KR102481875B1 - Display device including fingerpring identification sensor - Google Patents

Abstract

The present invention provides a display device capable of preventing a stain such as shadow mura from being recognized by a user when a fingerprint recognition sensor is attached to the rear surface of the display device, and A heat dissipation film disposed on one side and having a hole on one side, a fingerprint recognition sensor disposed in the hole provided in the heat dissipation film, and an optical member disposed to cover the hole provided in the heat dissipation film to prevent light from entering the display module. includes

Description

Display device including a fingerprint recognition sensor {DISPLAY DEVICE INCLUDING FINGERPRING IDENTIFICATION SENSOR}

The present invention relates to a display device including a fingerprint recognition sensor.

As the information society develops, demands for display devices for displaying images are increasing in various forms. As a display device, various display devices such as Liquid Crystal Display (LCD), Organic Light Emitting Display (OLED), and Quantum Dot Light Emitting Display (QLED) are utilized. It is becoming.

Display devices are applied to various electronic devices such as smart phones, tablets, notebook computers, monitors, and TVs. In particular, recently, the use of portable electronic devices such as smart phones, tablets, and notebook computers has greatly increased due to the development of mobile communication technology. In addition to communication functions, portable electronic devices store privacy information such as contacts, call details, messages, photos, memos, user's web surfing information, location information, and financial information. Accordingly, in order to prevent leakage of personal information from portable electronic devices, various security methods for protecting personal information are applied to portable electronic devices. Among these security methods, fingerprint authentication permits the use of an electronic device based on a user's biometric fingerprint, and thus has higher security power than other security methods, such as password authentication or pattern authentication.

Meanwhile, portable electronic devices such as smart phones or tablets are increasing the size of display devices while minimizing bezels to provide wider screens. However, since an image sensor for realizing a camera, an illuminance sensor for sensing illumination, a fingerprint recognition sensor for fingerprint authentication, and the like are disposed on the front of a portable electronic device such as a smartphone or tablet, along with a display device, display There is a limit to increasing the size of the device.

To increase the size of the display device, a fingerprint recognition sensor may be attached to the rear surface of the display device. In this case, a part of the back tape attached to the rear surface of the display device is removed and the fingerprint recognition sensor is attached, and a space may be formed between the back tape and the fingerprint recognition sensor. When the display device is implemented as an organic light emitting display device including a plastic film, since light may pass through the space between the back tape and the fingerprint recognition sensor during the manufacturing process, the organic light emitting element in the area where the space is formed may deteriorate. can For this reason, there may be a difference in deterioration speed between the organic light emitting element in the region where the space is formed between the back tape and the fingerprint recognition sensor and the organic light emitting element in other regions, for example, the region where the back tape is not removed. Therefore, even when an image with the same brightness is displayed, the luminance of the image displayed by the organic light emitting device in the area where the space is formed between the backing tape and the fingerprint recognition sensor is different from the image displayed by the organic light emitting device in the area where the backing tape is not removed. Differences in luminance may occur. As a result, stains, such as shadow mura, in which a difference in luminance occurs between an area where a space is formed between the back tape and the fingerprint recognition sensor and an area where the back tape is not removed may be recognized by the user.

The present invention has been made to solve the above problems, and when a fingerprint recognition sensor is attached to the rear surface of the display device, it is technical to provide a display device capable of preventing stains such as shadow mura from being recognized by a user. make it a task

The present invention for achieving the above technical problem is a display module for displaying an image, a heat dissipation film disposed on one surface of the display module and having a hole on one side, a fingerprint recognition sensor disposed in a hole provided in the heat dissipation film, and heat dissipation. A display device including an optical member disposed to cover a hole provided in a film and prevent light from entering the display module.

In the display device according to an exemplary embodiment of the present specification, an optical member made of a photochromic material or a light blocking material is disposed to cover a hole of a heat dissipation film.

As a result, since the display device according to an embodiment of the present invention can prevent light from penetrating into the space between the heat dissipation film and the fingerprint recognition sensor, the area formed with the space between the heat dissipation film and the fingerprint recognition sensor and the heat dissipation film It is possible to prevent a difference in luminance from occurring due to deterioration of the organic light emitting device in the area that is not removed.

Therefore, the display device according to an exemplary embodiment of the present invention can prevent a stain such as shadow mura from being recognized by a user.

The effects obtainable in the present invention are not limited to the effects mentioned above, and other effects not mentioned will be clearly understood by those skilled in the art from the description below. .

1 is a perspective view illustrating a portable electronic device including a display device according to an exemplary embodiment of the present invention.
2 is a perspective view showing a display device according to an exemplary embodiment of the present invention.
3 is a side cross-sectional view of a display device according to an exemplary embodiment of the present invention.
4 is an enlarged cross-sectional view showing a first embodiment of region A of FIG. 2 .
5 is a cross-sectional view showing an example of the display module of FIG. 4 .
6 is a cross-sectional view showing a display area of the display module of FIG. 5 in detail.
7 is an enlarged cross-sectional view showing a second embodiment of region A of FIG. 2 .
8 is an enlarged cross-sectional view showing a third embodiment of region A of FIG. 2 .

The meaning of terms described in this specification should be understood as follows.

Singular expressions should be understood to include plural expressions unless the context clearly defines otherwise, and terms such as “first” and “second” are used to distinguish one component from another, The scope of rights should not be limited by these terms. It should be understood that terms such as "comprise" or "having" do not preclude the presence or addition of one or more other features, numbers, steps, operations, components, parts, or combinations thereof. The term “at least one” should be understood to include all possible combinations from one or more related items. For example, "at least one of the first item, the second item, and the third item" means not only the first item, the second item, or the third item, respectively, but also two of the first item, the second item, and the third item. It means a combination of all items that can be presented from one or more. The term "on" means not only the case where a certain component is formed directly on top of another component, but also the case where a third component is interposed between these components.

Hereinafter, a preferred example of the display device according to the present invention will be described in detail with reference to the accompanying drawings. In adding reference numerals to components of each drawing, the same components may have the same numerals as much as possible even if they are displayed on different drawings. In addition, in describing the present invention, if it is determined that a detailed description of a related known configuration or function may obscure the gist of the present invention, the detailed description may be omitted.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a perspective view illustrating a portable electronic device including a display device according to an exemplary embodiment of the present invention.

Referring to FIG. 1 , a portable electronic device (PED) according to an embodiment of the present invention is a smart phone, but is not limited thereto. That is, a portable electronic device according to an embodiment of the present invention may be a tablet or a notebook computer.

The portable electronic device (PED) includes a case (CS) forming an exterior, a display device (CDIS), a sound output module (SOM), an image sensor (CAM), an illuminance sensor (IS), a speaker (SPK), and a microphone (MIC). , an earphone port (EP), and a charging port (CP).

The case CS may be formed to cover the front, side, and rear surfaces of the portable electronic device PED. The case CS may be formed of plastic. A display device CDIS, a sound output module SOM, a camera CAM, and an illuminance sensor IS may be disposed on the front surface of the case CS. A microphone MIC, an earphone port EP, and a charging port CP may be disposed on one side of the case CS.

The display device CDIS occupies most of the front surface of the portable electronic device PED. A detailed description of the display device CDIS will be described later with reference to FIGS. 2 and 3 .

The sound output module (SOM) is a receiving device that outputs the other party's voice during a call with the other party.

The image sensor CAM is a device for capturing an image seen on the front of the portable electronic device (PED), and another image sensor may be additionally disposed on the rear surface of the portable electronic device (PED). .

The illuminance sensor IS is a device for adjusting the luminance of the display device CDIS by detecting the amount of incident light.

The microphone (MIC) is a transmitting device for converting sound waves of a user's voice into electrical signals and transmitting the sound waves to the other party.

The speaker (SPK) outputs a sound signal related to a function or application performed in the portable electronic device (PED).

The earphone port (EP) is a port that outputs a sound signal to the earphone instead of the speaker (SPK) when the earphone is inserted.

The charging port CP is a port to which a charger for charging a battery of a portable electronic device (PED) is connected.

2 is a perspective view showing a display device according to an exemplary embodiment, and FIG. 3 is a side cross-sectional view of the display device according to an exemplary embodiment.

2 and 3 , a display device according to an exemplary embodiment of the present invention includes a cover substrate 10, a display module 30, an optical member 40, a heat dissipation film 50, and a fingerprint recognition sensor 60. ).

The cover substrate 10 may be formed of plastic or glass. The cover substrate 10 may include a flat portion FL and a curvature portion CU, but is not limited thereto. The flat portion FL may be formed flat in a central region of the cover substrate 10 . The curvature portion CU may have a first curvature at an edge of at least one side of the cover substrate 10 . 1 to 3 illustrate that the curvature part CU is formed on both edges of the cover substrate 10, but is not limited thereto. That is, the curvature portion CU may be formed only on one edge of the cover substrate 10, or may be formed on three or four edges of the cover substrate 10.

A decor layer 11 may be formed on the back surface of the cover substrate 10 facing the display module 30 . The decor layer 11 is a layer formed with a pattern that can be displayed to a user even when the display module 30 does not display an image. For example, as shown in FIG. 2 , a company logo 11a such as “LG” may be formed on the decor layer 11 . In addition, the decor layer 11 may include a color layer 11b formed in an area corresponding to the bezel area of the display module 30 . For example, the decor layer 11 may include a color layer 11b having a black color in an area corresponding to the bezel area of the display module 30 . In this case, since the color layer 11b of the decor layer 11 can be expressed in the same color as the display area of the display module 30 when the display module 30 does not display an image, The screen may appear wide to the user.

The display module 30 is disposed on the rear surface of the cover substrate 10 . The display module 30 is a display device that displays a predetermined image. For example, the display module 30 may be an organic light emitting display as shown in FIGS. 5 and 6 , but is not limited thereto. That is, the display module 30 may be a liquid crystal display or a quantum dot light emitting display.

The display module 30 may be disposed on the flat portion FL and the curved portion CU of the cover substrate 10 . Since the display module 30 is also disposed on the curved portion CU of the cover substrate 10 , the user can view an image through the curved portion CU of the cover substrate 10 .

The optical member 40 may be disposed on the rear surface of the display module 30, but is not limited thereto. The optical member 40 is disposed to cover a hole H provided in a heat dissipation film 50 to be described later, and prevents light from entering the display module 30 . The optical member 40 according to an example may include a photochromic material. The light transmittance of the optical member 40 according to an example is changed when exposed to ultraviolet light, thereby controlling the amount of ultraviolet light incident on the rear surface of the display module 30 . In addition, the optical member 40 according to an example is made of a material that turns black when exposed to ultraviolet rays and returns to a transparent color when ultraviolet rays are removed, so that the space between the heat dissipation film 50 and the fingerprint recognition sensor 60 ( It is possible to prevent deterioration of the organic light emitting device formed in the region corresponding to SP).

The optical member 40 according to another example includes a light-blocking material and may block all light incident from the outside to the rear surface of the display module 30 . As described above, in the display device according to one embodiment of the present invention, since the optical member 40 for preventing light from being incident is disposed on the rear surface of the display module 30, the fingerprint recognition sensor 60 uses an ultrasonic type rather than an optical type. can

The heat dissipation film 50 is disposed on one surface of the display module 30 and disposed on the rear surface of the optical member 40 . The heat dissipation film 50 may include a material having high thermal conductivity to effectively dissipate heat generated from the display module 30 . In addition, the heat dissipation film 50 may perform a buffer function to protect the display module 30 from external impact.

A portion of the heat dissipation film 50 may be removed in order to attach the fingerprint recognition sensor 60 to the rear surface of the optical member 40 . Hereinafter, a region from which a portion of the heat dissipation film 50 is removed will be referred to as a hole H.

The fingerprint recognition sensor 60 may be attached to the rear surface of the optical member 40 in the hole H of the heat dissipation film 50 . The fingerprint recognition sensor 60 may recognize a user's fingerprint using an ultrasonic method.

The fingerprint recognition sensor 60 projects ultrasonic waves to the front surface where the display module 30 is disposed, and determines the shape of the fingerprint through the size of the ultrasonic wave reflected from the fingerprint of the finger. Specifically, the user's fingerprint has ridges and valleys, and the reflected ultrasonic wave is received differently depending on which part the generated ultrasonic wave is reflected, so the fingerprint recognition sensor 60 detects the reflected ultrasonic wave An outline of the fingerprint can be obtained based on the pattern.

The fingerprint recognition sensor 60 may include a fingerprint input unit and a fingerprint processing unit. The fingerprint input unit may include an ultrasonic transmitter that generates ultrasonic waves and an ultrasonic receiver that receives ultrasonic waves. The fingerprint processing unit may include a control unit that processes the value received from the ultrasonic reception unit and determines whether the fingerprint is authenticated.

4 is an enlarged cross-sectional view showing a first embodiment of region A of FIG. 3 .

Referring to FIG. 4 , the display device according to the first embodiment of the present invention includes a cover substrate 10, a display module 30, an optical member 40, a heat dissipation film 50, and a fingerprint recognition sensor 60. Rather, it further includes a first adhesive layer 20, a flexible circuit board 65, and a second adhesive layer 70. In addition, the display module 30 may include a support substrate 31 , a flexible substrate 32 , a pixel array layer 33 , a barrier film 34 , and a polarizing film 35 . In addition, the heat dissipation film 50 may include a cushion layer 51 , a heat dissipation layer 52 , and an electrostatic protection layer 53 .

The first adhesive layer 20 is disposed between the cover substrate 10 and the display module 30 to adhere the cover substrate 10 to the polarizer 33 of the display module 30 . The first adhesive layer 20 may be an optically transparent resin (OCR) or an optically transparent adhesive film (OCA film).

The support substrate 31 is a substrate for supporting the flexible substrate 32 and may be formed of plastic. For example, the support substrate 31 may be formed of polyethylene terephthalate (PET).

The flexible substrate 32 may be disposed on the front surface of the support substrate 31 and may be formed of a plastic film having flexibility capable of being bent. For example, the flexible substrate 32 may be formed of a polyimide film.

The pixel array layer 33 may be formed on the front surface of the flexible substrate 32 . The pixel array layer 33 is a layer that displays an image by means of a plurality of pixels. The pixel array layer 33 may include a thin film transistor layer, a light emitting device layer, and an encapsulation layer.

The barrier film 34 may be disposed to cover the pixel array layer 33 to protect the pixel array layer 33 from oxygen or moisture. That is, the barrier film 34 may be disposed on the pixel array layer 33 . The barrier film 34 may include a touch sensing layer for sensing a user's touch.

The polarizing film 35 may be attached to the front surface of the barrier film 34 to prevent deterioration in visibility due to reflection of external light. The polarizing film 35 may be disposed to overlap the pixel array layer 33 .

A detailed description of the display module 30 will be described later with reference to FIGS. 5 and 6 .

The optical member 40 is disposed between the support substrate 31 and the heat dissipation film 50 . The optical member 40 is configured in the form of a film and may be entirely formed on the rear surface of the support substrate 31 . The optical member 40 may be formed on the rear surface of the support substrate 31 and may be disposed to cover the hole H of the heat dissipation film 50 . The optical member 40 is made of a photochromic material or a light blocking material to prevent the organic light emitting element formed in the area corresponding to the space SP between the heat dissipation film 50 and the fingerprint recognition sensor 60 from deteriorating. It can be prevented.

The cushion layer 51 may be disposed on the rear surface of the optical member 40 . The cushion layer 51 serves to buffer shock when an external shock is applied to the display module 30 . An adhesive material may be applied to the front surface of the cushion layer 51, and thus the heat dissipation film 50 may be attached to the rear surface of the optical member 40 without a separate adhesive layer.

The heat dissipation layer 52 may be disposed on the rear surface of the cushion layer 51 . The heat dissipation layer 52 may be formed of a metal layer having high thermal conductivity, such as graphite, to effectively dissipate heat generated from the display module 30 .

The static electricity protection layer 53 may be disposed on the rear surface of the heat dissipation layer 52 . The static electricity protection layer 53 may serve not only to protect the display module 30 from static electricity applied from the outside, but also to discharge heat generated from the display module 30 like the heat dissipation layer 52 . The static electricity protection layer 53 may be formed of copper (Cu).

The fingerprint recognition sensor 60 may be mounted on a flexible circuit board 65 . The flexible circuit board 65 may be a flexible printed circuit board. The flexible circuit board 65 may include a connector connected to a cable connected to the application board of the portable electronic device. An application chip may be mounted on the application board. Accordingly, information on whether the fingerprint recognition sensor 60 has authenticated the fingerprint may be transmitted to the application board of the portable electronic device through the flexible circuit board 65 .

The second adhesive layer 70 bonds the support substrate 31 and the fingerprint recognition sensor 60 to each other. The second adhesive layer 70 may be a transparent adhesive film (OCA film).

The fingerprint recognition sensor 60 may be disposed in the hole H of the heat dissipation film 50 . The hole H of the heat dissipation film 50 indicates an area where a part of the heat dissipation film 50 is removed to attach the fingerprint recognition sensor 60 to the rear surface of the display module 30 . Since the fingerprint recognition sensor 60 is disposed in the hole H of the heat dissipation film 50 , a space SP may be formed between the fingerprint recognition sensor 60 and the heat dissipation film 50 . When light passes through the space SP between the heat dissipation film 50 and the fingerprint recognition sensor 60, the organic formed in the area corresponding to the space SP between the heat dissipation film 50 and the fingerprint recognition sensor 60. The light emitting element may deteriorate. Therefore, in the display device according to the first embodiment of the present invention, the optical member 40 is disposed to cover the hole H of the heat dissipation film 50 . As a result, since the display device according to the first embodiment of the present invention can prevent light from penetrating into the space SP between the heat dissipation film 50 and the fingerprint recognition sensor 60, the heat dissipation film 50 and It is possible to prevent a difference in luminance from occurring due to deterioration of the organic light emitting diode in the region where the space SP between the fingerprint recognition sensors 60 is formed and the region where the heat dissipation film 50 is not removed. Accordingly, the display device according to the first embodiment of the present invention can prevent stains such as shadow mura from being recognized by the user.

5 is a cross-sectional view showing an example of the display module of FIG. 4 , and FIG. 6 is a cross-sectional view showing a display area of the display module of FIG. 5 in detail.

In FIGS. 5 and 6 , description has been focused on the display module 30 implemented as an organic light emitting display device. In addition, in FIGS. 5 and 6 , the light emitting element layer 120 has been mainly described as being formed in a top emission method in which light is emitted in the direction in which the barrier film 34 is disposed, that is, in the upward direction.

5 and 6 , the display module 30 may include a support substrate 31, a flexible substrate 32, a pixel array layer 33, a barrier film 34, and a polarizing film 35. there is. The pixel array layer 33 may include a thin film transistor layer 110 , a light emitting device layer 120 and an encapsulation layer 130 . The display area AA refers to an area where the light emitting element layer 120 is formed to display an image, and the non-display area NAA refers to an area around the display area.

Since the support substrate 31, the flexible substrate 32, the barrier film 34, and the polarizing film 35 have been described in detail with reference to FIGS. 4 and 5, a detailed description thereof will be omitted.

A thin film transistor layer 110 is formed on the flexible substrate 32 . The thin film transistor layer 110 includes thin film transistors 210 , a gate insulating film 220 , an interlayer insulating film 230 , a protective film 240 , and a planarization film 250 .

A buffer layer may be formed on the flexible substrate 32 . The buffer film may be formed on the flexible substrate 32 to protect the thin film transistors 210 and the light emitting devices from moisture penetrating through the support substrate 31 and the flexible substrate 32 , which are vulnerable to moisture permeation. The buffer layer may include a plurality of inorganic layers alternately stacked. For example, the buffer layer may be formed of a multilayer in which one or more inorganic layers of a silicon oxide layer (SiOx), a silicon nitride layer (SiNx), and SiON are alternately stacked. The buffer film may be omitted.

A thin film transistor 210 is formed on the buffer layer. The thin film transistor 210 includes an active layer 211 , a gate electrode 212 , a source electrode 213 and a drain electrode 214 . 6 illustrates that the thin film transistor 210 is formed in a top gate (top gate) method in which the gate electrode 212 is positioned above the active layer 211, it should be noted that it is not limited thereto. That is, the thin film transistor 210 is a bottom gate (bottom gate) method in which the gate electrode 212 is positioned below the active layer 211 or the gate electrode 212 is located above and below the active layer 211. It may be formed in a double gate method located in both.

An active layer 211 is formed on the buffer layer. The active layer 211 may be formed of a silicon-based semiconductor material or an oxide-based semiconductor material. A light blocking layer may be formed between the buffer layer and the active layer 211 to block external light incident on the active layer 211 .

A gate insulating layer 220 may be formed on the active layer 211 . The gate insulating layer 220 may be formed of an inorganic layer, for example, a silicon oxide layer (SiOx), a silicon nitride layer (SiNx), or a multilayer thereof.

A gate electrode 212 and a gate line may be formed on the gate insulating layer 220 . The gate electrode 212 and the gate line are made of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu). It may be formed as a single layer or multiple layers made of one or an alloy thereof.

An interlayer insulating layer 230 may be formed on the gate electrode 212 and the gate line. The interlayer insulating layer 230 may be formed of an inorganic layer, for example, a silicon oxide layer (SiOx), a silicon nitride layer (SiNx), or a multilayer thereof.

A source electrode 213 , a drain electrode 214 , and a data line may be formed on the interlayer insulating layer 230 . Each of the source electrode 213 and the drain electrode 214 may be connected to the active layer 211 through a contact hole passing through the gate insulating layer 220 and the interlayer insulating layer 230 . The source electrode 213, the drain electrode 214, and the data line are made of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), or neodymium (Nd). And copper (Cu) may be formed of a single layer or multiple layers made of any one or an alloy thereof.

A protective layer 240 may be formed on the source electrode 223 , the drain electrode 224 , and the data line to insulate the thin film transistor 220 . The protective layer 240 may be formed of an inorganic layer, for example, a silicon oxide layer (SiOx), a silicon nitride layer (SiNx), or a multilayer thereof.

A planarization layer 250 may be formed on the passivation layer 240 to flatten a level difference caused by the thin film transistor 210 . The planarization layer 250 may be formed of an organic layer such as acryl resin, epoxy resin, phenolic resin, polyamide resin, or polyimide resin. there is.

A light emitting element layer 120 is formed on the thin film transistor layer 110 . The light emitting device layer 120 includes light emitting devices and a bank 264 .

The light emitting elements and the bank 264 are formed on the planarization film 250 . The light emitting device may be an organic light emitting device. In this case, the light emitting element may include a first electrode 261 , a light emitting layer 262 , and a second electrode 263 . The first electrode 261 may be an anode electrode, and the second electrode 263 may be a cathode electrode.

The first electrode 261 may be formed on the planarization layer 250 . The first electrode 261 may be connected to the source electrode 213 of the thin film transistor 210 through a contact hole passing through the passivation layer 240 and the planarization layer 250 . The first electrode 261 may include a stacked structure of aluminum and titanium (Ti/Al/Ti), a stacked structure of aluminum and ITO (ITO/Al/ITO), an APC alloy, and a stacked structure of APC alloy and ITO (ITO/APC /ITO) may be formed of a metal material with high reflectivity. An APC alloy is an alloy of silver (Ag), palladium (Pd), and copper (Cu).

The bank 264 may be formed to cover an edge of the first electrode 261 on the planarization layer 250 to partition pixels. That is, the bank 264 serves as a pixel defining film defining pixels.

In each of the pixels, a first electrode 261 corresponding to an anode electrode, a light emitting layer 262, and a second electrode 263 corresponding to a cathode electrode are sequentially stacked, and holes from the first electrode 261 and second electrodes 261 are formed. This indicates a region where electrons from the electrode 263 are coupled to each other in the light emitting layer 262 to emit light.

A light emitting layer 262 is formed on the first electrode 261 and the bank 264 . The light emitting layer 262 may be an organic light emitting layer. In this case, the light emitting layer 262 is a common layer commonly formed in pixels and may be a white light emitting layer emitting white light. The light emitting layer 262 may be formed in a tandem structure of two or more stacks. Each of the stacks may include a hole transporting layer, at least one light emitting layer, and an electron transporting layer.

Also, when the emission layer 262 is formed in a tandem structure of two or more stacks, a charge generation layer may be formed between the stacks. The charge generation layer may include an n-type charge generation layer positioned adjacent to the lower stack and a p-type charge generation layer formed on the n-type charge generation layer and positioned adjacent to the upper stack. The n-type charge generation layer injects electrons into the lower stack, and the p-type charge generation layer injects holes into the upper stack. The n-type charge generation layer may be an organic layer in which an organic host material capable of transporting electrons is doped with an alkali metal such as Li, Na, K, or Cs, or an alkaline earth metal such as Mg, Sr, Ba, or Ra. The p-type charge generating layer may be an organic layer doped with a dopant in an organic host material having hole transport capability.

The second electrode 263 is formed on the light emitting layer 262 . The second electrode 263 may be formed to cover the light emitting layer 262 . The second electrode 263 may be a common layer commonly formed in pixels.

The second electrode 263 is a transparent conductive material (TCO) such as ITO or IZO capable of transmitting light, or magnesium (Mg), silver (Ag), or magnesium (Mg) and silver (Ag). It may be formed of a semi-transmissive conductive material such as an alloy of. When the second electrode 140 is formed of a transflective metal material, light emission efficiency may be increased by microcavities. A capping layer may be formed on the second electrode 263 .

An encapsulation layer 130 is formed on the light emitting device layer 120 . The encapsulation layer 130 includes an encapsulation film 270 .

The encapsulation film 270 serves to prevent oxygen or moisture from penetrating the light emitting layer 262 and the second electrode 263 . To this end, the encapsulation film 270 may include at least one inorganic film. The inorganic layer may be formed of silicon nitride, aluminum nitride, zirconium nitride, titanium nitride, hafnium nitride, tantalum nitride, silicon oxide, aluminum oxide, or titanium oxide.

In addition, the encapsulation film 270 may further include at least one organic film. The organic layer may be formed to a thickness sufficient to prevent particles from penetrating the encapsulation layer 270 and being injected into the light emitting layer 262 and the second electrode 263 .

A color filter layer may be formed on the encapsulation layer 130 . The color filter layer includes color filters and a black matrix. Each of the color filters may be arranged to correspond to pixels. The black matrix 294 may be disposed between the color filters to prevent color mixing from occurring when light from one pixel propagates to the color filter of an adjacent pixel. The black matrix 294 may be arranged to correspond to the bank 264 . An overcoat layer may be formed on the color filters to flatten a level difference between the color filters and the black matrix.

FIG. 7 is an enlarged cross-sectional view showing a second embodiment of region A of FIG. 3 .

FIG. 7 is a cross-sectional view showing a display device according to a second exemplary embodiment of the present invention, which is identical to the display device according to FIG. 4 except for an optical member 40 . Therefore, the same reference numerals are assigned to the same components, and only different configurations will be described below.

Referring to FIG. 7 , the optical member 40 of the display device according to the second exemplary embodiment of the present invention may be disposed on the rear surface of the display module 30 . A transparent adhesive resin (OCR) may be applied to the front surface of the optical member 40 , and thus the optical member 40 may be adhered to the rear surface of the display module 30 . In addition, the optical member 40 may be attached to the display module 30 by being disposed to surround the second adhesive layer 70 disposed between the display module 30 and the fingerprint recognition sensor 60 .

The optical member 40 is made of a photochromic material or a light blocking material, and is located in the space SP between the heat dissipation film 50 and the fingerprint recognition sensor 60 on the rear surface of the display module 30. It can be placed in the corresponding area. As a result, the optical member 40 may prevent light from penetrating into the space SP between the heat dissipation film 50 and the fingerprint recognition sensor 60 .

When the optical member 40 is disposed in an area corresponding to the space SP between the heat dissipation film 50 and the fingerprint recognition sensor 60 on the rear surface of the display module 30, the cushion layer 51 It may be arranged to overlap the end of the optical member 40.

In addition, the optical member 40 is not limited to being disposed in an area corresponding to the space SP between the heat dissipation film 50 and the fingerprint recognition sensor 60 on the rear surface of the display module 30 .

As described above, the display device according to the second embodiment of the present invention corresponds to the space SP between the heat dissipation film 50 and the fingerprint recognition sensor 60 on the rear surface of the display module 30. An optical member 40 made of a photochromic material or light blocking material is disposed in the region. As a result, since the display device according to the second exemplary embodiment of the present invention can prevent light from penetrating into the space SP between the heat dissipation film 50 and the fingerprint recognition sensor 60, the heat dissipation film 50 and It is possible to prevent a difference in luminance from occurring due to deterioration of the organic light emitting diode in the region where the space SP between the fingerprint recognition sensors 60 is formed and the region where the heat dissipation film 50 is not removed. Accordingly, the display device according to the second exemplary embodiment of the present invention can prevent stains such as shadow mura from being recognized by the user.

8 is an enlarged cross-sectional view showing a third embodiment of region A of FIG. 3 .

FIG. 8 is a cross-sectional view showing a display device according to a third embodiment of the present invention, which is the same as the display device according to FIG. 4 except for the optical member 40 . Therefore, the same reference numerals are assigned to the same components, and only different configurations will be described below.

Referring to FIG. 8 , the optical member 40 of the display device according to the third embodiment of the present invention is provided in the hole H of the heat dissipation film 50 and is disposed to surround the fingerprint recognition sensor 60 . The optical member 40 may be disposed in the space SP between the heat dissipation film 50 and the fingerprint recognition sensor 60 on the rear surface of the display module 30 . As a result, the optical member 40 is made of a photochromic material or a light blocking material to prevent light from penetrating into the space SP between the heat dissipation film 50 and the fingerprint recognition sensor 60. .

An adhesive resin (OCR) may be applied to the optical member 40, and thus the optical member 40 may be adhered to the rear surface of the display module 30 and the heat dissipation film 50.

As described above, the display device according to the third embodiment of the present invention has an optical member in the space SP between the heat dissipation film 50 and the fingerprint recognition sensor 60 on the rear surface of the display module 30. (40) is placed. As a result, since the display device according to the third exemplary embodiment of the present invention can prevent light from penetrating into the space SP between the heat dissipation film 50 and the fingerprint recognition sensor 60, the heat dissipation film 50 and It is possible to prevent a difference in luminance from occurring due to deterioration of the organic light emitting diode in the region where the space SP between the fingerprint recognition sensors 60 is formed and the region where the heat dissipation film 50 is not removed. Accordingly, the third embodiment of the present invention can prevent a stain such as shadow mura from being recognized by a user.

Although the embodiments of the present invention have been described in more detail with reference to the accompanying drawings, the present invention is not necessarily limited to these embodiments, and may be variously modified and implemented without departing from the technical spirit of the present invention. . Therefore, the embodiments disclosed in the present invention are not intended to limit the technical idea of the present invention, but to explain, and the scope of the technical idea of the present invention is not limited by these embodiments. Therefore, it should be understood that the embodiments described above are illustrative in all respects and not restrictive. The protection scope of the present invention should be construed according to the scope of the claims, and all technical ideas within the scope equivalent thereto should be construed as being included in the scope of the present invention.

10: cover substrate 20: first adhesive layer
30: display module 31: support substrate
32: flexible substrate 33: pixel array layer
34: barrier film 35: polarizing film
40: optical member 50: heat dissipation film
51: cushion layer 52: heat dissipation layer
53: electrostatic protection layer 60: fingerprint recognition sensor
65: flexible circuit board 70: second adhesive layer

Claims (10)

a display module displaying an image;
a heat dissipation film disposed on one side of the display module and having a hole on one side thereof;
a fingerprint recognition sensor disposed in a hole provided in the heat dissipation film; and
An optical member disposed to cover a hole provided in the heat dissipation film to prevent light from entering the display module,
The optical member is disposed between the display module and the heat dissipation film. According to claim 1,
The display device of claim 1 , wherein the optical member includes a photochromic material. According to claim 1,
The display device of claim 1 , wherein the optical member turns black when exposed to ultraviolet rays and returns to a transparent color when ultraviolet rays are removed. According to claim 1,
The display device of claim 1 , wherein light transmittance of the optical member is changed when exposed to ultraviolet light. According to claim 1,
The display device of claim 1 , wherein the optical member includes a light blocking material. According to claim 1,
The optical member blocks ultraviolet rays, and the fingerprint recognition sensor is an ultrasonic type display device. delete According to claim 1,
The display module includes a support substrate and a flexible substrate disposed on the support substrate, wherein the flexible substrate is bendable. a display module displaying an image;
a heat dissipation film disposed on one side of the display module and having a hole on one side thereof;
a fingerprint recognition sensor disposed in a hole provided in the heat dissipation film;
an optical member disposed to cover a hole provided in the heat dissipation film and prevent light from being incident to the display module; and
An adhesive layer disposed between the fingerprint recognition sensor and the display module,
The optical member surrounds the adhesive layer. a display module displaying an image;
a heat dissipation film disposed on one side of the display module and having a hole on one side thereof;
a fingerprint recognition sensor disposed in a hole provided in the heat dissipation film; and
An optical member disposed to cover a hole provided in the heat dissipation film to prevent light from entering the display module,
The optical member is provided in the hole and surrounds the fingerprint recognition sensor.

Images