KR102356380B1 - Curved display device - Google Patents

Abstract

The present invention relates to a curved display device capable of minimizing a bezel area of a curved display device having multiple curvatures at each of four side corners of the curved cover glass. A curved display device according to an exemplary embodiment includes a flat portion, a first curved portion extending from a first side of the flat portion and bent at a first curvature, and a second curved portion extending from a second side of the flat portion and bent at a second curvature. a curved substrate including two curvature portions, and multiple curvature portions overlapped with the first curved portion and the second curved portion to be bent into multiple curvatures; and a display module disposed on a lower surface of the curved substrate and including a pixel array layer disposed on the substrate. The edge of the substrate is disposed on the multi-curvature portion.

Description

Curved display device {CURVED DISPLAY DEVICE}

The present invention relates to a curved display device.

As the information society develops, the demand for a display device for displaying an image is increasing in various forms. Accordingly, recently, a liquid crystal display (LCD), a non-emission display device such as a plasma display panel (PDP), and an organic light emitting display (OLED), quantum dot emission Various display devices such as an electroluminescence display such as a quantum dot light emitting display (QLED) are being used.

Recently, an organic light emitting display device has been developed as a curved display device in which both edges of the flexible display device or four edges of the display device are curved. The curved display device refers to a display device in which a flexible display module is attached to a curved cover glass.

1 is an exemplary view showing a curved cover glass in which four sides of up, down, left and right are bent. Referring to FIG. 4 , an upper side of the curved cover glass (CCG) has a first curvature having a first directionality, a left side has a second curvature having a second directionality, a right side has a third curvature having a third directionality, and a lower side thereof is a fourth directionality It can be bent with a fourth curvature having Each of the four side corners C1 to C4 of the curved cover glass CCG is formed to have multiple curvatures including curvatures having different directions. For example, the upper left corner C1 of the curved cover glass CCG may be formed to have multiple curvatures including a first curvature having a first directionality and a second curvature having a second directionality. The upper right corner C2 of the curved cover glass CCG may be formed to have multiple curvatures including a first curvature having a first directionality and a third curvature having a third directionality. The lower right corner C3 of the curved cover glass CCG may be formed to have multiple curvatures including a second curvature having a second directionality and a fourth curvature having a fourth directionality. The lower right corner C1 of the curved cover glass CCG may be formed to have multiple curvatures including a third curvature having a third directionality and a fourth curvature having a fourth directionality.

Since each of the four side corners of the curved cover glass CCG has multiple curvatures, there may be interference with the curved cover glass CCG when the flexible display module FDP is disposed. Accordingly, the flexible display module FDP is not disposed on the lower surfaces of the four side corners C1 to C4 of the curved cover glass CCG. In this case, the flexible display module FDP is not disposed above and below the curved cover glass CCG as shown in FIG. 1 . Accordingly, there is a problem in that the distances D1 and D2 from the upper end or lower end of the cover glass CCG to the display area DA of the flexible display module FDP become longer. That is, there is a problem in that the bezel area of the curved display device is widened.

An object of the present invention is to provide a curved display device capable of minimizing the bezel area of the curved display device having multiple curvatures at each of the four side corners of the curved cover glass.

A curved display device according to an exemplary embodiment includes a flat portion, a first curved portion extending from a first side of the flat portion and bent at a first curvature, and a second curved portion extending from a second side of the flat portion and bent at a second curvature. a curved substrate including two curvature portions, and multiple curvature portions overlapped with the first curved portion and the second curved portion to be bent into multiple curvatures; and a display module disposed on a lower surface of the curved substrate and including a pixel array layer disposed on the substrate. The edge of the substrate is disposed on the multi-curvature portion.

According to an embodiment of the present invention, the flexible display module is disposed not only on the flat portion and the first to fourth curved portions of the curved substrate, but also the first to fourth multi-curvature portions. As a result, according to an embodiment of the present invention, the non-display area of the flexible display module may be disposed on the first to fourth multi-curvature portions. Accordingly, according to the exemplary embodiment of the present invention, the distance from the upper end or lower end of the cover glass to the display area of the flexible display module can be reduced, so that the bezel area of the curved display device can be minimized.

In addition, in the exemplary embodiment of the present invention, in consideration of the multiple curvatures of the first multiple curvature portion, the support substrate of the flexible display module and the corners of the flexible substrate are formed in an obliquely cut shape. As a result, the embodiment of the present invention can prevent the support substrate from interfering with the curved substrate.

Furthermore, according to an embodiment of the present invention, the length of the flexible substrate that may not interfere with the curved substrate in the first multi-curvature portion may be calculated according to the thickness from the flexible substrate to the curved substrate. As a result, in the embodiment of the present invention, by obliquely cutting the edge of the flexible substrate according to the calculated length of the flexible substrate, it is possible to prevent the flexible substrate from interfering with the curved substrate.

1 is an exemplary view showing a curved cover glass in which four sides of up, down, left and right are bent.
2 is a perspective view of a curved display device according to an embodiment of the present invention.
3 is a plan view of a curved display device according to an embodiment of the present invention.
4 is a bottom view of a curved display device according to an embodiment of the present invention.
FIG. 5 is an enlarged bottom view illustrating in detail the first corner of FIG. 4 .
FIG. 6 is a cross-sectional view taken along line I-I' of FIG. 4 .
FIG. 7 is a cross-sectional view taken along line II-II' of FIG. 4 .
8 is a cross-sectional view illustrating an example of the flexible display module of FIGS. 6 and 7 .
9 is a cross-sectional view illustrating a display area of the flexible display module of FIG. 8 in detail.
FIG. 10 is an enlarged bottom view illustrating in detail a second corner portion of FIG. 4 .

Like reference numerals refer to substantially identical elements throughout. In the following description, a detailed description of configurations and functions known in the art and cases not related to the core configuration of the present invention may be omitted. The meaning of the terms described in this specification should be understood as follows.

Advantages and features of the present invention and methods of achieving them will become apparent with reference to the embodiments described below in detail in conjunction with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but will be implemented in a variety of different forms, and only these embodiments allow the disclosure of the present invention to be complete, and common knowledge in the technical field to which the present invention belongs It is provided to fully inform the possessor of the scope of the invention, and the present invention is only defined by the scope of the claims.

The shapes, sizes, proportions, angles, numbers, etc. disclosed in the drawings for explaining the embodiments of the present invention are illustrative and the present invention is not limited to the illustrated matters. Like reference numerals refer to like elements throughout. In addition, in describing the present invention, if it is determined that a detailed description of a related known technology may unnecessarily obscure the gist of the present invention, the detailed description thereof will be omitted.

When 'including', 'having', 'consisting', etc. mentioned in this specification are used, other parts may be added unless 'only' is used. When a component is expressed in the singular, the case in which the plural is included is included unless otherwise explicitly stated.

In interpreting the components, it is construed as including an error range even if there is no separate explicit description.

In the case of a description of the positional relationship, for example, when the positional relationship of two parts is described as 'on', 'on', 'on', 'beside', etc., 'right' Alternatively, one or more other parts may be positioned between two parts unless 'directly' is used.

In the case of a description of a temporal relationship, for example, 'immediately' or 'directly' when a temporal relationship is described with 'after', 'following', 'after', 'before', etc. It may include cases that are not continuous unless this is used.

Although the first, second, etc. are used to describe various elements, these elements are not limited by these terms. These terms are only used to distinguish one component from another. Accordingly, the first component mentioned below may be the second component within the spirit of the present invention.

"X-axis direction", "Y-axis direction", and "Z-axis direction" should not be interpreted only as a geometric relationship in which the relationship between each other is vertical, and is wider than within the scope where the configuration of the present invention can function functionally. It may mean having a direction.

The term “at least one” should be understood to include all possible combinations of one or more related items. For example, the meaning of “at least one of the first, second, and third items” means that each of the first, second, or third items as well as two of the first, second and third items It may mean a combination of all items that can be presented from more than one.

Each feature of the various embodiments of the present invention may be partially or wholly combined or combined with each other, technically various interlocking and driving are possible, and each of the embodiments may be independently implemented with respect to each other or implemented together in a related relationship. may be

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

2 is a perspective view of a curved display device according to an embodiment of the present invention. 3 is a plan view of a curved display device according to an embodiment of the present invention. 4 is a bottom view of a curved display device according to an embodiment of the present invention.

2 to 4 , a curved display device (CDIS) according to an embodiment of the present invention includes a curved substrate 10 , a first adhesive layer 20 , a flexible display module 30 , and a heat dissipation substrate 40 . ), etc.

The curved substrate 10 may be formed of a plastic film or a glass substrate. The curved substrate 10 includes a flat portion FA, first to fourth curved portions CA1 to CA4, and first to fourth multi-curvature portions DCA1 to DCA4 as shown in FIG. 2 .

The flat portion FA corresponds to a central area of the curved substrate 10 .

The first curved portion CA1 may be a first side region of the curved substrate 10 , and an upper region of the curved substrate 10 as shown in FIG. 3 . The first curvature portion CA1 has a first directionality and is bent at the first curvature, and may be an area extending from the first side of the flat portion FA.

The second curved portion CA2 may be a second side region of the curved substrate 10 , and a left region of the curved substrate 10 as shown in FIG. 3 . The second curvature portion CA2 has a second directionality and is bent at the second curvature, and may be an area extending from the second side of the flat portion FA.

The third curved portion CA3 may be a third side region of the curved substrate 10 , and may be a right region of the curved substrate 10 as shown in FIG. 3 . The third curvature portion CA3 has a third directionality and is curved at the third curvature, and may be an area extending from the third side of the flat portion FA.

The fourth curved portion CA4 may be a fourth side region of the curved substrate 10 , and a lower region of the curved substrate 10 as shown in FIG. 3 . The fourth curvature portion CA4 has a fourth directionality and is curved at the fourth curvature, and may be an area extending from the fourth side of the flat portion FA.

3 and 4 , the first multi-curvature portion DCA1 may be an area in which the first curved portion CA1 and the second curved portion CA2 overlap and are bent to multiple curvatures. The first multi-curvature portion DCA1 may be located at the first corner portion C1 corresponding to the upper left corner portion of the curved substrate 10 .

3 and 4 , the second multi-curvature portion DCA2 may be an area in which the first curved portion CA1 and the third curved portion CA3 overlap and are bent to multiple curvatures. The second multi-curvature portion DCA2 may be positioned at the second corner portion C2 corresponding to the upper right corner portion of the curved substrate 10 .

3 and 4 , the third multi-curvature portion DCA3 may be an area in which the second curved portion CA2 and the fourth curved portion CA4 overlap and are bent to multiple curvatures. The third multi-curvature portion DCA2 may be positioned at the third corner portion C3 corresponding to the lower left corner portion of the curved substrate 10 .

3 and 4 , the fourth multi-curvature portion DCA4 may be an area in which the third curved portion CA3 and the fourth curved portion CA4 overlap and are bent to multiple curvatures. The fourth multi-curvature portion DCA4 may be positioned at the fourth corner portion C4 corresponding to the lower right corner portion of the curved substrate 10 .

Meanwhile, in FIGS. 2 to 4 , for convenience of explanation, the curved substrate 10 includes four curvature portions CA1 to CA4 and four multi-curvature portions DCA1 to DCA4, but is not limited thereto. does not That is, the curved substrate 10 may include at least two curved portions and only one multi-curvature portion formed by overlapping them.

Also, the first to fourth curvatures of the curved substrate 10 may be different from each other. Alternatively, the first and fourth curvatures may be equal to each other and the second and third curvatures may be equal to each other. Alternatively, the first and fourth curvatures may be the same as each other, but the second and third curvatures may be different from each other. Alternatively, the second and third curvatures may be the same as each other, but the first and fourth curvatures may be different from each other.

A decoration layer having a predetermined pattern formed thereon may be formed on the lower surface of the curved substrate 10 . The decoration layer may be a layer on which a pattern that can be shown to a user is formed even when the flexible display module 30 does not display an image. For example, a company logo may be formed on the decoration layer. Alternatively, the decoration layer may include a color layer formed in an area corresponding to the bezel area of the flexible display module. For example, the decoration layer may include a color layer having a black color, and in this case, the color layer of the decoration layer is the display area of the flexible display module 30 and the display area of the flexible display module 30 when the flexible display module 30 does not display an image. It can be expressed in the same color. Accordingly, the screen of the flexible display module 30 may appear wide to the user.

The flexible display module 30 may be disposed on the lower surface of the curved substrate 10 . As shown in FIG. 4 , the flexible display module 30 includes a flat portion FA, first to fourth curved portions CA1 to CA4 , and first to fourth multi-curvature portions DCA1 to DCA4 of the curved substrate 10 , as shown in FIG. 4 . ) can be placed in

The flexible display module 30 is a display device that displays a predetermined image. For example, the flexible display module 30 may be an organic light emitting display device or a quantum dot light emitting display device, but is not limited thereto. A detailed description of the flexible display module 30 will be described later with reference to FIGS. 5 to 10 .

A heat dissipation layer 40 may be disposed on a lower surface of the flexible display module 30 . The heat dissipation layer 40 may include a metal layer having high thermal conductivity to effectively dissipate heat generated from the flexible display module 30 . In addition, the heat dissipation layer 40 may include a foam that serves as a buffer to protect the flexible display module 30 from external impact.

The touch circuit board 60 may be attached to the upper surface of the flexible display module 30 , and may be bent toward the lower surface of the flexible display module 30 to be disposed on the lower surface of the heat dissipation layer 40 .

As described above, according to the embodiment of the present invention, the flexible display module 30 is provided not only in the flat portion FA and the first to fourth curved portions CA1 to CA4 of the curved substrate 10 , but also in the first to fourth multi-curvature portions DCA1 to DCA4 are also disposed. As a result, according to an embodiment of the present invention, the non-display area of the flexible display module 30 may be disposed on the first to fourth multi-curvature portions DCA1 to DCA4 . Accordingly, according to the exemplary embodiment of the present invention, the distance from the upper end or lower end of the cover glass CCG to the display area DA of the flexible display module FDP can be reduced, and thus the bezel area of the curved display device. ) can be minimized.

FIG. 5 is an enlarged bottom view illustrating in detail the first corner of FIG. 4 . 5 is an enlarged bottom view of the first corner portion C1 of the curved substrate 10 on which the first multi-curvature portion DCA1 is positioned.

In FIG. 5 , only the curved substrate 10 , the support substrate 31 of the display module 30 , the heat dissipation layer 40 , the first adhesive layer 20 , and the touch circuit board 60 are illustrated for convenience of explanation. . The first adhesive layer 20 is a layer for bonding the display module 30 to the curved substrate 10 and is not visible from the bottom view, and thus is illustrated with a dotted line.

Referring to FIG. 5 , the curved substrate 10 has a first curvature CA1 bent from the flat portion FA to a first curvature in the y-axis direction, and a second curvature in the x-axis direction from the flat portion FA. The second curved portion CA2, and the first multi-curvature portion DCA1 bent to multiple curvatures including the first and second curvatures in the overlapping region of the first and second curved portions CA1 and CA2 ) is included. 5 illustrates that the second curvature is greater than the first curvature.

The support substrate 31 of the display module 30 is disposed on the lower surface of the curved substrate 10 . The support substrate 31 of the display module 30 may be disposed on the flat portion FA, the first curved portion CA1 , the second curved portion CA2 , and the first multi-curvature portion DCA1 . The edge of the support substrate 31 and the edge of the flexible substrate 32 (refer to FIGS. 6 and 7 ) supported by the support substrate 31 may be disposed in the first multi-curvature portion DCA1 as shown in FIG. 5 . In this case, in order to prevent the support substrate 31 from interfering with the curved substrate 10 , the corners of the support substrate 31 and the flexible substrate 32 are formed in consideration of the multiple curvatures of the first multi-curvature portion DCA1 . It may be formed in an obliquely cut shape. For example, if the second curvature bent in the x-axis direction is greater than the first curvature bent in the y-axis direction as shown in FIG. 5 , the cutting length (a) in the x-axis direction in the support substrate 31 and the flexible substrate 32 ) may be shorter than the cut length (b) in the y-axis direction. 5 illustrates that the corners of the support substrate 31 and the flexible substrate 32 are formed in an oblique line, but is not limited thereto, and may be formed in a curved shape (elliptical shape).

The heat dissipation layer 40 is disposed on the lower surface of the support substrate 31 of the display module 30 . The heat dissipation layer 40 may be disposed on the flat portion FA, the first curved portion CA1 , the second curved portion CA2 , and the first multi-curvature portion DCA1 . The edge of the heat dissipation layer 40 may be disposed on the first multi-curvature portion DCA1 as shown in FIG. 5 . The edge of the heat dissipation layer 40 may be formed in a shape cut obliquely similarly to the edge of the support substrate 31 and the flexible substrate 32 .

The first adhesive layer 20 is disposed between the lower surface of the curved substrate 10 and the upper surface of the display module 30 , and adheres the lower surface of the curved substrate 10 to the upper surface of the display module 30 . The first adhesive layer 20 may be disposed on the flat portion FA, the first curved portion CA1 , and the second curved portion CA2 . For this reason, based on the y-axis direction, the distance D3 from the first adhesive layer 20 to the end of the curved substrate 10 from the first curved portion CA1 is the first multiple from the first adhesive layer 20 . It may be shorter than the distance D4 from the curved portion DCA1 to the end of the curved substrate 10 . In addition, based on the x-axis direction, the distance D5 from the first adhesive layer 20 to the end of the curved substrate 10 from the second curved portion CA2 is the first multiple curvature from the first adhesive layer 20 . It may be shorter than the distance D6 from the portion DCA1 to the end of the curved substrate 10 .

In addition, since the first multiple curvature portion DCA1 is bent to multiple curvatures including the first curvature and the second curvature, the display module 30 is formed in the first multiple curvature portion DCA1 using the first adhesive layer 20 . ), problems such as overlapping of the first adhesive layer 20 may occur. Therefore, in the embodiment of the present invention, it is preferable that the first adhesive layer 20 is not disposed on the first multi-curvature portion DCA1 .

Meanwhile, an enlarged bottom view of the second corner portion C2 of the curved substrate 10 on which the second multi-curvature portion DCA2 is positioned is substantially the same as that illustrated in FIG. 5 symmetrically with respect to the y-axis. Accordingly, an enlarged bottom view of the second corner portion C2 of the curved substrate 10 is omitted.

As described above, in the embodiment of the present invention, the corners of the support substrate 31 and the flexible substrate 32 of the flexible display module 30 are cut obliquely in consideration of the multiple curvatures of the first multiple curvature portion DCA1 . formed in the form As a result, the embodiment of the present invention can prevent the support substrate 31 from interfering with the curved substrate 10 .

6 is a cross-sectional view taken along line I-I' of FIG. 4 . FIG. 7 is a cross-sectional view taken along line II-II' of FIG. 4 .

6 and 7 , a curved display device (CDIS) according to an embodiment of the present invention includes a curved substrate 10 , a first adhesive layer 20 , a display module 30 , and a heat dissipation layer 40 . , a flexible film 50 , and a touch circuit board 60 .

Since the curved substrate 10 has been described in detail with reference to FIGS. 2 to 4 , a detailed description thereof will be omitted.

The flexible display module 30 may be disposed on the lower surface of the curved substrate 10 . As shown in FIG. 4 , the flexible display module 30 includes a flat portion FA, first to fourth curved portions CA1 to CA4 , and first to fourth multi-curvature portions DCA1 to DCA4 of the curved substrate 10 , as shown in FIG. 4 . ) can be placed in

The flexible display module 30 is a display device that displays a predetermined image. For example, the flexible display module 30 may be an organic light emitting display device or a quantum dot light emitting display device, but is not limited thereto. Hereinafter, for convenience of description, the flexible display module 30 will be mainly described as an organic light emitting display device.

The display module 30 may include a support substrate 31 , a flexible substrate 32 , a pixel array layer 33 , a barrier film 34 , and a polarizing film 35 .

The support substrate 31 is a substrate for supporting the flexible substrate 32 and may be formed of plastic or glass. For example, the support substrate 31 may be formed of polyethylene terephthalate (PET).

The flexible substrate 32 may be disposed on the upper surface of the support substrate 31 and may be formed of a plastic film having flexibility. For example, the flexible substrate 32 may be formed of a polyimide film.

The pixel array layer 33 may be formed on the top surface of the flexible substrate 32 . The pixel array layer 33 is a layer for displaying an image by means of a plurality of pixels. The pixel array layer 33 may include a thin film transistor layer, a light emitting device layer, and an encapsulation layer. A detailed description of the pixel array layer of the display module 30 will be described later with reference to FIGS. 8 and 9 .

The barrier film 34 may be disposed to cover the pixel array layer 33 in order to protect the pixel array layer 33 from oxygen or moisture. That is, the barrier film 34 may be disposed on the pixel array layer 33 . The barrier film 34 may include a touch sensing layer for sensing a user's touch.

The polarizing film 35 may be attached on the upper surface of the barrier film 34 to prevent deterioration of visibility due to reflection of external light. The polarizing film 35 may be disposed to overlap the pixel array layer 33 .

The first adhesive layer 20 is disposed between the curved substrate 10 and the display module 30 to adhere the curved substrate 10 and the polarizing film 35 of the display module 30 . The first adhesive layer 20 may be an optically transparent resin (OCR) or an optically transparent adhesive film (OCA film).

The heat dissipation layer 40 may be disposed on the lower surface of the support substrate 31 of the display module 30 . The heat dissipation layer 40 may include a metal layer 41 having high thermal conductivity to effectively dissipate heat generated from the flexible display module 30 . For example, the metal layer 41 may be copper (Cu), aluminum (Al), or aluminum nitride (AlN). In addition, the heat dissipation layer 40 may include a foam 42 that serves as a buffer to protect the display module 30 from external impact. When the heat dissipation layer 40 includes the metal layer 41 and the foam 42 , the foam 42 is disposed on the lower surface of the support substrate 31 , and the metal layer 41 is formed on the lower surface of the foam 42 . can be placed.

The flexible film 50 may be a chip on film (COF) on which the driving IC 51 is mounted. The driving IC 51 may be a source driving IC for supplying driving signals to the data lines of the pixel array layer 33 .

The flexible film 50 may be attached in a bent form as shown in FIG. 6 . One side of the flexible film 50 is attached to the upper surface of the flexible substrate 32 using a first anisotropic conductive film 71 , and the other side is a heat dissipation layer 40 through a second adhesive layer 73 . ) may be attached to the lower surface of the metal layer 41 . Specifically, one side of the flexible film 50 may be attached to pads provided on the upper surface of the flexible substrate 32 not covered by the barrier film 34 . Since the pads provided on the upper surface of the flexible substrate 32 are connected to the data lines of the pixel array layer 33 , driving signals of the source drive IC are transmitted to the data of the pixel array layer 33 through the flexible film 50 and the pads. can be supplied to the lines.

The touch circuit board 60 may include a touch sensing circuit 61 for supplying touch signals to the touch sensing layer of the barrier film 34 and sensing a user's touch input. The touch circuit board 60 may be a flexible printed circuit board having flexibility.

The touch circuit board 60 may be attached in a bent form as shown in FIG. 6 . One side of the touch circuit board 60 is attached to the upper surface of the barrier film 34 using the second anisotropic conductive film 92 , and the other side is the other side of the flexible film 50 through the third adhesive layer 94 . can be attached to the side. Specifically, one side of the touch circuit board 60 may be attached to pads provided on the upper surface of the barrier film 34 not covered by the polarizing film 35 . Since the pads provided on the upper surface of the barrier film 34 are connected to the touch sensing layer of the barrier film 34 , the touch signals of the touch sensing circuit 61 of the touch circuit board 60 are applied to the touch circuit board 60 and the pad. It can be supplied to the touch sensing layer of the barrier film 34 through the.

Meanwhile, the first adhesive layer 20 may cover one side of the touch circuit board 60 attached to the upper surface of the barrier film 34 . In this case, since one side of the touch circuit board 60 attached to the upper surface of the barrier film 34 is fixed by the first adhesive layer 20, the touch circuit board 60 is Even if an external force is applied to the attachment region, one side of the touch circuit board 60 may be prevented from being unstucked or sagging from the barrier film 34 .

The upper or lower surface of the other side of the flexible film 50 may be attached to the main circuit board on which the control circuit is mounted using an anisotropic conductive film. In addition, the upper or lower surface of the other side of the touch circuit board 60 may be attached to the main circuit board through an adhesive layer. The main circuit board may be fixedly attached to the lower surface of the metal layer 41 of the heat dissipation layer 40 . The main circuit board may be a flexible printed circuit board or a printed circuit board.

On the other hand, as shown in FIG. 7 , on the lower surface of the curved substrate 10 , a point corresponding to the boundary portion BD of the first multi-curvature portion DCA1 is A, and a point corresponding to the boundary portion BD in the flexible substrate 32 is selected If B and a point corresponding to the curved substrate 10 closest to the flexible substrate 32 are referred to as C, then A, B, and C may be connected to form a triangle. At this time, if the distance from A to B is X, the distance from B to C is Y, and the angle at C is θ, X is the thickness from the flexible substrate 32 to the curved substrate 10, and Y is It may be referred to as the sum of the length Y1 from the first multi-curvature portion DCA1 to the end of the flexible substrate 32 and the distance Y2 between the end of the flexible substrate 32 and the curved substrate 10 . Therefore, when the flexible substrate 32 is in contact with the curved substrate 10 , the length of the flexible substrate 32 in contact with the curved substrate 10 in the first multiple curvature DCA1 is Y. can X, Y, and θ may be defined as in Equation 1.

In order for the flexible substrate 32 not to interfere with the curved substrate 10 in the first multi-curvature portion CA1 , the length of the flexible substrate 32 in the first multi-curvature portion CA1 is calculated by Equation 1 It can be set to be smaller than Y. That is, the edge of the flexible substrate 32 may be cut obliquely as shown in FIG. 5 according to Y calculated by Equation 1 .

On the other hand, when the length Y1 of the flexible substrate 32 in the first multi-curvature portion CA1 is Y, the flexible substrate 32 may contact the curved substrate 10, in this case the curved substrate ( 10 ) A buffer member for protecting the flexible substrate 32 may be formed on a side surface of the flexible substrate 32 .

As described above, the embodiment of the present invention may not interfere with the curved substrate 10 in the first multi-curvature portion CA1 depending on the thickness from the flexible substrate 32 to the curved substrate 10 . The length of the flexible substrate 32 may be calculated. As a result, the embodiment of the present invention prevents the flexible substrate 32 from interfering with the curved substrate 10 by obliquely cutting the edge of the flexible substrate 32 according to the calculated length of the flexible substrate 32 . can do.

8 is a cross-sectional view illustrating an example of the flexible display module of FIGS. 6 and 7 . 9 is a cross-sectional view illustrating a display area of the flexible display module of FIG. 8 in detail.

In FIGS. 8 and 9 , the display module 30 has been mainly described as being implemented as an organic light emitting display device. In addition, in FIGS. 8 and 9 , the light emitting device layer 120 is mainly described in the direction in which the barrier film 34 is disposed, that is, formed in a top emission method in which light is emitted in an upper direction.

8 and 9 , the display area AA indicates an area in which the light emitting device layer 120 is formed to display an image, and the non-display area NAA indicates a peripheral area of the display area.

The display module 30 includes a pixel array layer 33 including a support substrate 31 , a flexible substrate 32 , a thin film transistor layer 110 , a light emitting device layer 120 , and an encapsulation layer 130 , a barrier film ( 34 ), and a polarizing film 35 .

Since the support substrate 31 , the flexible substrate 32 , the barrier film 34 , and the polarizing film 35 have been described in detail with reference to FIGS. 2 and 3 , a detailed description thereof will be omitted.

A thin film transistor layer 110 is formed on the flexible substrate 32 . The thin film transistor layer 110 includes thin film transistors 210 , a gate insulating layer 220 , an interlayer insulating layer 230 , a passivation layer 240 , and a planarization layer 250 .

A buffer layer may be formed on the flexible substrate 32 . The buffer layer may be formed on the flexible substrate 32 to protect the thin film transistors 210 and the light emitting devices from moisture penetrating through the support substrate 31 and the flexible substrate 32, which are vulnerable to moisture permeation. The buffer layer may be formed of a plurality of inorganic layers alternately stacked. For example, the buffer layer may be formed as a multilayer in which one or more inorganic layers of a silicon oxide layer (SiO _x ), a silicon nitride layer (SiN _{x ), and SiON are alternately stacked.} The buffer layer may be omitted.

A thin film transistor 210 is formed on the buffer layer. The thin film transistor 210 includes an active layer 211 , a gate electrode 212 , a source electrode 213 , and a drain electrode 214 . 5 illustrates that the thin film transistor 210 is formed in a top gate (top gate) method in which the gate electrode 212 is positioned on the active layer 211 , but it should be noted that the present invention is not limited thereto. That is, the thin film transistors 210 have a lower gate (bottom gate) method in which the gate electrode 212 is positioned under the active layer 211 or the gate electrode 212 is positioned above and below the active layer 211 . It may be formed in a double gate method in which all of them are located.

An active layer 211 is formed on the buffer layer. The active layer 211 may be formed of a silicon-based semiconductor material or an oxide-based semiconductor material. A light blocking layer for blocking external light incident to the active layer 211 may be formed between the buffer layer and the active layer 211 .

A gate insulating layer 220 may be formed on the active layer 211 . The gate insulating layer 220 may be formed of an inorganic layer, for example, a silicon oxide layer (SiO _x ), a silicon nitride layer (SiN _x ), or a multilayer thereof.

A gate electrode 212 and a gate line may be formed on the gate insulating layer 220 . The gate electrode 212 and the gate line may include any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu). It may be formed as a single layer or multiple layers made of one or an alloy thereof.

An interlayer insulating layer 230 may be formed on the gate electrode 212 and the gate line. The interlayer insulating layer 230 may be formed of an inorganic layer, for example, a silicon oxide layer (SiO _x ), a silicon nitride layer (SiN _x ), or a multilayer thereof.

A source electrode 213 , a drain electrode 214 , and a data line may be formed on the interlayer insulating layer 230 . Each of the source electrode 213 and the drain electrode 214 may be connected to the active layer 211 through a contact hole penetrating the gate insulating layer 220 and the interlayer insulating layer 230 . The source electrode 213 , the drain electrode 214 , and the data line are formed of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), and neodymium (Nd). and copper (Cu) or an alloy thereof may be formed as a single layer or multiple layers.

A protective layer 240 for insulating the thin film transistor 220 may be formed on the source electrode 223 , the drain electrode 224 , and the data line. The passivation layer 240 may be formed of an inorganic layer, for example, a silicon oxide layer (SiO _x ), a silicon nitride layer (SiN _x ), or a multilayer thereof.

A planarization layer 250 for flattening a step caused by the thin film transistor 210 may be formed on the passivation layer 240 . The planarization film 250 may be formed of an organic film such as an acrylic resin, an epoxy resin, a phenolic resin, a polyamide resin, or a polyimide resin. have.

The light emitting device layer 120 is formed on the thin film transistor layer 110 . The light emitting device layer 120 includes light emitting devices and a bank 264 .

The light emitting devices and the bank 264 are formed on the planarization layer 250 . The light emitting device may include a first electrode 261 , a light emitting layer 262 , and a second electrode 263 . The first electrode 261 may be an anode electrode, and the second electrode 263 may be a cathode electrode.

The first electrode 261 may be formed on the planarization layer 250 . The first electrode 261 may be connected to the source electrode 213 of the thin film transistor 210 through a contact hole penetrating the passivation layer 240 and the planarization layer 250 . The first electrode 261 has a stacked structure of aluminum and titanium (Ti/Al/Ti), a stacked structure of aluminum and ITO (ITO/Al/ITO), an APC alloy, and a stacked structure of an APC alloy and ITO (ITO/APC). /ITO) may be formed of a high reflectance metal material. The APC alloy is an alloy of silver (Ag), palladium (Pd), and copper (Cu).

The bank 264 may be formed to cover the edge of the first electrode 261 on the planarization layer 250 to partition the pixels. That is, the bank 264 serves as a pixel defining film defining pixels.

In each of the pixels, a first electrode 261 corresponding to an anode electrode, a light emitting layer 262 , and a second electrode 263 corresponding to a cathode electrode are sequentially stacked to form a hole and a second electrode from the first electrode 261 . It represents a region where electrons from the electrode 263 are coupled to each other in the light emitting layer 262 to emit light.

A light emitting layer 262 is formed on the first electrode 261 and the bank 264 . The emission layer 262 may be an organic emission layer. In this case, the light emitting layer 262 is a common layer commonly formed in pixels, and may be a white light emitting layer that emits white light. The emission layer 262 may be formed in a tandem structure of two or more stacks. Each of the stacks may include a hole transporting layer, at least one light emitting layer, and an electron transporting layer.

In addition, when the emission layer 262 is formed in a tandem structure of two or more stacks, a charge generating layer may be formed between the stacks. The charge generation layer may include an n-type charge generation layer disposed adjacent to the lower stack and a p-type charge generation layer formed on the n-type charge generation layer and disposed adjacent to the upper stack. The n-type charge generation layer injects electrons into the lower stack, and the p-type charge generation layer injects holes into the upper stack. The n-type charge generation layer may be an organic layer doped with an alkali metal such as Li, Na, K, or Cs, or an alkaline earth metal such as Mg, Sr, Ba, or Ra to an organic host material having electron transport ability. The p-type charge generating layer may be an organic layer in which a dopant is doped into an organic host material having hole transport ability.

The second electrode 263 is formed on the emission layer 262 . The second electrode 263 may be formed to cover the emission layer 262 . The second electrode 263 may be a common layer commonly formed in pixels.

The second electrode 263 is a transparent metal material (TCO, Transparent Conductive Material) such as ITO or IZO capable of transmitting light, or magnesium (Mg), silver (Ag), or magnesium (Mg) and silver (Ag). It may be formed of a semi-transmissive conductive material such as an alloy of When the second electrode 140 is formed of a transflective metal material, light output efficiency may be increased due to a micro cavity. A capping layer may be formed on the second electrode 263 .

An encapsulation layer 130 is formed on the light emitting device layer 120 . The encapsulation layer 130 includes an encapsulation film 270 .

The encapsulation layer 270 serves to prevent oxygen or moisture from penetrating into the light emitting layer 262 and the second electrode 263 . To this end, the encapsulation film 270 may include at least one inorganic film. The inorganic layer may be formed of silicon nitride, aluminum nitride, zirconium nitride, titanium nitride, hafnium nitride, tantalum nitride, silicon oxide, aluminum oxide, or titanium oxide.

Also, the encapsulation layer 270 may further include at least one organic layer. The organic layer may be formed to a thickness sufficient to prevent particles from penetrating the encapsulation layer 270 and being input to the emission layer 262 and the second electrode 263 .

A color filter layer may be formed on the encapsulation layer 130 . The color filter layer includes color filters and a black matrix. Each of the color filters may be disposed to correspond to the pixels. The black matrix 294 may be disposed between the color filters in order to prevent color mixing due to light from one pixel traveling to the color filter of an adjacent pixel. The black matrix 294 may be disposed to correspond to the bank 264 . An overcoat layer may be formed on the color filters to planarize a level difference due to the color filters and the black matrix.

FIG. 10 is an enlarged bottom view illustrating in detail a fourth corner of FIG. 4 .

10 is an enlarged bottom view of the fourth corner portion C4 of the curved substrate 10 in which the fourth multi-curvature portion DCA4 is positioned.

In FIG. 10 , only the curved substrate 10 , the support substrate 31 of the display module 30 , the heat dissipation layer 40 , and the first adhesive layer 20 are illustrated for convenience of explanation. The first adhesive layer 20 is a layer for bonding the display module 30 to the curved substrate 10 and is not visible from the bottom view, and thus is illustrated with a dotted line.

FIG. 10 is substantially the same as the touch circuit board 60 in FIG. 5 , so the curved substrate 10 shown in FIG. 10 , the support substrate 31 of the display module 30 , and the heat dissipation layer 40 . , and a detailed description of the first adhesive layer 20 will be omitted.

In addition, an enlarged bottom view of the third corner portion C3 of the curved substrate 10 on which the third multi-curvature portion DCA3 is positioned is substantially the same as that illustrated in FIG. 10 symmetrically with respect to the y-axis. Accordingly, an enlarged bottom view of the third corner portion C3 of the curved substrate 10 is omitted.

Although the embodiments of the present invention have been described in more detail with reference to the accompanying drawings, the present invention is not necessarily limited to these embodiments, and various modifications may be made within the scope without departing from the technical spirit of the present invention. . Accordingly, the embodiments disclosed in the present invention are not intended to limit the technical spirit of the present invention, but to explain, and the scope of the technical spirit of the present invention is not limited by these embodiments. Therefore, it should be understood that the embodiments described above are illustrative in all respects and not restrictive. The protection scope of the present invention should be construed by the claims, and all technical ideas within the scope equivalent thereto should be construed as being included in the scope of the present invention.

10: curved substrate 20: first adhesive layer
30: display module 31: support substrate
32: flexible substrate 33: pixel array layer
34: barrier film 35: polarizing film
40: heat dissipation layer 41: metal layer
42: foam 50: flexible film
51: driving IC 60: touch circuit board
61: touch sensing circuit 71: first anisotropic conductive film
72: second anisotropic conductive film 73: second adhesive layer
74: third adhesive layer FL: flat part
CA1: first curved portion CA2: second curved portion
CA3: third curved portion CA4: fourth curved portion
DCA1: first multi-curvature portion DCA2: second multi-curvature portion
DCA3: third multi-curvature portion DCA4: fourth multi-curvature portion
C1: first corner C2: second corner
C3: third corner C4: fourth corner

Claims (10)

a flat portion, a first curved portion extending from a first side of the flat portion in a first direction and bent at a first curvature, a second curved portion extending from a second side of the flat portion in a second direction and bent at a second curvature, and a curved substrate including a multiple curvature part bent to multiple curvatures by overlapping the first curvature part and the second curvature part; and
a display module disposed on a lower surface of the curved substrate and including a pixel array layer disposed on the substrate;
The edge of the substrate is disposed on the multiple curvature,
The substrate includes a flexible substrate and a support substrate supporting the flexible substrate,
The curved display device covers the support substrate. The method of claim 1,
Further comprising a first adhesive layer for adhering the curved substrate and the substrate,
Based on the first direction, the distance from the first adhesive layer to the end of the curved substrate from the first curved portion is shorter than the distance from the first adhesive layer to the end of the curved substrate from the multi-curvature portion. type display. 3. The method of claim 2,
Based on the second direction, the distance from the first adhesive layer to the end of the curved substrate from the second curved portion is shorter than the distance from the first adhesive layer to the end of the curved substrate from the multi-curvature portion. type display. delete The method of claim 1,
A curved display device in which an edge of the flexible substrate disposed on the multi-curvature portion and an edge of the support substrate are obliquely cut or curved. 6. The method of claim 5,
When the second curvature is greater than the first curvature, the cut length of the edge of the flexible substrate in the second direction is shorter than the cut length in the first direction. The method of claim 1,
Further comprising a heat dissipation substrate disposed on the lower surface of the support substrate,
A curved display device in which an edge of the heat dissipation substrate is disposed on the multi-curvature portion. 8. The method of claim 7,
A curved display device in which an edge of the heat dissipation substrate disposed on the multi-curvature portion is cut obliquely. The method of claim 1,
The display module is
a barrier film covering the pixel array layer; and
The curved display device further comprising a polarizing plate disposed on the barrier film. 10. The method of claim 9,
a flexible film attached to a non-display area around the pixel array layer on the substrate; and
The curved display device further comprising a flexible circuit board attached to the barrier film.

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