KR102366671B1 - 기판을 처리하기 위한 방법 및 장치 - Google Patents

기판을 처리하기 위한 방법 및 장치 Download PDF

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Publication number
KR102366671B1
KR102366671B1 KR1020170175039A KR20170175039A KR102366671B1 KR 102366671 B1 KR102366671 B1 KR 102366671B1 KR 1020170175039 A KR1020170175039 A KR 1020170175039A KR 20170175039 A KR20170175039 A KR 20170175039A KR 102366671 B1 KR102366671 B1 KR 102366671B1
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South Korea
Prior art keywords
substrate
seal
wet
external space
holding member
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KR1020170175039A
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Korean (ko)
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KR20180077027A (ko
Inventor
다카히사 오쿠조노
줌페이 후지카타
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가부시키가이샤 에바라 세이사꾸쇼
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    • H01L21/02052—
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34—Pretreatment of metallic surfaces to be electroplated
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/10—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H10P70/15—Cleaning before device manufacture, i.e. Begin-Of-Line process by wet cleaning only
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1619—Apparatus for electroless plating
    • C23C18/1628—Specific elements or parts of the apparatus
    • C23C18/163—Supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/1803—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
    • C23C18/1824—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment
    • C23C18/1827—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment only one step pretreatment
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/004—Sealing devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/08—Rinsing
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • H01L21/6704—
    • H01L21/67242—
    • H01L22/10—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Automation & Control Theory (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manufacturing & Machinery (AREA)
KR1020170175039A 2016-12-28 2017-12-19 기판을 처리하기 위한 방법 및 장치 Active KR102366671B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2016-255283 2016-12-28
JP2016255283A JP7067863B2 (ja) 2016-12-28 2016-12-28 基板を処理するための方法および装置

Publications (2)

Publication Number Publication Date
KR20180077027A KR20180077027A (ko) 2018-07-06
KR102366671B1 true KR102366671B1 (ko) 2022-02-23

Family

ID=62625643

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020170175039A Active KR102366671B1 (ko) 2016-12-28 2017-12-19 기판을 처리하기 위한 방법 및 장치

Country Status (4)

Country Link
US (2) US10508352B2 (https=)
JP (1) JP7067863B2 (https=)
KR (1) KR102366671B1 (https=)
TW (1) TWI737869B (https=)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7085968B2 (ja) * 2018-11-15 2022-06-17 株式会社荏原製作所 基板ホルダ、めっき装置および基板のめっき方法
JP7132136B2 (ja) * 2019-01-23 2022-09-06 上村工業株式会社 ワーク保持治具及び電気めっき装置
AT522169B1 (de) * 2019-10-16 2020-09-15 Ess Holding Gmbh Vorrichtung zur Oberflächenbehandlung eines Werkstückes in einer Fertigungsstraße
KR102343769B1 (ko) * 2020-08-18 2021-12-28 한국과학기술연구원 플라즈마 전해산화 장치 및 이를 이용한 플라즈마 전해산화방법
KR102835057B1 (ko) * 2020-08-25 2025-07-18 주식회사 제우스 기판처리장치 및 그 제어방법
US12347697B2 (en) 2021-05-31 2025-07-01 Ebara Corporation Prewet module and prewet method
WO2022254485A1 (ja) 2021-05-31 2022-12-08 株式会社荏原製作所 プリウェットモジュール、およびプリウェット方法
CN115715337B (zh) * 2021-10-14 2023-09-08 株式会社荏原制作所 预湿处理方法
JP7081063B1 (ja) * 2021-10-18 2022-06-06 株式会社荏原製作所 めっき方法及びめっき装置
TWI803026B (zh) * 2021-10-25 2023-05-21 日商荏原製作所股份有限公司 鍍覆方法及鍍覆裝置
WO2023248416A1 (ja) * 2022-06-23 2023-12-28 株式会社荏原製作所 プリウェットモジュール、およびプリウェット方法
CN115241114B (zh) * 2022-08-17 2023-10-10 常熟市兆恒众力精密机械有限公司 一种晶圆盘夹具

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130255360A1 (en) 2012-03-27 2013-10-03 Ebara Corporation Plating method and plating apparatus
US20160102397A1 (en) 2014-10-08 2016-04-14 Applied Materials, Inc. Vacuum pre-wetting apparatus and methods

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01240694A (ja) * 1988-03-18 1989-09-26 Hanami Kagaku Kk 狭隙空間部分に対するメッキ方法
JP4664320B2 (ja) 2000-03-17 2011-04-06 株式会社荏原製作所 めっき方法
JP5681681B2 (ja) * 2012-08-31 2015-03-11 日本エレクトロプレイテイング・エンジニヤース株式会社 前処理方法及び前処理装置
US9617648B2 (en) * 2015-03-04 2017-04-11 Lam Research Corporation Pretreatment of nickel and cobalt liners for electrodeposition of copper into through silicon vias

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130255360A1 (en) 2012-03-27 2013-10-03 Ebara Corporation Plating method and plating apparatus
US20160102397A1 (en) 2014-10-08 2016-04-14 Applied Materials, Inc. Vacuum pre-wetting apparatus and methods

Also Published As

Publication number Publication date
US11371155B2 (en) 2022-06-28
JP7067863B2 (ja) 2022-05-16
US10508352B2 (en) 2019-12-17
KR20180077027A (ko) 2018-07-06
US20180179656A1 (en) 2018-06-28
US20200080218A1 (en) 2020-03-12
TW201839181A (zh) 2018-11-01
JP2018104799A (ja) 2018-07-05
TWI737869B (zh) 2021-09-01

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