KR20130026893A - Led pakage and backlight unit inculding the same - Google Patents

Led pakage and backlight unit inculding the same Download PDF

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Publication number
KR20130026893A
KR20130026893A KR1020110090341A KR20110090341A KR20130026893A KR 20130026893 A KR20130026893 A KR 20130026893A KR 1020110090341 A KR1020110090341 A KR 1020110090341A KR 20110090341 A KR20110090341 A KR 20110090341A KR 20130026893 A KR20130026893 A KR 20130026893A
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KR
South Korea
Prior art keywords
led package
light
guide plate
liquid crystal
light guide
Prior art date
Application number
KR1020110090341A
Other languages
Korean (ko)
Inventor
김민규
Original Assignee
엘지디스플레이 주식회사
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Publication date
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Priority to KR1020110090341A priority Critical patent/KR20130026893A/en
Publication of KR20130026893A publication Critical patent/KR20130026893A/en

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0033—Means for improving the coupling-out of light from the light guide
    • G02B6/005—Means for improving the coupling-out of light from the light guide provided by one optical element, or plurality thereof, placed on the light output side of the light guide
    • G02B6/0051—Diffusing sheet or layer
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0033—Means for improving the coupling-out of light from the light guide
    • G02B6/005—Means for improving the coupling-out of light from the light guide provided by one optical element, or plurality thereof, placed on the light output side of the light guide
    • G02B6/0055—Reflecting element, sheet or layer
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
    • G02B6/0086—Positioning aspects
    • G02B6/0088—Positioning aspects of the light guide or other optical sheets in the package
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
    • G02B6/0086—Positioning aspects
    • G02B6/0091—Positioning aspects of the light source relative to the light guide
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133615—Edge-illuminating devices, i.e. illuminating from the side
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Nonlinear Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Engineering & Computer Science (AREA)
  • Planar Illumination Modules (AREA)
  • Liquid Crystal (AREA)

Abstract

The present invention discloses an LED package. More specifically, the LED package (LED pakage) provided in the backlight unit of the light receiving display device, such as a liquid crystal display device, the LED package that has improved the hot-spot defect by changing its structure and includes the same It relates to a backlight unit.
According to a preferred embodiment, the LED package of the present invention, the main body having a light emitting diode device, a lead frame to which the light emitting diode is bonded, and a lead frame, and at least one side surface protruding in the light emitting direction It includes.
Therefore, the present invention further forms a protrusion for reflecting the light emitted from one side of the mold frame of the LED package constituting the light source, thereby improving the hot spot phenomenon by replacing the 'c' shaped reflector.

Description

LED package and backlight unit including the same {LED PAKAGE AND BACKLIGHT UNIT INCULDING THE SAME}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an LED package, and in particular, an LED package which improves a hot-spot defect by changing a structure of an LED package provided in a backlight unit of a light receiving display device such as a liquid crystal display. And it relates to a backlight unit comprising the same.

Liquid crystal display devices have advantages such as excellent visibility, easy thinning, low power, and low heat generation. Since the liquid crystal panel of the liquid crystal display device is a non-emissive device, it requires a backlight unit for supplying light, and the liquid crystal panel and the backlight unit are modularized by being combined through various mechanism structures. It is used for image display apparatuses, such as a monitor and a mobile.

1 is a view showing a part of a cross section of a conventional liquid crystal display device module.

As shown, the conventional liquid crystal display device module includes a liquid crystal panel 10 for displaying an image, a backlight unit 20 for providing light to the liquid crystal panel 10, and a mechanism structure 60 for modularizing the liquid crystal panel 10. do.

The liquid crystal panel 10 has a structure in which a liquid crystal layer is interposed between two substrates bonded to face each other at a predetermined distance. The liquid crystal panel 10 realizes an image by controlling light transmittance of the liquid crystal layer according to a signal applied from a driver.

The backlight unit 20 is positioned at the rear surface of the liquid crystal panel 10, and is provided as a light source 22, a light guide plate 25 disposed to face one side of the light source 22, and a front surface of the light guide plate 25. A plurality of optical sheets 27 and a reflecting plate 50 disposed on the rear surface of the light guide plate 25 is included. Here, the light source 22 is composed of one or more LED package 30 and the LED PCB 40 to which the LED package 30 is bonded.

In addition, although not shown, the light guide plate 25 is mounted on a flat bottom surface of the reflecting plate 50, and there is no fixing means therebetween, so that each side of the light guide plate 25 is bottomed by using a double-sided tape (not shown). It is fixed by attaching to the cover 65.

The mechanism structure 60 includes a guide panel 62, a bottom cover 65, and a top case 67. First, the guide panel 62 seats the liquid crystal panel 10 on the inner stepped portion, borders each corner thereof, and mounts the light guide plate 25 and the optical sheet 27 under the guide panel 62. The guide panel 62 is made of a synthetic resin having a high reflectance to reflect the light traveling through the light guide plate 23 in the lateral direction instead of the top.

The bottom cover 65 is fastened to the outside with the guide panel 62 to receive the backlight unit 20 on the bottom surface.

The top case 67 covers the upper edge of the liquid crystal panel 10, that is, the bezel area, and is coupled to the bottom cover 65 to modularize the liquid crystal display.

In the liquid crystal display module having such a structure, the light emitted from the backlight unit 20 should proceed to the display area of the liquid crystal panel 10. For this purpose, the aforementioned reflective plate 50 is formed in a 'c' shape to form a liquid crystal panel ( Minimize light propagating to the non-display area (10), that is, the outer corner.

FIG. 2 is a view illustrating a '-' shaped reflector of a conventional liquid crystal display module.

As shown, the conventional 'c' shaped reflector 50 is formed of a bottom portion 52 on which the light guide plate is mounted, and an upper portion 59 where the side portion 53 and the side portion 53 are bent upward. . In addition, the light source 22 is disposed in the side portion 53, and an opening 55 for emitting light in the light guide plate direction is formed.

According to this structure, the light source 22 is disposed outside the side portion 53 of the reflector plate 50 so that the LED package 30 is inserted into the opening 55 and the LED PCB 40 abuts the side portion 53. Is assembled so that the light emitted from the LED package 30 is directed toward the light guide plate.

In the previous liquid crystal display, some of the light emitted from the LED package 30 is not incident on the side of the light guide plate but proceeds to the side of the LED package 30, that is, the corner of the liquid crystal panel, which is the display area of the liquid crystal panel. Instead of going to the non-display area, the light is output to the outside as it is, which causes the backlight unit to decrease light efficiency.

1 is proposed to overcome this problem, the reflector 50 is provided with a 'c' shape rather than a straight line to reflect the light leaking to the side of the LED package 30 to re-enter the light guide plate again.

However, the aforementioned 'c' shaped reflector 50 has a disadvantage in that the bending and opening cutting processing process is further added, unlike the general flat reflector, and its manufacturing cost is higher than that of the linear reflector.

In addition, the light guide plate is expanded by heat generated from the LED package 30 when the liquid crystal display is driven, and thus the light guide plate is advanced in the light source direction, thereby reducing a gap between the LED package 30 and the light guide plate. Accordingly, a problem may occur in that the side surface of the light guide plate melts due to heat generated from the LED package 30.

The present invention has been made to solve the above problems, and an object of the present invention is to provide a structure of a backlight unit that can be replaced at a low cost to the '-' shaped reflector introduced to improve the light efficiency of the light source.

In addition, another object of the present invention is to provide a structure of a backlight unit which can more stably fix a light guide plate that expands according to heat generated by a light source through a simple mechanical design change.

In order to achieve the above object, an LED package according to a preferred embodiment of the present invention, a light emitting diode device; A lead frame to which the light emitting diodes are bonded; And a main body molding the lead frame and having a shielding portion protruding in at least one side surface in the light emitting direction.

The shield may be integral with the main body.

The shielding portion is characterized in that the fixing member is further protruded in the light emitting direction on the outer surface.

The fixing member is characterized in that a serration pattern is formed on at least one surface.

A wire electrically connecting the light emitting diode element and the lead frame; And an encapsulant for molding the LED element.

In order to achieve the above object, a backlight unit including an LED package according to a preferred embodiment of the present invention, LED package including a main body having a shielding portion protruding in the light emitting direction of at least one side; LED PCB in which one or more of the LED package is arranged in a line; A light guide plate having at least one side surface facing the light emitting surface of the LED package and configured to guide incident light to the front surface; An optical sheet disposed on a front surface of the light guide plate to diffuse and collect incident light; And a reflector disposed on a rear surface of the light guide plate to reflect incident light to the light guide plate.

The LED package is characterized in that the shield is disposed on the LED PCB to be parallel to the front surface of the light guide plate.

The LED package is characterized in that the fixing member which is in contact with one surface of the light guide plate is attached to the outer surface of the shield.

The fixing member and the light guide plate are characterized in that a serration pattern is formed on the contact surface.

According to a preferred embodiment of the present invention, by further forming a projection for reflecting the light emitted to one side of the mold frame of the LED package constituting the light source, the hot spot phenomenon of the image is replaced by replacing the '?' Shaped reflector There is an effect to improve.

In addition, by forming a fixing member having a sawtooth pattern on one end of the LED package, and forming a pattern corresponding to the sawtooth pattern on the light guide plate to bite each other, there is an effect of fixing the light guide plate to expand by heat to prevent damage.

1 is a view showing a part of a cross section of a conventional liquid crystal display device module.
FIG. 2 is a view illustrating a '-' shaped reflector of a conventional liquid crystal display module.
3 is an exploded perspective view of a liquid crystal display module to which the LED package and the backlight unit including the LED package according to the embodiment of the present invention are applied.
4A to 4C are diagrams illustrating an LED package and a bonding form thereof according to an embodiment of the present invention.
5 is a cross-sectional view of a part of a liquid crystal display module to which an LED package and a backlight unit according to an exemplary embodiment of the present invention are applied.
6 is a cross-sectional view of a part of a liquid crystal display module including an LED package and a backlight unit according to another embodiment of the present invention.

Hereinafter, an LED package and a backlight unit including the same according to a preferred embodiment of the present invention will be described with reference to the accompanying drawings. The drawings referred to with respect to the following embodiments are not intended to limit the shape and position of the components to the illustrated form, and in particular, in order to help the understanding of the structure and shape that are technical features of the present invention, The scale is exaggerated or reduced.

3 is an exploded perspective view of a liquid crystal display module to which the LED package and the backlight unit including the LED package according to the embodiment of the present invention are applied.

As shown, the liquid crystal display module to which the backlight unit of the present invention is applied includes a liquid crystal panel 100 for displaying an image, a backlight unit 120 for providing light to the liquid crystal panel 100, and fixing and storing the liquid crystal panel 100. Consists of instrument structure 160.

The liquid crystal panel 100 includes a liquid crystal layer (not shown) which is bonded to the lower substrate and the upper substrate by being spaced apart from each other by a predetermined distance, and interposed between the lower and upper substrates. The liquid crystal panel 100 is bonded with a driving driver 115 for generating and providing a plurality of control signals for driving the liquid crystal panel 100, and a flexible cable 116 for transmitting and receiving signals to and from the outside. Here, the driving driver 115 may be bonded on one surface of the lower substrate 112 by a tape automated bonding (TAB) or a chip on glass (COG) method.

A thin film transistor as a switching element, various wirings and electrodes are formed on one substrate of the liquid crystal panel 100, and a color for displaying three primary colors of red (R), green (G), and blue (B) on another substrate. A filter and a black matrix BM are formed to define a plurality of pixels.

The driving driver 115 may include a gate driver for providing a scan signal for driving the above-described thin film transistor, and a data driver for providing a data signal to an electrode in the liquid crystal panel 100, and includes a flexible cable 116. It is connected to an external system and a power supply for supplying power.

In particular, the pixels of the liquid crystal panel 100 are defined at a plurality of gate wirings arranged in one direction, a plurality of data wirings intersecting the plurality of gate wirings, and intersection points of the wirings. Each pixel includes a thin film transistor as a switching element, and the thin film transistor includes a gate electrode connected to the above-described gate line, a semiconductor layer formed by laminating amorphous silicon, etc. on the gate electrode, a data layer and a pixel. It consists of a source electrode and a drain electrode electrically connected to an electrode.

In addition, when the liquid crystal panel 100 is a twisted nematic (TN) driving method according to the type of substrate, a transparent common electrode for applying a voltage to the liquid crystal layer is formed on the front surface of the upper substrate, and in-plane switching In the case of the IPS driving method, the common electrode and the pixel electrode are all formed on one substrate.

The two substrates of the liquid crystal panel 100 configured as described above are bonded to face each other by a sealant formed on the outside thereof, and a liquid crystal layer is interposed therebetween, and although not shown, polarizers may be formed on the front and rear surfaces of the liquid crystal panel 100. An image is realized by converting the components of the light that is attached and incident and emitted.

The backlight unit 120 is disposed to face the light source 122 disposed at one lower end of the liquid crystal panel 100 and the light emitting surface of the light source 122 to guide light emitted from the light source 122. It consists of optical members 125, 127, 150 for diffusing and condensing.

In detail, the light source 122 includes a plurality of LED packages 130 and an LED PCB 140 in which one or more LED packages 130 are bonded in a row. Here, the light emitting surface of the LED package 130 is disposed on one side of the structure 160 to face the light guide plate 125. In the drawing, an example of the backlight unit 120 of the photometric type in which the light source 122 is disposed on the side of the liquid crystal panel 100 is illustrated.

The light source 122 electrically connects the plurality of LED packages 130 through a plurality of electrodes and wirings formed on one surface of the LED PCB 140, and is connected to an external power supply unit through a separate cable.

The LED package 130 may be used in combination with R, G, and B light emitting diodes (LEDs) emitting red, green, and blue (B) monochromatic light, respectively, or one light emission. The diode may be used in the form of emitting white light.

In particular, the LED package 130 is manufactured by molding a light emitting diode bonded on a lead frame to a resin material, and a shielding part 139 protruding toward the light emitting surface is further formed at at least one side end of the main body. It is characterized by being. The LED package 130 is bonded to the LED PCB 140 so that the shield 139 faces upward, that is, toward the liquid crystal panel 100. More detailed description of the LED package 130 will be described later.

The optical members 125, 127, and 150 for increasing the efficiency of light emitted from the LED package 130 include a light guide plate 125 for supplying incident light over the entire area of the liquid crystal panel 100, and a liquid crystal panel. A plurality of optical sheets 127 disposed between the light guide plate 125 and the light guide plate 125 to diffuse and condense the light guided by the light guide plate 125, and disposed on the rear surface of the light guide plate 125 to emit light emitted downward; It is made of a reflective plate 150 to reflect back in the light guide plate (125) direction.

According to this structure, the light incident on one side of the light guide plate 125 is repeatedly refracted and reflected by the diffusing agent added to the light guide plate 125 to the other side and then exits upward.

In addition, the optical sheet 127 is composed of a diffusion sheet and a prism sheet, and diffuses and condenses the light emitted from the light guide plate 12 to transfer to the liquid crystal panel 100, typically one sheet is provided with a diffusion sheet Preferably, the prism sheet is configured to be provided with at least two prism sheets so that the prism shape intersects in the horizontal and vertical directions to refract all the incident light in each direction to improve the straightness of the light.

The reflector 150 is disposed on the rear surface of the light guide plate 125 and serves to re-reflect light emitted downward to travel upward in the light guide plate 125, that is, in the direction of the liquid crystal panel 100.

The liquid crystal panel 100 and the backlight unit 120 having the above-described structure are mechanically modularized by the mechanism structure 160 described later, and include a guide panel 162, a bottom cover 165, and a top case 167. do.

Referring to the coupling structure, the guide panel 162 is an opaque synthetic resin structure in the form of a rectangular frame, it is preferable that the guide panel 162 is made of white with good reflective properties in order to increase the efficiency of light leaking from the backlight unit 120, Steps are formed in the liquid crystal panel 100 is seated on the upper surface in the direction. The backlight unit 120 is disposed in the inner space of the guide panel 162.

In addition, the guide panel 162 is coupled to the bottom cover 165 in the rear direction to surround the edge, so that the backlight unit 120 disposed in the interior space of the guide panel 162 is the bottom of the bottom cover 165. It is stored in the cotton.

The bottom cover 165 is coupled to the lower portion of the guide panel 162 to mount the backlight unit 120 and maintain the back rigidity of the modular liquid crystal display. The bottom cover 165 is not an essential component of the liquid crystal display module 100 of all types, and the bottom cover may be omitted in the case of a small liquid crystal display module used in a mobile device.

The top case 167 may be coupled in an upper direction of the guide panel 162 on which the liquid crystal panel 100 is seated, and may be coupled in a form in which an inner surface surrounds each outer surface of the bottom cover 165. The top case 167 serves to hold the liquid crystal panel 100 without departing from an impact applied from the outside.

The liquid crystal display device module including the backlight unit according to the embodiment of the present invention having such a structure is the LED package by the shielding portion 139 protruding upward in one side of the LED package 130 included in the light source 122. By reflecting the light traveling to the side of the 130 in the direction of the light guide plate 125, it is possible to ensure a high light efficiency even with the linear reflector 150, rather than the 'c'-shaped hot water generated in the liquid crystal panel 100 Spot phenomenon can be improved.

Hereinafter, the structure of the LED package according to an embodiment of the present invention with reference to the drawings.

4A to 4C are diagrams illustrating an LED package and a bonding form thereof according to an embodiment of the present invention.

As shown, the LED package 130 of the present invention is composed of a main body 132, a shield 139 protruding upward from one side of the main body 132.

As shown, the LED package 130 according to the embodiment of the present invention includes a light emitting diode device 131, the main body 132, a lead frame 133, a wire 134 and an encapsulant 117.

More specifically, the light emitting diode elements 131 are formed by growing a gallium nitride (GaN) thin film on a substrate such as sapphire, and a plurality of light emitting diode elements 131 may be mounted on the lead frame 133 according to a designer's intention. As illustrated, the semiconductor pad portion may be mounted in the form of being bonded to the wire 134 as the upper portion, and the flipped type may be omitted so that the substrate portion of the light emitting diode element 131 is bonded upward. It can also be implemented as a flip-type.

The active layer of the light emitting diode device 131 may be a multiple quantum well structure (MQW), and the wavelength and wavelength of the required band may be obtained by controlling the composition and thickness of the well layer and the barrier layer.

The main body 132 may be formed of a resin-based mold in which the light emitting diode element 131 is mounted inwards, and increases the efficiency of light emitted from the light emitting diode element 131. It protects the light emitting diode element 131 from the.

The lead frame 133 is for supplying power to the n-type GaN layer and the p-type GaN layer of the light emitting diode element 131 and is molded into the main body 132, and two electrodes are exposed below. In addition, the wire 134 is electrically connected to both semiconductor pads of the light emitting diode element 131.

Here, each electrode, that is, the anode and the cathode of the lead frame 133 can be identified by the polarity mark m displayed on the main body 132.

The wire 134 is for electrically connecting the light emitting diode element 131 and the lead frame 133, and may be one of gold, aluminum, and copper. As an example of the bonding method of the wire 134, a gold pressing wire may be applied to a thermocompression bonding method using heat and pressure at a temperature of 300 ° C. or higher, and an ultrasonic bonding method may be applied to an aluminum wire. .

The reflector 136 is formed on the inner surface of the cup on the main body 132 to further increase the efficiency of light emitted from the light emitting diode element 131.

The encapsulant 137 is formed in a form covering the upper portion of the light emitting diode element 131 on the lead frame 133, and is typically manufactured through a compounding step, a mixing step, a discharging step, and a curing step. The encapsulant 137 physically protects the components mounted inside the lead frame 133, and serves to diffuse the light emitted from the light emitting diode element 131 to the front side.

The shield 138 is in the form of a rectangular plate extending a predetermined length in the upper direction from at least one side of the main body 132, the width of the shield is the same as the main body 132, the protruding length is opposite to the LED package 130 It is formed to be larger than the minimum separation distance to the light guide plate. The shield 138 is made of the same material as the main body 132 and is manufactured separately from the main body 132 to be bonded to each other, and is manufactured at once through the same mold as the same material.

The LED package 130 having such a structure is bonded in a plurality arranged in a line on the LED PCB 140, bonded to the signal wiring formed on the LED PCB substrate 140, the lead frame of each LED package 130 133 are electrically connected to each other. In addition, the LED PCB 140 is attached to the flexible cable 149 which is electrically connected to the signal wiring on one side, through which it is connected to the external system.

By the shield of the LED package of this structure it is possible to minimize the light leaking between the light guide plate, and thus it is possible to improve the hot-spot phenomenon without a separate shield means, that is, the 'c' shaped reflector. Hereinafter, an LED package and a backlight unit according to an exemplary embodiment of the present invention will be described with reference to a cross-sectional view of a liquid crystal display module including the backlight unit of the present invention.

5 is a cross-sectional view of a part of a liquid crystal display module to which an LED package and a backlight unit according to an exemplary embodiment of the present invention are applied.

As shown, the liquid crystal display module to which the backlight unit of the present invention is applied includes a liquid crystal panel 100 for displaying an image, a backlight unit 120 for providing light to the liquid crystal panel 100, and a mechanical structure for modularizing the liquid crystal panel 100. 160.

The liquid crystal panel 100 is a structure in which a liquid crystal layer is interposed between two substrates bonded to face each other at a predetermined distance, and the light transmittance of the liquid crystal layer is controlled according to a signal applied from a driving driver (not shown) to implement an image.

The backlight unit 120 is positioned at the rear surface of the liquid crystal panel 100, and is provided as a light source 122, a light guide plate 125 disposed to face one side of the light source 122, and a front surface of the light guide plate 125. A plurality of optical sheets 127 and a straight reflector 150 disposed on the rear surface of the light guide plate 125 are included.

The light source 122 includes a plurality of LED packages 130 and LED PCBs 140 in which the LED packages 130 are arranged in a line. In particular, the LED package 130 has a shielding portion 138 having a predetermined length in a direction facing the light guide plate 125, and the LED package 130 has a shielding portion 138 upwards, that is, a liquid crystal panel ( Bonded to the LED PCB 140 to face 100). According to such a structure, of the light emitted from the light emitting diode device (not shown) mounted on the LED package 130, the light traveling in the upper direction, that is, the non-display area of the liquid crystal panel 100 by the shielding portion 138 It is blocked and is faced to the side of the light guide plate again.

The mechanism structure 160 includes a guide panel 162, a bottom cover 165, and a top case 167. The guide panel 162 mounts the liquid crystal panel 100 on the inner stepped portion, borders each corner thereof, and mounts the light guide plate 125 and the optical sheet 127 below.

The bottom cover 165 is fastened to the outside of the guide panel 162 to accommodate the backlight unit 120 on the bottom surface. In addition, the top case 167 covers the upper edge of the liquid crystal panel 100, that is, the bezel area, and is coupled to the bottom cover 165.

Most of the light emitted from the backlight unit 120 in the structure of the liquid crystal display module having such a structure passes through the light guide plate 125 to the display area of the liquid crystal panel 100, and thus, at the position of the LED package 130. The corresponding hot spot phenomenon is improved.

On the other hand, according to the heat generated from the LED package 130, the light guide plate 125 facing each other is expanded and the spacing of the LED package 130 is narrowed, the phenomenon that the light guide plate 125 is often melted below. Another embodiment of the present invention which improves the light guide plate breakage described above will be described.

6 is a cross-sectional view of a part of a liquid crystal display module including an LED package and a backlight unit according to another embodiment of the present invention.

As shown, the liquid crystal display module to which the backlight unit of the present invention is applied includes a liquid crystal panel 200 for displaying an image, a backlight unit 220 for providing light to the liquid crystal panel 200, and a mechanical structure for modularizing the liquid crystal panel 200. 260.

The liquid crystal panel 200 has a structure in which a liquid crystal layer is interposed between two substrates bonded to face each other at a predetermined distance, and has the same structure as in the above-described embodiment.

The backlight unit 220 is positioned as a rear surface of the liquid crystal panel 200, and is provided as a light source 222, a light guide plate 225 disposed to face one side of the light source 222, and a front surface of the light guide plate 225. A plurality of optical sheets 227 and a straight reflective plate 250 disposed on the rear surface of the light guide plate 225.

The light source 222 includes a plurality of LED packages 230 in which the shield 238 is formed, and an LED PCB 240 in which the LED packages 230 are arranged in a line, and the LED package 230 includes a shield ( 238 is bonded to the LED PCB 240 to face upward, that is, toward the liquid crystal panel 200. According to this structure, of the light emitted from the light emitting diode device (not shown), the light traveling in the upper direction, that is, the non-display area of the liquid crystal panel 100 is blocked by the shielding portion 238 to face the side of the light guide plate again. do.

In addition, a fixing member 239 having a predetermined serration pattern sp is further provided on an upper surface of the shield 238 protruding upward of the LED package 230.

The above-described fixing member 239 is formed at the same time in the form of an extension of the shielding portion 238 when the LED package 230 is manufactured as a mold, or is manufactured as a separate member from the LED package 230 and the LED package 230 After bonding), it may be formed by attaching using an adhesive or the like.

The fixing member 239 protrudes to be in contact with the upper side end portion of the light guide plate 225, and the tooth pattern sp is formed at a portion in contact with the light guide plate 225. In addition, a tooth pattern sp is formed at a portion of the light guide plate 225 that is in contact with the fixing member 239, so that the light guide plate 225 is fixed by the bite of the light guide plate 225 and the fixing member 239. Even if the light guide plate 225 is expanded by heat, the fixing member 239 supports it, thereby preventing the LED package 230 from being pushed in the direction.

The mechanism structure 260 includes a guide panel 262, a bottom cover 265, and a top case 267. The guide panel 262 mounts the liquid crystal panel 200 on the inner stepped portion, mounts the light guide plate 225 and the optical sheet 227 formed with a tooth pattern sp at the bottom edges thereof.

The bottom cover 265 is fastened to the outside of the guide panel 262 to receive the backlight unit 220 on the bottom surface. In addition, the top case 267 covers the upper edge of the liquid crystal panel 200, that is, the bezel area, and is coupled to the bottom cover 265.

According to this structure, the side of the light guide plate expanded by the heat generated in the LED package is separated by the fixing member attached to the LED package, so that the separation distance from the LED package is maintained to prevent breakage of the light guide plate.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments.

100: liquid crystal panel 115: drive driver
116: flexible cable 120: backlight unit
122: light source 125: light guide plate
127: optical sheet 130: LED package
138: shield 140: LED PCB
150: reflector 162: guide panel
165: bottom cover 167: top case

Claims (9)

Light emitting diode elements;
A lead frame to which the light emitting diodes are bonded; And
A main body molding the lead frame and having a shielding portion protruding in at least one side surface in a light emitting direction
LED package comprising a. The method according to claim 1,
LED shield, characterized in that the shield is integral with the body. The method of claim 1,
The shielding portion
LED package, characterized in that the fixing member is further protruded in the light emitting direction on the outer surface. The method of claim 3, wherein
The fixing member is a LED package, characterized in that a serration pattern is formed on at least one surface. The method according to claim 1,
A wire electrically connecting the light emitting diode element and the lead frame; And
Encapsulant Molding the LED Element
LED package, characterized in that it further comprises. At least one LED package including a body having a shielding portion protruding in a light emitting direction;
LED PCB in which one or more of the LED package is arranged in a line;
A light guide plate having at least one side surface facing the light emitting surface of the LED package and configured to guide incident light to the front surface;
An optical sheet disposed on a front surface of the light guide plate to diffuse and collect incident light; And
A reflector disposed on a rear surface of the light guide plate to reflect incident light to the light guide plate
Backlight unit comprising a. The method according to claim 6,
The LED package,
And the shield is disposed on the LED PCB so as to be parallel to the front surface of the light guide plate. The method according to claim 6,
The LED package,
And a fixing member contacting one surface of the light guide plate on an outer surface of the shield. The method of claim 8,
The fixing member and the light guide plate, the backlight unit characterized in that a serration pattern is formed on the contact surface.

KR1020110090341A 2011-09-06 2011-09-06 Led pakage and backlight unit inculding the same KR20130026893A (en)

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Application Number Priority Date Filing Date Title
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Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20150078935A (en) * 2013-12-31 2015-07-08 엘지이노텍 주식회사 The backlight unit
TWI507795B (en) * 2013-11-12 2015-11-11 Wistron Corp Backlight module
CN105511160A (en) * 2015-12-24 2016-04-20 贵州晟鑫辉科技有限公司 Lateral entrance type reflector plate and backlight module containing same
US9470839B2 (en) 2014-06-19 2016-10-18 Samsung Display Co., Ltd. Light source module and backlight unit including the same
US9658487B2 (en) 2015-03-30 2017-05-23 Samsung Display Co., Ltd. Display device including support frame having reflective stepped portion
US9995869B2 (en) 2014-10-15 2018-06-12 Samsung Display Co., Ltd. Backlight unit and display device having the same
WO2018205828A1 (en) * 2017-05-11 2018-11-15 京东方科技集团股份有限公司 Backlight module and display device
CN114415414A (en) * 2022-01-25 2022-04-29 合肥京东方光电科技有限公司 Front light module and display device

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI507795B (en) * 2013-11-12 2015-11-11 Wistron Corp Backlight module
KR20150078935A (en) * 2013-12-31 2015-07-08 엘지이노텍 주식회사 The backlight unit
US9470839B2 (en) 2014-06-19 2016-10-18 Samsung Display Co., Ltd. Light source module and backlight unit including the same
US9995869B2 (en) 2014-10-15 2018-06-12 Samsung Display Co., Ltd. Backlight unit and display device having the same
US9658487B2 (en) 2015-03-30 2017-05-23 Samsung Display Co., Ltd. Display device including support frame having reflective stepped portion
CN105511160A (en) * 2015-12-24 2016-04-20 贵州晟鑫辉科技有限公司 Lateral entrance type reflector plate and backlight module containing same
WO2018205828A1 (en) * 2017-05-11 2018-11-15 京东方科技集团股份有限公司 Backlight module and display device
CN114415414A (en) * 2022-01-25 2022-04-29 合肥京东方光电科技有限公司 Front light module and display device
CN114415414B (en) * 2022-01-25 2024-01-16 合肥京东方光电科技有限公司 Front light module and display device

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