth example of the present invention.
FIG. 15 is a cross-sectional view taken along the line V-V' shown in FIG. 14;
16 is a view illustrating a light output direction from five surfaces of a light emitting diode package according to a fourth example of the present invention.
17A to 17F are process diagrams for explaining step by step a method of manufacturing a light emitting diode package according to a fourth example of the present invention.
18 is a cross-sectional view illustrating a partial cross-section of a backlight unit according to an embodiment of the present invention.
19 is a perspective view illustrating the light emitting diode array and the light guide plate shown in FIG. 18 .
20 is a cross-sectional view taken along the line VI-VI' shown in FIG. 18;
21 is a view showing the luminance of a light incident portion of a light guide plate in the backlight unit of the present invention.
22 is a perspective view schematically illustrating a liquid crystal display according to an embodiment of the present invention.
23 is a cross-sectional view taken along line VII-VII' shown in FIG. 22;

The meaning of the terms described in this specification should be understood as follows.

The singular expression is to be understood as including the plural expression unless the context clearly defines otherwise, and the terms "first", "second", etc. are used to distinguish one element from another, The scope of rights should not be limited by these terms. It should be understood that terms such as “comprise” or “have” do not preclude the possibility of addition or existence of one or more other features or numbers, steps, operations, components, parts, or combinations thereof. The term “at least one” should be understood to include all possible combinations from one or more related items. For example, the meaning of “at least one of the first, second, and third items” means that each of the first, second, or third items as well as two of the first, second and third items It means a combination of all items that can be presented from more than one. The term “on” is meant to include not only cases in which a certain component is formed directly above another component, but also a case in which a third component is interposed between these components.

Hereinafter, a light emitting diode package, a manufacturing method thereof, and preferred examples of a backlight unit and a liquid crystal display using the same according to the present invention will be described in detail with reference to the accompanying drawings. In adding reference numerals to components of each drawing, the same components may have the same reference numerals as much as possible even though they are indicated in different drawings. In addition, in describing the present invention, if it is determined that a detailed description of a related known configuration or function may obscure the gist of the present invention, the detailed description may be omitted.

3 is a perspective view for explaining a light emitting diode package according to a first example of the present invention, FIG. 4 is a cross-sectional view taken along line II' shown in FIG. 3, and FIG. 5 is a line II-II shown in FIG. ' is a cross-sectional view of

3 to 5 , the light emitting diode package 100 according to the first example of the present invention includes first and second lead electrodes 110 and 120 , and a mold frame 130 . , a light emitting diode chip 140 , and an encapsulation layer 150 .

The first lead electrode 110 may be formed of a metal plate having a constant thickness. For example, the first lead electrode 110 may be formed of at least one of copper (Cu), silver (Ag), gold (Au), platinum (Pt), and nickel (Ni), or an alloy material thereof. can The first lead electrode 110 may be electrically connected to the anode electrode of the light emitting diode chip 140 .

The second lead electrode 120 is arranged to be parallel to the first lead electrode 110 and spaced apart from each other by a predetermined interval, and may be made of the same thickness and the same material as that of the first lead electrode 110 . However, the second lead electrode 120 may have a size different from that of the first lead electrode 110 . For example, the second lead electrode 120 may be formed to have a smaller size than the first lead electrode 110 . The second lead electrode 120 may be electrically connected to the cathode electrode of the light emitting diode chip 140 .

The mold frame 130 supports the first and second lead electrodes 110 and 120 and is made of a plastic material, for example, polyphthalamide (PPA), epoxy molding compound (EMC), or polycyclohexylenedimethyleneterephthalate (PCT). can

The mold frame 130 is formed to surround each side of the first and second lead electrodes 110 and 120 by an insert injection method using a mold, and is integrated with the first and second lead electrodes 110 and 120. do. The mold frame 130 according to an example includes a bottom portion 132 and a pair of long side walls 134a and 134b.

The bottom portion 132 surrounds each side of the first and second lead electrodes 110 and 120 . That is, the bottom 132 surrounds each side of the first and second lead electrodes 110 and 120 so that the lower and upper surfaces of the first and second lead electrodes 110 and 120 are exposed to the outside, respectively. That is, the short side edge portion of the bottom portion 132 is formed with the first and second lead electrodes 110 and 120 so that the short side surfaces 110a and 120a of each of the first and second lead electrodes 110 and 120 are not exposed to the outside. , 120) cover each of the short side surfaces 110a, 120a, respectively. To this end, the bottom portion 132 is formed to have a size wider than that of the first and second lead electrodes 110 and 120 arranged in parallel with each other, and is formed between the first and second lead electrodes 110 and 120 . By wrapping each side of each of the first and second lead electrodes 110 and 120 as well as space, each of the short side surfaces 110a and 120a of each of the first and second lead electrodes 110 and 120 is not exposed to the outside. do.

The pair of long side walls 134a and 134b are provided in parallel with each other to have a predetermined height at the long side edge of the bottom part 132 . The pair of long sidewalls 134a and 134b may cover upper edge portions of the adjacent first and second lead electrodes 110 and 120, respectively.

Each of the pair of long sidewalls 134a and 134b may be inclined at an obtuse angle θ from the top surface of the first lead electrode 110 to have a larger area from the top to the bottom. Each of the pair of long sidewalls 134a and 134b covers the long side of the encapsulation layer 150 , thereby limiting the long side light beam angle of the light emitting diode package 100 . As an example, when the light emitting diode package 100 has a side view structure, the pair of long side walls 134a and 134b set the light beam angle in the vertical direction (Z) of the light emitting diode package 100 . limited to less than an angle. As another example, when the light emitting diode package 100 has a top view structure, the pair of long sidewalls 134a and 134b have a light beam direction in the short side longitudinal direction Y of the light emitting diode package 100 . It is limited to less than the set angle.

On the other hand, the mold frame 130 further includes a pair of short side walls (not shown) provided in parallel with each other to have a predetermined height on the short edge portion of the bottom portion 132, but the pair of short side walls The light emitting diode package 100 is removed from the mold frame 130 according to a cutting process to be described later to extend the light emitting angle, thereby exposing the short sides 151 and 152 of the encapsulation layer 150 to the outside. .

Each of the short side surfaces 110a and 120a of each of the first and second lead electrodes 110 and 120 may be exposed to the outside of the short side surfaces SS1 and SS2 of the bottom part 132 of the mold frame 130 . In this case, each of the first and second lead electrodes 110 and 120 is cut together with the short side wall of the mold frame 130 during the cutting process, and light is emitted by fragments of the lead electrodes 110 and 120 generated at this time. The short sides 151 and 152 of the encapsulation layer 150 may be contaminated, which makes it difficult to secure the light emitting efficiency of the light emitting diode package 100 and the reproducibility of the sidewall light emission, and the mold frame 130 may be torn from the side. can occur. Accordingly, each of the first and second lead electrodes 110 and 120 according to the present invention does not overlap the frame cutting line CL of the cutting process, and each of the first and second lead electrodes 110 and 120 Each of the short side surfaces 110a and 120a is spaced apart from the frame cutting line CL by a set distance D. As shown in FIG. Therefore, in the cutting process according to the present invention, since the lead electrodes 110 and 120 made of a metal material other than the mold frame 130 are not cut, fragments of the lead electrodes 110 and 120 are not generated and the encapsulation layer 150 emits light. Since the short sides 151 and 152 of the light emitting diode package 100 are not contaminated, the light emitting efficiency of the light emitting diode package 100 and the reproducibility of the sidewall light emission can be secured, and the mold frame 130 from being torn from the side can be prevented.

The light emitting diode chip 140 is electrically connected to the first and second lead electrodes 110 and 120 , and emits light by emitting light according to the driving power supplied from the first and second lead electrodes 110 and 120 . do. For example, the light emitting diode chip 140 may be a blue light emitting diode chip emitting blue light.

The light emitting diode chip 140 is directly attached to the upper surface of the first lead electrode 110 by a die bonding process, and then by a wire bonding process using wires 142 and 144. It is electrically connected to the first and second lead electrodes 110 and 120 . That is, the light emitting diode chip 140 includes an anode terminal (not shown) and a cathode terminal (not shown), and the anode terminal is electrically connected to the first lead electrode 110 through the first wire 142 and , the cathode terminal is electrically connected to the second lead electrode 120 through the second wire 144 . Since the light emitting diode chip 140 is directly attached to the first lead electrode 110 by a die bonding process, the present invention can improve the adhesion of the light emitting diode chip 140 and improve the structure of the mold frame 130 . can be simplified.

Each of the first and second wires 142 and 144 may include a conductive material having excellent electrical conductivity, such as gold (Au), silver (Ag), or copper (Cu) material.

The encapsulation layer 150 is filled in an encapsulation space provided by a pair of long sidewalls 134a and 134b and a pair of short sidewalls of the mold frame 130 to encapsulate the light emitting diode chip 140 . The encapsulation layer 150 may be formed of a mixed material of an encapsulation material and a fluorescent material. The fluorescent material may be a yellow fluorescent material, but is not limited thereto, and may be one or more color fluorescent materials for generating white light according to the color light emitted from the light emitting diode chip 140 . It is assumed that it is a yellow fluorescent material. The fluorescent material absorbs a portion of blue light emitted from the light emitting diode chip 140 and emits yellow light. Accordingly, in the encapsulation layer 150 , white light is generated by mixing the blue light emitted from the light emitting diode chip 140 and the yellow light emitted by the fluorescent material to be emitted to the outside.

The long side of the encapsulation layer 150 is surrounded by a pair of long side walls 134a and 134b of the mold frame 130 and is not exposed to the outside of the long side surfaces LS1 and LS2 of the mold frame 130 . In contrast, the short sides 151 and 152 of the encapsulation layer 150 are not surrounded by the pair of short side walls of the mold frame 130 as the pair of short side walls of the mold frame 130 are removed by the cutting process. and exposed to the outside. Accordingly, as shown in FIG. 6 , the light generated by the light emitting diode chip 140 , not only in the front direction FD of the encapsulation layer 150 , but also in the short side direction SSD1 of the encapsulation layer 150 . , SSD2) as well.

As described above, in the light emitting diode package 100 according to the first example of the present invention, as the short sides 151 and 152 of the encapsulation layer 150 are exposed to the outside, the front direction FD and the short side direction of the encapsulation layer 150 . By emitting light in the three-plane direction including (SSD1, SSD2), it has a wide light directivity angle.

7A to 7F are process diagrams for explaining step by step a method of manufacturing a light emitting diode package according to a first example of the present invention, which is a cross-sectional view taken along line I-I' and line II-II' shown in FIG. 3 .

A method of manufacturing a light emitting diode package according to a first example of the present invention will be described in stages with reference to FIGS. 7A to 7F .

First, as shown in FIG. 7A , first and second lead electrodes 110 and 120 having a planar polygonal shape are disposed to be parallel to each other and spaced apart from each other at regular intervals. For example, the first and second lead electrodes 110 and 120 may be disposed side by side in the first horizontal direction (X).

Then, as shown in FIG. 7B , a mold frame 130 is formed to surround each side of the first and second lead electrodes 110 and 120 . For example, the mold frame 130 is formed to surround each side of the first and second lead electrodes 110 and 120 by an insert injection method using a mold, so that the first and second lead electrodes 110, 120 , and the bottom 132 surrounding each side of the first and second lead electrodes 110 and 120 , and long sides 134a and 134b formed at a constant height at the edge of the bottom 132 . ) and short side walls 134c and 134d. Accordingly, a concave portion 136 surrounded by a pair of long sides 134a and 134b and a pair of short side walls 134c and 134d is provided on the bottom portion 132 , and a pair of long sides 134a is provided on the bottom portion 132 . , 134b) and the pair of short side walls 134c and 134d may each have an inclined surface that is inclined so that the cross-sectional area of the concave portion 136 is gradually decreased from the upper portion to the bottom portion 132 . In addition, each of the short side surfaces 110a and 120a of the first and second lead electrodes 110 and 120 is formed from the frame cutting line CL so as not to overlap the frame cutting line CL, which will be described later. They are spaced apart by a predetermined interval (D) toward the middle of the long side in the longitudinal direction.

Then, as shown in FIG. 7C , the light emitting diode chip 140 is electrically connected to the first and second lead electrodes 110 and 120 . For example, the light emitting diode chip 140 is directly attached to the upper surface of the first lead electrode 110 by a die bonding process, and then is subjected to a wire bonding process using the first and second wires 142 and 144 . may be electrically connected to the first and second lead electrodes 110 and 120 by the

Then, as shown in FIG. 7D , an encapsulation layer 150 encapsulating at least the light emitting diode chip 140 is formed by applying and curing an encapsulation material to the recess 136 provided in the mold frame 130 . Here, the encapsulation layer 150 may be formed of a mixed material of an encapsulation material and a fluorescent material.

Then, as shown in FIGS. 7E and 7F , the short side walls 134c and 134d of the mold frame 130 are cut so that the short sides 151 and 152 of the encapsulation layer 150 are exposed to the outside. For example, the short side walls 134c and 134d and the bottom of the mold frame 130 along the frame cutting line CL set on the short side walls 134c and 134d of the mold frame 130 through a cutting process using a cutting wheel. The short sides 151 and 152 of the encapsulation layer 150 may be exposed to the outside by cutting the portion 132 . Here, as a part of the bottom part 132 overlapping the short side walls 134c and 134d and the short side walls 134c and 134d of the mold frame 130 is removed, the first and second lead electrodes 110 and 120, respectively Each of the short side surfaces 110a and 120a is wrapped by the remaining bottom part 132 that is not removed by the cutting process and is not exposed to the outside. In particular, since the short side surfaces 110a and 120a of each of the first and second lead electrodes 110 and 120 are spaced apart from the frame cutting line CL by a set distance D and do not overlap the frame cutting line CL. In the cutting process, only the mold frame 130 is cut. As a result, the problem of contamination of the encapsulation layer 150 due to debris generated when the lead electrodes 110 and 120 is cut does not occur, and the side surface of the mold frame 130 does not occur. No tearing occurs.

The cutting process is performed only on the short side walls 134c and 134d of the mold frame 130 , so that the long side of the encapsulation layer 150 is surrounded by the long side walls 134a and 134b of the mold frame 130 to the outside. not exposed as

As described above, in the method of manufacturing a light emitting diode package according to the first example of the present invention, the short sides 151 and 152 of the encapsulation layer 150 are exposed to the outside by cutting the short side walls 134c and 134d of the mold frame 130 . By doing this, the light emitted from the light emitting diode chip 140 is emitted in three directions including the front direction and the short side direction of the encapsulation layer 150 , so that the light beam angle of the light emitting diode package can be widened.

8 is a perspective view illustrating a light emitting diode package according to a second example of the present invention, and FIG. 9 is a cross-sectional view taken along line III-III' shown in FIG. 8, which is a light emitting diode package according to the second example of the present invention. It is constructed by changing the structure of the mold frame in Accordingly, in the following description, only the mold frame and related components will be described, and the same reference numerals as those of FIGS. 3 and 4 will be assigned to the remaining components, and a redundant description thereof will be omitted. And, a cross-sectional view taken along the line II-II' shown in FIG. 8 is shown in FIG. 5 .

5, 8 and 9, the mold frame 130 according to another example has a bottom portion 132, a pair of long side walls 134a and 134b, and a pair of short side walls 134c and 134d. includes

Since each of the bottom portion 132 and the pair of long side walls 134a and 134b is the same as described above, a redundant description thereof will be omitted.

Each of the pair of short side walls 134c and 134d is provided parallel to each other at both ends of the short side of the bottom part 132 so as to have a height lower than that of the pair of long side walls 134a and 134b. In this case, each of the pair of short side walls 134c and 134d may include an inclined surface 134s inclined at an obtuse angle from the upper surface of the first lead electrode 110 to have a larger area from the top to the bottom. The inclined surface 134s reflects the light incident from the light emitting diode chip 140 and the encapsulation layer 150 in the front direction Z of the encapsulation layer 150, thereby forming a short side surface SS1 of the encapsulation layer 150; SS2), the amount of light emitted in the front direction Z of the encapsulation layer 150 is increased instead of decreasing.

The inclined surfaces 134s of each of the pair of short side walls 134c and 134d are formed by a cutting process based on the frame cutting line CL, so that the lower side of the short side of the encapsulation layer 150 except the upper side of the short side of the encapsulation layer 150 . covers the bay In this case, the frame cutting line CL is formed by a distance D set from the short side surfaces 110a and 120a of each of the first and second lead electrodes 110 and 120 so that the upper portion of the short side of the encapsulation layer 150 is exposed to the outside. While being spaced apart, they may overlap the inclined surfaces 134s of the pair of short side walls 134c and 134d. When the cutting process for the mold frame 130 is performed along the frame cutting line CL, the upper portions of the short side walls 134c and 134d of the mold frame 130 are removed by the cutting process, thereby encapsulating the encapsulation layer 150 . While the upper portion of the short side of the mold frame 130 is exposed to the outside, the lower portions of the short side walls 134c and 134d of the mold frame 130 are not removed by the cutting process. (134c, 134d).

As described above, the light emitting diode package 200 according to the second example of the present invention has a three-sided direction including the front direction and the short side direction of the encapsulation layer 150 compared to the light emitting diode package 100 according to the first example of the present invention. As a result, the light beam angle is slightly reduced, but the amount of light emitted in the front direction Z of the encapsulation layer 150 may be increased.

Additionally, in the light emitting diode packages according to the first and second examples described above, although it has been described that the light emitting diode chip 140 is directly die-bonded to the upper surface of the first lead electrode 110 , the present invention is not limited thereto, and the light emitting diodes are not limited thereto. The chip 140 may be positioned on the first lead electrode 110 and die-bonded to the bottom 140 of the mold frame 130 . In this case, the light emitting diode chip 140 and the lead electrodes 110 and 120 . ) can increase the insulation between To this end, the bottom 132 of the mold frame 130 may include a side bottom 132a and an upper bottom 132b as shown in FIGS. 10 and 11 .

The side bottom portion 132a is formed to have a size wider than that of the first and second lead electrodes 110 and 120 disposed in parallel with each other, so that the space between the first and second lead electrodes 110 and 120 as well as the space between the first and second lead electrodes 110 and 120 is wider. Rather, each of the first and second lead electrodes 110 and 120 is wrapped around each side so that each of the short side surfaces 110a and 120a of each of the first and second lead electrodes 110 and 120 is not exposed to the outside.

The top bottom part 132b covers the entire top surface of each of the first and second lead electrodes 110 and 120 except for a part of the top surface of the first lead electrode 110 and a part of the top surface of the second lead electrode 120 . and a first electrode exposure hole H1 exposing a portion of the top surface of the first lead electrode 110 and a second electrode exposure hole H2 exposing a portion of the top surface of the second lead electrode 120 . .

The light emitting diode chip 140 is directly die-bonded to the top surface of the top bottom part 132b overlapping the first lead electrode 110 , and then through the first wire 142 through the first electrode exposure hole H1 . ) and a part of the second lead electrode 120 exposed by the second electrode exposure hole H2 through the second wire 144 and electrically connected to the part electrically connected.

12 is a perspective view for explaining a light emitting diode package according to a third example of the present invention, and FIG. 13 is a cross-sectional view taken along the line IV-IV' shown in FIG. is composed of two light emitting diode chips. Accordingly, in the following description, only the light emitting diode chip and related components will be described, and the same reference numerals as those of FIGS. 3 and 4 will be assigned to the remaining components, and redundant description thereof will be omitted. And, a cross-sectional view taken along the line II-II' shown in FIG. 12 is shown in FIG. 5 .

First, the light emitting diode package 300 according to the third example of the present invention may include first and second light emitting diode chips 140a and 140b.

After the first light emitting diode chip 140a is directly attached to the upper surface of the first lead electrode 110 by a die bonding process, the first lead electrode 110 through the first wire 142 according to the wire bonding process. ) and electrically connected to the second lead electrode 120 through the second wire 144 .

The second light emitting diode chip 140b is directly attached to the upper surface of the second lead electrode 120 by a die bonding process, and then the first lead electrode 110 through a third wire 146 according to a wire bonding process. ) and electrically connected to the second lead electrode 120 through the fourth wire 148 .

The first lead electrode 110 may have a larger area than the second lead electrode 120 , or the first and second lead electrodes 110 and 120 may have the same area as each other.

The pitch P between the first and second light emitting diode chips 140a and 140b is the height SH of the short sides 151 and 152 of the encapsulation layer 150 exposed to the outside and the desired height of the light emitting diode package 300 . It can be set according to the side light intensity ratio. That is, the side light intensity ratio of the light emitting diode package 300 may vary according to the pitch P between the first and second light emitting diode chips 140a and 140b. For example, the side light intensity ratio of the light emitting diode package 300 may increase as the pitch P between the first and second light emitting diode chips 140a and 140b increases.

As described above, the light emitting diode package 300 according to the third example of the present invention includes two light emitting diode chips 140a and 140b, so that it is relatively compared to the light emitting diode packages 100 and 200 shown in FIGS. 3 to 11 . The side light quantity ratio may be increased, and the front light quantity ratio and the side light quantity ratio may be optimized to a desired ratio by the pitch P between the first and second light emitting diode chips 140a and 140b.

14 is a perspective view for explaining a light emitting diode package according to a fourth example of the present invention, and FIG. 15 is a cross-sectional view taken along the line V-V' shown in FIG. 14, which is a light emitting diode package according to the first example of the present invention. It is constructed by additionally removing the short side wall of the mold frame. Accordingly, in the following description, only the mold frame and related components will be described, and the same reference numerals as those of FIGS. 3 and 4 will be assigned to the remaining components, and a redundant description thereof will be omitted. And, a cross-sectional view taken along the line I-I' shown in FIG. 14 is shown in FIG. 4 .

4, 14 and 15 , in the light emitting diode package 400 according to the fourth example of the present invention, the mold frame 130 includes only the bottom part 132 .

The bottom portion 132 surrounds each side of the first and second lead electrodes 110 and 120 . That is, the bottom 132 surrounds each side of the first and second lead electrodes 110 and 120 so that the lower and upper surfaces of the first and second lead electrodes 110 and 120 are exposed to the outside, respectively. That is, the short side edge portion of the bottom portion 132 is formed with the first and second lead electrodes 110 and 120 so that the short side surfaces 110a and 120a of each of the first and second lead electrodes 110 and 120 are not exposed to the outside. , 120) cover each of the short side surfaces 110a, 120a, respectively. In addition, the long side edge portion of the bottom portion 132 has the first lead electrode 110 so that the long side surface 110b of the first lead electrode 110 and the long side surface of the second lead electrode 120 are not exposed to the outside, respectively. ) wraps the long side 110b and the long side of the second lead electrode 120 . To this end, the bottom portion 132 is formed to have a size wider than that of the first and second lead electrodes 110 and 120 arranged in parallel with each other, and is formed between the first and second lead electrodes 110 and 120 . Each of the short side surfaces 110a and 120a of each of the first and second lead electrodes 110 and 120 and the first lead electrode ( The long side 110b of 110 and the long side of the second lead electrode 120 are not exposed to the outside.

On the other hand, the mold frame 130 has a pair of long side walls (not shown) provided in parallel with each other to have a predetermined height on the long edge of the bottom part 132 and side by side to have a predetermined height on the short edge of the bottom part 132 . The above-mentioned mold further includes a pair of short side walls (not shown) provided to make the mold, but each of the pair of long side walls and the pair of short side walls is performed along the frame cutting line CL set in the mold frame 130 . It is removed from the mold frame 130 by the cutting process of the frame 130 , so that the encapsulation layer 150 has both the short sides 151 and 152 and the long sides 153 and 154 not covered by the mold frame 130 . and exposed to the outside.

The frame cutting line CL is a distance set from each side surface 110a, 110b, and 120a of the first and second lead electrodes 110 and 120 so as not to overlap the first and second lead electrodes 110 and 120, respectively. (D) is set to be spaced apart. Accordingly, in the cutting process of the mold frame 130 , since the lead electrodes 110 and 120 made of a metal material other than the mold frame 130 are not cut, fragments of the lead electrodes 110 and 120 are not generated, so that light-emitting encapsulation Since each side 151 , 152 , 153 , and 154 of the layer 150 is not contaminated, the light emitting efficiency of the light emitting diode package 100 and the reproducibility of the sidewall light emission can be secured, and the mold frame 130 is prevented from tearing the side. can be prevented.

As described above, in the light emitting diode package 400 according to the fourth example of the present invention, as shown in FIG. 16 , each side of the encapsulation layer 150 , that is, short sides 151 and 152 and long sides 153 and 154 . As all of these are exposed to the outside, light is emitted in five directions including the front direction FD, the short side directions SSD1 and SSD2, and the long side directions LSD1 and LSD2 of the encapsulation layer 150, thereby directing a wider light. have an angle

17A to 17F are process diagrams for explaining step by step a method of manufacturing a light emitting diode package according to a fourth example of the present invention, which is a cross-sectional view taken along the line I-I' and the line V-V' shown in FIG. 14 .

A method of manufacturing a light emitting diode package according to a fourth example of the present invention will be described in stages with reference to FIGS. 17A to 17F .

First, as shown in FIG. 17A , first and second lead electrodes 110 and 120 having a planar polygonal shape are disposed to be parallel to each other and spaced apart from each other by a predetermined interval. For example, the first and second lead electrodes 110 and 120 may be disposed side by side in the first horizontal direction (X).

Then, as shown in FIG. 17B , a mold frame 130 is formed to surround each side of the first and second lead electrodes 110 and 120 . For example, the mold frame 130 is formed to surround each side of the first and second lead electrodes 110 and 120 by an insert injection method using a mold, so that the first and second lead electrodes 110, 120 , and the bottom 132 surrounding each side of the first and second lead electrodes 110 and 120 , and long sides 134a and 134b formed at a constant height at the edge of the bottom 132 . ) and short side walls 134c and 134d. Accordingly, a concave portion 136 surrounded by a pair of long sides 134a and 134b and a pair of short side walls 134c and 134d is provided on the bottom portion 132 , and a pair of long sides 134a is provided on the bottom portion 132 . , 134b) and the pair of short side walls 134c and 134d may each have an inclined surface that is inclined so that the cross-sectional area of the concave portion 136 is gradually decreased from the upper portion to the bottom portion 132 . In addition, each side of the first and second lead electrodes 110 and 120 has a predetermined distance D from the frame cutting line CL toward the middle of the mold frame 130 so as not to overlap the frame cutting line CL. spaced apart as much as

Then, as shown in FIG. 17C , the light emitting diode chip 140 is electrically connected to the first and second lead electrodes 110 and 120 . For example, the light emitting diode chip 140 is directly attached to the upper surface of the first lead electrode 110 by a die bonding process, and then is subjected to a wire bonding process using the first and second wires 142 and 144 . may be electrically connected to the first and second lead electrodes 110 and 120 by the

Then, as shown in FIG. 17D , an encapsulation layer 150 encapsulating at least the light emitting diode chip 140 is formed by applying and curing an encapsulation material to the recess 136 provided in the mold frame 130 . Here, the encapsulation layer 150 may be formed of a mixed material of an encapsulation material and a fluorescent material.

Then, as shown in FIGS. 17E and 17F , the short side walls 134c and 134d of the mold frame 130 are cut so that the short sides 151 and 152 of the encapsulation layer 150 are exposed to the outside, and encapsulation is performed. The long side walls 134a and 134b of the mold frame 130 are cut so that the long sides 153 and 154 of the layer 150 are exposed to the outside. For example, the short side walls 134c and 134d and the bottom of the mold frame 130 along the frame cutting line CL set on the short side walls 134c and 134d of the mold frame 130 through a cutting process using a cutting wheel. The short sides 151 and 152 of the encapsulation layer 150 are exposed to the outside by cutting the portion 132 , and the mold frame along the frame cutting line CL set on the long sidewalls 134a and 134b of the mold frame 130 . The long sides 153 and 154 of the encapsulation layer 150 may be exposed to the outside by cutting the long side walls 134a and 134b of the 130 and the bottom 132 . Here, the first and second lead electrodes 110 and 120 as the short side walls 134c and 134d and the long side walls 134a and 134b of the mold frame 130 and a part of the bottom 132 overlapping them are removed. ) Each side is wrapped by the remaining bottom part 132 that is not removed by the cutting process and is not exposed to the outside. In particular, since each side of the first and second lead electrodes 110 and 120 is spaced apart from the frame cutting line CL by a set distance D and does not overlap the frame cutting line CL, in the cutting process, the mold frame Only 130 is cut, so that the problem of contamination of the encapsulation layer 150 due to debris generated when the lead electrodes 110 and 120 is cut does not occur, and the side of the mold frame 130 does not tear. .

As described above, in the method of manufacturing a light emitting diode package according to the fourth example of the present invention, each side surface of the encapsulation layer 150 is cut by cutting the short side walls 134c and 134d and the long side walls 134a and 134b of the mold frame 130 . By exposing all of (151, 152, 153, and 154) to the outside, the light emitted from the light emitting diode chip 140 is emitted in five directions including the front direction of the encapsulation layer 150, the short side direction, and the long side direction. It is possible to widen the light beam angle of the light emitting diode package.

Additionally, in the light emitting diode package 400 and its manufacturing method according to the fourth example of the present invention, the mold frame 130 has the short sides 151 and 152 of the encapsulation layer 150 as shown in FIG. 9 . Long side walls 134a and 134b surrounding only the lower portions of the long sides 153 and 154 of the encapsulation layer 150 may be further included in order to expose the whole and upper portions of the long sides 153 and 154 to the outside. Further, in the light emitting diode package 400 and its manufacturing method according to the fourth example of the present invention, the mold frame 130 has the short sides 151 and 152 of the encapsulation layer 150 as shown in FIG. 9 . Short side walls 134c and 134d surrounding the lower portions of the short sides 151 and 152 and/or the long sides 153 and 154 of the encapsulation layer 150 to expose the upper portions and/or the upper portions of the long sides 153 and 154 to the outside, respectively. and long side walls 134a and 134b may be further included. Each of the short side walls 134c and 134d and the long side walls 134a and 134b of the mold frame 130 surrounding the lower sides of the short sides 151 and 152 and/or the lower sides of the long sides 153 and 154 of the encapsulation layer 150 is an inclined surface. can have In this case, the amount of light emitted in the short side direction and/or the long side direction of the encapsulation layer 150 in the light emitting diode package 400 according to the fourth example of the present invention is the short side walls 134c and 134d of the mold frame 130 and While the amount of light emitted in the front direction of the encapsulation layer 150 is decreased by each of the long side walls 134a and 134b, the short side walls 134c and 134d and the long side walls 134a and 134b of the mold frame 130, respectively. It is increased by the reflected light reflected by the inclined surface.

On the other hand, in the light emitting diode package 400 and its manufacturing method according to the fourth example of the present invention, the light emitting diode chip 140 is not directly die-bonded to the upper surface of the first lead electrode 110 , and is shown in FIGS. 11 , the die-bonding may be performed on the upper surface of the upper bottom portion 132b of the mold frame 130 . In addition, as shown in FIGS. 12 and 13 , the light emitting diode chip 140 may be composed of two or more.

18 is a cross-sectional view illustrating a partial cross-section of a backlight unit according to an embodiment of the present invention, and FIG. 19 is a perspective view illustrating the light emitting diode array and the light guide plate shown in FIG. 18 .

18 and 19 , the backlight unit 500 according to an embodiment of the present invention includes a light guide plate 510 , a light emitting diode array 520 , a reflective sheet 530 , and optical sheets 540 . .

The light guide plate 510 has a rectangular plate shape to include the light incident part 512 provided on at least one side thereof. The light guide plate 510 includes an optical pattern (not shown) for emitting the light incident from the light incident part 512 in the upper surface direction.

The light emitting diode array 520 irradiates light to the light incident part 512 of the light guide plate 510 using a light emitting diode package. The light emitting diode array 520 according to an example includes a printed circuit board 522 and a plurality of light emitting diode packages 524 .

The printed circuit board 522 is disposed on one side of the light guide plate 510 to face the light incident part 512 of the light guide plate 510 . The printed circuit board 522 includes an anode power line (not shown) for supplying anode power to the anode terminal of each of the plurality of light emitting diode packages 524 and a cathode power supply to the cathode terminal of each of the plurality of light emitting diode packages 524 Includes a cathode power line (not shown) for supplying.

Each of the plurality of light emitting diode packages 524 is mounted on a printed circuit board 522 at regular intervals to irradiate light to the light incident portion 512 of the light guide plate 510 . Since each of the plurality of light emitting diode packages 524 has the same configuration as the light emitting diode packages 100 , 200 , 300 , and 400 according to the first to fourth examples of the present invention, a redundant description thereof will be omitted. do it with

The first and second lead electrodes 110 and 120 (refer to FIG. 4 ) of each of the plurality of light emitting diode packages 524 are respectively connected to the anode power line and the cathode power line of the printed circuit board 522 by surface mounting technology. do. Accordingly, each of the plurality of light emitting diode packages 524 emits light by the anode power supply and the cathode power supply and emits light in three directions including the front direction and the side direction, thereby providing light to the light incident part 512 of the light guide plate 510 . investigate

The reflective sheet 530 is disposed to cover a lower portion of the light guide plate 510 . The reflective sheet 530 minimizes light loss by reflecting light incident through the lower surface of the light guide plate 510 toward the inside of the light guide plate 510 .

The optical sheets 540 are disposed on the light guide plate 510 to improve luminance characteristics of light emitted from the light guide plate 510 . For example, the optical sheets 540 may include, but are not limited to, a lower diffusion sheet, a prism sheet, and an upper diffusion sheet, and a diffusion sheet, a prism sheet, and a dual brightness enhancement film (dual brightness en-hancement). film), and a laminated combination of two or more selected from lenticular sheets.

As described above, in the backlight unit 500 according to an example of the present invention, each of the plurality of light emitting diode packages 524 has a three- or five-sided light output structure, so that each of the plurality of light emitting diode packages 524 has a wide light beam angle. Accordingly, a hot spot phenomenon occurring in the light incident portion 512 of the light guide plate 510 can be minimized, and thus, the distance between the light incident portion 12 of the light guide plate 10 and the light emitting diode package 22 is reduced. The bezel width of the light incident part may be reduced. In addition, in the backlight unit 500 according to an embodiment of the present invention, the number of required light emitting diode packages 524 is reduced due to the wide light directivity angle of each of the plurality of light emitting diode packages 524, so that the manufacturing cost is reduced. can

Additionally, the backlight unit 500 according to an embodiment of the present invention may further include a plurality of light path conversion members 550 shown in FIGS. 19 and 20 .

Each of the plurality of light path conversion members 550 is attached to the printed circuit board 522 so as to be disposed between the plurality of light emitting diode packages 524 . For example, each of the plurality of light path changing members 550 transmits a propagation path of light emitted from a side, for example, a short side, of each of the adjacent first and second light emitting diode packages 524 to the entrance of the light guide plate 510 . By converting toward the light portion 512 , a hot spot phenomenon in the light incident portion 512 of the light guide plate 510 is further prevented.

Each of the plurality of light path conversion members 550 according to an example is incident on a lower surface 551 attached to the printed circuit board 522 by an adhesive member 560 and a side surface of the first light emitting diode package 524 . The first reflective surface 552 for reflecting the light to be formed toward the light incident part 512 of the light guide plate 510, and the light emitted from the side surface of the second light emitting diode package 524 to the light incident part of the light guide plate 510 ( and a second reflective surface 554 that reflects toward 512 . Each of the plurality of light path changing members 550 may have a triangular cross-section in which the first and second reflective surfaces 554 are inclined at the same angle from the lower surface 551 .

Each of the plurality of light path changing members 550 has a height of the light guide plate 510 while the light incident from each side of the adjacent first and second light emitting diode packages 524 is advanced to the light incident part 512 of the light guide plate 510 . In order to prevent a hot spot phenomenon in the light incident part 512 , it is preferable that the light emitting diode package 524 be equal to or higher than the height of the light emitting diode package 524 . That is, the vertex of the light path converting member 550 having a triangular cross-section may be located on the same horizontal line as the height of the light emitting diode package 524 or may be located higher than the height of the light emitting diode package 524 .

21 is a view showing the luminance of a light incident portion of a light guide plate in the backlight unit of the present invention.

First, as shown in FIG. 2 , in the conventional backlight unit, it can be seen that the hot spot phenomenon occurs due to the stepped area LA and the dark area DA generated in the light incident portion of the light guide plate.

On the other hand, as can be seen in FIG. 21 , in the backlight unit according to the present invention, each of the plurality of light emitting diode packages 524 has a three-sided or five-sided light output structure, so that each of the plurality of light emitting diode packages 524 has a wide light direction. It can be seen that due to the angle, the size of the dark area DA generated in the light incident portion 512 of the light guide plate 510 corresponding between the plurality of light emitting diode packages 524 is minimized, thereby minimizing the hot spot phenomenon. can

22 is a perspective view schematically illustrating a liquid crystal display according to an embodiment of the present invention, and FIG. 23 is a cross-sectional view taken along line VII-VII' of FIG. 22 .

22 and 23 , the liquid crystal display according to an embodiment of the present invention includes a liquid crystal display panel 610 , a backlight unit 500 , a guide frame 630 , a storage case 640 , and a panel driving circuit unit 650 . ), an outer cover 660 , and a front partial cover 670 .

The liquid crystal display panel 610 includes a lower substrate 611 and an upper substrate 613 that are bonded to each other with a liquid crystal layer interposed therebetween, and displays a predetermined image using light emitted from the backlight unit 500 . .

The lower substrate 611 is a thin film transistor array substrate and includes a plurality of pixels (not shown) formed in each pixel area intersected by a plurality of gate lines (not shown) and a plurality of data lines (not shown). Each pixel may include a thin film transistor (not shown) connected to a gate line and a data line, a pixel electrode connected to the thin film transistor, and a common electrode formed adjacent to the pixel electrode and supplied with a common voltage.

A pad part (not shown) connected to each signal line is provided on the lower edge of the lower substrate 611 , and the pad part is connected to the panel driver 650 . Also, a gate driving circuit (not shown) for supplying a gate signal to a gate line of the liquid crystal display panel 610 is formed on the left and/or right edge portions of the lower substrate 611 . A gate driving circuit is formed together with the thin film transistor manufacturing process of each pixel so as to be connected to each gate line.

The upper substrate 613 includes a pixel defining pattern defining an opening region overlapping each pixel region formed on the lower substrate 611 , and a color filter formed in the opening region. The upper substrate 613 is oppositely bonded to the lower substrate 611 with the liquid crystal layer interposed therebetween by a sealant to cover the entire lower substrate 611 except for the pad portion of the lower substrate 611 .

At least one of the lower substrate 611 and the upper substrate 613 is formed with an alignment layer (not shown) for setting a pretilt angle of the liquid crystal. The liquid crystal layer is interposed between the lower substrate 611 and the upper substrate 613, and liquid crystal molecules are arranged in a horizontal direction according to a transverse electric field formed by a data voltage and a common voltage applied to the pixel electrode for each pixel. made of liquid

A lower polarization member 615 having a first polarization axis is attached to the rear surface of the lower substrate 611 , and upper polarized light having a second polarization axis intersecting the first polarization axis is attached to the front surface of the upper substrate 613 . A member 617 is attached.

As such, the liquid crystal display panel 610 drives the liquid crystal layer according to the electric field formed for each pixel by the data voltage and the common voltage applied to each pixel, thereby displaying a predetermined color image according to the light transmittance of the liquid crystal layer. .

The backlight unit 500 irradiates light to the rear surface of the liquid crystal display panel 610 . The backlight unit 500 according to an example includes a light guide plate 510 , a light emitting diode array 520 , a reflective sheet 530 , and optical sheets 540 , and the backlight unit 500 is illustrated in FIGS. 18 to Since the backlight unit has the same configuration as that of the backlight unit shown in FIG. 20 , the same reference numerals are given, and a redundant description thereof will be omitted.

As described above, in the backlight unit 500 , each of the plurality of light emitting diode packages 524 has a three- or five-sided light output structure, so that light incident from each of the plurality of light emitting diode packages 524 to the light incident part of the light guide plate 510 . As the light is incident at this wide light directing angle, a hot spot phenomenon occurring in the light incident portion of the light guide plate 510 may be minimized.

The guide frame 630 is formed in a rectangular band shape to support a rear edge portion of the liquid crystal display panel 610 . The guide frame 630 includes a panel support for supporting the rear edge of the liquid crystal display panel 610 , and a guide sidewall formed vertically from the panel support to surround each side of the storage case 640 . Here, the panel support portion of the guide frame 640 may be physically coupled to the rear edge portion of the liquid crystal display panel 610 through an adhesive member 635 such as a double-sided tape, a thermosetting resin, or a photocurable resin.

The storage case 640 accommodates the backlight unit 500 and supports the guide frame 630 . The storage case 640 according to an example may include a bottom surface supporting the backlight unit 500 and a case sidewall that is bent vertically from an end of the bottom surface to support the panel support of the guide frame 630 . A printed circuit board 522 of the light emitting diode array 520 may be attached to a case sidewall corresponding to the light incident portion of the light guide plate 510 among the case sidewalls of the storage case 640 .

The panel driving circuit unit 650 is connected to a pad unit provided on the lower substrate 611 to drive each pixel of the liquid crystal display panel 610 to display a predetermined color image on the liquid crystal display panel 610 . The panel driving circuit unit 650 according to an example includes a plurality of flexible circuit films 651 , a data driving integrated circuit 653 , a display printed circuit board 655 , and a timing controller (not shown).

Each of the plurality of flexible circuit films 651 is attached to the pad portion of the lower substrate 611 and the printed circuit board 655 for display by a film attaching process, and is a Tape Carrier Package (TCP) or Chip On Flexible (COF) Board or Chip On Film). Each of the plurality of flexible circuit films 651 is bent to surround the lower edge of the liquid crystal display panel 610 and is disposed on the rear surface of the guide frame 630 .

The data driving integrated circuit 653 is mounted on each of the plurality of flexible circuit films 651 and is connected to the pad portion through the flexible circuit film 651 . The data driving integrated circuit 653 receives the pixel data and the data control signal for each pixel supplied from the timing controller, converts the pixel data for each pixel into an analog data signal according to the data control signal, and converts the data to the corresponding data through the pad unit. supply to the line.

The display printed circuit board 655 is connected to a plurality of flexible circuit films 651 . The display printed circuit board 655 serves to provide a signal necessary for displaying an image to each pixel of the liquid crystal display panel 610 to the data driving integrated circuit 653 and the gate driving circuit. To this end, various signal wirings, various power supply circuits (not shown), and a memory device (not shown) are mounted on the display printed circuit board 655 .

The timing controller is mounted on the printed circuit board 655 for display and transmits digital image data input from the driving system in response to a timing synchronization signal supplied from an external driving system (not shown) to the pixel arrangement of the liquid crystal display panel 610 . The pixel data for each pixel is generated by arranging to fit the structure, and the generated pixel data for each pixel is provided to the data driving integrated circuit 653 . In addition, the timing controller generates a data control signal and a gate control signal, respectively, based on the timing synchronization signal to control driving timings of the data driving integrated circuit 653 and the gate driving circuit, respectively.

Additionally, the timing controller may individually control the luminance of each region of the liquid crystal display panel 610 by partially controlling the light emitting diode packages 524 of the backlight unit 500 through edge-type local dimming technology. .

The outer cover 660 constitutes the outermost rear surface and side surfaces of the liquid crystal display device, and surrounds the guide frame 630 and each side surface of the liquid crystal display panel 610 while supporting the rear surface of the storage case 640 . To this end, the outer cover 660 is vertically bent from the cover plate supporting the rear surface of the storage case 640 and the end of the cover plate to surround each side of the guide frame 630 and the liquid crystal display panel 610 . cover sidewalls. Here, the upper portion of the side wall of the cover surrounds each side of the liquid crystal display panel 610 except for the front surface of the liquid crystal display panel 610 so as to cover the entire front surface of the liquid crystal display panel 610 of the liquid crystal display device. exposed forward.

Additionally, since the upper and left edges of the liquid crystal display panel 610 connected to the panel driving circuit unit 650 are not covered by a separate mechanism, the upper surface of the liquid crystal display panel 610 and A side sealing member (not shown) having a predetermined thickness may be additionally provided on the upper side, the left side, and the right side of the liquid crystal display panel 610 to protect the side and light leakage from the left side and the right side. The side sealing member is made of a thermosetting or photo-curable resin and may be formed through a coating process of applying a predetermined thickness to the upper, left, and right surfaces of the liquid crystal display panel 610 and a curing process performed immediately after the application process. .

The front cover 670 is assembled with the outer cover 660 to cover the lower edge of the liquid crystal display panel 610 . That is, the pad portion of the liquid crystal display panel 610 connected to the panel driving circuit unit 650 is not covered by the outer cover 660 but is exposed in front of the liquid crystal display device. The front cover 670 covers the lower edge portion of the liquid crystal display panel 610 , the pad portion, the panel driving circuit portion 650 , and the cover sidewalls of the outer cover 660 to thereby cover the pad portion of the liquid crystal display panel 610 . and the panel driving circuit unit 650 are hidden. Accordingly, according to the present invention, the front surface of the liquid crystal display panel 610 except for the lower edge portion of the liquid crystal display panel 610 covered by the front cover 670 is implemented as a flat surface without a step, thereby providing a liquid crystal display. The aesthetics of the device may be improved.

As described above, in the liquid crystal display according to the present invention, a hot spot phenomenon occurs in the light input unit 512 of the light guide plate 510 according to the light output structure on three or five sides of the light emitting diode package 524 included in the backlight unit 500 . By being minimized, the image quality may be improved, and as the top surface of the liquid crystal display panel 610 except for the lower edge portion of the liquid crystal display panel 610 is exposed to the outside, it has an improved aesthetic feeling.

The present invention described above is not limited to the above-described embodiments and the accompanying drawings, and it is common in the technical field to which the present invention pertains that various substitutions, modifications and changes are possible within the scope of the present invention. It will be clear to those who have the knowledge of Therefore, the scope of the present invention is indicated by the following claims, and all changes or modifications derived from the meaning and scope of the claims and their equivalent concepts should be construed as being included in the scope of the present invention.

100, 200, 300, 400, 500: backlight unit 110: first lead electrode
120: second lead electrode 130: mold frame
140: light emitting diode chip 150: encapsulation layer
510: light guide plate 520: light emitting diode array
522: printed circuit board 524: light emitting diode package
550: light path conversion member 610: liquid crystal display panel
630: guide frame 640: storage case
660: outer cover 670: front partial cover

Claims (17)

a first lead electrode;
a second lead electrode parallel to the first lead electrode and spaced apart from the first lead electrode;
a mold frame supporting the first and second lead electrodes;
at least one light emitting diode chip electrically connected to the first and second lead electrodes; and
An encapsulation layer encapsulating the light emitting diode chip,
The mold frame surrounds each side of the first and second lead electrodes,
The upper part of the short side of the encapsulation layer is exposed to the outside,
The mold frame is
a bottom portion surrounding each side of the first and second lead electrodes;
a pair of long side walls provided in parallel with each other at both long side edges of the bottom part to surround the long side of the encapsulation layer; and
A light emitting diode package comprising a pair of short sidewalls provided in parallel with each other at both ends of the short side of the bottom so as to have a height lower than that of the pair of long sidewalls and surrounding the lower side of the short side of the encapsulation layer. delete delete The method of claim 1,
Each of the pair of short side walls is inclined at an obtuse angle from a top surface of the first lead electrode, a light emitting diode package. delete delete The method of claim 1,
Each of the upper long side of the encapsulation layer is exposed to the outside,
The pair of long sidewalls surround only the lower portion of the long side of the encapsulation layer, the light emitting diode package. The method of claim 1,
The at least one light emitting diode chip is directly attached to the upper surface of the first lead electrode or the upper surface of the second lead electrode, the light emitting diode package. The method of claim 1,
The mold frame has first and second electrode exposure holes while additionally covering upper surfaces of the first and second lead electrodes,
The at least one light emitting diode chip is disposed on the mold frame overlapping the first lead electrode or the second lead electrode and electrically connected to the first and second lead electrodes through the first and second electrode exposure holes. connected by a light emitting diode package. disposing the first and second lead electrodes to be spaced apart from each other at a predetermined interval so as to be parallel to each other;
forming a mold frame surrounding each side of the first and second lead electrodes;
electrically connecting at least one light emitting diode chip to the first and second lead electrodes;
forming an encapsulation layer encapsulating the light emitting diode chip; and
cutting the mold frame so that at least one of a long side and a short side of the encapsulation layer is exposed to the outside;
The mold frame is
a bottom portion surrounding each side of the first and second lead electrodes;
a pair of long side walls provided in parallel with each other at both long side edges of the bottom part to surround the long side of the encapsulation layer; and
A method of manufacturing a light emitting diode package, comprising a pair of short sidewalls provided in parallel with each other at both ends of the short side of the bottom to have a height lower than that of the pair of long sidewalls and surrounding the lower side of the short side of the encapsulation layer. 11. The method of claim 10,
The step of cutting the mold frame includes cutting the short side walls of the mold frame so that side surfaces of the first and second lead electrodes are surrounded by the bottom part and the top of the short side of the encapsulation layer is exposed to the outside. , a method of manufacturing a light emitting diode package. 12. The method of claim 11,
The cutting of the mold frame includes cutting the long sidewalls of the mold frame so that side surfaces of the first and second lead electrodes are surrounded by the bottom portion and the upper long side or the entire long side of the encapsulation layer is exposed to the outside. Further comprising, a method of manufacturing a light emitting diode package. 11. The method of claim 10,
The at least one light emitting diode chip is directly attached to the upper surface of the first lead electrode or the second lead electrode, the method of manufacturing a light emitting diode package. a light guide plate having a light incident part;
a light emitting diode array irradiating light to the light incident portion of the light guide plate; and
and optical sheets disposed on the light guide plate;
The light emitting diode array,
The light emitting diode packages according to any one of claims 1, 4 or 7; and
and a printed circuit board on which the light emitting diode packages are mounted at regular intervals. 15. The method of claim 14,
It is attached to the printed circuit board so as to be disposed between a pair of adjacent light emitting diode packages, and further includes a light path conversion member for advancing the incident light emitted from the side surfaces of the pair of adjacent light emitting diode packages to the light incident part of the light guide plate. which is a backlight unit. liquid crystal display panel;
a guide frame supporting the liquid crystal display panel;
a storage case supporting the guide frame; and
and the backlight unit according to claim 14 accommodated in the storage case and irradiating light to the liquid crystal display panel. 17. The method of claim 16,
The backlight unit is attached to the printed circuit board to be disposed between a pair of adjacent light emitting diode packages, and a light path conversion that advances the incident light emitted from side surfaces of the pair of adjacent light emitting diode packages to the light incident part of the light guide plate The liquid crystal display device further comprising a member.

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