KR102462967B1 - Display device including fingerpring identification sensor - Google Patents

Abstract

An object to be solved according to an embodiment of the present specification relates to a display device capable of preventing a stain such as shadow mura from being recognized by a user when a fingerprint recognition sensor is attached to the rear surface of the display device. A display device according to an embodiment of the present specification includes a display module disposed on a rear surface of a cover substrate and displaying an image, a heat dissipation film disposed on the rear surface of the display module and having a hole formed therein, and a rear surface of the display module in the hole of the heat dissipation film A fingerprint recognition sensor disposed thereon, and a flexible circuit board on which the fingerprint recognition sensor is mounted, the flexible circuit board covering the hole of the heat dissipation film.

Description

DISPLAY DEVICE INCLUDING FINGERPRING IDENTIFICATION SENSOR

The present specification relates to a display device including a fingerprint recognition sensor.

As the information society develops, the demand for a display device for displaying an image is increasing in various forms. As a display device, various display devices such as a liquid crystal display (LCD), an organic light emitting display (OLED), and a quantum dot light emitting display (QLED) are used. is becoming

The display device is applied to various electronic devices such as a smart phone, a tablet, a notebook computer, a monitor, and a TV. In particular, in recent years, the use of portable electronic devices such as smartphones, tablets, and notebook computers has greatly increased due to the development of mobile communication technologies. In addition to the communication function, the portable electronic device stores privacy information such as contact information, call history, message, photo, memo, user's web surfing information, location information, and financial information. Accordingly, in order to prevent personal information from being leaked from the portable electronic device, various security methods for protecting personal information are applied to the portable electronic device. Among these security methods, fingerprint authentication permits the use of an electronic device based on a user's fingerprint, which is biometric information, and thus has higher security power than other security methods, for example, password authentication or pattern authentication.

Meanwhile, in portable electronic devices such as smartphones or tablets, the size of the display device is increased while minimizing the bezel in order to provide a wider screen. However, since an image sensor for realizing a camera together with a display device, an illuminance sensor for sensing illuminance, and a fingerprint recognition sensor for fingerprint authentication are disposed on the front surface of a portable electronic device such as a smartphone or tablet, display There is a limit to increasing the size of the device.

In order to increase the size of the display device, a fingerprint recognition sensor may be attached to the rear surface of the display device. In this case, a portion of the back tape attached to the back surface of the display device is removed and the fingerprint recognition sensor is attached, and a space may be formed between the back tape and the fingerprint recognition sensor. When the display device is implemented as an organic light emitting display device including a plastic film, light may pass through the space between the back tape and the fingerprint recognition sensor during the manufacturing process, so that the organic light emitting diode in the space formed area may be deteriorated. can For this reason, there may be a difference in the degradation rate of the organic light emitting element in the region where the space is formed between the backing tape and the fingerprint recognition sensor and the organic light emitting element in the other region, for example, in the region where the backing tape is not removed. Therefore, even when an image of the same brightness is displayed, the luminance of the image displayed by the organic light emitting device in the area where a space is formed between the back tape and the fingerprint recognition sensor and the image displayed by the organic light emitting device in the area where the back tape is not removed. A difference in luminance may occur. As a result, a stain, such as shadow mura, in which a luminance difference occurs in an area in which a space is formed between the backing tape and the fingerprint recognition sensor and the backing tape is not removed may be recognized by the user.

An object to be solved according to an embodiment of the present specification is to provide a display device capable of preventing a stain such as shadow mura from being recognized by a user when a fingerprint recognition sensor is attached to the rear surface of the display device.

The problems to be solved according to the embodiments of the present specification are not limited to the problems mentioned above, and other problems not mentioned will be clearly understood by those skilled in the art from the following description.

A display device according to an embodiment of the present specification includes a display module disposed on a rear surface of a cover substrate and displaying an image, a heat dissipation film disposed on the rear surface of the display module and having a hole formed therein, and a rear surface of the display module in the hole of the heat dissipation film A fingerprint recognition sensor disposed thereon, and a flexible circuit board on which the fingerprint recognition sensor is mounted, the flexible circuit board covering the hole of the heat dissipation film.

A display device according to another exemplary embodiment of the present specification includes a display module disposed on a cover substrate and displaying an image, a heat dissipation film disposed on the back surface of the display module and having a hole, and a hole in the heat dissipation film attached to the back surface of the display module. A fingerprint recognition sensor, and a light blocking layer covering a space between the fingerprint recognition sensor and the heat dissipation film is provided.

A display device according to another exemplary embodiment of the present specification includes a display module disposed on a cover substrate and displaying an image, a heat dissipation film disposed on the back surface of the display module and having a hole, and a hole in the heat dissipation film attached to the back surface of the display module. A fingerprint recognition sensor, and a resin filled in a space between the fingerprint recognition sensor and the heat dissipation film.

Embodiments of the present specification arrange the flexible circuit board to cover the hole of the heat dissipation film. As a result, since the embodiments of the present invention can prevent light from being transmitted into the space between the heat dissipation film and the fingerprint recognition sensor, in the area where the space between the heat dissipation film and the fingerprint recognition sensor is formed and the area where the heat dissipation film is not removed It is possible to prevent a difference in luminance due to deterioration of the organic light emitting diode. Accordingly, embodiments of the present invention may prevent a stain such as shadow mura from being recognized by a user.

In addition, in the embodiments of the present specification, the light blocking layer is disposed on the rear surface of the display module in a region corresponding to the space between the heat dissipation film and the fingerprint recognition sensor. As a result, since the embodiments of the present invention can prevent light from being transmitted into the space between the heat dissipation film and the fingerprint recognition sensor, in the area where the space between the heat dissipation film and the fingerprint recognition sensor is formed and the area where the heat dissipation film is not removed It is possible to prevent a difference in luminance due to deterioration of the organic light emitting diode. Accordingly, embodiments of the present invention may prevent a stain such as shadow mura from being recognized by a user.

In addition, in the embodiments of the present invention, when the user applies pressure to attach the fingerprint recognition sensor to the rear surface of the display module by arranging the reinforcing layer on the rear surface of the display module, the second adhesive layer is pressed on the front surface of the display module. It can prevent recognition of traces.

In addition, embodiments of the present invention may improve the ultrasonic recognition rate when the fingerprint recognition sensor is an ultrasonic type by disposing a metal thin film layer on the rear surface of the reinforcing layer.

1 is a perspective view illustrating a portable electronic device including a display device according to an embodiment of the present invention.
2 is a perspective view illustrating a display device according to an exemplary embodiment.
3 is a side cross-sectional view of a display device according to an exemplary embodiment.
FIG. 4 is an enlarged cross-sectional view illustrating a first example of area A of FIG. 3 .
5 is a cross-sectional view illustrating an example of the display module of FIG. 4 .
6 is a cross-sectional view illustrating a display area of the display module of FIG. 5 in detail.
FIG. 7 is an enlarged cross-sectional view illustrating a second example of area A of FIG. 3 .
FIG. 8 is an enlarged cross-sectional view illustrating a third example of area A of FIG. 3 .
9 is an enlarged cross-sectional view illustrating a fourth example of area A of FIG. 3 .
FIG. 10 is an enlarged cross-sectional view illustrating a fifth example of area A of FIG. 3 .
11 is an enlarged cross-sectional view illustrating a sixth example of area A of FIG. 3 .

Like reference numerals refer to substantially identical elements throughout. In the following description, a detailed description of configurations and functions known in the art and cases not related to the core configuration of the present invention may be omitted. The meaning of the terms described herein should be understood as follows.

Advantages and features of the present invention and methods of achieving them will become apparent with reference to the embodiments described below in detail in conjunction with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but will be implemented in a variety of different forms, only these embodiments allow the disclosure of the present invention to be complete, and common knowledge in the technical field to which the present invention belongs It is provided to fully inform the possessor of the scope of the invention, and the present invention is only defined by the scope of the claims.

The shapes, sizes, proportions, angles, numbers, etc. disclosed in the drawings for explaining the embodiments of the present invention are illustrative and the present invention is not limited to the illustrated matters. Like reference numerals refer to like elements throughout. In addition, in describing the present invention, if it is determined that a detailed description of a related known technology may unnecessarily obscure the subject matter of the present invention, the detailed description thereof will be omitted.

When 'including', 'having', 'consisting', etc. mentioned in this specification are used, other parts may be added unless 'only' is used. When a component is expressed in the singular, the case in which the plural is included is included unless specifically stated otherwise.

In interpreting the components, it is interpreted as including an error range even if there is no separate explicit description.

In the case of a description of the positional relationship, for example, when the positional relationship of two parts is described as 'on', 'on', 'on', 'beside', etc., 'right' Alternatively, one or more other parts may be positioned between two parts unless 'directly' is used.

In the case of a description of a temporal relationship, for example, 'immediately' or 'directly' when a temporal relationship is described as 'after', 'following', 'after', 'before', etc. It may include cases that are not continuous unless this is used.

Although the first, second, etc. are used to describe various components, these components are not limited by these terms. These terms are only used to distinguish one component from another. Accordingly, the first component mentioned below may be the second component within the spirit of the present invention.

"X-axis direction", "Y-axis direction", and "Z-axis direction" should not be interpreted only as a geometric relationship in which the relationship between each other is vertical, and is wider than the range in which the configuration of the present invention can function functionally. It may mean having a direction.

The term “at least one” should be understood to include all possible combinations from one or more related items. For example, the meaning of "at least one of the first, second, and third items" means 2 of the first, second, and third items as well as each of the first, second, or third items. It may mean a combination of all items that can be presented from more than one.

Each feature of the various embodiments of the present invention may be partially or wholly combined or combined with each other, technically various interlocking and driving are possible, and each of the embodiments may be implemented independently of each other or may be implemented together in a related relationship. may be

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a perspective view illustrating a portable electronic device including a display device according to an embodiment of the present invention.

Referring to FIG. 1 , although a portable electronic device (PED) according to an embodiment of the present invention is illustrated as a smart phone, the present invention is not limited thereto. That is, the portable electronic device according to an embodiment of the present invention may be a tablet or a notebook computer.

A portable electronic device (PED) includes a case (CS), a display device (CDIS), a sound output module (SOM), an image sensor (CAM), an illuminance sensor (IS), a speaker (SPK), a microphone (MIC), and an earphone port (EP), and a charging port (CP).

The case CS may be formed to cover a front surface, a side surface, and a rear surface of the portable electronic device PED. The case CS may be formed of plastic. A display device CDIS, a sound output module SOM, a camera CAM, and an illuminance sensor IS may be disposed on the front surface of the case CS. A microphone MIC, an earphone port EP, and a charging port CP may be disposed on one side of the case CS.

The display device CDIS occupies most of the front surface of the portable electronic device PED. A detailed description of the display device CDIS will be described later with reference to FIGS. 2 and 3 .

The sound output module (SOM) is a receiving device that outputs the voice of the other party when talking with the other party. The image sensor CAM is a device for capturing an image seen on the front surface of the portable electronic device PED, and another image sensor may be additionally disposed on the rear surface of the portable electronic device PED. The illuminance sensor IS is a device for adjusting the luminance of the display device CDIS by sensing the amount of incident light. A microphone (MIC) is a transmitting device for converting a sound wave of a user's voice into an electric signal during a call with the other party and transmitting it. The speaker SPK outputs a sound signal related to a function or application performed in the portable electronic device (PED). The earphone port EP is a port for outputting a sound signal to the earphone instead of the speaker SPK when an earphone is inserted. The charging port CP is a port to which a charger for charging the battery of the portable electronic device PED is connected.

2 is a perspective view illustrating a display device according to an exemplary embodiment. 3 is a side cross-sectional view of a display device according to an exemplary embodiment.

2 and 3 , a display device according to an exemplary embodiment includes a cover substrate 10 , a display module 30 , a heat dissipation film 40 , and a fingerprint recognition sensor 50 .

The cover substrate 10 may be formed of plastic or glass. The cover substrate 10 includes a flat portion FL and a curved portion CU. The flat portion FL may be formed to be flat in the central region of the cover substrate 10 . The curvature portion CU may have a first curvature at an edge of at least one side of the cover substrate 10 . 1 to 3 illustrate that the curvature portion CU is formed on both side edges of the cover substrate 10, but is not limited thereto. That is, the curvature portion CU may be formed only on one edge of the cover substrate 10 , or may be formed on three or four edges of the cover substrate 10 .

A decoration layer 11 may be formed on a rear surface of the cover substrate 10 facing the display module 30 . The decor layer 11 is a layer on which a pattern that can be shown to a user is formed even when the display module 30 does not display an image. For example, a company logo 11a such as “LG” may be formed on the decoration layer 11 as shown in FIG. 2 . Also, the decoration layer 11 may include a color layer 11b formed in an area corresponding to the bezel area of the display module 30 . For example, the decoration layer 11 may include a color layer 11b having a black color in an area corresponding to the bezel area of the display module 30 . In this case, since the color layer 11b of the decoration layer 11 may be expressed in the same color as the display area of the display module 30 when the display module 30 does not display an image, The screen may appear wide to the user.

The display module 30 is disposed on the rear surface of the cover substrate 10 . The display module 30 is a display device that displays a predetermined image. For example, the display module 30 may be an organic light emitting display as shown in FIGS. 5 and 6 , but is not limited thereto. That is, the display module 30 may be a liquid crystal display or a quantum dot light emitting display.

The display module 30 may be disposed on the flat portion FL and the curved portion CU of the cover substrate 10 . Since the display module 30 is also disposed on the curved portion CU of the cover substrate 10 , the user may view an image through the curved portion CU of the cover substrate 10 .

A heat dissipation film 40 is disposed on the rear surface of the display module 30 . The heat dissipation film 40 may include a material having high thermal conductivity to effectively dissipate heat generated from the display module 30 . In addition, the heat dissipation film 40 may perform a buffer function to protect the display module 30 from external impact.

A portion of the heat dissipation film 40 may be removed to attach the fingerprint recognition sensor 50 to the rear surface of the display module 30 . Hereinafter, a region from which a portion of the heat dissipation film 40 is removed will be referred to as a hole H.

The fingerprint recognition sensor 50 may be attached to the rear surface of the display module 30 in the hole H of the heat dissipation film 40 . The fingerprint recognition sensor 50 may recognize a user's fingerprint in an optical or ultrasonic manner.

In the case of the optical fingerprint sensor 50, the light source emitting a predetermined light to the front surface on which the display module 30 is disposed, and the laser light reflected from the fingerprint of the finger are received and converted into an electrical signal. It may include a sensor. The light source may be laser light or LED light, and the optical sensor may be a complementary metal oxide semiconductor (CMOS) image sensor or a charge coupled device (CCD) image sensor. In this case, since the light emitted from the light source of the fingerprint recognition sensor 50 is reflected and absorbed by the crests and valleys of the fingerprint of the finger, the fingerprint pattern information of the finger may be sensed by the optical sensor.

When the fingerprint recognition sensor 50 is of the ultrasonic type, the ultrasonic wave is emitted to the front surface where the display module 30 is disposed, and the shape of the fingerprint is determined based on the size of the ultrasonic wave reflected from the fingerprint of the finger. Specifically, the user's fingerprint has ridges and ridges, so that the reflected ultrasonic waves are received differently depending on which part is reflected in the generated ultrasonic waves. The outline of the fingerprint can be obtained based on the pattern. When the fingerprint recognition sensor 50 is ultrasonic, it may include a fingerprint input unit and a fingerprint processing unit. The fingerprint input unit may include an ultrasonic transmitter that generates ultrasonic waves and an ultrasonic receiver that receives ultrasonic waves. The fingerprint processing unit may include a control unit that determines whether fingerprint authentication is performed by processing the value received from the ultrasonic receiving unit.

FIG. 4 is an enlarged cross-sectional view illustrating a first example of area A of FIG. 3 .

Referring to FIG. 4 , the display device according to the first embodiment of the present invention includes a cover substrate 10 , a display module 30 , a heat dissipation film 40 , and a fingerprint recognition sensor 50 as well as a first adhesive layer ( 20), the flexible circuit board 51, and a second adhesive layer 60 is further included. Also, the display module 30 may include a support substrate 31 , a flexible substrate 32 , a pixel array layer 33 , a barrier film 34 , and a polarizing film 35 . In addition, the heat dissipation film 40 may include a cushion layer 41 , a heat dissipation layer 42 , and an electrostatic protection layer 43 .

The first adhesive layer 20 is disposed between the cover substrate 10 and the display module 30 to adhere the cover substrate 10 and the polarizing plate 33 of the display module 30 . The first adhesive layer 20 may be an optically transparent resin (OCR) or an optically transparent adhesive film (OCA film).

The support substrate 31 is a substrate for supporting the flexible substrate 32 and may be formed of plastic. For example, the support substrate 31 may be formed of polyethylene terephthalate (PET).

The flexible substrate 32 may be disposed on the front surface of the support substrate 31 and may be formed of a plastic film having flexibility. For example, the flexible substrate 32 may be formed of a polyimide film.

The pixel array layer 33 may be formed on the front surface of the flexible substrate 32 . The pixel array layer 33 is a layer for displaying an image by a plurality of pixels. The pixel array layer 33 may include a thin film transistor layer, a light emitting device layer, and an encapsulation layer.

The barrier film 34 may be disposed to cover the pixel array layer 33 in order to protect the pixel array layer 33 from oxygen or moisture. That is, the barrier film 34 may be disposed on the pixel array layer 33 . The barrier film 34 may include a touch sensing layer for sensing a user's touch.

The polarizing film 35 may be attached to the front surface of the barrier film 34 to prevent deterioration of visibility due to reflection of external light. The polarizing film 35 may be disposed to overlap the pixel array layer 33 .

A detailed description of the display module 30 will be described later with reference to FIGS. 5 and 6 .

The cushion layer 41 may be disposed on the rear surface of the support substrate 31 . The cushion layer 41 serves to buffer the impact when an impact from the outside is applied to the display module 30 . An adhesive material may be applied to the front surface of the cushion layer 41 , whereby the heat dissipation film 40 may be attached to the rear surface of the support substrate 31 without a separate adhesive layer.

The heat dissipation layer 42 may be disposed on the rear surface of the cushion layer 41 . The heat dissipation layer 42 may be formed of a metal layer having high thermal conductivity, for example, graphite to effectively dissipate heat generated from the display module 30 .

The static electricity protection layer 43 may be disposed on the rear surface of the heat dissipation layer 42 . The static electricity protection layer 43 may not only protect the display module 30 from static electricity applied from the outside, but may also serve to radiate heat generated from the display module 30 like the heat dissipation layer 42 . The static electricity protection layer 43 may be formed of copper (Cu).

The fingerprint recognition sensor 50 may be mounted on the flexible circuit board 51 . The flexible circuit board 51 may be a flexible printed circuit board. The flexible circuit board 51 may include a connector connected to a cable connected to the application board of the portable electronic device. An application chip may be mounted on the application board. For this reason, information on whether the fingerprint recognition sensor 50 has authenticated the fingerprint may be transmitted to the application board of the portable electronic device through the flexible circuit board 51 .

The fingerprint recognition sensor 50 may be disposed in the hole H of the heat dissipation film 40 . The hole H of the heat dissipation film 40 indicates a region where a portion of the heat dissipation film 40 is removed in order to attach the fingerprint recognition sensor 50 to the rear surface of the display module 30 . Since the fingerprint recognition sensor 50 is disposed in the hole H of the heat dissipation film 40 , a space SP may be formed between the fingerprint recognition sensor 50 and the heat dissipation film 40 . When light passes through the space SP between the heat dissipation film 40 and the fingerprint recognition sensor 50 , the organic formed in the area corresponding to the space SP between the heat dissipation film 40 and the fingerprint recognition sensor 50 . The light emitting device may deteriorate.

The flexible circuit board 51 may be disposed to cover the hole H of the heat dissipation film 40 . For example, the width in the first direction (X-axis direction) of the flexible circuit board 51 and the width in the second direction (Z-axis direction) intersecting the first direction are the first width of the hole H of the heat dissipation film 40 . The width in the direction (X-axis direction) and the width in the second direction (Z-axis direction) may be formed to be wider. For this reason, it is possible to prevent light from being transmitted into the space SP between the heat dissipation film 40 and the fingerprint recognition sensor 50 .

In addition, the flexible circuit board 51 may be in contact with the rear surface of the heat dissipation film 40 , that is, the rear surface of the static electricity protection layer 43 . Since the flexible circuit board 51 is flexible, the end of the flexible circuit board 51 may be bent to make contact with the rear surface of the heat dissipation film 40 as shown in FIG. 4 . The flexible circuit board 51 may be attached to the rear surface of the heat dissipation film 40 using a double-sided adhesive film. In this case, the flexible circuit board 51 may more effectively prevent light from being transmitted into the space SP between the heat dissipation film 40 and the fingerprint recognition sensor 50 .

The second adhesive layer 60 adheres the support substrate 31 and the fingerprint recognition sensor 50 . The second adhesive layer 60 may be a transparent adhesive film (OCA film).

As described above, in the first embodiment of the present invention, the flexible circuit board 51 is disposed to cover the hole H of the heat dissipation film 40 . As a result, the first embodiment of the present invention can prevent light from being transmitted into the space SP between the heat dissipation film 40 and the fingerprint recognition sensor 50, so the heat dissipation film 40 and the fingerprint recognition sensor ( 50), it is possible to prevent a luminance difference from occurring due to deterioration of the organic light emitting diode in the region where the space SP is formed and the region where the heat dissipation film 40 is not removed. Accordingly, according to the first embodiment of the present invention, it is possible to prevent a stain such as shadow mura from being recognized by a user.

5 is a cross-sectional view illustrating an example of the display module of FIG. 4 . 6 is a cross-sectional view illustrating a display area of the display module of FIG. 5 in detail.

In FIGS. 5 and 6 , the display module 30 has been mainly described as being implemented as an organic light emitting display device. In addition, in FIGS. 5 and 6 , the light emitting device layer 120 is mainly described in the direction in which the barrier film 34 is disposed, that is, formed in a top emission method in which light is emitted in an upper direction.

5 and 6 , the display module 30 may include a support substrate 31 , a flexible substrate 32 , a pixel array layer 33 , a barrier film 34 , and a polarizing film 35 . have. The pixel array layer 33 may include a thin film transistor layer 110 , a light emitting device layer 120 , and an encapsulation layer 130 . The display area AA indicates an area in which the light emitting device layer 120 is formed to display an image, and the non-display area NAA indicates a peripheral area of the display area.

Since the support substrate 31 , the flexible substrate 32 , the barrier film 34 , and the polarizing film 35 have been described in detail with reference to FIGS. 4 and 5 , a detailed description thereof will be omitted.

A thin film transistor layer 110 is formed on the flexible substrate 32 . The thin film transistor layer 110 includes thin film transistors 210 , a gate insulating layer 220 , an interlayer insulating layer 230 , a passivation layer 240 , and a planarization layer 250 .

A buffer layer may be formed on the flexible substrate 32 . The buffer layer may be formed on the flexible substrate 32 to protect the thin film transistors 210 and the light emitting devices from moisture penetrating through the support substrate 31 and the flexible substrate 32, which are vulnerable to moisture permeation. The buffer layer may be formed of a plurality of inorganic layers alternately stacked. For example, the buffer layer may be formed as a multilayer in which one or more inorganic layers of a silicon oxide layer (SiO _x ), a silicon nitride layer (SiN _x ), and SiON are alternately stacked. The buffer layer may be omitted.

A thin film transistor 210 is formed on the buffer layer. The thin film transistor 210 includes an active layer 211 , a gate electrode 212 , a source electrode 213 , and a drain electrode 214 . 6 illustrates that the thin film transistor 210 is formed in a top gate (top gate) method in which the gate electrode 212 is positioned on the active layer 211 , but it should be noted that the present invention is not limited thereto. That is, the thin film transistors 210 have a bottom gate (bottom gate) method in which the gate electrode 212 is positioned under the active layer 211 or the gate electrode 212 is positioned above and below the active layer 211 . It may be formed in a double gate method in which all of them are located.

An active layer 211 is formed on the buffer layer. The active layer 211 may be formed of a silicon-based semiconductor material or an oxide-based semiconductor material. A light blocking layer for blocking external light incident to the active layer 211 may be formed between the buffer layer and the active layer 211 .

A gate insulating layer 220 may be formed on the active layer 211 . The gate insulating layer 220 may be formed of an inorganic layer, for example, a silicon oxide layer (SiO _x ), a silicon nitride layer (SiN _x ), or a multilayer thereof.

A gate electrode 212 and a gate line may be formed on the gate insulating layer 220 . The gate electrode 212 and the gate line may include any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu). It may be formed as a single layer or multiple layers made of one or an alloy thereof.

An interlayer insulating layer 230 may be formed on the gate electrode 212 and the gate line. The interlayer insulating layer 230 may be formed of an inorganic layer, for example, a silicon oxide layer (SiO _x ), a silicon nitride layer (SiN _x ), or a multilayer thereof.

A source electrode 213 , a drain electrode 214 , and a data line may be formed on the interlayer insulating layer 230 . Each of the source electrode 213 and the drain electrode 214 may be connected to the active layer 211 through a contact hole penetrating the gate insulating layer 220 and the interlayer insulating layer 230 . The source electrode 213 , the drain electrode 214 , and the data line are formed of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), and neodymium (Nd). and copper (Cu) or an alloy thereof may be formed as a single layer or multiple layers.

A protective layer 240 for insulating the thin film transistor 220 may be formed on the source electrode 223 , the drain electrode 224 , and the data line. The passivation layer 240 may be formed of an inorganic layer, for example, a silicon oxide layer (SiO _x ), a silicon nitride layer (SiN _x ), or a multilayer thereof.

A planarization layer 250 for flattening a step caused by the thin film transistor 210 may be formed on the passivation layer 240 . The planarization film 250 may be formed of an organic film such as an acrylic resin, an epoxy resin, a phenolic resin, a polyamide resin, or a polyimide resin. have.

A light emitting device layer 120 is formed on the thin film transistor layer 110 . The light emitting device layer 120 includes light emitting devices and a bank 264 .

The light emitting devices and the bank 264 are formed on the planarization layer 250 . The light emitting device may be an organic light emitting device. In this case, the light emitting device may include a first electrode 261 , a light emitting layer 262 , and a second electrode 263 . The first electrode 261 may be an anode electrode, and the second electrode 263 may be a cathode electrode.

The first electrode 261 may be formed on the planarization layer 250 . The first electrode 261 may be connected to the source electrode 213 of the thin film transistor 210 through a contact hole penetrating the passivation layer 240 and the planarization layer 250 . The first electrode 261 has a stacked structure of aluminum and titanium (Ti/Al/Ti), a stacked structure of aluminum and ITO (ITO/Al/ITO), an APC alloy, and a stacked structure of an APC alloy and ITO (ITO/APC). /ITO) may be formed of a metal material having a high reflectance. The APC alloy is an alloy of silver (Ag), palladium (Pd), and copper (Cu).

The bank 264 may be formed to cover the edge of the first electrode 261 on the planarization layer 250 to partition the pixels. That is, the bank 264 serves as a pixel defining film defining pixels.

In each of the pixels, a first electrode 261 corresponding to an anode electrode, a light emitting layer 262 , and a second electrode 263 corresponding to a cathode electrode are sequentially stacked, so that holes from the first electrode 261 and the second It represents a region where electrons from the electrode 263 are combined with each other in the light emitting layer 262 to emit light.

A light emitting layer 262 is formed on the first electrode 261 and the bank 264 . The emission layer 262 may be an organic emission layer. In this case, the light emitting layer 262 is a common layer commonly formed in pixels, and may be a white light emitting layer that emits white light. The emission layer 262 may be formed in a tandem structure of two or more stacks. Each of the stacks may include a hole transporting layer, at least one light emitting layer, and an electron transporting layer.

In addition, when the emission layer 262 is formed in a tandem structure of two or more stacks, a charge generating layer may be formed between the stacks. The charge generation layer may include an n-type charge generation layer disposed adjacent to the lower stack and a p-type charge generation layer disposed on the n-type charge generation layer and disposed adjacent to the upper stack. The n-type charge generation layer injects electrons into the lower stack, and the p-type charge generation layer injects holes into the upper stack. The n-type charge generation layer may be an organic layer doped with an alkali metal such as Li, Na, K, or Cs, or an alkaline earth metal such as Mg, Sr, Ba, or Ra to an organic host material having an electron transport ability. The p-type charge generating layer may be an organic layer in which a dopant is doped into an organic host material having hole transport ability.

The second electrode 263 is formed on the emission layer 262 . The second electrode 263 may be formed to cover the emission layer 262 . The second electrode 263 may be a common layer commonly formed in pixels.

The second electrode 263 is a transparent metal material (TCO, Transparent Conductive Material) such as ITO or IZO capable of transmitting light, or magnesium (Mg), silver (Ag), or magnesium (Mg) and silver (Ag). It may be formed of a semi-transmissive conductive material such as an alloy of When the second electrode 140 is formed of a transflective metal material, light output efficiency may be increased due to a micro cavity. A capping layer may be formed on the second electrode 263 .

An encapsulation layer 130 is formed on the light emitting device layer 120 . The encapsulation layer 130 includes an encapsulation film 270 .

The encapsulation layer 270 serves to prevent oxygen or moisture from penetrating into the light emitting layer 262 and the second electrode 263 . To this end, the encapsulation film 270 may include at least one inorganic film. The inorganic layer may be formed of silicon nitride, aluminum nitride, zirconium nitride, titanium nitride, hafnium nitride, tantalum nitride, silicon oxide, aluminum oxide, or titanium oxide.

Also, the encapsulation layer 270 may further include at least one organic layer. The organic layer may be formed to a thickness sufficient to prevent particles from penetrating the encapsulation layer 270 and being input to the emission layer 262 and the second electrode 263 .

A color filter layer may be formed on the encapsulation layer 130 . The color filter layer includes color filters and a black matrix. Each of the color filters may be disposed to correspond to the pixels. The black matrix 294 may be disposed between the color filters in order to prevent color mixing due to light from one pixel traveling to a color filter of an adjacent pixel. The black matrix 294 may be disposed to correspond to the bank 264 . An overcoat layer may be formed on the color filters in order to planarize a step caused by the color filters and the black matrix.

FIG. 7 is an enlarged cross-sectional view illustrating a second example of area A of FIG. 3 .

Referring to FIG. 7 , the display device according to the second embodiment of the present invention includes a cover substrate 10 , a display module 30 , a heat dissipation film 40 , and a fingerprint recognition sensor 50 as well as a first adhesive layer ( 20 ), the flexible circuit board 51 , the second adhesive layer 60 , and the light blocking layer 70 . Also, the display module 30 may include a support substrate 31 , a flexible substrate 32 , a pixel array layer 33 , a barrier film 34 , and a polarizing film 35 . In addition, the heat dissipation film 40 may include a cushion layer 41 , a heat dissipation layer 42 , and an electrostatic protection layer 43 .

7 , the cover substrate 10 , the first adhesive layer 20 , the display module 30 , the heat dissipation film 40 , the fingerprint recognition sensor 50 , the flexible circuit board 51 , and the second adhesive layer 60 , ) is substantially the same as that described in FIG. 4 , and thus detailed description thereof will be omitted.

The light blocking layer 70 may be disposed on the rear surface of the display module 30 . A transparent adhesive resin (OCR) may be coated on the front surface of the light blocking layer 70 , so that the light blocking layer 70 may be adhered to the rear surface of the display module 30 . The light blocking layer 70 may be disposed in a region corresponding to the space SP between the heat dissipation film 40 and the fingerprint recognition sensor 50 on the rear surface of the display module 30 . As a result, it is possible to prevent light from being transmitted into the space SP between the heat dissipation film 40 and the fingerprint recognition sensor 50 .

When the light blocking layer 70 is disposed in an area corresponding to the space SP between the heat dissipation film 40 and the fingerprint recognition sensor 50 as shown in FIG. 7 , between the heat dissipation film 40 and the fingerprint recognition sensor 50 . Since it is possible to prevent light from being transmitted into the space SP of the flexible circuit board 51 , it is not necessary to cover the hole H of the heat dissipation film 40 . When the light blocking layer 70 is disposed in an area corresponding to the space SP between the heat dissipation film 40 and the fingerprint recognition sensor 50 on the rear surface of the display module 30 , the cushion layer 41 is It may be disposed to overlap with an end of the light blocking layer 70 .

In addition, the light blocking layer 70 is not limited to being disposed in a region corresponding to the space SP between the heat dissipation film 40 and the fingerprint recognition sensor 50 on the rear surface of the display module 30 . That is, the light blocking layer 70 may be disposed on the entire surface of the rear surface of the display module 30 . In this case, since the fingerprint recognition sensor 50 is difficult to optically recognize a fingerprint, it may be implemented in an ultrasonic type.

As described above, in the second embodiment of the present invention, a light blocking layer is formed in a region corresponding to the space SP between the heat dissipation film 40 and the fingerprint recognition sensor 50 on the rear surface of the display module 30 . (70) is placed. As a result, the second embodiment of the present invention can prevent light from being transmitted into the space SP between the heat dissipation film 40 and the fingerprint recognition sensor 50, so the heat dissipation film 40 and the fingerprint recognition sensor ( 50), it is possible to prevent a luminance difference from occurring due to deterioration of the organic light emitting diode in the region where the space SP is formed and the region where the heat dissipation film 40 is not removed. Accordingly, according to the second embodiment of the present invention, it is possible to prevent a stain such as shadow mura from being recognized by a user.

FIG. 8 is an enlarged cross-sectional view illustrating a third example of area A of FIG. 3 .

Referring to FIG. 8 , the display device according to the third embodiment of the present invention includes a cover substrate 10 , a display module 30 , a heat dissipation film 40 , and a fingerprint recognition sensor 50 as well as a first adhesive layer ( 20 ), the flexible circuit board 51 , and the resin 80 . Also, the display module 30 may include a support substrate 31 , a flexible substrate 32 , a pixel array layer 33 , a barrier film 34 , and a polarizing film 35 . In addition, the heat dissipation film 40 may include a cushion layer 41 , a heat dissipation layer 42 , and an electrostatic protection layer 43 .

Since the cover substrate 10, the first adhesive layer 20, the display module 30, the heat dissipation film 40, and the fingerprint recognition sensor 50 shown in FIG. 8 are substantially the same as those described in FIG. 4, these A detailed description thereof will be omitted. In addition, since the flexible circuit board 51 shown in FIG. 8 is substantially the same as that described in FIG. 7 , a detailed description thereof will be omitted.

The resin 80 may be disposed in the space SP between the heat dissipation film 40 and the fingerprint recognition sensor 50 on the rear surface of the display module 30 . The resin 80 may be formed in a colored color, and is preferably formed in black in order to enhance the light blocking effect. As a result, it is possible to prevent light from being transmitted into the space SP between the heat dissipation film 40 and the fingerprint recognition sensor 50 .

In addition, by applying the resin 80 to the space SP between the heat dissipation film 40 and the fingerprint recognition sensor 50 and then curing the resin 80 , the resin 80 is the heat dissipation film 40 and the fingerprint recognition It may serve to attach the sensor 50 . For this reason, the second adhesive layer 60 for attaching the fingerprint recognition sensor 50 to the rear surface of the display module 30 may be omitted.

In addition, when the resin 80 is disposed in the space SP between the heat dissipation film 40 and the fingerprint recognition sensor 50 as shown in FIG. 8 , the space between the heat dissipation film 40 and the fingerprint recognition sensor 50 ( Since it is possible to prevent light from passing through the SP), the flexible circuit board 51 does not need to be disposed to cover the hole H of the heat dissipation film 40 .

As described above, in the third embodiment of the present invention, the resin 80 is disposed in the space SP between the heat dissipation film 40 and the fingerprint recognition sensor 50 on the rear surface of the display module 30 . do. As a result, the second embodiment of the present invention can prevent light from being transmitted into the space SP between the heat dissipation film 40 and the fingerprint recognition sensor 50, so the heat dissipation film 40 and the fingerprint recognition sensor ( 50), it is possible to prevent a luminance difference from occurring due to deterioration of the organic light emitting diode in the region where the space SP is formed and the region where the heat dissipation film 40 is not removed. Accordingly, according to the third embodiment of the present invention, it is possible to prevent a stain such as shadow mura from being recognized by a user.

In addition, when the fingerprint recognition sensor 50 is attached using the second adhesive layer 60 , a pressure is applied to the fingerprint recognition sensor 50 from the rear surface of the display module 30 to attach, and this causes the user to use the display module The problem of recognizing the press trace of the second adhesive layer 60 from the front surface of 30 may occur. However, in the second embodiment of the present invention, by applying the resin 80 to the space SP between the heat dissipation film 40 and the fingerprint recognition sensor 50 and curing the resin 80, the resin 80 is The heat dissipation film 40 and the fingerprint recognition sensor 50 are attached. As a result, according to the embodiment of the present invention, it is possible to prevent a problem in that the user recognizes the traces of pressing of the second adhesive layer 60 on the front surface of the display module 30 .

9 is an enlarged cross-sectional view illustrating a fourth example of area A of FIG. 3 .

Referring to FIG. 9 , the display device according to the fourth embodiment of the present invention includes a cover substrate 10 , a display module 30 , a heat dissipation film 40 , and a fingerprint recognition sensor 50 , as well as a first adhesive layer ( 20 ), the flexible circuit board 51 , the second adhesive layer 60 , the resin 81 , the reinforcing layer 90 , and the metal thin film layer 91 . Also, the display module 30 may include a support substrate 31 , a flexible substrate 32 , a pixel array layer 33 , a barrier film 34 , and a polarizing film 35 . In addition, the heat dissipation film 40 may include a cushion layer 41 , a heat dissipation layer 42 , and an electrostatic protection layer 43 .

The cover substrate 10 shown in FIG. 9 , the first adhesive layer 20 , the display module 30 , the heat dissipation film 40 , the fingerprint recognition sensor 50 , the flexible circuit board 51 , and the second adhesive layer 60 . ) is substantially the same as that described in FIG. 4 , and thus detailed description thereof will be omitted.

The reinforcing layer 90 may be disposed on the rear surface of the display module 30 . The reinforcing layer 90 is the second adhesive layer 60 from the front of the display module 30 when the user applies pressure to attach the fingerprint recognition sensor 50 to the back of the display module 30. layer to prevent it from happening. The reinforcing layer 90 may be formed of a plastic layer such as polyethylene terephthalate (PET) or a metal layer such as SUS. The reinforcing layer 90 may be formed only in an area corresponding to the fingerprint recognition sensor 50 , but is not limited thereto. For example, the reinforcing layer 90 may be disposed on the entire surface of the rear surface of the support substrate 31 .

The metal thin film layer 91 may be disposed on the rear surface of the reinforcing layer 90 . The metal thin film layer 91 is a layer for improving the ultrasonic recognition rate when the fingerprint recognition sensor 50 is ultrasonic. When the fingerprint recognition sensor 50 is of the ultrasonic type, when the density of the layer disposed on the fingerprint recognition sensor 50 through which the ultrasonic waves pass is not uniform, the ultrasonic recognition rate may be lowered. When the metal thin film layer 91 is disposed on the fingerprint recognition sensor 50 and the layer through which ultrasonic waves pass has a uniform density, the ultrasonic recognition rate may be increased. For example, the metal thin film layer 91 may be a thin film layer of copper. Accordingly, in the third embodiment of the present invention, the fingerprint recognition sensor 50 is preferably ultrasonic. However, when the metal thin film layer 91 is omitted, the fingerprint recognition sensor 50 may be implemented as an optical type.

The resin 80 includes a space SP between the heat dissipation film 40 and the reinforcing layer 90 and a space SP between the heat dissipation film 40 and the metal thin film layer 91 on the rear surface of the display module 30 . , and/or may be disposed in the space SP between the heat dissipation film 40 and the fingerprint recognition sensor 50 . The space SP between the heat dissipation film 40 and the reinforcing layer 90, the space SP between the heat dissipation film 40 and the metal thin film layer 91, and/or the heat dissipation film 40 and the fingerprint recognition sensor 50 By curing the resin 80 after coating the resin 80 in the space SP between the resin 80, the heat dissipation film 40 and the reinforcing layer 90, the metal thin film layer 91, and/or fingerprint recognition It may serve to attach the sensor 50 . In particular, when the resin 80 serves to attach the heat dissipation film 40 and the fingerprint recognition sensor 50 , the second adhesive layer 60 may be omitted.

The resin 80 may be formed of a colored color, and may be formed of black in order to enhance a light blocking effect. In this case, since it is possible to prevent light from being transmitted into the space SP between the heat dissipation film 40 and the fingerprint recognition sensor 50 , the flexible circuit board 51 has a hole (H) of the heat dissipation film 40 . It does not have to be placed to cover it.

As described above, in the fourth embodiment of the present invention, the flexible circuit board 51 is disposed to cover the hole H of the heat dissipation film 40 , or the space between the heat dissipation film 40 and the reinforcing layer 90 . (SP), the space (SP) between the heat dissipation film 40 and the metal thin film layer (91), and / or disposing the resin 80 in the space (SP) between the heat dissipation film 40 and the fingerprint recognition sensor (50) do. As a result, since the fourth embodiment of the present invention can prevent light from being transmitted into the space SP between the heat dissipation film 40 and the fingerprint recognition sensor 50, the heat dissipation film 40 and the fingerprint recognition sensor ( 50), it is possible to prevent a luminance difference from occurring due to deterioration of the organic light emitting diode in the region where the space SP is formed and the region where the heat dissipation film 40 is not removed. Accordingly, according to the fourth embodiment of the present invention, it is possible to prevent a stain such as shadow mura from being recognized by a user.

In addition, according to the fourth embodiment of the present invention, when the user applies pressure for attaching the fingerprint recognition sensor 50 to the rear surface of the display module 30 by disposing the reinforcement layer 90 on the rear surface of the display module 30 . It is possible to prevent recognition of the trace of pressing of the second adhesive layer 60 on the front surface of the display module 30 . In addition, in the fourth embodiment of the present invention, when the fingerprint recognition sensor 50 is ultrasonic, the ultrasonic recognition rate can be improved by disposing the metal thin film layer 91 on the rear surface of the reinforcing layer 90 .

FIG. 10 is an enlarged cross-sectional view illustrating a fifth example of area A of FIG. 2 .

Referring to FIG. 10 , the display device according to the fifth embodiment of the present invention includes a cover substrate 10 , a display module 30 , a heat dissipation film 40 , and a fingerprint recognition sensor 50 , as well as a first adhesive layer ( 20 ), the flexible circuit board 51 , the second adhesive layer 60 , the reinforcing layer 90 , and the metal thin film layer 91 . Also, the display module 30 may include a support substrate 31 , a flexible substrate 32 , a pixel array layer 33 , a barrier film 34 , and a polarizing film 35 . In addition, the heat dissipation film 40 may include a cushion layer 41 , a heat dissipation layer 42 , and an electrostatic protection layer 43 .

The cover substrate 10 shown in FIG. 10 , the first adhesive layer 20 , the display module 30 , the heat dissipation film 40 , the fingerprint recognition sensor 50 , the flexible circuit board 51 , and the second adhesive layer 60 . ) is substantially the same as that described in FIG. 4 , and thus detailed description thereof will be omitted.

In addition, since the reinforcing layer 90 and the metal thin film layer 91 shown in FIG. 10 are substantially the same as those described in FIG. 9 , except that they are disposed on the entire rear surface of the display module 30 . , a detailed description thereof will be omitted.

11 is an enlarged cross-sectional view illustrating a sixth example of area A of FIG. 3 .

Referring to FIG. 11 , the display device according to the sixth embodiment of the present invention includes a cover substrate 10 , a display module 30 , a heat dissipation film 40 , and a fingerprint recognition sensor 50 , as well as a first adhesive layer ( 20), the flexible circuit board 51 and the second adhesive layer 60 are further included. Also, the display module 30 may include a support substrate 31 , a flexible substrate 32 , a pixel array layer 33 , a barrier film 34 , and a polarizing film 35 . In addition, the heat dissipation film 40 may include a cushion layer 41 , a heat dissipation layer 42 , and an electrostatic protection layer 43 .

The cover substrate 10 , the first adhesive layer 20 , the display module 30 , the heat dissipation film 40 , the fingerprint recognition sensor 50 , and the second adhesive layer 60 shown in FIG. 11 are substantially the same as those described in FIG. 4 . , so a detailed description thereof will be omitted. Since the flexible circuit board 51 shown in FIG. 10 is substantially the same as that described in FIG. 7 , a detailed description thereof will be omitted.

In addition, the resin 80 shown in FIG. 11 is sprayed on the area corresponding to the hole H of the heat dissipation film 40 , and is applied to the space SP between the heat dissipation film 40 and the fingerprint recognition sensor 50 . can be Specifically, the resin 80 is sprayed into the space SP between the heat dissipation film 40 and the fingerprint recognition sensor 50, and the support substrate 31 exposed by the hole H of the heat dissipation film 40 The rear surface, the second adhesive layer 60 , the fingerprint recognition sensor 50 , the cushion layer 41 , the heat dissipation layer 42 , and the side surfaces of the static electricity protection layer 43 may be coated.

In addition, the resin 80 may be applied on the back surface of the flexible circuit board 51 and the static electricity protection layer 43 . After the resin 80 is applied, it may be cured through an Ultra Violet (UV) curing machine. The resin 80 may be formed in a colored color, and is preferably formed in black in order to enhance the light blocking effect. In this case, the resin 80 may include black pigments and a photoinitiator. The thickness to which the resin 80 is applied is preferably 10 to 100 μm.

Although the embodiments of the present invention have been described in more detail with reference to the accompanying drawings, the present invention is not necessarily limited to these embodiments, and various modifications may be made within the scope without departing from the technical spirit of the present invention. . Therefore, the embodiments disclosed in the present invention are not intended to limit the technical spirit of the present invention, but to explain, and the scope of the technical spirit of the present invention is not limited by these embodiments. Therefore, it should be understood that the embodiments described above are illustrative in all respects and not restrictive. The protection scope of the present invention should be construed by the claims, and all technical ideas within the scope equivalent thereto should be construed as being included in the scope of the present invention.

10: cover substrate first adhesive layer
30: display module 31: support substrate
32: flexible substrate 33: pixel array layer
34: barrier film 35: polarizing film
40: heat dissipation film 41: cushion layer
42: heat dissipation layer 43: electrostatic protection layer
50: fingerprint recognition sensor 51: flexible circuit board
60: second adhesive layer 70: light blocking layer
80: resin 90: reinforcing layer
91: metal thin film layer

Claims (20)

a display module disposed on a rear surface of the cover substrate and displaying an image;
a heat dissipation film disposed on a rear surface of the display module and having a hole formed therein;
a fingerprint recognition sensor disposed on the rear surface of the display module in the hole of the heat dissipation film; and
and a flexible circuit board on which the fingerprint recognition sensor is mounted,
The flexible circuit board blocks the light by covering the hole of the heat dissipation film,
The heat dissipation film,
a cushion layer disposed on a rear surface of the display module and configured to cushion an impact from the outside;
a heat dissipation layer disposed on a rear surface of the cushion layer and configured to dissipate heat generated from the display module; and
and an electrostatic protection layer disposed on a rear surface of the heat dissipation layer. The method of claim 1,
The flexible circuit board is in contact with a rear surface of the heat dissipation film. 3. The method of claim 2,
The display device further comprising a double-sided adhesive film for adhering the flexible circuit board and the heat dissipation film. The method of claim 1,
The display device further comprising a transparent adhesive film for adhering the display module and the fingerprint recognition sensor. The method of claim 1,
The fingerprint recognition sensor is an optical display device. The method of claim 1,
The fingerprint recognition sensor is an ultrasonic type display device. 7. The method of claim 6,
a reinforcing layer disposed between the fingerprint recognition sensor and the display module; and
The display device further comprising a metal thin film layer disposed between the reinforcing layer and the fingerprint recognition sensor. The method of claim 1,
The cushion layer buffers the impact when an impact from the outside is applied to the display module,
The heat dissipation layer radiates heat generated from the display module,
The electrostatic protection layer protects the display module from static electricity applied from the outside. a display module disposed on the cover substrate and displaying an image;
a heat dissipation film disposed on a rear surface of the display module and having a hole formed therein;
a fingerprint recognition sensor attached to the rear surface of the display module in the hole of the heat dissipation film; and
and a light-shielding layer covering the space between the fingerprint recognition sensor and the heat dissipation film,
The light blocking layer is located between the rear surface of the display module and the fingerprint recognition sensor,
The heat dissipation film,
a cushion layer disposed on a rear surface of the display module and configured to cushion an impact from the outside;
a heat dissipation layer disposed on a rear surface of the cushion layer and configured to dissipate heat generated from the display module; and
and an electrostatic protection layer disposed on a rear surface of the heat dissipation layer. 10. The method of claim 9,
The display device further comprising a transparent adhesive film for adhering the display module and the fingerprint recognition sensor. 10. The method of claim 9,
The fingerprint recognition sensor is an optical display device. 10. The method of claim 9,
The fingerprint recognition sensor is an ultrasonic type display device. 13. The method of claim 12,
a reinforcing layer disposed between the fingerprint recognition sensor and the display module; and
The display device further comprising a metal thin film layer disposed between the reinforcing layer and the fingerprint recognition sensor. 10. The method of claim 9,
The cushion layer buffers the impact when an impact from the outside is applied to the display module,
The heat dissipation layer radiates heat generated from the display module,
The electrostatic protection layer protects the display module from static electricity applied from the outside. a display module disposed on the cover substrate and displaying an image;
a heat dissipation film disposed on a rear surface of the display module and having a hole formed therein;
a fingerprint recognition sensor attached to the rear surface of the display module in the hole of the heat dissipation film; and
and a colored resin filled to block light in a space between the fingerprint recognition sensor and the heat dissipation film,
The heat dissipation film,
a cushion layer disposed on a rear surface of the display module and configured to cushion an impact from the outside;
a heat dissipation layer disposed on a rear surface of the cushion layer and configured to dissipate heat generated from the display module; and
and an electrostatic protection layer disposed on a rear surface of the heat dissipation layer. 16. The method of claim 15,
The display device, characterized in that the resin is formed in black. 16. The method of claim 15,
The fingerprint recognition sensor is an optical display device. 16. The method of claim 15,
The fingerprint recognition sensor is an ultrasonic type display device. 19. The method of claim 18,
a reinforcing layer disposed between the fingerprint recognition sensor and the display module; and
The display device further comprising a metal thin film layer disposed between the reinforcing layer and the fingerprint recognition sensor. 20. The method of claim 19,
The resin is disposed in at least one of between the reinforcing layer and the heat dissipation film and between the metal thin film layer and the heat dissipation film.

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